AI computing power chip VC uniform temperature plate brazing fin liquid cooling plate

Abstract

The utility model discloses a kind of VC uniform temperature plate brazing fin liquid cooling plate for AI computing power chip, including substrate, substrate is sequentially provided with liquid cooling plate upper plate and VC uniform temperature plate from top to bottom, liquid cooling plate upper plate and VC uniform temperature plate between being provided with staggered tooth fin, substrate end face middle part is respectively provided with liquid inlet mechanism and liquid outlet mechanism.The utility model has the beneficial effects that: it has strengthening effect on the structure of liquid cooling plate and VC uniform temperature plate combination, it is beneficial to improve the flatness of uniform temperature plate, the area of fin on VC uniform temperature plate is large, the heat dissipation is more uniform, the temperature of chip is relatively more uniform, VC uniform temperature plate and liquid cooling plate combination heat dissipation, in smaller size space, with higher heat dissipation capacity, more suitable for size space limited chip heat dissipation occasion, VC uniform temperature plate upper plate and liquid cooling plate lower plate share a plate, save space, reduce cost.

Description

Technical Field

[0001] This utility model relates to the field of liquid cooling plate technology for computing chip applications, specifically a VC vapor chamber liquid cooling plate with brazed fins for AI computing chips. Background Technology

[0002] With the rapid development of AI technology, the demand for AI computing power is constantly increasing, and the power consumption of AI chips (such as GPUs and CPUs) is continuously increasing, which puts forward higher requirements for the heat dissipation of computing power cabinets. Liquid cooling technology has developed rapidly in this context and has gradually become mainstream. Among the many heat dissipation technologies, how to solve the heat dissipation problem in a smaller space and under higher heat dissipation demand conditions has become an urgent problem to be solved in the field of chip heat dissipation. This invention relates to a GPU and CPU heat dissipation liquid cooling plate, which is composed of a VC temperature homogenizer and a liquid cooling plate, and can effectively solve the requirement of high heat dissipation in a small space. Utility Model Content

[0003] The purpose of this invention is to provide a VC vapor chamber with brazed fins for AI computing chips, in order to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a liquid cooling plate with brazed fins for an AI computing chip using a VC vapor chamber, comprising a substrate, wherein a liquid cooling plate and a VC vapor chamber are arranged sequentially from top to bottom on the substrate, and staggered toothed fins are provided between the liquid cooling plate and the VC vapor chamber, and a liquid inlet mechanism and a liquid outlet mechanism are respectively provided in the middle part of the end face of the substrate.

[0005] In a further optimized version, the substrate is provided with at least four snap fasteners symmetrically and equidistantly around its perimeter.

[0006] In a further optimized configuration, the upper end face of the liquid cooling plate is provided with a liquid cooling plate inlet and a liquid cooling plate outlet that are connected through the liquid inlet and outlet.

[0007] In a further optimized configuration, the staggered toothed fins are disposed within the inner cavity of the upper plate of the liquid cooling plate.

[0008] In a further optimized configuration, the VC heat spreader and the upper plate of the liquid cooling plate are integrated by brazing and embedded in the bottom of the substrate.

[0009] In a further optimized configuration, the liquid inlet mechanism and the liquid outlet mechanism include two water nozzle bases, each with a liquid inlet and a liquid outlet at one end, and each with at least two sealing rings fitted onto it.

[0010] In a further optimization, the two water nozzle bases are provided with limiting pins at one end near the liquid inlet and liquid outlet.

[0011] Beneficial effects

[0012] The AI ​​computing chip VC vapor chamber with brazed finned liquid cooling plate provided by this utility model strengthens the structure of the liquid cooling plate and VC vapor chamber assembly, which helps to improve the flatness of the vapor chamber. The fins have a large flat area on the VC vapor chamber, resulting in more uniform heat dissipation and a more uniform chip temperature. The VC vapor chamber and liquid cooling plate assembly has higher heat dissipation capacity in a smaller space, making it more suitable for chip heat dissipation applications with limited space. The upper plate of the VC vapor chamber and the lower plate of the liquid cooling plate share a single plate, saving space and reducing costs. Attached Figure Description

[0013] Figure 1 This is an exploded view of the overall structure of this utility model;

[0014] Figure 2 This is a schematic diagram of the liquid cooling plate structure of this utility model;

[0015] Figure 3 This is a schematic diagram of the bottom surface structure of the liquid cooling plate of this utility model;

[0016] Figure 4 This is a schematic diagram of the liquid inlet / outlet mechanism of this utility model. Detailed Implementation

[0017] The following are specific embodiments of the present invention, which are described in conjunction with the accompanying drawings. However, the present invention is not limited to these embodiments.

[0018] Example

[0019] like Figure 1-4 As shown, a liquid cooling plate with brazed fins for an AI computing chip using a VC vapor chamber includes a substrate 1. The substrate 1 is provided with a liquid cooling plate upper plate 5 and a VC vapor chamber 7 from top to bottom. Interlaced toothed fins 6 are provided between the liquid cooling plate upper plate 5 and the VC vapor chamber 7. A liquid inlet mechanism 3 and a liquid outlet mechanism 4 are respectively provided in the middle part of the end face of the substrate 1.

[0020] In this embodiment, the substrate 1 is provided with at least four snap fasteners 2 symmetrically and equidistantly around its perimeter.

[0021] The end face of the upper plate 5 of the liquid cooling plate is provided with a liquid cooling plate inlet 8 and a liquid cooling plate outlet 9 that are connected through the liquid inlet 3 and the liquid outlet 4.

[0022] The staggered toothed fins 6 are disposed in the inner cavity of the upper plate 5 of the liquid cooling plate.

[0023] The VC heat spreader 7 and the upper plate of the liquid cooling plate 5 are integrated by brazing and are embedded in the bottom of the substrate 1.

[0024] The liquid inlet mechanism 3 and the liquid outlet mechanism 4 include two water nozzle bases 12. One end of each water nozzle base 12 is provided with a liquid inlet and a liquid outlet, and at least two sealing rings 11 are fitted on both the liquid inlet and the liquid outlet.

[0025] Limiting pins 13 are provided at one end of the two water nozzle bases 12 near the liquid inlet and liquid outlet.

[0026] The VC vapor chamber and liquid cooling plate are brazed together and embedded in the bottom of the substrate. The liquid inlet and outlet protrude from the through holes in the substrate. The inner cavity of the liquid cooling plate is equipped with two sets of staggered toothed fins. The bottom surface of the staggered teeth is in close contact with the upper surface of the VC vapor chamber, and the top surface of the staggered teeth is in close contact with the inner wall of the upper cover of the liquid cooling plate. The staggered teeth and the inner cavity of the cooling plate form spatially staggered internal flow channels. During the fluid flow, turbulence is continuously generated to enhance heat transfer and play a positive role in the heat dissipation of the cooling plate.

[0027] The liquid cooling plate, the staggered toothed fins, and the VC vapor chamber form an independent liquid cooling channel. The coolant enters from the liquid cooling plate inlet, splits from the middle of the staggered toothed fins to both ends, enters the staggered toothed fins at both ends of the staggered toothed fins and flows out from the liquid cooling plate outlet, thereby carrying away the heat from the VC vapor chamber and achieving the purpose of cooling the chip.

[0028] The inlet / outlet interface consists of an inlet / outlet port, a sealing ring, and a limiting pin. The inlet / outlet port has three O-ring grooves, with two O-ring seals installed in the last two grooves respectively. After the inlet / outlet port is inserted into the faucet base, the limiting pin is inserted from the side of the faucet base. The limiting pin is located in the first groove of the inlet / outlet port. The limiting pin is a cotter pin, and it has an interference fit with the hole on the side of the faucet base, which can effectively prevent the interface from loosening due to vibration during transportation. The aforementioned structure ensures the sealing performance of the inlet / outlet port, while also facilitating the maintenance and replacement of the sealing ring.

[0029] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.

Claims

1. A VC vapor chamber with brazed finned liquid cooling plate for AI computing chips, characterized in that: The substrate (1) includes a liquid cooling plate (5) and a VC heat exchange plate (7) arranged from top to bottom. There are staggered toothed fins (6) between the liquid cooling plate (5) and the VC heat exchange plate (7). The middle part of the end face of the substrate (1) is provided with a liquid inlet mechanism (3) and a liquid outlet mechanism (4).

2. The VC vapor chamber with brazed fins for AI computing chips according to claim 1, characterized in that: The substrate (1) is symmetrically provided with at least four buckles (2) at equal intervals around its perimeter.

3. The VC vapor chamber with brazed fins for AI computing chips according to claim 1, characterized in that: The end face of the upper plate (5) of the liquid cooling plate is provided with a liquid cooling plate inlet (8) and a liquid cooling plate outlet (9) that are connected through the liquid inlet mechanism (3) and the liquid outlet mechanism (4).

4. The VC vapor chamber with brazed fins for AI computing chips according to claim 1, characterized in that: The staggered toothed fins (6) are disposed in the inner cavity of the upper plate (5) of the liquid cooling plate.

5. The VC vapor chamber with brazed fins for AI computing chips according to claim 1, characterized in that: The VC heat spreader (7) and the upper plate (5) of the liquid cooling plate are integrated by brazing and are embedded in the bottom of the substrate (1).

6. The VC vapor chamber with brazed fins for AI computing chips according to claim 1, characterized in that: The liquid inlet mechanism (3) and the liquid outlet mechanism (4) include two water nozzle bases (12), one end of which is provided with a liquid inlet and a liquid outlet, and at least two sealing rings (11) are fitted on the liquid inlet and the liquid outlet.

7. The VC vapor chamber brazed fin liquid cooling plate for AI computing chips according to claim 6, characterized in that: The two water nozzle bases (12) are provided with a limiting pin (13) at one end near the liquid inlet and liquid outlet.

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