Variable frequency drive and laundry treating apparatus
Patent Information
- Application Number
- CN202520794966.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-24
- Publication Date
- 2026-08-18
- Estimated Expiration
- 2035-04-24
AI Technical Summary
[0024]本申请实施例提供的变频驱动器和衣物处理设备，供风装置设置于散热器上，能够减少安装供风装置所占用的空间体积，使变频驱动器结构布局更加紧凑。同时，散热器通过热传导、热辐射或热对流散发功率器件的热量，供风装置通过气流将热量带走，能够提高对功率器件的散热效率，提高降温效率，进而延长功率器件的使用寿命。
Smart Images
Figure CN224653811U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of household appliance technology, and more particularly to a frequency converter and a clothing processing device. Background Technology
[0002] In related technologies, heat pump dryers utilize inverter drivers, which offer advantages in energy saving, pressure control precision, extended service life, reduced operating costs, lower noise levels, and reduced impact on the power grid. During the drying process, the inverter driver in a heat pump dryer can reach a maximum power of 850W. The driver operates in a relatively sealed environment with a relatively high ambient temperature, exceeding 60°C. Therefore, heat dissipation measures are necessary for the power components within the inverter driver to reduce its temperature. Utility Model Content
[0003] In view of this, embodiments of this application aim to provide a frequency converter and a clothing processing device that can perform heat dissipation treatment on the power devices in the frequency converter.
[0004] A first aspect of this application provides a frequency converter driver, comprising:
[0005] Circuit board;
[0006] Power devices are mounted on the circuit board;
[0007] A heat sink, configured to dissipate heat from the power device;
[0008] An air supply device is installed on the radiator to supply air to the radiator for heat dissipation.
[0009] In some embodiments, the heat sink includes:
[0010] A heat sink, wherein the power device is at least partially in contact with the heat sink;
[0011] A heat sink, wherein a plurality of heat sinks are spaced apart on the heat sink plate, the plurality of heat sinks forming a recess, and the air supply device is installed in the recess.
[0012] In some embodiments, the heat sink is divided into:
[0013] First heat sink;
[0014] The second heat sink has multiple first heat sinks located on both sides of multiple second heat sinks. The height of the first heat sink is greater than the height of the second heat sink, so that the second heat sink forms the recessed portion. The air supply device is installed on the second heat sink.
[0015] In some embodiments, the heat sink includes a first heat dissipation section and a second heat dissipation section, with the two first heat dissipation sections located on opposite sides of the second heat dissipation section. The height of the first heat dissipation section is greater than the height of the second heat dissipation section, so that the second heat dissipation section forms the recessed portion. The air supply device is installed on the second heat dissipation section.
[0016] In some embodiments, the height of the air supply device is greater than the height of the radiator.
[0017] In some embodiments, the height of the air supply device is less than or equal to the height of the radiator.
[0018] In some embodiments, the heat sink includes:
[0019] A heat sink, wherein the power device is at least partially in contact with the heat sink;
[0020] A heat sink, wherein a plurality of heat sinks are spaced apart on the heat sink plate, and the air supply device is installed on at least one side of the extending direction of the heat sink so that the air supply device supplies air to the extending direction of the heat sink.
[0021] In some embodiments, the power device includes a smart power module, a rectifier bridge, and a PFC power transistor, wherein the smart power module and the rectifier bridge are respectively connected to the heat sink.
[0022] In some embodiments, the heat sink is connected to the circuit board.
[0023] In some embodiments, the air supply device is a fan or blower.
[0024] The variable frequency drive and clothing processing equipment provided in this application embodiment have an air supply device mounted on a radiator, which reduces the space occupied by the air supply device and makes the variable frequency drive structure more compact. Simultaneously, the radiator dissipates heat from the power devices through heat conduction, heat radiation, or heat convection, and the air supply device carries away the heat through airflow, improving the heat dissipation efficiency of the power devices, increasing cooling efficiency, and thus extending the service life of the power devices.
[0025] A second aspect of this application provides a garment processing device, including the frequency converter driver described in any one of the embodiments of this application.
[0026] In some embodiments, the clothing processing equipment is a heat pump dryer.
[0027] The garment processing equipment provided in this application embodiment has the same beneficial effects as the aforementioned frequency converter because it includes the frequency converter described above. Attached Figure Description
[0028] Figure 1This is a partial structural diagram of the frequency converter driver in the first embodiment of this application;
[0029] Figure 2 This is a schematic diagram of the circuit board and power device in one embodiment of this application;
[0030] Figure 3 for Figure 1 A schematic diagram of the inverter driver from another perspective;
[0031] Figure 4 for Figure 1 A schematic diagram of the heat sink in the inverter driver shown.
[0032] Figure 5 This is a partial structural diagram of the frequency converter driver in the second embodiment of this application;
[0033] Figure 6 for Figure 5 A schematic diagram of the heat sink in the inverter driver shown.
[0034] Figure 7 This is a partial structural diagram of the frequency converter driver in the third embodiment of this application.
[0035] Explanation of reference numerals in the attached figures
[0036] 100. Variable frequency drive; 10. Circuit board; 20. Power device; 21. Intelligent power module; 22. Rectifier bridge; 23. PFC power transistor; 30. Heat sink; 31. Heat sink plate; 32. Heat sink fin; 32a. Recess; 321. First heat sink fin; 322. Second heat sink fin; 323. First heat dissipation section; 324. Second heat dissipation section; 35. Heat sink block; 40. Air supply device; X, First direction; Y, Second direction; Z, Third direction. Detailed Implementation
[0037] The embodiments of this application will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this application, but should not be used to limit the scope of this application.
[0038] It should be noted that in the embodiments of this application, the orientations or positional relationships such as "upper" and "lower" are based on the orientations or positional relationships shown in the accompanying drawings. It should be understood that these orientational terms are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The application will be further described in detail below with reference to the accompanying drawings and specific embodiments. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0039] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application based on the specific circumstances.
[0040] In the embodiments of this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature and the second feature are in direct contact, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0041] In the description of this specification, references to terms such as "some embodiments," "exemplary," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the embodiments of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine the different embodiments or examples described in this application, as well as the features of those different embodiments or examples.
[0042] In related technologies, when a heat pump dryer is performing the drying operation, the maximum power of the inverter driver can reach 850W. The inverter driver is in a relatively sealed environment with a high ambient temperature, which can reach above 60°C. To prevent the inverter driver from overheating, heat dissipation measures are required for the power components within the inverter driver.
[0043] In view of this, embodiments of this application provide a variable frequency drive capable of heat dissipation for the power devices within the variable frequency drive. The variable frequency drive can be used in clothing handling equipment such as dryers, which may be, for example, heat pump dryers.
[0044] Please see Figures 1-7 The frequency converter 100 includes a circuit board 10, a power device 20, a heat sink 30, and an air supply device 40. The power device 20 is disposed on the circuit board 10; the heat sink 30 is configured to dissipate heat from the power device 20; and the air supply device 40 is disposed on the heat sink 30 to supply air to the heat sink 30 for heat dissipation.
[0045] Circuit board 10 is, for example, a printed circuit board, i.e., a PCB board. Circuit board 10 provides mounting positions for power devices 20 and enables signal transmission and power distribution through wiring so that power devices 20 can operate normally and perform their functions.
[0046] The power device 20 is a core component of the frequency converter drive 100, enabling functions such as power conversion and control, overcurrent protection, overvoltage protection, and short-circuit protection. For example, please refer to... Figure 2 The power device 20 includes, for example, an intelligent power module 21, a rectifier bridge 22, and a PFC power transistor 23. The intelligent power module 21 integrates power switches, drive circuits, and protection circuits into a single module. The rectifier bridge 22 converts the input AC power into DC power, providing a stable DC power supply for the subsequent inverter circuit. The PFC power transistor 23 controls the waveform of the input current, synchronizing it with the input voltage waveform to improve the power factor and reduce harmonic content. For an example, please refer to [link to example description]. Figure 3 The intelligent power module 21 and rectifier bridge 22 are respectively connected to the heat sink 30. The intelligent power module 21 and rectifier bridge 22 provide support for the heat sink 30. Simultaneously, the intelligent power module 21 and rectifier bridge 22, connected to the heat sink 30, can transfer heat to the heat sink 30 through heat conduction, improving heat dissipation. Exemplarily, the PFC power transistor 23 is spaced apart from the heat sink 30. In other embodiments not shown, the heat sink 30 can be connected to the circuit board 10. For example, the heat sink 30 has mounting posts that connect to the circuit board 10, the height of which is configured to avoid obstructing the power device 20, facilitating its installation.
[0047] The heat sink 30 dissipates heat generated by the power device 20 through heat conduction, heat radiation, or heat convection. The structure of the heat sink 30 is not limited; exemplarily, the heat sink 30 is a single-piece molded part to reduce assembly and disassembly steps and improve structural strength. The material of the heat sink 30 can be selected according to requirements. For example, the material of the heat sink 30 can be aluminum, which is beneficial for achieving structural strength and reducing production costs. Alternatively, the material of the heat sink 30 can be copper to improve heat dissipation efficiency. The heat sink 30 can also be a semiconductor material.
[0048] The air supply device 40 is used to provide airflow to the radiator 30 for cooling. For example, the air supply device 40 can be a fan or blower, capable of supplying air to the radiator 30 for heat dissipation, such as blowing air onto the radiator 30 or drawing air into the radiator 30, thereby removing heat from the radiator 30 through airflow. The specific location of the air supply device 40 on the radiator 30 is not limited; it can be located above the radiator 30 or at least on one side of the radiator 30. "At least on one side" refers to being located on one or both sides of the radiator 30.
[0049] For example, the air supply device 40 and the power device 20 are located on both sides of the radiator 30.
[0050] For example, the air supply device 40 is mounted on the radiator 30 by fasteners, such as screws.
[0051] In this embodiment, the air supply device 40 is mounted on the radiator 30, which reduces the space occupied by the air supply device 40 and makes the structure of the frequency converter 100 more compact. Simultaneously, the radiator 30 dissipates heat from the power device 20 through heat conduction, heat radiation, or heat convection, and the air supply device 40 carries away the heat through airflow, improving the heat dissipation efficiency of the power device 20, increasing cooling efficiency, and thus extending the service life of the power device 20.
[0052] For example, there are multiple power devices 20, and the multiple power devices 20 are cooled by a single heat sink 30. In this way, the structure can be simplified compared to configuring a separate heat dissipation structure for each power device 20.
[0053] In some embodiments, please refer to Figure 3 and 4 The heat sink 30 includes a heat sink 31 and heat sink fins 32. The power device 20 is at least partially in contact with the heat sink 31; a plurality of heat sink fins 32 are spaced apart on the heat sink 31, forming recesses 32a, and an air supply device 40 is mounted in the recesses 32a. For example, the plurality of heat sink fins 32 are arranged at intervals along a first direction X. The heat sink fins 32 extend along a second direction Y. Exemplarily, the first direction X and the second direction Y are perpendicular. For example, both the first direction X and the second direction Y are perpendicular to a third direction Z.
[0054] The power device 20 is in contact with the heat sink 31 at least in part, and the other part, although not in contact with the heat sink 31, can also transfer heat to the heat sink 31 through thermal radiation or thermal convection.
[0055] Multiple heat sinks 32 are spaced apart to increase the heat dissipation area and provide an airflow channel for the air supply device 40 so that airflow blows toward the heat sink 31. The heat sinks 32 form recesses 32a to install the air supply device 40, which can reduce the height of the air supply device 40 and make the variable frequency drive 100 have a compact structure.
[0056] The thickness of the heat sink 32 along the first direction X can be uniform or varied. For example, please refer to... Figure 4 To improve the support effect, the thickness of the heat sink 32 located in the middle is greater than the thickness of the other heat sinks 32.
[0057] For example, the heat sink 31 and the heat fin 32 are integrally molded parts. This reduces the number of disassembly and assembly steps and improves structural strength.
[0058] For example, the projection of the heat sink 31 along the third direction Z can cover the power device 20 being cooled, so as to improve the heat dissipation effect.
[0059] For example, the two outermost heat sinks 32 are located at the outermost end of the heat sink 31.
[0060] For example, multiple heat sinks 32 are evenly spaced, that is, the distance between two adjacent heat sinks 32 is the same, so that the heat of the heat sink 31 is evenly transferred to the heat sinks 32.
[0061] In some embodiments, please refer to Figure 3 and Figure 4 The heat sink 32 is divided into first heat sink 321 and second heat sink 322. Multiple first heat sinks 321 are located on both sides of multiple second heat sinks 322. The height of the first heat sink 321 is greater than the height of the second heat sink 322, so that the second heat sink 322 forms a recess 32a. An air supply device 40 is installed on the second heat sink 322. The second heat sink 322 supports the air supply device 40, which is located between two first heat sinks 321. There can be two, three, or more first heat sinks 321.
[0062] For example, each of the first heat sinks 321 has the same cross-section along the first direction X, and each of the second heat sinks 322 has the same cross-section along the first direction X.
[0063] In other embodiments, please refer to Figure 5 and Figure 6 The heat sink 32 includes a first heat dissipation section 323 and a second heat dissipation section 324. The two first heat dissipation sections 323 are respectively located on both sides of the second heat dissipation section 324. The height of the first heat dissipation section 323 is greater than the height of the second heat dissipation section 324, so that the second heat dissipation section 324 forms a recess 32a. The air supply device 40 is installed on the second heat dissipation section 324. Exemplarily, a plurality of heat sinks 32 are arranged at intervals along the second direction Y. Each heat sink 32 has the same cross-section along the second direction Y, and the heat sink 32 extends along the first direction X. Exemplarily, the thickness of the heat sink 32 along the second direction Y can be the same or different. For example, in order to improve support stability, the thickness of the heat sink 32 located in the middle along the second direction Y is greater than the thickness of the heat sinks 32 located on both sides along the second direction Y.
[0064] For example, the heat sink 31, the first heat dissipation section 323, and the second heat dissipation section 324 are integrally molded parts. This reduces the number of disassembly and assembly steps and improves structural strength.
[0065] In other embodiments not shown, the heat sink 30 may include Figures 3-4 The first heat sink 32 and Figures 5-6The combination of heat sinks 32, that is, replacing the heat sink 32 including the first heat dissipation section 323 and the second heat dissipation section 324. Figures 3-4 The second heat sink 322 in the middle can make the recessed part 32a located in the middle of the heat sink, and the recessed part 32a is surrounded by heat sinks or partial structures of heat sinks.
[0066] In other embodiments, please refer to Figure 7 The radiator 30 includes heat sink 35 and heat sink 31. The heat sink 35 is disposed on the heat sink 31, and two heat sinks 35 are spaced apart. The air supply device 40 is installed on the heat sink 31 and located between the two heat sinks 35, and the air supply device 40 is spaced apart from the heat sink 31. In this way, the structure of the radiator 30 can be simplified and manufacturing can be facilitated.
[0067] For example, the heat sink 31 and the heat sink block 35 are integrally molded parts. This reduces the number of disassembly and assembly steps and improves structural strength.
[0068] It is understandable that the height relationship between the air supply device 40 and the heat sink 30 can be set according to the total height of the structure on the circuit board 10, while also taking into account the heat dissipation effect.
[0069] In some embodiments, please refer to Figure 3 , Figure 5 and Figure 7 The height of the air supply device 40 is greater than the height of the radiator 30. The height of the air supply device 40 relative to the circuit board 10 is greater than the height of the radiator 30. For example, as... Figure 3 and Figure 4 As shown, the air supply device 40 is located on the radiator 30, partly within the recess 32a and partly protruding from the second heat sink 322. Or, as... Figure 5 As shown, the air supply device 40 is located on the radiator 30, partly within the recess 32a and partly protruding from the first heat dissipation section 323. In this way, the portion of the air supply device 40 protruding from the radiator 30 fully utilizes the space, thereby increasing the heat dissipation area of the radiator 30. For example, Figure 4 In this case, the height of the second heat sink 322 can be increased, thereby increasing the heat dissipation area. Figure 6 In the middle, the height of the second heat dissipation section 324 can be increased, thereby increasing the heat dissipation area.
[0070] For example, when the height of other structures on the circuit board 10 is greater than the height of the heat sink 30, the height of the air supply device 40 can be set to be greater than the height of the heat sink 30, but not exceeding the height of the structure.
[0071] In other embodiments not shown, the height of the air supply device 40 is less than or equal to the height of the radiator 30. For example, the air supply device 40 is located on the radiator 30 within a recess 32a, and its height is less than or equal to the height of the second heat sink 322. In this way, the air supply device 40 does not occupy additional vertical space, thus improving space utilization.
[0072] For example, when there is no other structure on the circuit board 10 with a height greater than that of the heat sink 30, the height of the air supply device 40 is set to be less than or equal to the height of the heat sink 30.
[0073] In some embodiments not shown, the heat sink 30 includes a heat sink 31 and heat sink fins 32. The power device 20 is at least partially in contact with the heat sink 31; a plurality of heat sink fins 32 are spaced apart on the heat sink 31, and an air supply device 40 is mounted on at least one side of the extending direction of the heat sink fins 32 to supply air to the extending direction of the heat sink fins 32. Exemplarily, the extending direction of the heat sink fins 32 is a first direction X or a second direction Y.
[0074] In other words, the air supply device 40 is located on the side of the heat sink 32. Airflow enters between two adjacent heat sinks 32, carrying away the heat from the heat sink 31. The air supply device 40 is installed on one or both sides of the heat sink 32 in its extension direction.
[0075] This application also provides a clothing processing device, including the variable frequency drive 100 described in any one of the embodiments of this application. Exemplarily, the clothing processing device is a heat pump dryer. A heat pump dryer is a condenser dryer that absorbs heat from the outside air through an evaporator, and the compressor transfers and releases this heat into the dryer drum, thereby increasing the temperature inside the drum and drying the clothes. The variable frequency drive 100 is used to control the compressor, dynamically adjusting the compressor's motor speed and output power to achieve precise control based on system load changes, thereby improving energy efficiency. Heat pump dryers have advantages such as heat recycling, high efficiency and energy saving, minimal damage to clothes, high level of intelligence, and environmental friendliness.
[0076] The above description is merely a preferred embodiment of this application and is not intended to limit the application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.
Claims
1. A variable frequency drive, characterized in that, include: Circuit board; Power devices are mounted on the circuit board; A heat sink is configured to dissipate heat from the power device through heat conduction, heat radiation, or heat convection. An air supply device is installed on the radiator to supply air to the radiator for heat dissipation.
2. The variable frequency drive according to claim 1, characterized in that, The heat sink includes: A heat sink, wherein the power device is at least partially in contact with the heat sink; A heat sink, wherein a plurality of heat sinks are spaced apart on the heat sink plate, the plurality of heat sinks forming a recess, and the air supply device is installed in the recess.
3. The variable frequency drive according to claim 2, characterized in that, The heat sink is divided into: First heat sink; The second heat sink has multiple first heat sinks located on both sides of multiple second heat sinks. The height of the first heat sink is greater than the height of the second heat sink, so that the second heat sink forms the recessed portion. The air supply device is installed on the second heat sink.
4. The frequency converter driver according to claim 2, characterized in that, The heat sink includes a first heat dissipation section and a second heat dissipation section. The two first heat dissipation sections are located on both sides of the second heat dissipation section. The height of the first heat dissipation section is greater than the height of the second heat dissipation section, so that the second heat dissipation section forms the recessed portion. The air supply device is installed on the second heat dissipation section.
5. The variable frequency drive according to claim 1, characterized in that, The height of the air supply device is greater than the height of the radiator.
6. The variable frequency drive according to claim 1, characterized in that, The height of the air supply device is less than or equal to the height of the radiator.
7. The variable frequency drive according to claim 1, characterized in that, The heat sink includes: A heat sink, wherein the power device is at least partially in contact with the heat sink; A heat sink, wherein a plurality of heat sinks are spaced apart on the heat sink plate, and the air supply device is installed on at least one side of the extending direction of the heat sink so that the air supply device supplies air to the extending direction of the heat sink.
8. The variable frequency drive according to any one of claims 1 to 7, characterized in that, The power device includes a smart power module, a rectifier bridge, and a PFC power transistor, with the smart power module and the rectifier bridge respectively connected to the heat sink.
9. The variable frequency drive according to any one of claims 1 to 7, characterized in that, The heat sink is connected to the circuit board.
10. The variable frequency drive according to any one of claims 1 to 7, characterized in that, The air supply device is a fan or blower.
11. A garment processing device, characterized in that, Includes the variable frequency drive as described in any one of claims 1 to 10.
12. The garment processing equipment according to claim 11, characterized in that, The clothing processing equipment is a heat pump dryer.