Universal carrier for circuit boards

Abstract

This utility model relates to a universal circuit board carrier. The universal circuit board carrier includes a carrier body, a reinforcing cover plate, and a circuit board cover plate. The carrier body includes a carrier plate, a flexible pad on one side of the carrier plate, and a first positioning structure and a second positioning structure on the other side of the carrier plate. The first positioning structure is used to position the circuit board portion of the material to be processed, and the flexible pad is used to position the reinforcing portion of the material to be processed. The reinforcing cover plate is rotatably mounted on the carrier plate and corresponds to and cooperates with the flexible pad to cover the reinforcing portion of the material to be processed. The circuit board cover plate includes a cover plate body for movably covering the circuit board portion, and a third positioning structure on the cover plate body, which corresponds to and cooperates with the second positioning structure. This utility model solves the problem in traditional technology where, when connecting the three processes of bonding, pressing, and curing reinforcement with FPC in a production line, traditional carriers cannot be compatible with different production equipment and operating methods.

Description

Technical Field

[0001] This utility model relates to the field of circuit board manufacturing technology, and in particular to a universal circuit board carrier. Background Technology

[0002] As FPCs (Flexible Printed Circuits) are increasingly used across various industries, their product design methods are constantly evolving, with designs varying drastically depending on the application scenario. Because some FPCs require components to be mounted to achieve specific functions under certain conditions, reinforcement is applied to the back of the components to ensure the flatness of the pads during component mounting, thus guaranteeing the optimal mounting effect.

[0003] In traditional FPC production, reinforcing plates are pre-bonded, pressed, and cured with the FPC for later use during the assembly process. This method separates plasma cleaning, bonding, pressing, and curing into three separate processes: after plasma cleaning, bonding; after bonding, pressing; and finally, curing. Each process completes one step, and each step involves product handling and the use of different carriers, resulting in lower production efficiency compared to continuous production. While continuous production offers high automation, ensuring the carriers are compatible with the pressing equipment's worktable and operating methods becomes a key challenge in achieving continuous production. Utility Model Content

[0004] This utility model provides a universal carrier for circuit boards, which can solve the technical problem that traditional carriers cannot be compatible with different production equipment and operation methods when the three processes of bonding, pressing and curing the reinforcing plate and FPC are connected in the production line.

[0005] To address the aforementioned technical problems, this utility model provides a universal circuit board carrier, comprising:

[0006] The carrier body includes a carrier plate, a flexible pad disposed on one side of the carrier plate, and a first positioning structure and a second positioning structure disposed on the other side of the carrier plate. The first positioning structure is used to position the circuit board part of the material to be processed, and the flexible pad is used to position the reinforcing part of the material to be processed.

[0007] A reinforcing cover plate is rotatably mounted on the carrier plate and corresponds to the flexible pad to cover the reinforcing parts of the material to be processed.

[0008] The circuit board cover includes a cover body for movably covering the circuit board portion of the material to be processed, and a third positioning structure disposed on the cover body, wherein the third positioning structure corresponds to and cooperates with the second positioning structure.

[0009] Optionally, a mounting groove is provided on one side of the vehicle plate, and the flexible pad includes a rubber pad block that can be detachably disposed in the mounting groove.

[0010] Optionally, the width of the vehicle plate is less than or equal to 350 mm, and its thickness is 2.5-3.5 mm;

[0011] The thickness of the rubber pad is 2.8-3.2 mm, which is greater than the depth of the mounting groove.

[0012] Optionally, the reinforcing cover includes a fiberglass cloth plate rotatably disposed on the edge of the carrier plate for covering the reinforcing parts of the rubber pad block and the material to be processed it carries;

[0013] The fiberglass cloth sheet has a thickness of 0.1-0.3 mm, a length greater than the length of the rubber pad, and a width greater than the width of the rubber pad but less than or equal to the width of the carrier plate.

[0014] Optionally, one edge of the fiberglass cloth sheet is bonded to one edge of the carrier plate using flexible tape.

[0015] Optionally, the first positioning structure includes a plurality of first positioning protrusions protruding from the middle position of the carrier plate, and the plurality of first positioning protrusions are used to correspond one-to-one with a plurality of circuit board positioning holes on the circuit board part of the material to be processed.

[0016] The second positioning structure includes a plurality of second positioning protrusions protruding from the periphery of the carrier plate, the height of the second positioning protrusions being greater than the height of the first positioning protrusion; the third positioning structure includes a plurality of cover plate positioning holes provided on the periphery of the cover plate body, the plurality of cover plate positioning holes corresponding to and cooperating with the plurality of second positioning protrusions one by one.

[0017] Optionally, the height of the first positioning protrusion is 1.9-2.0 mm, and the height of the second positioning protrusion is 2.9-3.0 mm.

[0018] Optionally, the carrier plate is an aluminum alloy plate or a synthetic stone plate;

[0019] Alternatively, the carrier plate may include an aluminum alloy main plate and a synthetic stone slab embedded in the aluminum alloy main plate for supporting the material to be processed.

[0020] Optionally, a permanent magnet block is embedded in the carrier plate, and the main body of the cover plate is a magnetic suction plate.

[0021] Optionally, the carrier plate is provided with a bearing area for bearing the material to be processed, and a non-functional area located outside the bearing area, wherein the non-functional area is hollowed out.

[0022] The beneficial effects of the technical solution provided by this utility model include:

[0023] The universal circuit board carrier provided by this utility model allows for the pre-positioning of a circuit board (referred to as the material to be processed) onto the universal circuit board carrier. Specifically, the first positioning structure on the carrier plate of the carrier body positions the circuit board portion of the material to be processed. A circuit board cover is then placed over the circuit board portion of the material to be processed, with the third positioning structure on the cover body connecting to the second positioning structure on the carrier plate. This allows the circuit board cover to position and press the circuit board portion of the material to be processed. Simultaneously, the reinforcing portion of the material to be processed is placed on the flexible pad of the carrier plate, with the reinforcing portion in an open state (i.e., no reinforcing cover is needed on the flexible pad or the reinforcing portion at this time), facilitating the subsequent application of reinforcement to the reinforcing portion of the material to be processed.

[0024] After positioning the material to be processed using the universal circuit board carrier, the carrier and the material can be fed into the plasma machine via a track. Upon sensing the carrier, the plasma machine activates atmospheric plasma, and the plasma head moves perpendicular to the carrier's path, cleaning the reinforcing areas on the material where the reinforcing plate needs to be bonded. After cleaning, the carrier and material are conveyed to the reinforcing bonding machine. The machine uses a vision inspection device to identify the markings on the reinforcing areas and then applies the reinforcing plate to the required positions. The reinforcing plate is then bonded to the correct locations. After bonding, the reinforcing cover plate, which is rotatably mounted on the carrier plate, can be placed on the reinforcing plate and the flexible pad. Then, the carrier and the material to be processed (with the reinforcing plate bonded) are conveyed to the spot press, and the product area to be pressed (with the reinforcing plate bonded) of the material to be processed enters the pressing area of ​​the spot press. The spot press head presses the product area to be pressed (with the reinforcing plate bonded) of the material to be processed. After the pressing of the material to be processed (with the reinforcing plate bonded) is completed, the carrier and the material to be processed (with the reinforcing plate bonded) can be conveyed to the vertical furnace to cure the material to be processed with the reinforcing plate bonded. After curing is completed, the carrier and the material to be processed are conveyed out.

[0025] The universal circuit board carrier proposed in this utility model can adapt to the processes of plasma cleaning, bonding, pressing and curing of reinforcing plates and circuit boards. It is compatible with different production equipment and operation methods involved in these processes, so as to realize the three processes of bonding, pressing and curing of reinforcing plates and circuit boards in line production, which can reduce product turnover and greatly improve production efficiency. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a simplified schematic diagram of the structure of the material to be processed according to an embodiment of this utility model;

[0028] Figure 2 This is a simplified schematic diagram of the structure for attaching a reinforcing plate to the material to be processed according to an embodiment of the present invention.

[0029] Figure 3 This is a simplified structural diagram of the universal circuit board carrier (before attaching the reinforcing plate) described in this embodiment of the utility model.

[0030] Figure 4 This is a simplified block diagram illustrating the structure of a production line in which the universal circuit board carrier described in this embodiment of the invention is applied.

[0031] Figure 5 This is a simplified structural diagram of the universal circuit board carrier (when pressing the reinforcing plate) described in the embodiment of this utility model;

[0032] Figure 6 This is a simplified schematic diagram of the structure of the point press machine described in this embodiment of the present invention, which uses a general-purpose circuit board carrier to press together a reinforcing plate and a material to be processed.

[0033] Figure 7 This is a simplified structural diagram of the reinforcing portion of the universal carrier for circuit boards described in this embodiment of the present invention;

[0034] Figure 8 This is a simplified exploded structural diagram of the reinforcing part of the universal carrier for circuit boards described in this embodiment of the present invention.

[0035] In the diagram: 10. General-purpose circuit board carrier; 20. Material to be processed; 22. Circuit board section; 24. Reinforcing section; 26. Circuit board positioning hole; 30. Reinforcing plate; 40. Plasma machine; 50. Reinforcing bonding machine; 60. Spot press; 62. Pressing platform; 64. Spot press head; 70. Vertical curing oven; 100. Carrier body; 110. Carrier plate; 112. Mounting groove; 1122. Groove bottom hole; 120. Flexible pad; 122. Adhesive pad block; 124. Connecting screw; 126. Connecting groove hole; 130. First positioning structure; 132. First positioning protrusion; 140. Second positioning structure; 142. Second positioning protrusion; 200. Reinforcing cover plate; 210. Fiberglass cloth plate; 300. Circuit board cover plate; 310. Cover plate body; 320. Third positioning structure; 322. Cover plate positioning hole. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0037] like Figure 3 As shown, this utility model proposes a universal circuit board carrier 10, which may include a carrier body 100. The carrier body 100 may have a reinforcing positioning area and a main circuit board positioning area on both sides, respectively. The reinforcing positioning area may be provided with a reinforcing cover plate 200, and the main circuit board positioning area may be provided with a circuit board cover plate 300. The circuit board (which may be referred to as the material to be processed 20) to be bonded to the reinforcing plate 30 can be placed on the carrier body 100. Figures 1 to 2 Positioning can be performed as shown. Specifically, the reinforcing part 24 of the material to be processed 20 can be placed in the reinforcing positioning area. After the reinforcing part 24 is attached to the reinforcing plate 30, it can be covered by the reinforcing cover plate 200. The circuit board part 22 of the material to be processed 20 can be positioned in the main positioning area of ​​the circuit board and covered by the circuit board cover plate 300.

[0038] Moreover, such as Figure 3As shown, the carrier body 100 may include a carrier plate 110, a flexible pad 120 disposed on one side of the carrier plate 110, and a first positioning structure 130 and a second positioning structure 140 disposed on the other side of the carrier plate 110. The first positioning structure 130 is used to position the circuit board portion 22 of the material to be processed 20, and the flexible pad 120 is used to position the reinforcing portion 24 of the material to be processed 20. Moreover, the reinforcing cover plate 200 is rotatably disposed on the carrier plate 110 and corresponds to and cooperates with the flexible pad 120 to cover the reinforcing portion 24 of the material to be processed 20. Furthermore, the circuit board cover plate 300 may include a cover plate body 310 for movably covering the circuit board portion 22 of the material to be processed 20, and a third positioning structure 320 disposed on the cover plate body 310. The third positioning structure 320 corresponds to and cooperates with the second positioning structure 140.

[0039] The universal circuit board carrier 10 provided by this utility model allows the circuit board (i.e., the material 20 to be processed) to be pre-positioned on the universal circuit board carrier 10 to be bonded to the reinforcing plate 30. Specifically, the first positioning structure 130 on the carrier plate 110 of the carrier body 100 positions the circuit board portion 22 of the material 20 to be processed, and the circuit board cover plate 300 is placed on the circuit board portion 22 of the material 20 to be processed, so that the third positioning structure 320 on the cover plate body 310 is connected to the second positioning structure 140 on the carrier plate 110, so that the circuit board cover plate 300 completes the positioning and pressing of the circuit board portion 22 of the material 20 to be processed; at the same time, the reinforcing portion 24 of the material 20 to be processed is placed on the flexible pad 120 of the carrier plate 110, and the reinforcing portion 24 is in an open state (i.e., the reinforcing cover plate 200 is not pressed on the flexible pad 120 and the reinforcing portion 24 at this time), so that the reinforcement can be applied to the reinforcing portion 24 of the material 20 to be processed later.

[0040] like Figure 4 As shown, after the circuit board universal carrier 10 is used to position the material to be processed 20, the circuit board universal carrier 10 and the material to be processed 20 can be entered into the plasma machine equipment 40 via the track. After the plasma machine equipment 40 senses the carrier, atmospheric plasma is activated, and the plasma head moves vertically along the carrier to clean the reinforcing parts 24 on the material to be processed 20 where the reinforcing plate 30 needs to be bonded. After cleaning the reinforcing parts 24 of the material to be processed 20, the carrier and the material to be processed 20 can be transported to the reinforcing bonding machine 50. The reinforcing bonding machine 50 uses a vision inspection device to identify the markings on the reinforcing parts 24 of the material to be processed 20 and then performs bonding, bonding the reinforcing plate 30 at the required position on the reinforcing parts 24. Figure 5As shown, after the reinforcing plate 30 is bonded, the reinforcing cover plate 200, which is rotatably mounted on the carrier plate 110, can be placed on the reinforcing plate 30 and the flexible pad 120. Then, the carrier and the material to be processed 20 (with the reinforcing plate 30 bonded) are conveyed to the spot press 60, so that the product pressing area of ​​the material to be processed 20 (with the reinforcing plate 30 bonded) enters the pressing area of ​​the pressing platform 62 of the spot press 60. The spot press head 64 performs spot pressing on the product pressing area of ​​the material to be processed 20 (with the reinforcing plate 30 bonded), such as... Figure 6 As shown; after the pressing of the material to be processed 20 (with the reinforcing plate 30 attached) is completed, the carrier and the material to be processed 20 (with the reinforcing plate 30 attached) can be transported to the vertical curing oven 70 to cure the material to be processed 20 with the reinforcing plate 30 attached. After curing is completed, the carrier and the material to be processed 20 are transported out.

[0041] The universal circuit board carrier 10 proposed in this utility model can adapt to the processes of plasma cleaning, bonding, pressing and curing of reinforcing plate 30 and circuit board. It can be compatible with different production equipment and operation methods involved in these processes, so that the three processes of bonding, pressing and curing of reinforcing plate 30 and circuit board can be connected for production, which can reduce product turnover and greatly improve production efficiency.

[0042] Furthermore, such as Figure 3 and Figure 5 As shown, the width of the carrier plate 110 can be less than or equal to 350mm, and its thickness is 2.5-3.5mm. This allows the width of the carrier plate 110 to be less than or equal to the width of the worktable of each piece of equipment. For example, the maximum width of the worktable of a stoking machine is 350mm, therefore the width of the carrier plate 110 cannot exceed 350mm. Furthermore, the length of the carrier plate 110 can be enlarged according to the actual length of the material 20 to be processed; in addition, the thickness of the carrier plate 110 can be set to 3mm, but the thickness can also be changed according to actual conditions (such as 2.5mm, 3.5mm, etc.). Moreover, the length and thickness of the carrier plate 110 should not be designed to be too large to avoid excessive weight.

[0043] Furthermore, the vehicle plate 110 can be made of aluminum alloy or synthetic stone. When aluminum alloy is used as the vehicle plate 110, it offers high strength while remaining lightweight, along with good thermal conductivity, corrosion resistance, ease of processing, moderate cost, and recyclability. When synthetic stone is used as the vehicle plate 110, it provides excellent insulation and temperature resistance, as well as low water absorption, dimensional stability, shock absorption and protection, and strong chemical stability. Either aluminum alloy or synthetic stone can be selected as the vehicle plate 110 as needed.

[0044] Alternatively, both aluminum alloy plates and synthetic stone plates can be used to fabricate the carrier plate 110. For example, the carrier plate 110 may include an aluminum alloy main plate and a synthetic stone plate embedded in the aluminum alloy main plate for supporting the material to be processed 20. The area on the carrier plate 110 that needs to support the material to be processed 20 (circuit board and reinforcing plate 30) (i.e., the supporting area) can be made of synthetic stone, while other non-supporting areas (non-functional areas) of the carrier plate 110 can be made of aluminum alloy plates, so that the carrier plate 110 simultaneously possesses the characteristics of both aluminum alloy and synthetic stone. Specifically, a carrier mounting groove 112 hole can be provided in the supporting area of ​​the aluminum alloy main plate, and a synthetic stone plate can be installed at the carrier mounting groove 112 hole to form a composite carrier plate 110. Moreover, the carrier mounting groove 112 hole can be a stepped groove penetrating the aluminum alloy main plate, allowing the synthetic stone plate to be glued into the stepped groove.

[0045] Furthermore, the carrier plate 110 may be provided with a bearing area for bearing the material to be processed 20, and a non-functional area located outside the bearing area, with the non-functional area being hollowed out. This allows other areas (i.e., non-functional areas) on the carrier plate 110 besides bearing the material to be processed 20 to be carried to be included. By setting multiple hollowed-out holes, the non-primary functional areas can be hollowed out, which can reduce the weight of the carrier and avoid the carrier being too heavy to be easily handled by personnel.

[0046] Moreover, such as Figure 3 , Figure 7 , Figure 8 As shown, a mounting groove 112 may be provided on one side of the carrier plate 110, and the flexible pad 120 may include a rubber pad block 122 detachably disposed in the mounting groove 112. By providing a mounting groove 112 on the carrier plate 110, the flexible pad 120 can be embedded in the mounting groove 112. Moreover, the flexible pad 120 may be a block-shaped rubber pad block 122, which may be rectangular, and the mounting groove 112 may also be correspondingly rectangular. During processing, the reinforcing part 24 of the material to be processed 20 may be placed at the middle position of the rubber pad block 122.

[0047] Furthermore, the thickness of the rubber pad 122 can be 2.8-3.2 mm, greater than the depth of the mounting groove 112. This allows the top of the rubber pad 122 to protrude beyond the top surface of the carrier plate 110, providing a certain amount of elastic expansion space for the reinforcing portion 24 of the material to be processed 20 placed on the rubber pad 122 and its reinforcing plate 30. In this embodiment, the thickness of the rubber pad 122 can be 3.0 mm, which can be the same as the thickness of the carrier plate 110. In addition, the thickness of the rubber pad 122 can be adjusted as needed. Furthermore, the depth of the mounting groove 112 can be one-third to one-half of the thickness of the rubber pad 122, i.e., 1.0-2.0 mm.

[0048] Furthermore, the silicone pad 122 can be a rectangular silicone pad, and the mounting groove 112 can also be a rectangular groove. The silicone pad can be detachably installed in the mounting groove 112 using connecting screws 124. Specifically, a connecting slot hole 126 can be provided around each of the silicone pad 122, and multiple bottom holes 1122 can be correspondingly provided on the bottom wall of the mounting groove 112. The silicone pad is fixed in the mounting groove 112 using connecting screws 124 that pass through the connecting slot holes 126 and the bottom holes 1122.

[0049] In addition, such as Figure 3 and Figure 5 As shown, the reinforcing cover plate 200 may include a fiberglass cloth plate 210 rotatably disposed on the edge of the carrier plate 110, used to cover the rubber pad 122 and the reinforcing portion 24 of the material to be processed 20 it carries. By rotating the fiberglass cloth plate 210 disposed on the edge of the carrier plate 110, the fiberglass cloth plate 210 can be rotated to cover the rubber pad 122 position on the carrier plate 110, or to expose the rubber pad 122 position. That is, the fiberglass cloth plate 210 can cover the reinforcing portion 24 of the material to be processed 20, and can also cover the reinforcing plate 30 placed on the reinforcing portion 24.

[0050] Furthermore, the thickness of the fiberglass cloth sheet 210 can be 0.1-0.3 mm, its length is greater than the length of the rubber pad 122, and its width is greater than the width of the rubber pad 122 but less than or equal to the width of the carrier plate 110. The size of the fiberglass cloth sheet 210 can be determined according to the size of the reinforcing plate 30 and the size of the rubber pad 122, and the size of the fiberglass cloth sheet 210 must be greater than the size of the rubber pad 122. Moreover, the thickness of the fiberglass cloth sheet 210 can be set to 0.3 mm, and its non-functional areas (i.e., areas not covered by the reinforcing plate) can be hollowed out to reduce weight.

[0051] Furthermore, one edge of the fiberglass cloth sheet 210 can be bonded to one edge of the carrier plate 110 using flexible tape (high-temperature tape). The high-temperature tape acts like a hinge, allowing the fiberglass cloth sheet 210 to be rotatably connected to the carrier plate 110. This simple rotatable connection between the fiberglass cloth sheet 210 and the carrier plate 110 will not damage the structure of the fiberglass cloth sheet 210. Moreover, after the reinforcing plate 30 is attached to the reinforcing portion 24 of the material to be processed 20, the fiberglass cloth sheet 210 can be pressed onto the adhesive pad 122 and the reinforcing plate 30, so that the reinforcing plate 30 and the reinforcing portion 24 of the material to be processed 20 can be pressed together using the fiberglass cloth sheet 210.

[0052] In addition, such as Figure 3As shown, the first positioning structure 130 on the carrier plate 110 may include a plurality of first positioning protrusions 132 protruding from the middle position of the carrier plate 110. The plurality of first positioning protrusions 132 are used to correspond one-to-one with the plurality of circuit board positioning holes 26 of the circuit board portion 22 of the material to be processed 20. That is, the main body of the material to be processed 20 can be positioned on the carrier plate 110 by means of the plurality of first positioning protrusions 132. Moreover, in this embodiment, the plurality of first positioning protrusions 132 can be evenly arranged along the center line of the length direction of the carrier plate 110, so that the material to be processed 20 can be positioned from the center. In addition, the plurality of first positioning protrusions 132 can also be irregularly arranged in the middle and / or around the perimeter of the carrier plate 110.

[0053] Furthermore, the second positioning structure 140 on the carrier plate 110 may include a plurality of second positioning protrusions 142 protruding from the periphery of the carrier plate 110, the height of the second positioning protrusions 142 being greater than the height of the first positioning protrusions 132; while the third positioning structure 320 of the circuit board cover 300 may include a plurality of cover plate positioning holes 322 disposed on the periphery of the cover plate body 310, the plurality of cover plate positioning holes 322 corresponding to the plurality of second positioning protrusions 142 one by one. After the initial positioning of the material to be processed 20 is completed by the plurality of first positioning protrusions 132, the final fixed positioning of the material to be processed 20 can be completed by the second positioning protrusions 142 and the circuit board cover 300, which is simple to fix and convenient to disassemble, assemble and disassemble the material to be processed 20. Moreover, by making the first positioning protrusions 132 lower than the second positioning protrusions 142, it is convenient that after positioning the material to be processed 20 by the first positioning protrusions 132, it does not affect the positioning and covering of the circuit board cover 300 on the material to be processed by the second positioning protrusions 142.

[0054] Furthermore, the height of the first positioning protrusion 132 can be 1.9-2.0 mm, and the height of the second positioning protrusion 142 can be 2.9-3.0 mm. This allows the height of the second positioning protrusion 142 to be approximately 1 mm greater than the height of the first positioning protrusion 132, facilitating the positioning of the circuit board cover 300. Moreover, the height of the first positioning protrusion 132 can be 1.95 mm, or 1.9 mm, or 2.0 mm, etc.; the height of the second positioning protrusion 142 can be 2.95 mm, or 2.9 mm, or 3.0 mm, etc. The thickness of the circuit board cover 300 can be approximately 1 mm.

[0055] Furthermore, in some embodiments, permanent magnets may be embedded in the carrier plate 110, and the main body 310 of the circuit board cover 300 may be a magnetic suction plate. Thus, when the circuit board cover 300 is positioned by the second positioning protrusion 142, it can also be magnetically positioned by the permanent magnets, making the positioning of the circuit board cover 300 more secure and facilitating its assembly and disassembly. Specifically, multiple permanent magnets can be arranged around the carrier plate 110, and the circuit board cover 300 can be made of a thin steel sheet, allowing it to be attracted from all sides.

[0056] In summary, the universal circuit board carrier 10 provided by this utility model can transform the traditional offline production process of plasma cleaning, bonding, pressing, and curing into an online process, thereby improving production efficiency. Traditional production requires 4 to 6 people, while online production only requires 2 people, which can reduce labor costs. In the future, it can be deeply integrated with SMT (Surface Mount Technology), dispensing, and other downstream processes to further enhance the level of production automation.

[0057] It should be noted that in this invention, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0058] The above description is merely a specific embodiment of the present invention, enabling those skilled in the art to understand or implement the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features of the present invention.

Claims

1. A universal carrier for circuit boards, characterized in that, include: The carrier body includes a carrier plate, a flexible pad disposed on one side of the carrier plate, and a first positioning structure and a second positioning structure disposed on the other side of the carrier plate. The first positioning structure is used to position the circuit board part of the material to be processed, and the flexible pad is used to position the reinforcing part of the material to be processed. A reinforcing cover plate is rotatably mounted on the carrier plate and corresponds to the flexible pad to cover the reinforcing parts of the material to be processed. The circuit board cover includes a cover body for movably covering the circuit board portion of the material to be processed, and a third positioning structure disposed on the cover body, wherein the third positioning structure corresponds to and cooperates with the second positioning structure.

2. The universal circuit board carrier according to claim 1, characterized in that, The vehicle plate has a mounting groove on one side, and the flexible pad includes a rubber pad block that can be detachably disposed in the mounting groove.

3. The universal circuit board carrier according to claim 2, characterized in that, The width of the vehicle plate is less than or equal to 350 mm, and its thickness is 2.5-3.5 mm. The thickness of the rubber pad is 2.8-3.2 mm, which is greater than the depth of the mounting groove.

4. The universal circuit board carrier according to claim 2, characterized in that, The reinforcing cover plate includes a fiberglass cloth plate rotatably disposed on the edge of the carrier plate, used to cover the reinforcing parts of the rubber pad block and the material to be processed it carries; The fiberglass cloth sheet has a thickness of 0.1-0.3 mm, a length greater than the length of the rubber pad, and a width greater than the width of the rubber pad but less than or equal to the width of the carrier plate.

5. The universal circuit board carrier according to claim 4, characterized in that, One edge of the fiberglass cloth board is bonded to one edge of the carrier board using flexible tape.

6. The universal circuit board carrier according to any one of claims 1-5, characterized in that, The first positioning structure includes a plurality of first positioning protrusions protruding from the middle position of the carrier plate, and the plurality of first positioning protrusions are used to correspond one-to-one with a plurality of circuit board positioning holes on the circuit board part of the material to be processed. The second positioning structure includes a plurality of second positioning protrusions protruding from the periphery of the carrier plate, the height of the second positioning protrusions being greater than the height of the first positioning protrusion; the third positioning structure includes a plurality of cover plate positioning holes provided on the periphery of the cover plate body, the plurality of cover plate positioning holes corresponding to and cooperating with the plurality of second positioning protrusions one by one.

7. The universal circuit board carrier according to claim 6, characterized in that, The height of the first positioning protrusion is 1.9-2.0 mm, and the height of the second positioning protrusion is 2.9-3.0 mm.

8. The universal circuit board carrier according to any one of claims 1-5, characterized in that, The carrier plate is made of aluminum alloy plate or synthetic stone plate; Alternatively, the carrier plate may include an aluminum alloy main plate and a synthetic stone slab embedded in the aluminum alloy main plate for supporting the material to be processed.

9. The universal circuit board carrier according to claim 8, characterized in that, The carrier plate is embedded with a permanent magnet, and the main body of the cover plate is a magnetic suction plate.

10. The universal circuit board carrier according to any one of claims 1-5, characterized in that, The carrier plate is provided with a bearing area for bearing the material to be processed, and a non-functional area located outside the bearing area, the non-functional area being hollowed out.

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