Pressing device with single-point pressure monitoring

Abstract

The utility model relates to a kind of compression device of pressure single point monitoring.The compression device includes upper die mechanism and lower die mechanism;Upper die mechanism includes upper die plate, is located on the limiting frame of upper die plate, is located on the multiple pressurizing units of upper die plate and limiting frame;Lower die mechanism includes lower die plate, and lower die plate is equipped with circuit board compression station, and multiple pressurizing units are set up in correspondence with circuit board compression station upside and downside;Each pressurizing unit includes the lifting drive structure of being equipped in the bottom of upper die plate, the pressure exerting force component of being equipped in the drive end of lifting drive structure;Pressure exerting force component includes the compression chassis connected with the drive end of lifting drive structure, the pressure head structure of being slidably equipped in the bottom of compression chassis, the pressure detection structure connected between the top of compression chassis and the top of pressure head structure.The utility model can solve the problem that traditional compression equipment carries out overall pressure exerting to compression material, cannot detect the pressure of single PCS unit, cannot guarantee that pressure can be evenly distributed.

Description

Technical Field

[0001] This utility model relates to the field of circuit board manufacturing technology, and in particular to a pressing device with single-point pressure monitoring. Background Technology

[0002] Auxiliary material lamination is a key process in the production of flexible printed circuits (FPCs). Its core function is to firmly bond various auxiliary materials (referred to as auxiliary materials) to the FPC substrate (or pre-processed semi-finished products) using specific equipment and parameters to meet the FPC's performance requirements, such as insulation, mechanical strength, and environmental resistance. During auxiliary material lamination, the positioned FPC substrate and auxiliary material assembly are placed into lamination equipment (such as a vacuum hot press). By setting parameters such as temperature, pressure, and time, the adhesive layer melts and fills the interface gaps, achieving initial bonding between the auxiliary materials and the substrate.

[0003] Furthermore, FPC substrates typically include multiple PCS (short for Piece) units. (During the production of flexible circuit boards, to improve processing efficiency, many PCS units with independent functions are usually assembled into a panel for a series of processes such as wiring, hole positioning, and surface treatment. After processing, the PCS units on the panel are separated through a splitting process, and these separated individual flexible circuit board products are called PCS products.) Therefore, it is usually necessary to simultaneously press one or more corresponding auxiliary materials onto each PCS unit on the FPC substrate. When pressing the FPC substrate and auxiliary materials (i.e., the pressing materials), the pressure must be evenly distributed to avoid insufficient local pressure, which could lead to air bubbles and affect product quality.

[0004] In traditional technology, when pressing materials with multiple PCS units are pressed, the pressing equipment usually applies pressure to the entire pressing material as a whole, and it is impossible to determine whether the pressure of the pressing equipment is evenly distributed to each PCS unit. Moreover, the pressing equipment can only detect the total pressure and regional component force applied to the entire pressing material, and cannot provide pressure data for individual PCS units, so it is impossible to monitor the pressure of each PCS unit. Utility Model Content

[0005] This invention provides a single-point pressure monitoring pressing device, which can solve the technical problem that traditional pressing equipment applies pressure to the pressing material as a whole, and cannot detect the pressure of a single PCS unit, thus failing to ensure that the pressure is evenly distributed to each PCS unit.

[0006] To solve the above-mentioned technical problems, this utility model provides a pressing device with single-point pressure monitoring, comprising:

[0007] The upper mold mechanism includes an upper mold plate, a limiting frame disposed on the upper mold plate, and a plurality of pressurizing units disposed on the upper mold plate and the limiting frame;

[0008] The lower mold mechanism includes a lower template, on which a circuit board pressing station for positioning a pressing material having multiple PCS units is provided, and multiple pressing units are arranged vertically and vertically corresponding to the circuit board pressing station.

[0009] Each of the pressurizing units includes a lifting drive structure located at the bottom of the upper template, and a pressure measuring component located at the bottom drive end of the lifting drive structure.

[0010] The pressure measuring component includes a pressing base connected to the bottom drive end of the lifting drive structure, a pressing head structure slidably disposed at the bottom of the pressing base, and a pressure detection structure connected between the top of the pressing base and the top of the pressing head structure. One pressing head structure is used to correspond to one PCS unit of the pressing material positioned at the circuit board pressing station.

[0011] Optionally, the pressure detection structure includes a pressure sensor located at the top of the pressing base and an elastic link structure located at the bottom of the pressure sensor, the elastic link structure being telescopically located at the top of the pressure head structure.

[0012] Optionally, the elastic linkage structure includes a connecting rod body disposed at the bottom of the pressure sensor, a force-measuring spring member elastically telescopically disposed at the top side of the connecting rod body, and a buffer spring member elastically telescopically disposed at the bottom side of the connecting rod body;

[0013] The pressure head structure includes a pressure head mounting bracket slidably connected to the side of the pressing base frame, and a pressing head disposed on the pressure head mounting bracket. The bottom of the connecting rod extends movably into the pressure head frame limiting groove of the pressure head mounting bracket. One end of the force measuring spring is connected to the top of the connecting rod and the other end abuts against the top of the pressure head mounting bracket. One end of the buffer spring is connected to the bottom of the connecting rod and the other end abuts against the top of the pressure head frame limiting groove.

[0014] Optionally, the force-measuring spring includes a first fixed ring sleeve fixedly sleeved on the top of the connecting rod body, a first movable ring sleeve movably sleeved on the middle of the connecting rod body, and a first connecting spring sleeved on the outside of the connecting rod body and connected between the first fixed ring sleeve and the first movable ring sleeve, wherein the first movable ring sleeve abuts against the top of the pressure head mounting bracket.

[0015] The buffer spring includes a second fixed ring sleeve fixedly sleeved at the bottom of the connecting rod body, a second movable ring sleeve movably sleeved at the middle of the connecting rod body, and a second connecting spring sleeved outside the connecting rod body and connected between the second fixed ring sleeve and the second movable ring sleeve, wherein the second movable ring sleeve abuts against the top of the pressure head frame limiting groove.

[0016] Optionally, the pressing base frame includes a pressing frame body, a lifting guide rail disposed on the side of the pressing frame body, and a pressing frame top plate protruding from the top side of the pressing frame body. The driving end of the lifting drive structure is connected to the top surface of the pressing frame top plate, the top of the pressure sensor is connected to the bottom surface of the pressing frame top plate, and the side of the pressure head mounting bracket is slidably disposed on the lifting guide rail.

[0017] Optionally, the limiting frame includes multiple support rods or multiple support plates disposed on the periphery of the bottom surface of the upper template, and a limiting plate connected to the ends of the multiple support rods or multiple support plates, wherein the lifting drive structure is limited and disposed on the limiting plate.

[0018] Optionally, a material positioning groove is provided at the circuit board pressing station of the lower template;

[0019] The circuit board pressing station is provided with multiple pressing and positioning protrusions around its perimeter, and each of the multiple pressing and positioning protrusions corresponds to and engages with a number of pressing and positioning holes on the bottom of the limiting frame.

[0020] Optionally, the upper mold mechanism includes a vacuum sleeve structure disposed under the bottom surface of the upper mold plate, and a vacuum pumping mechanism disposed on the vacuum sleeve structure and / or the upper mold plate. The vacuum sleeve structure is sleeved around the periphery of the limiting frame, and the plurality of pressurizing units are located in the vacuum cavity enclosed by the vacuum sleeve structure.

[0021] Optionally, the vacuum sleeve structure includes a telescopic sealing cover sleeved outside the limiting frame, and an annular sealing cover fixing plate disposed at the bottom of the telescopic sealing cover, wherein the sealing cover fixing plate is disposed vertically and vertically corresponding to the circuit board pressing station.

[0022] Optionally, the vacuum sleeve structure includes an annular sealing ring disposed at the bottom of the sealing cover fixing plate, and the periphery of the circuit board pressing station is provided with an annular sealing groove corresponding to the annular sealing ring.

[0023] The beneficial effects of the technical solution provided by this utility model include:

[0024] When pressing a material with multiple PCS units, the material can be placed at the circuit board pressing station of the lower mold plate of the lower mold mechanism, with the lower mold plate and the material positioned below multiple pressing units on the upper mold plate of the upper mold mechanism. Then, the multiple pressing units can press the multiple PCS units of the material. During the pressing process, the lifting drive structure of the multiple pressing units can drive the pressure measuring components closer to the multiple PCS units of the material, ensuring that the multiple pressure measuring components evenly press the multiple PCS units.

[0025] Furthermore, when multiple PCS units are pressed together using pressure-applying and force-measuring components of multiple pressurizing units, pressure can be applied to one PCS unit through the pressure head structure of the pressure-applying and force-measuring components. The pressure applied by the pressure head structure can be monitored through the pressure detection structure of the pressure-applying and force-measuring components. This allows for the detection of pressure applied to each PCS unit by multiple pressurizing units, ensuring that the pressure is evenly distributed across each PCS unit and guaranteeing product quality. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a three-dimensional structural diagram of the single-point pressure monitoring pressing device described in this embodiment of the invention. Figure 1 ;

[0028] Figure 2 This is a three-dimensional structural diagram of the single-point pressure monitoring pressing device described in this embodiment of the invention. Figure 2 ;

[0029] Figure 3 This is a three-dimensional structural diagram of the pressure measuring component of the single-point pressure monitoring pressing device according to an embodiment of the present invention. Figure 1 ;

[0030] Figure 4 This is a three-dimensional structural diagram of the pressure measuring component of the single-point pressure monitoring pressing device according to an embodiment of the present invention. Figure 2 ;

[0031] Figure 5This is an exploded structural diagram of the pressure measuring component of the single-point pressure monitoring pressing device according to an embodiment of the present invention;

[0032] Figure 6 This is a three-dimensional structural diagram of the pressure detection structure of the pressure measuring component described in this embodiment of the utility model;

[0033] Figure 7 This is a three-dimensional structural diagram of the single-point pressure monitoring pressing device described in this embodiment of the invention. Figure 3 ;

[0034] Figure 8 This is a three-dimensional structural diagram of the single-point pressure monitoring pressing device described in this embodiment of the invention. Figure 4 .

[0035] In the diagram: 10. Pressing device with single-point pressure monitoring; 20. Pressing material; 100. Upper mold mechanism; 110. Upper template; 120. Limiting frame; 122. Support rod; 124. Limiting plate; 1242. Pressing positioning hole; 130. Vacuum sleeve structure; 132. Telescopic sealing cover; 134. Sealing cover fixing plate; 136. Annular sealing ring; 140. Vacuuming mechanism; 200. Lower mold mechanism; 210. Lower template; 220. Circuit board pressing station; 222. Material positioning groove; 224. Pressing positioning protrusion; 226. Annular sealing groove; 300. Pressurizing unit; 310. Lifting drive structure; 320. Pressure measuring component; 32 2. Pressing base frame; 3222. Pressing frame main body; 3224. Pressing frame top plate; 3226. Lifting guide rail; 324. Pressure detection structure; 326. Pressing head structure; 328. Pressure sensor; 329. Elastic connecting rod structure; 3292. Connecting rod; 3294. Force measuring spring; 3296. Buffer spring; 3262. Pressing head mounting frame; 3264. Pressing head; 3266. Pressing head frame limiting groove; 32942. First fixed ring; 32944. First movable ring; 32946. First connecting spring; 32962. Second fixed ring; 32964. Second movable ring; 32966. Second connecting spring. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0037] like Figures 1 to 2As shown, this utility model proposes a single-point pressure monitoring pressing device 10, including an upper mold mechanism 100 and a lower mold mechanism 200 corresponding to the upper mold mechanism 100. The lower mold mechanism 200 can be used to position the FPC substrate and auxiliary materials (referred to as pressing materials 20) to be pressed, and the upper mold mechanism 100 can be used to press the pressing materials 20.

[0038] Furthermore, the upper mold mechanism 100 may include an upper template 110, a limiting frame 120 disposed on the upper template 110, and a plurality of pressing units 300 disposed on the upper template 110 and the limiting frame 120. The lower mold mechanism 200 may include a lower template 210, on which a circuit board pressing station 220 for positioning the pressing material 20 having a plurality of PCS units is provided, and the plurality of pressing units 300 are vertically corresponding to the circuit board pressing station 220. Each pressing unit 300 may include a lifting drive structure 310 disposed at the bottom of the upper template 110, and a pressure measuring component 320 disposed at the bottom drive end of the lifting drive structure 310.

[0039] When pressing a material 20 having multiple PCS units, the material 20 can be placed at the circuit board pressing station 220 of the lower template 210 of the lower mold mechanism 200, with the lower template 210 and the material 20 positioned below the multiple pressing units 300 on the upper template 110 of the upper mold mechanism 100. The multiple pressing units 300 can then press the multiple PCS units of the material 20. During the pressing process, the lifting drive structure 310 of the multiple pressing units 300 can drive the pressure measuring component 320 closer to the multiple PCS units of the material 20, ensuring that the multiple pressure measuring components 320 uniformly press the multiple PCS units.

[0040] Moreover, such as Figures 2 to 4 As shown, the pressure measuring component 320 may include a pressing base 322 connected to the bottom drive end of the lifting drive structure 310, a pressing head structure 326 slidably disposed at the bottom of the pressing base 322, and a pressure detection structure 324 connected between the top of the pressing base 322 and the top of the pressing head structure 326. One pressing head structure 326 is used to correspond to one PCS unit of the pressing material 20 positioned at the circuit board pressing station 220.

[0041] When multiple PCS units are pressed together using the pressure-applying and force-measuring components 320 of the multiple pressurizing units 300, pressure can be applied to one PCS unit through the pressure head structure 326 of the pressure-applying and force-measuring components 320. The pressure applied by the pressure head structure 326 is monitored by the pressure detection structure 324 of the pressure-applying and force-measuring components 320. This allows for the detection of the pressure applied to the multiple PCS units by the multiple pressurizing units 300, and the determination of whether the force is uniform can be made based on the actual pressure received by each PCS unit. The pressure applied to the pressure head structure 326 by the lifting drive structure 310 can be adjusted based on the detection results. In this way, the pressure of each PCS unit of the multiple PCS units of the pressed material 20 can be detected, and the pressure can be evenly distributed to each PCS unit, ensuring product quality.

[0042] When the pressing base 322 of the pressure measuring component 320 is lowered and moved by the lifting drive structure 310 of the pressurizing unit 300, the pressing head structure 326 on the pressing base 322 can be driven to press the pressing material 20 on the lower template 210. At this time, the pressure applied to the pressing material 20 by the pressing head structure 326 can be monitored by the pressure detection structure 324 between the pressing base 322 and the pressing head structure 326. Further, as Figures 4 to 5 As shown, the pressure detection structure 324 may include a pressure sensor 328 disposed on the top of the pressing base 322, and an elastic connecting rod structure 329 disposed on the bottom of the pressure sensor 328. The elastic connecting rod structure 329 is telescopically disposed on the top of the pressing head structure 326. When the pressing head structure 326 applies pressure to the pressing material 20, the pressure sensor 328 disposed between the pressing base 322 and the pressing head structure 326 can detect the pressure of the pressing head structure 326. Moreover, by providing the elastic connecting rod structure 329 between the pressure sensor 328 and the pressing head structure 326, the pressure sensor 328 and the pressing head structure 326 can be elastically connected, the pressing head structure 326 can be elastically supported, and the real-time pressure obtained by the pressure sensor 328 can be fed back based on the elastic compression of the elastic connecting rod structure 329.

[0043] Furthermore, such as Figures 5 to 6As shown, the elastic linkage structure 329 may include a connecting rod 3292 disposed at the bottom of the pressure sensor 328, a force-measuring spring 3294 elastically telescopically disposed at the top side of the connecting rod 3292, and a buffer spring 3296 elastically telescopically disposed at the bottom side of the connecting rod 3292. Furthermore, the pressure head structure 326 may include a pressure head mounting bracket 3262 slidably connected to the side of the pressure base 322, and a pressure head 3264 disposed on the pressure head mounting bracket 3262. The bottom of the connecting rod 3292 extends movably into the pressure head bracket limiting groove 3266 of the pressure head mounting bracket 3262. One end of the force-measuring spring 3294 is connected to the top of the connecting rod 3292, and the other end abuts against the top of the pressure head mounting bracket 3262. One end of the buffer spring 3296 is connected to the bottom of the connecting rod 3292, and the other end abuts against the top of the groove of the pressure head bracket limiting groove 3266.

[0044] Before the pressing material 20 is pressed by the pressing head 3264 on the pressing head mounting frame 3262 of the pressing head structure 326, the force measuring spring 3294 is in a relaxed state, while the buffer spring 3296 is in a contracted state under the weight of the pressing head structure 326. At this time, the bottom of the connecting rod 3292 of the elastic linkage structure 329 and the buffer spring 3296 thereon can provide elastic buffer support for the pressing head mounting frame 3262 and the pressing head 3264. The buffer spring 3296 can support the weight of the pressing head structure 326 itself, thus buffering out its own weight effect. This makes it easier to achieve the theoretical pressing pressure requirement during the pressing process (when the pressure required by the pressing material 20 is less than the weight of the pressing head structure 326 itself, the pressure is very unstable. A buffer spring 3296 can be added between the pressure sensor 328 and the pressing head structure 326 to hold the weight of the pressing head structure 326 and buffer out the influence of the pressing head's own weight). Moreover, during the pressing process, the bottom of the connecting rod 3292 of the elastic linkage structure 329 is squeezed by the pressing head 3264 and the pressing head mounting bracket 3262, causing the pressure exerted by the pressing head mounting bracket 3262 on the force measuring spring 3294 to contract. At this time, the contracted buffer spring 3296 relaxes, allowing the force measuring spring 3294 to compress and feed back the real-time pressure obtained by the pressure sensor 328.

[0045] Furthermore, in this embodiment, the force-measuring spring 3294 may include a first fixed ring 32942 fixedly sleeved on the top of the connecting rod 3292, a first movable ring 32944 movably sleeved on the middle of the connecting rod 3292, and a first connecting spring 32946 sleeved outside the connecting rod 3292 and connected between the first fixed ring 32942 and the first movable ring 32944. The first movable ring 32944 abuts against the top of the pressure head mounting bracket 3262. In the non-pressurized state, the first connecting spring 32946 is in a relaxed state; during the pressing process, the first movable ring 32944 of the force-measuring spring 3294 is subjected to pressure from the pressure head mounting bracket 3262, causing the first movable ring 32944 to slide towards the first fixed ring 32942, compressing the first connecting spring 32946, and feeding back the pressure it receives to the pressure sensor 328.

[0046] Furthermore, the buffer spring 3296 may include a second fixed ring 32962 fixedly sleeved at the bottom of the connecting rod 3292, a second movable ring 32964 movably sleeved at the middle of the connecting rod 3292, and a second connecting spring 32966 sleeved outside the connecting rod 3292 and connected between the second fixed ring 32962 and the second movable ring 32964. The second movable ring 32964 abuts against the top of the pressure head bracket limiting groove 3266. In the non-pressing state, the weight of the pressure head mounting bracket 3262 and the pressing head 3264 exerts pressure on the second movable ring 32964, causing it to move towards the second fixed ring 32962, compressing the second connecting spring 32966, and balancing the weight of the pressure head mounting bracket 3262 and the pressing head 3264.

[0047] In addition, such as Figures 3 to 5 As shown, the pressing base frame 322 may include a pressing frame body 3222, a lifting guide rail 3226 disposed on the side of the pressing frame body 3222, and a pressing frame top plate 3224 protruding from the top side of the pressing frame body 3222. The driving end of the lifting drive structure 310 is connected to the top surface of the pressing frame top plate 3224, the top of the pressure sensor 328 is connected to the bottom surface of the pressing frame top plate 3224, and the side of the pressure head mounting bracket 3262 is slidably disposed on the lifting guide rail 3226. When the lifting drive structure 310 drives the pressing frame top plate 3224 of the pressing base frame 322 to descend, the pressure head structure 326, which is slidably connected to the pressing frame body 3222 via the lifting guide rail 3226, can press down, so that the pressure head structure 326 applies pressure to the pressing material 20. At this time, when the pressure head structure 326 is subjected to the reaction force of the pressed material 20, it can rise along the lifting guide rail 3226 to apply pressure to the pressure sensor 328 and the elastic connecting rod structure 329.

[0048] In addition, such as Figures 1 to 2As shown, the limiting frame 120 may include multiple support rods 122 or multiple support plates disposed on the periphery of the bottom surface of the upper template 110, and a limiting plate 124 connected to the ends of the multiple support rods 122 or multiple support plates. The lifting drive structure 310 may be limited and positioned on the limiting plate 124. The limiting plate 124 can support and limit the lifting drive structure 310 of the multiple pressurizing units 300, so that the lifting drive of the pressurizing unit 300 on the pressure head structure 326 is stable and reliable.

[0049] Furthermore, in some embodiments, such as Figures 1 to 2 As shown, the circuit board pressing station 220 of the lower template 210 may be provided with a material positioning groove 222, which can be used to position the pressing material 20 to be pressed. Furthermore, a circuit board positioning plate may be detachably installed at the circuit board pressing station 220 of the lower template 210, and the circuit board positioning plate may be provided with the material positioning groove 222. Different circuit board positioning plates can be replaced according to different pressing materials 20.

[0050] Furthermore, multiple pressing positioning protrusions 224 can be provided around the circuit board pressing station 220 on the lower template 210. These protrusions 224 can correspond one-to-one with the multiple pressing positioning holes 1242 on the bottom of the limiting frame 120. During the pressing process, the upper mold mechanism 100 and the lower mold mechanism 200 can be positioned by the pressing positioning protrusions 224 and the pressing positioning holes 1242, making the pressing of the pressing material 20 more accurate and reliable. Specifically, the multiple pressing positioning holes 1242 can be set at the periphery of the limiting plate 124 of the limiting frame 120, corresponding one-to-one with the multiple pressing positioning protrusions 224 around the circuit board pressing station 220.

[0051] Furthermore, in other embodiments, such as Figures 7 to 8 As shown, the upper mold mechanism 100 may include a vacuum sleeve structure 130 disposed under the bottom surface of the upper mold plate 110, and a vacuum extraction mechanism 140 disposed on the vacuum sleeve structure 130 and / or the upper mold plate 110. The vacuum sleeve structure 130 is sleeved around the periphery of the limiting frame 120, and multiple pressurizing units 300 are located in the vacuum cavity enclosed by the vacuum sleeve structure 130. By providing the vacuum sleeve structure 130 and the vacuum extraction mechanism 140 around the multiple pressurizing units 300, when pressing the pressing material 20 on the lower mold plate 210, the multiple pressurizing units 300 and the pressing material 20 can be sealed with the vacuum sleeve structure 130 first, and the space sealed by the vacuum sleeve structure 130 can be vacuumed by the vacuum extraction mechanism 140, and then the pressing material 20 can be further vacuum-pressed by the multiple pressurizing units 300.

[0052] Furthermore, the vacuum sleeve structure 130 may include a telescopic sealing cover 132 sleeved outside the limiting frame 120, and an annular sealing cover fixing plate 134 located at the bottom of the telescopic sealing cover 132. The sealing cover fixing plate 134 is vertically corresponding to the circuit board pressing station 220. By setting the vacuum sleeve structure 130 as a telescopic sealing cover 132, when the pressing material 20 is pressed by multiple pressurizing units 300, the telescopic sealing cover 132 extends and retracts along with the extension and retraction of the pressurizing units 300, so as to achieve a good sealing effect. Moreover, the sealing cover fixing plate 134 located at the bottom of the telescopic sealing cover 132 can abut against the periphery of the circuit board pressing station 220 of the lower template 210 when the pressing material 20 on the lower template 210 is pressed, so as to form a seal at the circuit board pressing station 220.

[0053] Furthermore, the multiple support rods 122 or multiple support plates of the limiting frame 120, as well as the limiting plate 124, can form a support structure for the telescopic sealing cover 132, ensuring the stability of the telescopic sealing cover 132 during telescopic movement. For example, the telescopic sealing cover 132 may include a fixed cover portion disposed on the bottom surface of the upper template 110 and sleeved on the outside of the limiting plate 124, and a telescopic cover portion connected to the bottom end of the fixed cover portion, which can enhance the stability of the telescopic sealing cover 132. Moreover, the telescopic drive structure of the pressurizing unit 300 may be located inside the fixed cover portion, and the pressure measuring component 320 may be located inside the telescopic cover portion, so that the telescopic cover portion can telescopically move along with the telescopic movement of the pressure measuring component 320.

[0054] Furthermore, the vacuum sleeve structure 130 may include an annular sealing ring 136 disposed at the bottom of the sealing cover fixing plate 134, and an annular sealing groove 226 corresponding to the annular sealing ring 136 is provided on the periphery of the circuit board pressing station 220. By providing an annular sealing ring 136 at the bottom of the sealing cover fixing plate 134 and providing a corresponding annular sealing groove 226 on the periphery of the circuit board pressing station 220, the annular sealing ring 136 can seal at the annular sealing groove 226 during the pressing process, thereby enhancing the sealing effect.

[0055] It should be noted that in this invention, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0056] The above description is merely a specific embodiment of the present invention, enabling those skilled in the art to understand or implement the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features of the present invention.

Claims

1. A pressure-monitoring device with single-point pressure monitoring, characterized in that, include: The upper mold mechanism includes an upper mold plate, a limiting frame disposed on the upper mold plate, and a plurality of pressurizing units disposed on the upper mold plate and the limiting frame; The lower mold mechanism includes a lower template, on which a circuit board pressing station for positioning a pressing material having multiple PCS units is provided, and multiple pressing units are arranged vertically and vertically corresponding to the circuit board pressing station. Each of the pressurizing units includes a lifting drive structure located at the bottom of the upper template, and a pressure measuring component located at the bottom drive end of the lifting drive structure. The pressure measuring component includes a pressing base connected to the bottom drive end of the lifting drive structure, a pressing head structure slidably disposed at the bottom of the pressing base, and a pressure detection structure connected between the top of the pressing base and the top of the pressing head structure. One pressing head structure is used to correspond to one PCS unit of the pressing material positioned at the circuit board pressing station.

2. The pressure-monitoring device with single-point pressure monitoring according to claim 1, characterized in that, The pressure detection structure includes a pressure sensor located at the top of the pressing base and an elastic connecting rod structure located at the bottom of the pressure sensor. The elastic connecting rod structure is telescopically located at the top of the pressing head structure.

3. The pressure-monitoring device with single-point pressure monitoring according to claim 2, characterized in that, The elastic linkage structure includes a connecting rod body located at the bottom of the pressure sensor, a force-measuring spring member elastically telescopically located on the top side of the connecting rod body, and a buffer spring member elastically telescopically located on the bottom side of the connecting rod body. The pressure head structure includes a pressure head mounting bracket slidably connected to the side of the pressing base frame, and a pressing head disposed on the pressure head mounting bracket. The bottom of the connecting rod extends movably into the pressure head frame limiting groove of the pressure head mounting bracket. One end of the force measuring spring is connected to the top of the connecting rod and the other end abuts against the top of the pressure head mounting bracket. One end of the buffer spring is connected to the bottom of the connecting rod and the other end abuts against the top of the pressure head frame limiting groove.

4. The pressure-monitoring device with single-point pressure monitoring according to claim 3, characterized in that, The force-measuring spring includes a first fixed ring sleeve fixedly sleeved on the top of the connecting rod body, a first movable ring sleeve movably sleeved on the middle part of the connecting rod body, and a first connecting spring sleeved on the outside of the connecting rod body and connected between the first fixed ring sleeve and the first movable ring sleeve, wherein the first movable ring sleeve abuts against the top of the pressure head mounting bracket. The buffer spring includes a second fixed ring sleeve fixedly sleeved at the bottom of the connecting rod body, a second movable ring sleeve movably sleeved at the middle of the connecting rod body, and a second connecting spring sleeved outside the connecting rod body and connected between the second fixed ring sleeve and the second movable ring sleeve, wherein the second movable ring sleeve abuts against the top of the pressure head frame limiting groove.

5. The pressure-monitoring device with single-point pressure monitoring according to claim 3, characterized in that, The pressing base frame includes a pressing frame body, a lifting guide rail disposed on the side of the pressing frame body, and a pressing frame top plate protruding from the top side of the pressing frame body. The driving end of the lifting drive structure is connected to the top surface of the pressing frame top plate, the top of the pressure sensor is connected to the bottom surface of the pressing frame top plate, and the side of the pressure head mounting bracket is slidably disposed on the lifting guide rail.

6. The pressure-monitoring device with single-point pressure monitoring according to any one of claims 1-5, characterized in that, The limiting frame includes multiple support rods or multiple support plates disposed on the periphery of the bottom surface of the upper template, and a limiting plate connected to the ends of the multiple support rods or multiple support plates, wherein the lifting drive structure is limited and disposed on the limiting plate.

7. The pressure-monitoring device with single-point pressure monitoring according to any one of claims 1-5, characterized in that, The lower template is provided with a material positioning groove at the circuit board pressing station; The circuit board pressing station is provided with multiple pressing and positioning protrusions around its perimeter, and each of the multiple pressing and positioning protrusions corresponds to and engages with a number of pressing and positioning holes on the bottom of the limiting frame.

8. The pressure-monitoring device with single-point pressure monitoring according to any one of claims 1-5, characterized in that, The upper mold mechanism includes a vacuum sleeve structure disposed under the bottom surface of the upper mold plate, and a vacuum pumping mechanism disposed on the vacuum sleeve structure and / or the upper mold plate. The vacuum sleeve structure is sleeved around the periphery of the limiting frame, and a plurality of pressurizing units are located in the vacuum cavity enclosed by the vacuum sleeve structure.

9. The pressure-monitoring device with single-point pressure monitoring according to claim 8, characterized in that, The vacuum sleeve structure includes a telescopic sealing cover fitted outside the limiting frame, and an annular sealing cover fixing plate located at the bottom of the telescopic sealing cover. The sealing cover fixing plate is arranged vertically and vertically corresponding to the circuit board pressing station.

10. The pressure-monitoring device with single-point pressure monitoring according to claim 9, characterized in that, The vacuum sleeve structure includes an annular sealing ring located at the bottom of the sealing cover fixing plate, and an annular sealing groove corresponding to the annular sealing ring is provided on the periphery of the circuit board pressing station.

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