An electronic device

Abstract

The application provides an electronic device, and relates to the technical field of electronic device heat dissipation. The electronic device comprises: a first body, which has a cavity inside; the first body is respectively provided with an air inlet channel, an air outlet channel and an air guide channel; the air inlet channel and the air outlet channel are respectively communicated with the cavity; the air guide channel is communicated with the air outlet channel; a heat dissipation piece is arranged in the cavity; the heat dissipation piece can drive the first gas to enter the cavity from the air inlet channel and be discharged from the air outlet channel, and is used for dissipating heat of a heating piece; in the state that the first gas is discharged from the air outlet channel, the pressure of the air outlet channel is greater than that of the air guide channel, and the second gas can enter the air guide channel to mix with the first gas under the action of the pressure.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology for electronic devices, and more particularly to an electronic device. Background Technology

[0002] Currently, mainstream cooling solutions use blade-type fans, which suffer from low air pressure and limited cooling efficiency. Newer types of fans employ piezoelectric vibrating plates, achieving high airflow in a small volume through high-speed vibration, thus improving cooling efficiency. However, during the cooling process, the temperature of the gas involved in heat exchange can reach nearly 60 degrees Celsius. While these high-temperature gases gradually cool down upon exhaust, the high exhaust temperature still poses a risk of burns. Utility Model Content

[0003] This application provides an electronic device, comprising: a first body having an internal cavity, the first body being provided with an air inlet channel, an air outlet channel, and an air intake channel, the air inlet channel and the air outlet channel being respectively connected to the cavity, and the air intake channel being connected to the air outlet channel; a heat sink being disposed in the cavity, the heat sink being capable of driving a first gas to enter the cavity through the air inlet channel and exit through the air outlet channel for heat dissipation of a heat-generating component; wherein, when the first gas is exiting through the air outlet channel, the pressure in the air outlet channel is greater than that in the air intake channel, and a second gas can enter through the air intake channel under the action of the pressure and mix with the first gas.

[0004] In some embodiments of this application, the air outlet channel includes a first channel and a second channel arranged sequentially in the direction away from the cavity, the cross-sectional dimension of the first channel is smaller than that of the second channel, and the air intake channel is connected to the second channel.

[0005] In some embodiments of this application, the air outlet channel and the air inlet channel are flat-mouthed, and the ratio of the width dimension of the cross-section of the air inlet channel to the width dimension of the cross-section of the second channel is less than 1.

[0006] In some embodiments of this application, the electronic device further includes: a second body, wherein the first body is disposed on a first surface of the second body, and the heating element is disposed inside the second body; the air outlet channel includes an inlet end and an outlet end, wherein the outlet end is disposed higher than the inlet end in a direction perpendicular to the first surface.

[0007] In some embodiments of this application, the surfaces from the inlet end to the outlet end are inclined planes.

[0008] In some embodiments of this application, the cavity includes a first region and a second region arranged adjacent to each other in a horizontal direction, the heat sink is disposed in the first region, and the air inlet channel and the air outlet channel are respectively connected to the first region; the second region is used to house functional components.

[0009] In some embodiments of this application, a waterproof and breathable membrane is provided between the inlet end and the cavity; the air intake channel and the air outlet channel are connected in the middle.

[0010] In some embodiments of this application, the first body includes a second surface facing away from the first surface, and the second surface has an opening, which is the air inlet of the air duct.

[0011] In some embodiments of this application, the first body includes a frame and a cover, the frame being annular and the cover being fastened to the frame to form the cavity; the air inlet channel and the air outlet channel are disposed on the frame, and the air duct is disposed at the connection between the frame and the cover.

[0012] In some embodiments of this application, the frame is rectangular and includes a first plate perpendicular to the first surface and a pair of second plates. The pair of second plates are disposed opposite to the first plate, and the first plate is disposed away from the second region. The air outlet channel is disposed on the first plate. The air inlet channel is a pair, and the pair of air inlet channels are respectively disposed on the pair of second plates. Attached Figure Description

[0013] The above and other objects, features, and advantages of exemplary embodiments of this application will become readily understood by reading the following detailed description with reference to the accompanying drawings. In the drawings, several embodiments of this application are illustrated by way of example and not limitation, with the same or corresponding reference numerals denoteing the same or corresponding parts, wherein:

[0014] Figure 1 A schematic diagram of the structure of an electronic device according to an embodiment of this application is shown.

[0015] Figure 2 A cross-sectional view of an electronic device according to an embodiment of this application is shown schematically;

[0016] Figure 3 A schematic diagram of the internal structure of an electronic device according to an embodiment of this application is shown.

[0017] Figure 4 A simplified schematic diagram of the air outlet channel and the air inlet channel in the electronic device of the present application is shown in the embodiment.

[0018] Figure 5A simplified schematic diagram illustrating another embodiment of the air outlet channel and air inlet channel in the electronic device of this application is shown.

[0019] Figure 6 The diagram illustrates the gas flow in the air outlet and air inlet channels of the electronic device according to an embodiment of this application.

[0020] Explanation of icon numbers:

[0021] 1. First body; 101. Cavity; 1011. First region; 1012. Second region; 102. Air inlet channel; 103. Air outlet channel; 1031. First channel; 1032. Second channel; 1033. Inlet end; 1034. Outlet end; 104. Air intake channel; 105. Second surface; 106. Frame; 107. Cover; 2. Heat sink; 3. Functional component; 4. Second body; 401. First surface; 5. Waterproof and breathable membrane; Detailed Implementation

[0022] Exemplary embodiments of this application will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of this application are shown in the drawings, it should be understood that this application may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of this application and to fully convey the scope of this application to those skilled in the art.

[0023] It should be noted that, unless otherwise stated, the technical or scientific terms used in this application shall have the ordinary meaning as understood by one of ordinary skill in the art to which this application pertains.

[0024] As electronic devices become increasingly thinner and semiconductor components become highly integrated, heat dissipation within these devices has become a problem. For example, in the heat dissipation process of piezoelectric vibration fans, the temperature of the gas involved in heat exchange can reach nearly 60 degrees Celsius. Although this high-temperature gas gradually cools down as it is expelled from the casing of the electronic device, there is still a risk of burns due to the high outlet temperature.

[0025] Therefore, this application provides an electronic device that can mix with ambient temperature gas before expelling high-temperature gas from the device body to cool it down, thereby maintaining the existing high-efficiency heat dissipation performance and solving the risk of high-temperature burns.

[0026] This application provides an electronic device, such as... Figures 1 to 4As shown, it includes: a first body 1, which has a cavity 101 inside. The first body 1 is provided with an air inlet channel 102, an air outlet channel 103, and an air intake channel 104. The air inlet channel 102 and the air outlet channel 103 are respectively connected to the cavity 101, and the air intake channel 104 is connected to the air outlet channel 103; a heat sink 2, which is disposed in the cavity 101. The heat sink 2 can drive a first gas to enter the cavity 101 through the air inlet channel 102 and be discharged through the air outlet channel 103 for heat dissipation of the heat-generating component; wherein, when the first gas is discharged through the air outlet channel 103, the pressure of the air outlet channel 103 is greater than that of the air intake channel 104, and the second gas can enter through the air intake channel 104 under pressure and mix with the first gas.

[0027] The electronic device provided in this application embodiment can be a mobile phone, laptop, tablet computer, or game console, etc. The first body 1 can be the outer casing or part of the outer casing of the electronic device, and a cavity 101 is formed inside the first body 1. The first body 1 has an air inlet channel 102 for cooler external air to enter the cavity 101; an air outlet channel 103 for hot air to exit the first body 1 from the cavity 101; and an exhaust channel 104, whose inlet is located outside the first body 1 or in another cooler area inside the first body 1, and whose outlet is connected to the air outlet channel 103. A heat sink 2 is installed inside the cavity 101 and can be a piezoelectric vibration fan, a micro fan, etc., capable of driving gas flow to generate high-speed airflow to dissipate heat from the heat-generating component. The heat-generating component can be an electronic component requiring heat dissipation (such as a CPU, GPU, power module, etc.), located inside or close to the cavity 101, and the airflow driven by the heat sink 2 exchanges heat with the heat-generating component.

[0028] The heat sink 2 generates a high-speed airflow, which is the first gas. This first gas is drawn into the cavity 101 through the air inlet channel 102. Within the cavity 101, the first gas flows past the heating element, absorbing its heat and significantly increasing its temperature. Driven by the heat sink 2, the heated first gas flows towards and enters the air outlet channel 103, exiting the first body 1. When the high-temperature first gas flows at high speed through the air outlet channel 103, according to fluid dynamics principles, such as the Venturi effect, a relatively low-pressure zone is generated in the area near the connection point with the exhaust channel 104 within the air outlet channel 103. Simultaneously, the inlet end of the exhaust channel 104 is exposed to ambient atmospheric pressure, thus creating a pressure difference between the air outlet channel 103 and the inlet of the exhaust channel 104. Due to this pressure difference, cooler air from outside or other parts of the electronic device, i.e., the second gas, is automatically drawn into the exhaust channel 104. The cooler second gas enters the outlet duct 103 through the duct 104, where it encounters and mixes thoroughly with the high-temperature first gas flowing at high speed. The temperature of the mixed gas is significantly lower than that of the original high-temperature first gas, and then it is discharged from the outside of the first body 1 through the outlet duct 103.

[0029] The electronic device provided in this application embodiment can utilize the low-pressure area generated by the high-temperature airflow itself, and through the design of an air duct 104, passively introduce low-temperature air from the outside or inside to mix with the high-temperature exhaust during the exhaust stage. This can significantly reduce the temperature of the final exhaust gas while maintaining the efficient heat dissipation capacity of the piezoelectric fan, effectively eliminating the risk of burns.

[0030] In some embodiments, such as Figure 5 and Figure 6 As shown, the air outlet channel 103 includes a first channel 1031 and a second channel 1032 arranged sequentially in the direction away from the cavity 101. The cross-sectional dimension of the first channel 1031 is smaller than that of the second channel 1032. The air duct 104 is connected to the second channel 1032.

[0031] The exhaust duct 103 can be divided into two sections, namely the first duct 1031 and the second duct 1032, along the direction away from the cavity 101, i.e., the direction of gas discharge. The first duct 1031 is located near the exhaust port of the cavity 101, and its cross-sectional dimensions are smaller, for example, its diameter or cross-sectional area is smaller. When the first gas flows through this section, its flow velocity will increase significantly due to the narrowness of the duct. The second duct 1032 is located downstream of the first duct 1031, i.e., away from the cavity 101, and its cross-sectional dimensions are larger than those of the first duct 1031. The outlet of the induced draft duct 104 is connected to the second duct 1032, and the induced draft duct 104 can directly introduce external or low-temperature second gas into the interior of the second duct 1032.

[0032] The heated first gas exits from cavity 101 and first enters the first channel 1031. Due to the narrowness of the channel, the airflow is accelerated, and the flow rate increases. When the first gas leaves the first channel 1031 and enters the second channel 1032, a low-pressure zone is formed within the second channel 1032, which can forcefully draw in the low-temperature second gas. By increasing the cross-sectional area of ​​the second channel 1032, the gas-accommodating space can be increased, thereby allowing a larger flow rate of the low-temperature second gas to be drawn in. Ultimately, this lowers the temperature of the discharged mixed gas, bringing it closer to ambient temperature and further reducing the risk of burns.

[0033] In some embodiments, such as Figure 5 As shown, the outlet of the air duct 104 is located at the connection between the first duct 1031 and the second duct 1032.

[0034] In the transition zone of the channel expansion, specifically the area where the outlet of the first channel 1031 just enters the inlet of the second channel 1032, a significant local low-pressure zone is formed. At this time, the inlet of the exhaust channel 104 is directly connected to the outside, while the outlet of the exhaust channel 104 is located within this low-pressure zone at the inlet of the second channel 1032. This maximizes the pressure difference between the two ends of the exhaust channel 104. Driven by this pressure difference, the suction force of the exhaust channel 104 is significantly increased, substantially enhancing the amount and speed of the second gas introduced. This allows the high-temperature first gas to mix with a sufficient amount of low-temperature second gas, thereby more efficiently reducing the outlet air temperature and further improving the safety and reliability of the heat dissipation system.

[0035] In some embodiments, at the connection between the cavity 101 and the air outlet channel 103, the cross-sectional area gradually decreases from large to small along the direction from the cavity 101 to the air outlet channel 103, forming a nozzle-like structure. This allows the first gas to be accelerated as it flows through the connection, due to the decreasing cross-sectional area of ​​the channel, and thus ejected from the air outlet channel 103 at a faster speed. The high-speed ejection of the first gas can create a stronger pressure difference within the air outlet channel 103, thereby more effectively driving the second gas to enter from the duct 104 and mix with it.

[0036] In some embodiments, the air outlet channel 103 and the air inlet channel 104 are flat-mouthed, and the ratio of the width dimension of the cross-section of the air inlet channel 104 to the width dimension of the cross-section of the second channel 1032 is less than 1.

[0037] Both the exhaust duct 103 and the intake duct 104 are designed with a flattened cross-section, which can be a long, flattened strip structure with a rectangular cross-section. The flattened outlet of the intake duct 104 is located on the side wall of the exhaust duct 103, and the ratio of the width of the intake duct 104 to the width of the exhaust duct 103 is less than 1, meaning the width of the intake duct 104 is smaller than the width of the exhaust duct 103. For example, a flat duct with a narrower flat slit on its side wall.

[0038] When the airflow velocity in the outlet duct 103 is high, the second gas will be drawn in through the induced draft duct 104 and mixed with the high-temperature first gas in the outlet duct 103. Since the width of the induced draft duct 104 is smaller than that of the outlet duct 103, the second gas can cut into the first gas flow in the form of a high-speed narrow jet, thereby achieving thorough mixing.

[0039] The narrower air intake channel 104 allows the second gas to enter the exhaust channel 103 at a higher flow rate, more efficiently cutting the high-temperature airflow, improving mixing uniformity, and avoiding localized high temperatures. Simultaneously, the flat opening structure is suitable for confined spaces, saving space in the thickness direction of electronic devices, making it ideal for foldable screen phones, tablets, and other electronic products that prioritize ultra-thinness.

[0040] In some embodiments, the ratio of the width of the cross-section of the air intake channel 104 to the width of the cross-section of the second channel 1032 is 1:3, and the ratio of the width of the cross-section of the first channel 1031 to the width of the cross-section of the second channel 1032 is 2:3.

[0041] In some embodiments, such as Figures 1 to 3 As shown, the electronic device also includes: a second body 4, a first body 1 disposed on a first surface 401 of the second body 4, and a heating element disposed inside the second body 4; an air outlet channel 103 includes an inlet end 1033 and an outlet end 1034, the outlet end 1034 being disposed higher than the inlet end 1033 in a direction perpendicular to the first surface 401.

[0042] The electronic device includes a first body 1 and a second body 4. The second body 4 can be the core functional part of the electronic device, such as the host of a laptop, tablet, or mobile phone, containing key components such as a keyboard, motherboard, and battery. The first body 1 is disposed on the first surface 401 of the second body 4. For example, the camera part of a mobile phone is the first body 1, while the main body of the mobile phone is the second body 4. Heat-generating components, such as the CPU, GPU, and power supply chip, are housed within the second body 4. The cavity 101 inside the first body 1 can be directly connected to the heat-generating components, or the bottom surface of the cavity 101 can be connected to the heat-generating components via a heat-conducting plate, thereby ensuring that heat can be effectively transferred to the cavity 101 of the first body 1.

[0043] Because hot gas has a low density and naturally rises, the air outlet channel 103 is designed to be upward-sloping and ascending via electronic equipment. This fully utilizes the natural buoyancy of the hot air to accelerate its discharge. Simultaneously, it reduces the retention of hot gas on the first surface 401 of the second body 4 of the electronic equipment, preventing further temperature increases in the internal components of the second body 4 due to heat accumulation, thereby ensuring the stable operation of the electronic equipment.

[0044] In some embodiments, the surfaces from the inlet end 1033 to the outlet end 1034 are inclined planes.

[0045] The top wall of the air outlet duct 103 can be a plane that slopes upward from the inlet end 1033 to the outlet end 1034, and the bottom wall also adopts an upward sloping design. The cross-sectional shape of the entire air outlet duct 103 can be consistent, such as a rectangular flat opening. This makes the air outlet duct 103 appear as a channel that slopes upward along a straight line, and the inner wall surface between the inlet end 1033 and the outlet end 1034 of the air outlet duct 103 forms a continuous, smooth sloping plane.

[0046] The smooth inner wall reduces frictional resistance during airflow, allowing gas to exit more smoothly through the air outlet 103. Furthermore, the airflow, under the Coanda effect, can smoothly rise and exit along the inner wall. Combined with the low density and natural upward movement of hot air, the hot air exiting through the air outlet 103 can more efficiently escape from the first surface 401 of the second body 4, reducing the amount of heat trapped on the first surface 401 and thus preventing further temperature increases in the internal components of the second body 4 due to heat accumulation.

[0047] In some embodiments, the first channel 1031 is horizontally positioned, and the second channel 1032 is inclined upwards relative to the first channel 1031, with an inclination angle of 10°. Utilizing the Coanda effect, increasing the inclination angle by 10° allows the mixed gas to detach from the viscosity of the first surface 401 after leaving the outlet channel 103, preventing excessive heat buildup that could cause the internal components of the electronic device to overheat. Simultaneously, the 10° inclination angle utilizes the properties of hot air without excessively increasing the channel's space occupancy, thus maintaining the compactness of the electronic device.

[0048] In some embodiments, such as Figure 3 As shown, the cavity 101 includes a first region 1011 and a second region 1012 arranged adjacent to each other in the horizontal direction. The heat sink 2 is disposed in the first region 1011. The air inlet channel 102 and the air outlet channel 103 are respectively connected to the first region 1011. The second region 1012 is used to house the functional component 3.

[0049] The cavity 101 can be divided into two adjacent regions, namely the first region 1011 and the second region 1012, by one or more partition structures (such as partitions, ribs, sealing walls, etc.). These two regions are closely adjacent in the horizontal direction, for example, arranged side by side or front and back. They share some side walls, but are physically separated by the partition structures.

[0050] A heat sink 2 can be installed in the first region 1011, and the air inlet channel 102 is connected to this region, which can introduce cooler external air into the first region 1011. The air outlet channel 103 is also connected to the first region 1011, which can exhaust the high-temperature first gas that has been heated in the first region 1011, thereby completing the heat dissipation process.

[0051] Functional components 3 can be placed in the second region 1012. These components can include a camera module, earpiece, speaker, antenna module, etc. Because there is a partition structure between the first region 1011 and the second region 1012, the high-temperature airflow and heat radiation in the first region 1011 can be prevented from being directly transferred to the second region 1012, thus ensuring that the functional components 3 can perform normally.

[0052] By placing the heat sink 2 and the functional component 3 in the same cavity 101, good heat dissipation performance can be maintained while providing space for functional components 3 such as high-pixel multi-camera systems and sensors, thereby effectively improving the space utilization efficiency inside electronic devices.

[0053] In some embodiments, taking a mobile phone as an example, the first body 1 can be the camera assembly of the mobile phone, including a decorative shell. A cavity 101 is formed inside the decorative shell, and the cavity 101 is divided into a first region 1011 and a second region 1012. A heat sink 2 is disposed in the first region 1011, and the second region 1012 is used to house the camera. The second body 4 can be the main unit of the mobile phone, consisting of a protective shell. Core components such as the heat sink, motherboard, and display screen are installed inside the protective shell. The decorative shell is mounted on the protective shell, and due to the structural characteristics of the camera assembly itself, the decorative shell protrudes from the protective shell.

[0054] By utilizing the decorative housing of the phone's camera, the heat sink 2 and the camera can be integrated together within the decorative housing. This not only makes full use of the internal space of the decorative housing but also achieves a reasonable layout for the heat sink 2 and the camera, allowing both to function within their respective areas. At the same time, the partitioned design of the cavity 101 reduces the adverse effects of the heat dissipation process on the camera, thereby improving the utilization efficiency of the phone's internal space.

[0055] In some embodiments, a waterproof and breathable membrane 5 is provided between the inlet end 1033 and the cavity 101; the air intake channel 104 is connected to the middle of the air outlet channel 103.

[0056] The waterproof and breathable membrane 5, also known as a waterproof breathing membrane or microporous membrane, is installed at the inlet end 1033 of the air outlet channel 103, that is, the connection between the air outlet channel 103 and the cavity 101. When the first gas enters the cavity 101, it will first pass through the waterproof and breathable membrane 5 and then enter the air outlet channel 103. The air intake channel 104 is connected to the middle position of the air outlet channel 103 along the airflow direction.

[0057] Because the waterproof and breathable membrane 5 allows gas to pass freely but prevents liquid water and larger dust particles from entering, any liquids or dust contained in the external environment and the second gas during flow are effectively intercepted by the waterproof and breathable membrane 5, preventing them from entering the cavity 101 through the air outlet channel 103 and the air intake channel 104. This prevents external liquids and dust from entering the cavity 101 through the air outlet and air intake channels 104. While ensuring normal gas flow for heat dissipation, it also creates a protective barrier inside the cavity 101, ensuring that the internal components and heat sink 2 of the electronic equipment can operate stably in a clean and dry environment, extending the service life and reliability of the electronic equipment.

[0058] In some embodiments, such as Figure 1 As shown, the first body 1 includes a second surface 105 facing away from the first surface 401. The second surface 105 has an opening, which is the air inlet of the air intake channel 104.

[0059] The first body 1 is mounted on the second body 4 and protrudes from the first surface 401 of the second body 4. The first body 1 has a second surface 105 facing away from the first surface 401. An opening is provided on the second surface 105, which is the air inlet of the air intake channel 104. The opening is connected to the middle of the air outlet channel 103 through an internal channel. The opening can be a rectangular slit, a mesh, or an array of small holes.

[0060] When electronic devices are placed flat on a table or held by the user, the back of the electronic device is exposed to the outside. By setting the air inlet of the air intake duct 104 on the second surface 105 of the first body 1 facing away from the second body 4, the air inlet can more easily come into contact with the cold air in the environment, allowing the air intake duct 104 to efficiently draw in cold air from the environment and improve the cooling effect of mixing hot and cold gases. At the same time, external gas can be smoothly drawn into the air intake duct 104 along the second surface 105, ensuring the smoothness of the air intake process.

[0061] In some embodiments, such as Figure 3As shown, the first body 1 includes a frame 106 and a cover 107. The frame 106 is ring-shaped, and the cover 107 is fastened to the frame 106 to form a cavity 101. An air inlet channel 102 and an air outlet channel 103 are provided on the frame 106, and an air duct 104 is provided at the connection between the frame 106 and the cover 107.

[0062] Taking a mobile phone as an example, the first body 1 can be the rear camera module of the mobile phone, and the second body 4 can be the main body of the mobile phone. The frame 106 in the first body 1 can be a square ring-shaped metal structure, and the cover 107 can be made of glass. The cover 107 can be fastened to the frame 106 by means of buckles, screw posts or adhesive grooves, etc., and together with the frame 106, they form a closed cavity 101.

[0063] The sidewalls of frame 106 may have a certain thickness to provide space for processing air inlet channels 102 and air outlet channels 103. The sidewall with the air outlet channel 103 can be relatively thicker, and the air outlet channel 103 extends through this sidewall. This sidewall can be divided into two parts along the direction of the air outlet channel 103: one part connects to the cover 107, and the other part has an opening at the connection with the cover 107, extending into the air outlet channel 103 to form an air intake channel 104. A waterproof and breathable membrane 5 is attached between the air outlet channel 103 and the cavity 101 to effectively prevent liquids and dust from entering the cavity 101.

[0064] By setting the air duct 104 at the connection between the cover 107 and the frame 106, making it outside the cavity 101 and the cover 107, it is possible to clean, inspect or repair the air duct 104 without removing the cover 107 from the frame 106. This not only simplifies the operation process but also reduces the risk of damage to other components due to disassembly, thus improving maintenance efficiency.

[0065] In some embodiments, the frame 106 is rectangular and includes a first plate perpendicular to the first surface 401 and a pair of second plates. The pair of second plates are disposed relative to the first plate, and the first plate is disposed away from the second region 1012. An air outlet duct 103 is disposed on the first plate. There is a pair of air inlet ducts 102, and the pair of air inlet ducts 102 are respectively disposed on the pair of second plates.

[0066] Taking the rear camera module of a mobile phone as the first body 1 as an example, its frame 106 can be a rectangular structure, set perpendicular to the back cover of the mobile phone (i.e., the first surface 401). The first plate of the frame 106 can be a short side, perpendicular to the back cover of the mobile phone, and located on the side of the frame 106 away from the second region 1012. A pair of second plates can be the two long sides of the frame 106, also perpendicular to the back cover of the mobile phone, and symmetrically distributed relative to the first plates.

[0067] An air outlet duct 103 can be formed in the middle of the first plate, with an elongated opening that runs through the inner and outer sides of the first plate and connects to the first region 1011 inside the frame 106. A pair of air inlet ducts 102 are respectively located in the middle of a pair of second plates. Each air inlet duct 102 can be an array of multiple circular holes that runs through the second plate and connects to the first region 1011. In addition, waterproof and breathable membranes 5 can be attached to the inside of the air outlet duct 103 and the air inlet duct 102 to prevent liquids or dust from entering the cavity 101.

[0068] By symmetrically arranging a pair of air inlet channels 102 on the second plate, cold air from the outside can simultaneously enter the first area 1011 from both sides of the frame 106, forming a dual-side air intake mode. This effectively increases the air intake area and enhances the amount of cold air entering. Simultaneously, because the first plate is far from the second area 1012, the high-temperature airflow discharged from the exhaust channel 103 will not directly contact the camera or flash, thus avoiding adverse effects of high temperatures on these functional components 3 and ensuring their normal operation.

[0069] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An electronic device, characterized in that, include: The first body has an internal cavity. The first body is provided with an air inlet channel, an air outlet channel and an air duct. The air inlet channel and the air outlet channel are respectively connected to the cavity, and the air duct is connected to the air outlet channel. A heat sink is disposed in the cavity, and the heat sink can drive a first gas to enter the cavity through the air inlet channel and be discharged through the air outlet channel for heat dissipation of the heat-generating component. In the case where the first gas is discharged from the air outlet channel, the pressure of the air outlet channel is greater than that of the air intake channel, and the second gas can enter through the air intake channel and mix with the first gas under the action of the pressure.

2. The electronic device according to claim 1, characterized in that, The air outlet channel includes a first channel and a second channel arranged sequentially in the direction away from the cavity. The cross-sectional dimension of the first channel is smaller than that of the second channel, and the air intake channel is connected to the second channel.

3. The electronic device according to claim 2, characterized in that, The air outlet channel and the air inlet channel are flat-mouthed, and the ratio of the width of the cross-section of the air inlet channel to the width of the cross-section of the second channel is less than 1.

4. The electronic device according to claim 1, characterized in that, Also includes: The second body has the first body disposed on the first surface of the second body, and the heating element is disposed inside the second body. The air outlet channel includes an inlet end and an outlet end, and the outlet end is positioned higher than the inlet end in a direction perpendicular to the first surface.

5. The electronic device according to claim 4, characterized in that, The surface from the inlet end to the outlet end is an inclined plane.

6. The electronic device according to claim 4, characterized in that, The cavity includes a first region and a second region arranged adjacent to each other in a horizontal direction. The heat sink is disposed in the first region, and the air inlet channel and the air outlet channel are respectively connected to the first region. The second area is used to set up functional components.

7. The electronic device according to claim 4, characterized in that, A waterproof and breathable membrane is provided between the inlet end and the cavity; The air intake channel is connected to the middle of the air outlet channel.

8. The electronic device according to claim 6, characterized in that, The first body includes a second surface facing away from the first surface, and the second surface has an opening, which is the air inlet of the air duct.

9. The electronic device according to claim 8, characterized in that, The first body includes a frame and a cover, the frame being ring-shaped, and the cover being fastened to the frame to form the cavity; The air inlet channel and the air outlet channel are disposed on the frame, and the air duct is disposed at the connection between the frame and the cover.

10. The electronic device according to claim 9, characterized in that, The frame is rectangular and includes a first plate perpendicular to the first surface and a pair of second plates. The pair of second plates are disposed opposite to the first plate, and the first plate is disposed away from the second area. The air outlet channel is disposed on the first plate. The air inlet channels are a pair, and the pair of air inlet channels are respectively disposed on a pair of second plates.

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