A polytetrafluoroethylene diaphragm for circuit board etching

Abstract

The application discloses a polytetrafluoroethylene film for circuit board etching, which comprises a polytetrafluoroethylene film and a composite tensile layer, the polytetrafluoroethylene film is circular, and the composite tensile layer is hot-pressed on one side of the polytetrafluoroethylene film. The application has the effect of reducing the possibility of rupture of the polytetrafluoroethylene film during use.

Description

Technical Field

[0001] This application relates to the technical field of circuit board manufacturing, and in particular to a polytetrafluoroethylene film for etching circuit boards. Background Technology

[0002] In the production of printed circuit boards (PCBs), etching removes unwanted copper foil using chemical solutions (such as acidic copper chloride or alkaline ammonia) to form circuit patterns. Polytetrafluoroethylene (PTFE) film, due to its resistance to strong acids and alkalis, low surface hardness, and high temperature resistance, can be used as a temporary protective layer, covering areas that do not require etching to prevent corrosion from the chemical solutions. After the etching process is complete, the PTFE film is peeled off the PCB.

[0003] Currently, the production of polytetrafluoroethylene (PTFE) films requires machining, which produces parallel machining marks on the surface of the PTFE film. The presence of these machining marks affects the structural strength of the PTFE film.

[0004] Regarding the aforementioned technologies, the inventors believe that during use, when the surface of the polytetrafluoroethylene (PTFE) film is subjected to stress, it is prone to tearing along the direction of the machining marks, thereby preventing the PTFE film from being used normally. Utility Model Content

[0005] To reduce the possibility of polytetrafluoroethylene (PTFE) film cracking during use, this application provides a PTFE film for circuit board etching.

[0006] This application provides a polytetrafluoroethylene (PTFE) film for etching circuit boards, employing the following technical solution: A polytetrafluoroethylene (PTFE) film for etching circuit boards includes a PTFE film and a composite tensile layer. The PTFE film is circular, and the composite tensile layer is hot-pressed onto one side of the PTFE film.

[0007] By adopting the above technical solution, the composite tensile layer is hot-pressed onto one side of the PTFE membrane. When the PTFE membrane is subjected to external force, it provides tensile protection, helping to reduce the possibility of tearing. Through the cooperation between the PTFE membrane and the composite tensile layer, tensile protection of the PTFE membrane is achieved, effectively reducing the possibility of PTFE membrane rupture during use.

[0008] Optionally, the composite tensile layer is provided with a plurality of tensile filaments, which are arranged in parallel and the direction of the tensile filaments is perpendicular to the direction of the machining texture on the surface of the polytetrafluoroethylene film.

[0009] By adopting the above technical solution, the tensile filaments are set in the composite tensile layer, which further improves the structural strength of the composite tensile layer and further reduces the possibility of tearing of the PTFE film during use. Since the tensile filaments are set perpendicular to the machining grooves on the PTFE film surface, the possibility of the PTFE film tearing along its machining grooves is further reduced.

[0010] Optionally, the polytetrafluoroethylene (PTFE) membrane has stress-reducing grooves along its circumference on its side, and a plurality of stress-reducing grooves are provided on the edge of the PTFE membrane, with the ends of the stress-reducing grooves being rounded.

[0011] By adopting the above technical solution, the stress-reducing groove reduces the stress on the side of the PTFE membrane, and reduces the possibility of damage to the PTFE membrane due to impact on the edge during use.

[0012] Optionally, the polytetrafluoroethylene film is provided with a plurality of stamped grooves.

[0013] By adopting the above technical solution, the design of the stamping groove reduces the possibility of a vacuum being formed due to excessive adhesion between the PTFE film and the circuit board during the etching process, which facilitates the subsequent removal of the PTFE film. Optionally, a portion of the stamping grooves extend toward one side of the polytetrafluoroethylene film, while the remaining stamping grooves extend toward the other side of the polytetrafluoroethylene film.

[0014] By adopting the above technical solution, the stamping grooves are extended toward the opposite sides of the polytetrafluoroethylene film, which further reduces the possibility that the polytetrafluoroethylene film will fit too tightly with the structures on both sides during the etching process.

[0015] Optionally, an anti-UV layer is provided on the side of the composite tensile layer away from the polytetrafluoroethylene film.

[0016] By adopting the above technical solution, the UV-resistant layer provides ultraviolet protection for the composite tensile layer, reducing the possibility of the composite tensile layer aging due to sunlight exposure during use, which could lead to a decrease in strength.

[0017] Optionally, the edge of the polytetrafluoroethylene film is provided with an impact-resistant membrane along the circumferential direction.

[0018] By adopting the above technical solution, the impact-resistant membrane is placed on the edge of the polytetrafluoroethylene membrane, thereby protecting the edge of the polytetrafluoroethylene membrane and reducing the possibility of it being damaged by impact.

[0019] Optionally, the edge of the polytetrafluoroethylene membrane on the side where the composite tensile layer is provided is connected to a bending tab, and the bending tab is provided with a tension hole.

[0020] By adopting the above technical solution, after the etching operation of the circuit board is completed, the polytetrafluoroethylene film can be quickly peeled off from the circuit board through the bending blade and the pull hole set thereon. The setting of the bending blade makes it easy to remove the polytetrafluoroethylene film.

[0021] In summary, this application includes at least one of the following beneficial technical effects: 1. By combining the polytetrafluoroethylene (PTFE) film with the composite tensile layer, tensile protection of the PTFE film is achieved, which reduces the possibility of PTFE film cracking during use; 2. The UV-resistant layer provides ultraviolet protection for the composite tensile layer, reducing the possibility of the composite tensile layer aging due to sunlight exposure during use, which could lead to a decrease in strength. 3. The folding tabs facilitate the removal of the PTFE film. Attached Figure Description

[0022] Figure 1 This is a schematic diagram illustrating the structure of a polytetrafluoroethylene film for etching circuit boards, as described in this application.

[0023] Figure 2 This is a partial cross-sectional view used in the embodiments of this application to illustrate the polytetrafluoroethylene membrane.

[0024] Figure 3 yes Figure 2 Enlarged view of part A in the middle.

[0025] Explanation of reference numerals in the attached drawings: 1. Polytetrafluoroethylene membrane; 101. Positioning groove; 102. Stress-reducing groove; 103. Stamping groove; 2. Composite tensile layer; 3. Tensile filament; 4. UV-resistant layer; 5. Impact-resistant membrane; 6. Seam thread; 7. Bending piece; 71. Pull hole. Detailed Implementation

[0026] The following is in conjunction with the appendix Figure 1-3 This application will be further described in detail below. An embodiment of this application provides a polytetrafluoroethylene (PTFE) film for etching circuit boards, which has the effect of reducing the possibility of PTFE film 1 cracking during use.

[0027] Reference Figure 1 and Figure 2 A polytetrafluoroethylene (PTFE) film for etching circuit boards includes a PTFE film 1 and a composite tensile layer 2. The PTFE film 1 is in the shape of a circular sheet, and its presence is characterized by straight, parallel machined lines. The edges of the PTFE film 1 are provided with a plurality of positioning grooves 101 at equal angular intervals for positioning.

[0028] Reference Figure 1 and Figure 3The composite tensile layer 2 is hot-pressed onto one side of the polytetrafluoroethylene (PTFE) film 1. The composite tensile layer 2 is made of materials including, but not limited to, FEP (fluorinated ethylene propylene copolymer) and PFA (perfluoroalkoxy resin). Several tensile filaments 3 are arranged parallel to each other inside the composite tensile layer 2, and the direction of the tensile filaments 3 is perpendicular to the direction of the machining marks on the surface of the PTFE film 1.

[0029] Reference Figure 1 and Figure 3 A UV-resistant layer 4 is provided on the side of the composite tensile layer 2 away from the polytetrafluoroethylene (PTFE) film 1. An impact-resistant membrane 5 is provided circumferentially on the side edge of the PTFE film 1, and the impact-resistant membrane 5 is sewn to the edge of the PTFE film by a stitch 6. The impact-resistant membrane 5 is made of materials including but not limited to PFA or FEP, and the stitch 6 is made of PTFE. A stress-reducing groove 102 is formed circumferentially on the edge of the PTFE film 1, and the ends of the stress-reducing groove 102 are rounded. There is one stress-reducing groove 102 on each side of the PTFE film 1.

[0030] Reference Figure 1 The polytetrafluoroethylene (PTFE) membrane 1 has several stamped grooves 103 formed by stamping. Some of the stamped grooves 103 extend towards one side of the PTFE membrane 1, while the remaining stamped grooves 103 extend towards the other side of the PTFE membrane 1. Two bending tabs 7 are provided on the edge of the PTFE membrane 1 on the side where the composite tensile layer 2 is provided. The bending tabs 7 are provided with tension holes 71.

[0031] Reference Figure 1 and Figure 3 Because a composite tensile layer 2 is provided on one side of the polytetrafluoroethylene (PTFE) film 1, and several tensile filaments 3 are provided inside the composite tensile layer 2, the composite tensile layer 2 pulls the PTFE film 1. The tensile filaments 3 further reduce the possibility of the PTFE film 1 cracking along the machining marks. The impact-resistant membrane 5 reduces the possibility of the edge of the PTFE film 1 breaking under stress, and the stress-reducing groove 102 helps to reduce the possibility of the edge of the PTFE film 1 being damaged under external forces.

[0032] Reference Figure 1 and Figure 2The polytetrafluoroethylene (PTFE) film 1 has several stamped grooves 103 extending to both sides. These grooves reduce the possibility that the PTFE film 1 may adhere too tightly to the side structures during etching, making it difficult to remove. The UV-resistant layer 4 provides UV protection for the composite tensile layer 2, reducing the possibility of aging and cracking under sunlight. After etching the circuit board, the PTFE film 1 is peeled off from the etched circuit board using the bending tab 7.

[0033] The implementation principle of a polytetrafluoroethylene (PTFE) film for circuit board etching in this embodiment is as follows: the composite tensile layer 2 pulls the PTFE film 1, and the tensile filaments 3 further reduce the possibility of the PTFE film 1 cracking along the machining marks. The impact-resistant film 5 reduces the possibility of the edge of the PTFE film 1 breaking under stress, and the stress-reducing groove 102 helps reduce the possibility of the edge of the PTFE film 1 being damaged under external forces. The PTFE film 1 is provided with several stamping grooves 103 extending to both sides, and the stamping grooves 103 reduce the possibility that the PTFE film 1 will adhere too tightly to the side structures during the etching process, making it inconvenient to remove.

[0034] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A polytetrafluoroethylene film for etching circuit boards, characterized in that: It includes a polytetrafluoroethylene film (1) and a composite tensile layer (2), wherein the polytetrafluoroethylene film (1) is circular and the composite tensile layer (2) is hot-pressed onto one side of the polytetrafluoroethylene film (1).

2. The polytetrafluoroethylene film for etching circuit boards according to claim 1, characterized in that: The composite tensile layer (2) has a plurality of tensile filaments (3) arranged inside, and the tensile filaments (3) are arranged in parallel, with the arrangement direction of the tensile filaments (3) perpendicular to the machining direction of the surface of the polytetrafluoroethylene film (1).

3. The polytetrafluoroethylene film for etching circuit boards according to claim 1, characterized in that: The polytetrafluoroethylene membrane (1) has stress-reducing grooves (102) along its circumference on its side. Several stress-reducing grooves (102) are provided on the edge of the polytetrafluoroethylene membrane (1), and the ends of the stress-reducing grooves (102) are rounded.

4. The polytetrafluoroethylene film for etching circuit boards according to claim 1, characterized in that: The polytetrafluoroethylene membrane (1) is provided with a plurality of stamped grooves (103).

5. A polytetrafluoroethylene film for etching circuit boards according to claim 4, characterized in that: A portion of the stamping grooves (103) extend toward one side of the polytetrafluoroethylene film (1), while the remaining stamping grooves (103) extend toward the other side of the polytetrafluoroethylene film (1).

6. A polytetrafluoroethylene film for etching circuit boards according to claim 2, characterized in that: The composite tensile layer (2) has an anti-UV layer (4) on the side away from the polytetrafluoroethylene film (1).

7. A polytetrafluoroethylene film for etching circuit boards according to claim 6, characterized in that: The edge of the polytetrafluoroethylene membrane (1) is provided with an impact-resistant membrane (5) along the circumferential direction.

8. A polytetrafluoroethylene film for etching circuit boards according to claim 2, characterized in that: The edge of the polytetrafluoroethylene membrane (1) on the side where the composite tensile layer (2) is provided is connected to a bending piece (7), and the bending piece (7) is provided with a tension hole (71).

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