IDC server for geographic information processing

Abstract

The utility model relates to an IDC server for geographic information processing, including IDC case, a plurality of IDC server nodes, power module, data exchange module and node monitoring system, be equipped with the node installation cavity and function cavity that independently distribute up and down in IDC case, the installation area that is set up side by side and is respectively through IDC case both ends is divided into a plurality of installation areas in node installation cavity through the baffle, a plurality of IDC server nodes are respectively inserted in every installation area from one end of IDC case one -to -one correspondence, power module and data exchange module are arranged in function cavity, power module is connected with IDC server node and data exchange module electricity respectively, data exchange module is connected with IDC server node electricity respectively, and node monitoring system includes screen and singlechip, and the singlechip is installed in function cavity, and the singlechip is connected with screen, power module and data exchange module electricity respectively. Advantages: can monitor the running condition of every node through monitoring system, and it is convenient to dismouting debugging.

Description

Technical Field

[0001] This utility model relates to the field of server device technology, and in particular to an IDC server for geographic information processing. Background Technology

[0002] IDC (Internet Data Center) servers refer to specialized server equipment hosted in IDC (Internet Data Center) server rooms, used to provide internet services, data storage, computing resources, and various network applications. It is a core component of IDC infrastructure. Currently, Geographic Information Systems (GIS) have accumulated massive amounts of diverse geographic information data. With the advent of the big data era, it is necessary to explore more diverse and accurate measurement methods for acquiring geographic information data. Although the existing geographic data is extremely large in volume, its accuracy is relatively low. Much geographic data is generated after further processing of satellite imagery, and its accuracy and precision cannot meet the needs of current application scenarios. Currently, existing servers lack display modules, making it impossible to quickly find the hardware information and operating status of corresponding nodes during use.

[0003] Therefore, it is necessary to develop an IDC server for geographic information processing to solve the above-mentioned technical problems. Utility Model Content

[0004] The technical problem to be solved by this utility model is to provide an IDC server for geographic information processing, which effectively overcomes the defects of the prior art.

[0005] The technical solution of this utility model to solve the above-mentioned technical problems is as follows:

[0006] An IDC server for geographic information processing includes an IDC chassis, multiple IDC server nodes, a power module, a data exchange module, and a node monitoring system. The IDC chassis has independently distributed node mounting cavities and functional cavities. Each node mounting cavity is divided by partitions into multiple parallel mounting areas that connect to both ends of the IDC chassis. The multiple IDC server nodes are inserted one-to-one from one end of the IDC chassis into each of the mounting areas. The power module and data exchange module are located in the functional cavities. The power module is electrically connected to both the multiple IDC server nodes and the data exchange module. The multiple data exchange modules are electrically connected to each of the IDC server nodes. The node monitoring system includes a screen and a microcontroller. The microcontroller is mounted in the functional cavity and is electrically connected to the screen, the power module, and the data exchange module. There are eight IDC server nodes.

[0007] Based on the above technical solution, the present invention can be further improved as follows.

[0008] Furthermore, the aforementioned IDC chassis is a rectangular box, which includes a bottom shell, a cover plate, and a top cover, all of which are open at the top and both ends. The top cover is detachably mounted on the upper opening of the bottom shell. The cover plate is disposed between the inner walls of both sides of the bottom shell and close to the top cover. The cover plate and the bottom shell define the aforementioned node mounting cavity, and the cover plate and the top cover define the aforementioned functional cavity.

[0009] Furthermore, the aforementioned power module includes multiple power boxes, a power connection circuit board, and a power adapter fixing plate. The power adapter fixing plate is detachably mounted between the other end of the cover plate and the top cover. The power adapter fixing plate has multiple mounting holes corresponding to the power boxes. The multiple power boxes are inserted into the mounting holes one by one, and their ends are detachably connected to the power adapter fixing plate. The power connection circuit board is mounted on the upper part of the cover plate. The multiple power boxes are electrically connected to the power connection circuit board, and are electrically connected to the multiple IDC server nodes, data exchange modules, and node monitoring systems through the power connection circuit board.

[0010] Furthermore, the aforementioned power supply box has four units.

[0011] Furthermore, one end of the top cover is bent downward to form a sealing plate, and a screen mounting opening is provided on the sealing plate. The screen is installed into the functional cavity through the screen mounting opening and can be pulled out or pushed in through the screen mounting opening. The microcontroller is mounted on the upper part of the cover plate.

[0012] Furthermore, each of the two sides of one end of the bottom shell is provided with a vertically outward-folding node ear side plate for installation and connection with the cabinet, and one end of the node ear side plate is provided with a first handle.

[0013] Furthermore, the aforementioned IDC server node includes a long, narrow box, a motherboard, a graphics card module, a cooling fan assembly, and a power adapter board. One side of the box is open, and the motherboard, graphics card module, and cooling fan assembly are respectively installed on the other side wall inside the box. The motherboard is located near one end of the box, and the cooling fan assembly is positioned between the motherboard and the graphics card module. The exhaust direction of the cooling fan assembly is towards one end of the box. Ventilation openings are provided on both end side walls of the box. The power adapter board is installed on one side wall of the box and is electrically connected to the power module.

[0014] Furthermore, the motherboard has a slotted air guide shroud with open ends at the corresponding chip position. The slot of the air guide shroud fits into the motherboard. One end of the air guide shroud is close to one end of the housing. The other end of the air guide shroud extends to the cooling fan assembly. The cooling fan assembly has multiple cooling fans arranged vertically in a row inside. At least two of the cooling fans are located inside the other end of the air guide shroud, and at least one of the cooling fans is located outside the other end of the air guide shroud.

[0015] The advantages of this utility model are: the structure is reasonably designed, the operation status of each node can be monitored through the monitoring system, and it is convenient to disassemble and debug. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of the IDC server for geographic information processing according to this utility model.

[0017] Figure 2 This is an exploded view of the structure of the IDC server for geographic information processing according to this utility model.

[0018] Figure 3 This is a schematic diagram of the structure of the IDC server for geographic information processing according to this utility model after the top plate is removed;

[0019] Figure 4 This is a schematic diagram of the structure of the IDC server node in the IDC server for geographic information processing according to this utility model.

[0020] Figure 5 This is a module connection diagram of the various electrical components in the IDC server for geographic information processing according to this utility model;

[0021] Figure 6 This is a network signal connection topology diagram of the IDC server used for geographic information processing according to this utility model.

[0022] The attached diagram lists the components represented by each number as follows:

[0023] 1. IDC Chassis; 2. IDC Server Node; 3. Power Module; 4. Data Exchange Module; 11. Bottom Shell; 12. Cover Plate; 13. Top Cover; 21. Box Body; 22. Motherboard; 23. Graphics Card Module; 24. Cooling Fan Assembly; 25. Power Supply Adapter Board; 26. Air Guide Cover; 31. Power Supply Box; 32. Power Connection Circuit Board; 33. Power Adapter Fixing Plate; 51. Screen; 52. Microcontroller; 111. Partition; 112. Node Ear Side Plate; 113. First Handle; 131. Sealing Plate; 215. Vent; 242. Cooling Fan. Detailed Implementation

[0024] The principles and features of this utility model are described below with reference to the accompanying drawings. The examples given are only for explaining this utility model and are not intended to limit the scope of this utility model.

[0025] Example

[0026] like Figure 1 , 2 As shown in Figures 3, 5, and 6, the IDC server for geographic information processing in this embodiment includes an IDC chassis 1, multiple IDC server nodes 2, a power module 3, a data exchange module 4, and a node monitoring system. The IDC chassis 1 has independently distributed node mounting cavities and functional cavities. The node mounting cavities are divided into multiple parallel mounting areas that are connected to both ends of the IDC chassis 1 by partitions 111. The multiple IDC server nodes 2 are inserted into each of the mounting areas one by one from one end of the IDC chassis 1. The power module 3 and the data exchange module 4 are located in the functional cavities. The power module 3 is electrically connected to the multiple IDC server nodes 2 and the data exchange module 4, and the multiple data exchange modules 4 are electrically connected to each of the IDC server nodes 2. The node monitoring system includes a screen 51 and a microcontroller 52. The microcontroller 52 is installed in the functional cavities and is electrically connected to the screen 51, the power module 3, and the data exchange module 4. There are eight IDC server nodes 2.

[0027] The IDC server for geographic information processing in this embodiment has a reasonable internal structure design of IDC chassis 1, which makes multiple internal electrical components reasonably arranged in the corresponding cavities, facilitating disassembly, assembly, maintenance and repair. At the same time, the node monitoring system can effectively monitor the operating status of each node, which is convenient for disassembly and debugging.

[0028] In a preferred embodiment, the IDC chassis 1 is a rectangular box, which includes a bottom shell 11, a cover plate 12, and a top cover 13, all of which are open at the top and both ends. The top cover 13 is detachably mounted on the upper opening of the bottom shell 11. The cover plate 12 is disposed between the inner walls of the two sides of the bottom shell 11 and close to the top cover 13. The cover plate 12 and the bottom shell 11 define the node mounting cavity, and the cover plate 12 and the top cover 13 define the functional cavity.

[0029] In the above implementation scheme, the IDC chassis 1 adopts a traditional rectangular shape, with a simple and aesthetically pleasing structure. The bottom shell 11 is integrally cast, and the top cover 13 has flanged edges on both sides, which are fastened to the upper sides of the bottom shell 11 and assembled with screws. The cover plate 12 has flanged edges on both sides, which fit against the inner walls of the two sides of the IDC chassis 1 and are assembled with the bottom shell 11 by welding or screw fixing. The overall internal layout is very reasonable, facilitating the compact installation of the IDC server nodes 2 and other electrical components, allowing for an extremely miniaturized overall server size. Multiple installation areas are distributed side-by-side between the two sides of the IDC chassis 1.

[0030] In a preferred embodiment, the power module 3 includes multiple power boxes 31, a power connection circuit board 32, and a power adapter fixing plate 33. The power adapter fixing plate 33 is detachably mounted between the other end of the cover plate 12 and the top cover 13. The power adapter fixing plate 33 has multiple mounting holes corresponding to the power boxes 31. The multiple power boxes 31 are inserted into the mounting holes one by one, and their ends are detachably connected to the power adapter fixing plate 33. The power connection circuit board 32 is mounted on the upper part of the cover plate 12. The multiple power boxes 31 are electrically connected to the power connection circuit board 32, and are also electrically connected to the multiple IDC server nodes 2, the data exchange module 4, and the node monitoring system (e.g., ...) through the power connection circuit board 32. Figure 5 (As shown).

[0031] In the above implementation scheme, the power adapter fixing plate 33 can seal the other end of the functional cavity and also facilitates the installation of the power supply box 31. The power connection circuit board 32 mainly serves as an adapter for electrical connection between the power supply box 31 and other electrical components, facilitating the circuit connection of internal electrical components. This power connection circuit board 32 is a product of existing technology, and an appropriate model can be used in the actual product. In addition, all electrical components in the server are classified and connected to multiple power supply boxes 31 to achieve independent power supply.

[0032] Preferably, the power supply box 31 is provided with four.

[0033] In a preferred embodiment, one end of the top cover 13 is bent downward to form a sealing plate 131. The sealing plate 131 has a screen mounting opening. The screen 51 is inserted into the functional cavity through the screen mounting opening and can be pulled out or pushed in through the screen mounting opening. The microcontroller 52 is mounted on the upper part of the cover plate 12.

[0034] In this embodiment, screen 51 is a touch-sensitive smart screen (LCD screen) with an outer shell to prevent damage from impacts. Screen 51 is connected to microcontroller 52, which contains a pre-written control program. Through connection with data exchange module 4, it can monitor the operating status of each IDC server node 2. Screen 51 uses a pull-out assembly, allowing it to be pulled out from the screen mounting opening at the cover plate 131 for use, or pushed into the functional cavity for concealment when not in use, providing good protection.

[0035] More specifically, when using it, such as Figure 6 As shown, the microcontroller 52, controlled by screen 51, initiates a program command request, establishes a link with each IDC server node 2 through the data exchange module 4, calls the node's running data, and summarizes it on screen 51.

[0036] Preferably, the bottom shell 11 has vertically outward-curving node ear side plates 112 on both sides of one end for connection with the rack. Each node ear side plate 112 has a first handle 113 at one end. During installation, the entire server is pushed into the corresponding mounting cavity in the rack. After being pushed in, the node ear side plates 112 on both sides fit against the sides of the mounting cavity port and are connected by screws that pass through the node ear side plates 112 and the sides of the port. When removal is required, the screws are removed, and the entire server can be pulled out, making the operation very convenient.

[0037] In this embodiment, the data exchange module 4 consists of 8 10 Gigabit Ethernet ports and 4 10 Gigabit optical ports. The 8 10 Gigabit Ethernet ports are connected to 8 IDC server nodes 2 respectively. The screen 51 of the node monitoring system is connected to one 10 Gigabit optical port through a photoelectric conversion module. The two 10 Gigabit optical ports are connected to the rear of the IDC chassis 1 (that is, the other end of the IDC chassis 1) through an LC-LC fiber optic coupler.

[0038] As a preferred implementation method, such as Figure 4 As shown, the aforementioned IDC server node 2 includes a long, narrow box 21, a motherboard 22, a graphics card module 23, a cooling fan assembly 24, and a power supply adapter board 25. The box 21 has an open side. The motherboard 22, graphics card module 23, and cooling fan assembly 24 are respectively installed on the other side wall inside the box 21. The motherboard 22 is closer to one end of the box 21. The cooling fan assembly 24 is located between the motherboard 22 and the graphics card module 23. The airflow direction of the cooling fan assembly 24 is towards one end of the box 21. Ventilation vents 215 are respectively provided on the two side walls of the box 21. The power supply adapter board 25 is installed on one side wall of the box 21 and is electrically connected to the power module 3.

[0039] In the above implementation scheme, the airflow generated by the cooling fan assembly 24 follows a "straight-through" path, meaning that air enters from the other end of the housing 21, exits through a vent 215, and during this process, the airflow passes over the motherboard 22, carrying away the heat generated by the heat-generating electrical components on the motherboard 22. The airflow flows straight through the housing 21 from one end to the other. This straight-through airflow cooling method effectively reduces resistance and significantly improves heat dissipation performance. Furthermore, the internal space layout of the housing 21 is optimized, enhancing hardware expandability while ensuring heat dissipation performance.

[0040] In this embodiment, one end of the box 21 is connected to one end of the corresponding installation area through an existing snap-fit ​​structure (such as the CN214954853U computer chassis mounting snap-fit ​​structure, a in the figure refers to this), which can achieve quick locking. When disassembling, the snap-fit ​​connection can be released and the box 21 can be pulled out.

[0041] Preferably, the motherboard 22 has a slotted air guide shroud 26 with open ends at the corresponding chip positions. The slots of the air guide shroud 26 fit snugly against the motherboard 22. One end of the air guide shroud 26 is close to one end of the housing 21, and the other end extends to the cooling fan assembly 24. The cooling fan assembly 24 has multiple cooling fans 242 arranged vertically in a row inside, with at least two cooling fans 242 located inside the other end of the air guide shroud 26 and at least one cooling fan 242 located outside the other end of the air guide shroud 26. This design ensures that the air blown by at least two cooling fans 242 enters the air guide shroud 26, which covers the important electronic components (chips) on the motherboard 22. Therefore, the air guide shroud 26 effectively dissipates heat from the important electronic components on the motherboard 22, resulting in better heat dissipation performance and improved operation of the motherboard 22. Meanwhile, multiple cooling fans 242 cover the areas of the two side walls of the box 21 and blow directly onto them, so there are no blind spots in heat dissipation, making the entire IDC server node 2 run relatively stably.

[0042] In this embodiment, the other end of the aforementioned air guide shroud 26 is narrowed, and a second handle is provided on the outer side of one end of the aforementioned box body 21. The airflow blown out by the cooling fan 242 enters through the narrower air inlet at the other end of the air guide shroud 26, which enhances the air pressure and allows it to quickly enter the interior of the air guide shroud 26, promoting airflow and indirectly improving heat dissipation performance. At the same time, the design of the second handle (represented by b in the figure) facilitates the pulling out of the disassembled IDC server node 2 by holding the second handle during maintenance.

[0043] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0044] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0045] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0046] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0047] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0048] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. An IDC server for geographic information processing, characterized in that: The system includes an IDC chassis (1), multiple IDC server nodes (2), a power module (3), a data exchange module (4), and a node monitoring system. The IDC chassis (1) has independently distributed node mounting cavities and functional cavities. Each node mounting cavity is divided into multiple parallel mounting areas that connect to both ends of the IDC chassis (1) by a partition (111). Multiple IDC server nodes (2) are inserted one-to-one from one end of the IDC chassis (1) into each mounting area. The power module (3) and data exchange module... (4) The power supply module (3) is electrically connected to multiple IDC server nodes (2) and data exchange module (4) respectively, and the multiple data exchange modules (4) are electrically connected to each IDC server node (2). The node monitoring system includes a screen (51) and a microcontroller (52). The microcontroller (52) is installed in the functional cavity. The microcontroller (52) is electrically connected to the screen (51), the power supply module (3) and the data exchange module (4) respectively. There are eight IDC server nodes (2).

2. An IDC server for geographic information processing according to claim 1, characterized in that: The IDC chassis (1) is a rectangular box. The box includes a bottom shell (11) with openings at the top and both ends, a cover plate (12) and a top cover (13). The top cover (13) is detachably installed at the upper opening of the bottom shell (11). The cover plate (12) is located between the inner walls of the two sides of the bottom shell (11) and close to the top cover (13). The cover plate (12) and the bottom shell (11) define the node mounting cavity, and the cover plate (12) and the top cover (13) define the functional cavity.

3. An IDC server for geographic information processing according to claim 2, characterized in that: The power module (3) includes multiple power boxes (31), a power connection circuit board (32), and a power adapter fixing plate (33). The power adapter fixing plate (33) is detachably mounted between the other end of the cover plate (12) and the top cover (13). The power adapter fixing plate (33) has multiple mounting holes corresponding to the power boxes (31). The multiple power boxes (31) are inserted into the mounting holes one by one, and their ends are detachably connected to the power adapter fixing plate (33). The power connection circuit board (32) is mounted on the upper part of the cover plate (12). The multiple power boxes (31) are electrically connected to the power connection circuit board (32) respectively, and are electrically connected to the multiple IDC server nodes (2), data exchange module (4), and node monitoring system respectively through the power connection circuit board (32).

4. An IDC server for geographic information processing according to claim 3, characterized in that: The power supply box (31) has four.

5. An IDC server for geographic information processing according to claim 2, characterized in that: One end of the top cover (13) is bent downward to form a sealing plate (131). The sealing plate (131) has a screen mounting opening. The screen (51) is installed into the functional cavity through the screen mounting opening and can be pulled out or pushed in through the screen mounting opening. The microcontroller (52) is mounted on the upper part of the cover plate (12).

6. An IDC server for geographic information processing according to claim 2, characterized in that: The bottom shell (11) has vertically outward-turned node ear side plates (112) on both sides of one end, which are used for installation and connection with the cabinet. The node ear side plate (112) has a first handle (113) at one end.

7. An IDC server for geographic information processing according to any one of claims 1 to 6, characterized in that: The IDC server node (2) includes a long box (21), a motherboard (22), a graphics card module (23), a cooling fan assembly (24), and a power adapter board (25). One side of the box (21) is open. The motherboard (22), the graphics card module (23), and the cooling fan assembly (24) are respectively installed on the other side wall inside the box (21). The motherboard (22) is close to one end of the box (21). The cooling fan assembly (24) is located between the motherboard (22) and the graphics card module (23). The air outlet of the cooling fan assembly (24) is directed towards one end of the box (21). Ventilation vents (215) are provided on the two side walls of the box (21). The power adapter board (25) is installed on one side wall of the box (21) and is electrically connected to the power module (3).

8. An IDC server for geographic information processing according to claim 7, characterized in that: The motherboard (22) has a slotted air guide shroud (26) with open ends at the corresponding chip position. The slot of the air guide shroud (26) fits the motherboard (22). One end of the air guide shroud (26) is close to one end of the housing (21). The other end of the air guide shroud (26) extends to the cooling fan assembly (24). The cooling fan assembly (24) has multiple cooling fans (242) arranged vertically in a row inside. At least two of the cooling fans (242) are located inside the other end of the air guide shroud (26), and at least one of the cooling fans (242) is located outside the other end of the air guide shroud (26).

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