Wafer level detection mechanism

Abstract

The utility model relates to a kind of wafer level detection mechanisms, it includes the fixed frame for being fixed with the inner wall of wet method cavity;Hinged seat, the hinged seat is adjustably located on the fixed frame up and down;Mounting block and inductor, the mounting block has the mounting cavity of upside open, the rear end of this mounting block forms hinged joint, the front end of the mounting block has the inductive window corresponding with the inductor, the hinged joint and hinged seat are hinged by vertical bolt, nut on this vertical bolt is equipped, the inductor is fixed in the mounting cavity, its cable is passed hinged joint, hinged seat, fixed frame and inner wall to the wet method cavity outside rearward;Cover plate, the cover plate is detachably covered and is located on the mounting block to close the mounting cavity.The utility model avoids bottom corrosion environment, saves cavity space;While simplifying structure and optimizing cable sealing path, on the basis of satisfying angle and height manual adjustment function, significantly reduce cavity environmental pollution risk.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing technology, and in particular relates to a wafer leveling inspection mechanism. Background Technology

[0002] The wafer leveling inspection mechanism is used to detect whether the wafers on the washing tank (BOWL) are level or whether there are any wafers. It plays a vital role in semiconductor wet process equipment. Its presence ensures the normal operation of the equipment and avoids problems such as process defects caused by improper wafer positioning.

[0003] like Figure 7-9 As shown, the existing wafer level inspection mechanism 3 is installed at the bottom of the wet process chamber (corrosive gas environment). In order to provide manual adjustment of angle and height, its structural design is relatively complex, resulting in a large amount of exposed metal. Furthermore, the sensors are routed at the bottom of the wet process chamber, making the exposed metal parts and sensor cables susceptible to gas corrosion, resulting in a high risk of environmental pollution inside the chamber. In addition, being installed at the bottom of the wet process chamber occupies a large space, resulting in low utilization of the space inside the chamber. Utility Model Content

[0004] Based on this, a wafer level inspection mechanism is provided to address the aforementioned technical problems.

[0005] The technical solution adopted in this utility model is as follows:

[0006] A wafer leveling inspection mechanism, characterized in that it comprises:

[0007] A mounting bracket for fixing to the inner wall of the wet process chamber;

[0008] A hinge seat, the hinge seat being adjustable in height on the fixed frame;

[0009] The mounting block and sensor are mounted. The mounting block has an upper open mounting cavity. The rear end of the mounting block forms a hinge joint. The front end of the mounting block has a sensing window corresponding to the sensor. The hinge joint and the hinge seat are hinged by a vertical bolt and a nut on the vertical bolt. The sensor is fixed in the mounting cavity. Its cable passes through the hinge joint, the hinge seat, the fixing frame and the inner wall to the outside of the wet process cavity.

[0010] A cover plate, which is detachably installed on the mounting block to close the mounting cavity.

[0011] The beneficial effects of this utility model are as follows:

[0012] 1. The fixed position was changed from the bottom of the wet chamber to the inner wall, which avoids the corrosive gas environment at the bottom and also saves space;

[0013] 2. The structure is simple. While satisfying the manual adjustment function of angle and height, it reduces the exposure of metal. At the same time, the sensor cable is led from the hinge joint, hinge base, fixing frame and inner wall to the outside of the wet process chamber. While avoiding the corrosive gas environment at the bottom, the risk of environmental pollution inside the chamber is greatly reduced. Attached Figure Description

[0014] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments:

[0015] Figure 1 A three-dimensional structural schematic diagram of a wafer horizontal inspection mechanism provided for an embodiment of this utility model;

[0016] Figure 2 This is a vertical sectional view of an embodiment of the present utility model;

[0017] Figure 3 This is a rear view of the hinge seat and mounting block after assembly according to an embodiment of the present utility model.

[0018] Figure 4 for Figure 3 AA section view;

[0019] Figure 5 This is a schematic diagram of the fixing frame installed in the wet process chamber according to an embodiment of the present invention;

[0020] Figure 6 This is a top view of the wafer leveling inspection mechanism of this utility model installed in a wet processing chamber according to an embodiment of the present invention;

[0021] Figure 7 This is a schematic diagram showing the installation location of an existing wafer leveling inspection mechanism;

[0022] Figure 8 This is a schematic diagram of an existing wafer horizontal inspection mechanism;

[0023] Figure 9 This is an exploded view of an existing wafer level inspection facility. Detailed Implementation

[0024] The embodiments of this utility model will be described below with reference to the accompanying drawings. It should be noted that the embodiments described in this specification are not exhaustive and do not represent the only embodiments of this utility model. The following corresponding embodiments are only for clearly illustrating the utility model content of this patent and are not intended to limit its implementation. For those skilled in the art, different variations and modifications can be made based on the described embodiments. Any obvious variations or modifications that fall within the technical concept and utility model content of this utility model are also within the protection scope of this utility model.

[0025] like Figure 1 and Figure 2 As shown in the figure, this application provides a wafer level inspection mechanism, including a fixing frame 1100, a hinge seat 1200, a mounting block 1300, a sensor 1400, and a cover plate 1500.

[0026] like Figure 5 and Figure 6 As shown, the fixing bracket 1100 is used to fix to the inner wall 21 of the wet processing chamber 20, such as... Figure 1 As shown, it includes a vertical plate 1110. In this embodiment, the vertical plate 1110 is fixed to the inner sidewall 21 by welding.

[0027] The lower front side of the vertical plate 1110 has a horizontal support platform 1111. In this embodiment, the support platform 1111 includes two support blocks 1111a, which are symmetrically fixed to the lower front edge of the vertical plate 1110.

[0028] The front side of the hinge seat 1200 has a C-shaped opening 1210. The horizontal cross-section of the inner cavity of the C-shaped opening 1210 is semi-circular. In this embodiment, for ease of processing, the hinge seat 1200 is assembled from an upper part 1220 and a lower part 1230 and fixed by bolts and nuts.

[0029] The hinge seat 1200 has ears 1240 on both its left and right sides, corresponding vertically to two support blocks 1111a. Each ear 1240 has a waist-shaped hole 1241 extending vertically and horizontally. The hinge seat 1200 is fixed to the vertical plate 1110 via the waist-shaped hole 1241 and a horizontal bolt 1242 extending horizontally. Each ear 1240 has a set screw 1243 extending vertically. The lower end of the set screw 1243 contacts the corresponding support block 1111a vertically. By adjusting the set screw 1243, the hinge seat 1200 can slide vertically through the waist-shaped hole 1241 and the horizontal bolt 1242, thereby adjusting the vertical position of the hinge seat 1200 on the fixing frame 1100. Alternatively, the set screw can be located on the support block 1111a.

[0030] like Figure 1 and Figure 2 As shown, the mounting block 1300 has an open mounting cavity on the upper side. The rear end of the mounting block 1300 forms a hinge joint 1310, and the front end has a sensing window 1320 corresponding to the sensor 1400 for the sensor 1400 to transmit or receive signals. The horizontal cross section of the hinge joint 1310 is semi-circular and is located in the C-shaped opening 1210. The hinge joint 1310 and the hinge seat 1200 are hinged by vertical bolts 1311 passing through vertically and vertically and nuts 1312 provided on the vertical bolts 1311, so that the mounting block 1300 can be adjusted by swinging left and right.

[0031] The sensor 1400 is fixed in the mounting cavity by bolts, and its cable passes through the hinge joint 1310, the hinge seat 1200, the vertical plate 1110 and the inner wall 21 of the wet cavity to the outside of the wet cavity. Figure 4 The wiring channel 1313 on the hinge joint 1310 is shown.

[0032] The cover plate 1500 is detachably installed on the mounting block 1300 by bolts to close the mounting cavity. Its top has two slopes 1510 that extend diagonally downward from the middle to the left and right sides to drain the cleaning liquid remaining on the cover plate 1500 to the bottom of the wet chamber.

[0033] In this embodiment, the fixing bracket 1100, hinge seat 1200, mounting block 1300 and cover plate 1500 are all made of FMApprovals certified PVC or HT-PVC material, and the horizontal bolt 1242, vertical bolt 1311 and other bolts and nuts are all made of plastic material. Among them, the horizontal bolt 1242 and the vertical bolt 1311 can be made of M8 PEEK bolts.

[0034] In specific application scenarios, such as Figure 6 As shown, two wafer level detection mechanisms 1 are respectively installed on two opposite inner walls 21 of the wet process chamber. The sensor 1400 of one wafer level detection mechanism 1 is used to transmit signals, and the sensor 1400 of the other wafer level detection mechanism 1 is used to receive signals, thereby detecting whether the wafers on the cleaning tank 22 (BOWL) are level or whether there are any wafers. The installation process of a single wafer level detection mechanism 1 is as follows:

[0035] 1. Weld a fixing bracket 1100 onto the inner wall 21 according to the height of the BOWL;

[0036] 2. Secure the hinge seat 1200 to the fixing frame 1100 using horizontal bolts 1242;

[0037] 3. Fix the sensor 1400 in the mounting cavity of the mounting block 1300, lock the cover plate 1500, and then hinge the assembly to the hinge seat 1200 with the vertical bolts 1311 and nuts 1312. The angle can be adjusted arbitrarily according to the usage requirements. After the adjustment is completed, lock it with nuts 1312. The cable of the sensor 1400 passes through the hinge joint 1310, the hinge seat 1200, the vertical plate 1110 and the inner wall 21 of the wet process cavity, and is finally led out of the wet process cavity.

[0038] 4. Adjust the overall height using set screw 1243 according to the wafer height. In addition, if the overall height may slip after long-term use, resulting in inaccurate height position, the height position can be calibrated using set screw 1243.

[0039] As can be seen from the above, the wafer level inspection mechanism provided in this application has the following beneficial effects:

[0040] 1. The fixed position was changed from the bottom of the wet chamber to the inner wall, which avoids the corrosive gas environment at the bottom and also saves space;

[0041] 2. The structure is simple. While satisfying the manual adjustment function of angle and height, it reduces the exposure of metal. At the same time, the sensor cable is led from the hinge joint, hinge base, fixing frame and inner wall to the outside of the wet process chamber. While avoiding the corrosive gas environment at the bottom, the risk of environmental pollution inside the chamber is greatly reduced.

[0042] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A wafer leveling inspection mechanism, characterized in that, include: A mounting bracket for fixing to the inner wall of the wet process chamber; A hinge seat, the hinge seat being adjustable in height on the fixed frame; The mounting block and sensor are mounted. The mounting block has an upper open mounting cavity. The rear end of the mounting block forms a hinge joint. The front end of the mounting block has a sensing window corresponding to the sensor. The hinge joint and the hinge seat are hinged by a vertical bolt and a nut on the vertical bolt. The sensor is fixed in the mounting cavity. Its cable passes through the hinge joint, the hinge seat, the fixing frame and the inner wall to the outside of the wet process cavity. A cover plate, which is detachably installed on the mounting block to close the mounting cavity.

2. The wafer leveling inspection mechanism according to claim 1, characterized in that, The fixing frame includes a vertical plate, which is fixed to the inner side wall. The lower side of the vertical plate has a horizontal support platform. The left and right sides of the hinge seat have ears. The ears have waist-shaped holes extending in the vertical and front-back directions. The hinge seat is fixed to the vertical plate through the waist-shaped holes and horizontal bolts in the front-back direction. The ears and the support platform are provided with set screws in the vertical direction.

3. The wafer leveling inspection mechanism according to claim 2, characterized in that, The support platform includes two support blocks, which are symmetrically fixed to the lower edge of the front of the vertical plate. The two support blocks correspond vertically to the two ears.

4. A wafer leveling inspection mechanism according to claim 2, characterized in that, The set screw is located on the ear, and its lower end contacts the corresponding support block.

5. A wafer leveling inspection mechanism according to claim 1, characterized in that, The front side of the hinge seat has a C-shaped opening, the horizontal cross-section of the inner cavity of the C-shaped opening is semi-circular, and the horizontal cross-section of the hinge joint is semi-circular, which is located inside the C-shaped opening.

6. A wafer leveling inspection mechanism according to claim 1, characterized in that, The top of the cover plate has two sloping surfaces that extend downwards from the middle to the left and right sides.

7. A wafer leveling inspection mechanism according to claim 1, characterized in that, The cover plate is fixed to the mounting block by bolts.

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