A power module

Abstract

The application provides a power module, and relates to the technical field of power modules. The power module comprises a shell, a power plate assembly and a heat dissipation system; the inside of the shell comprises a first side and a second side; the power plate assembly comprises a first power plate and a second power plate; wherein the planes where the first side and the second side are located are parallel to each other; the first power plate is arranged on the first side in the inside of the shell, and the second power plate is arranged on the second side in the inside of the shell; the first power plate is connected with an external interface, the second power plate is electrically connected with the first power plate; wherein the external interface is used for providing an input current; the second power plate is used for supplying power to the power module based on the input current provided by the first power plate; the heat dissipation system comprises a heat exchange unit and a convection unit; the heat exchange unit is connected with the first power plate and the second power plate; the heat exchange unit is matched with the airflow generated by the convection unit to take away the heat generated by the first power plate and the second power plate during operation.

Description

Technical Field

[0001] This application relates to the field of power module technology, and more specifically, to a power module. Background Technology

[0002] With the increasing popularity of electric vehicles, the number of charging stations has surged, driving up the demand for power modules. At the same time, modules are evolving towards higher power density, meaning that power output is continuously increasing while size is shrinking, and the internal component layout is becoming increasingly compact. This also means that heat dissipation requirements are growing, and installation is becoming more complex.

[0003] However, current power module assembly methods typically involve assembling individual components first, followed by final assembly. But with increasingly smaller module sizes and higher power density of internal components, this assembly method becomes difficult to manufacture, significantly reducing production efficiency. Excessive process holes (such as side wiring holes) on the casing affect aesthetics and increase production steps and time. The lack of effective airflow guidance structures at the fan exhaust outlet leads to air pressure loss, reducing the convective heat dissipation efficiency of internal components and consequently increasing internal temperature. Limited space means that critical power component areas lack independent baffles / guides, further exacerbating heat dissipation problems and affecting component performance and lifespan. Using side openings and other methods for internal wiring arrangement increases assembly difficulty and cost, reducing assembly efficiency. Utility Model Content

[0004] In view of this, the purpose of this application is to provide a power module to improve the above-mentioned problems existing in the prior art.

[0005] The power module includes a housing, a power board assembly, and a heat dissipation system. The housing has a first side and a second side inside. The power board assembly includes a first power board and a second power board. The planes containing the first side and the second side are parallel to each other. The first power board is disposed on the first side inside the housing, and the second power board is disposed on the second side inside the housing. The first power board is connected to an external interface, and the second power board is electrically connected to the first power board. The external interface is used to provide input current. The second power board is used to supply power to the power module based on the input current provided by the first power board. The heat dissipation system includes a heat exchange unit and a convection unit. The heat exchange unit is connected to the first power board and the second power board. The airflow generated by the heat exchange unit and the convection unit works together to remove the heat generated by the first power board and the second power board during operation.

[0006] In the above implementation process, by mounting the power boards on both sides of the housing, space is effectively utilized, making the overall structure of the power module more compact. The combination of the heat exchange unit and the convection unit can effectively remove the heat generated by the power boards during operation, ensuring the stability and reliability of the power module under high power operation. The modularity of the power board assembly and heat dissipation system facilitates maintenance and upgrades, improving the scalability and flexibility of the power module.

[0007] Optionally, the heat exchange unit includes: a first heat dissipation fin and a second heat dissipation fin; the first heat dissipation fin and the second heat dissipation fin include continuous periodic undulating ridge-like protrusions.

[0008] In the above implementation process, the ridge-like protrusions of the heat sink fins significantly increase the heat dissipation area and improve heat dissipation efficiency. The cooperation between the heat exchange unit and the convection unit ensures that heat can be dissipated quickly, keeping the power board temperature within a safe range even during high-power operation. The power boards are mounted on both sides of the housing, making full use of space and making the overall structure of the power module more compact. The heat sink fins not only improve heat dissipation efficiency but also optimize space utilization, avoiding the heat dissipation system occupying too much space.

[0009] Optionally, the tooth height of the ridge protrusion is 0.1-0.5 mm, the tooth spacing is 0.2-1 mm, and each row of fins contains 20-30 protrusions.

[0010] In the above implementation process, the ridge-like protrusions of the heat sink fins significantly increase the heat dissipation area and improve heat dissipation efficiency. Reasonable tooth height, tooth spacing, and the number of protrusions optimize heat dissipation performance while avoiding reduced heat dissipation efficiency due to improper configuration. The power boards are mounted on both sides of the housing, making full use of space and resulting in a more compact overall power module structure. The heat sink fins not only improve heat dissipation efficiency but also optimize space utilization, preventing the heat dissipation system from occupying too much space.

[0011] Optionally, the cross-section of the ridge-like protrusion is arc-shaped or trapezoidal.

[0012] In the above implementation process, the arc-shaped or trapezoidal cross-section further optimizes the airflow path, reduces airflow resistance, and increases the heat dissipation area.

[0013] Optionally, the main body plane of the first heat dissipation fin is parallel to the mounting plane of the first power board; the main body plane of the second heat dissipation fin is perpendicular to the mounting plane of the second power board.

[0014] In the above implementation process, the first heat sink fin is parallel to the first power board to maximize the contact area and ensure efficient heat conduction. The second heat sink fin is perpendicular to the second power board to optimize the airflow path and reduce airflow resistance.

[0015] Optionally, the heat exchange unit further includes a thermally conductive sealing layer; the thermally conductive sealing layer covers the surfaces of the first power plate and the second power plate, and fills the interface gap between the first power plate and the second power plate and the first heat dissipation fins and the second heat dissipation fins.

[0016] In the above implementation process, the external interface receives the input current and transmits it to the first power board. The first power board then transmits the input current to the second power board, which further processes the current and supplies power to other parts of the power module. During operation, the power boards generate heat, which is efficiently conducted to the first and second heat sink fins via a thermally conductive sealant. The thermally conductive sealant covers the surface of the power board and fills the interface gaps, reducing thermal resistance and ensuring efficient heat transfer to the heat sink fins. The airflow generated by the convection unit passes through the surface of the heat sink fins, carrying away the heat and dissipating it into the external environment, thereby ensuring the normal operating temperature of the power boards.

[0017] Optionally, the first power board includes a first power conversion area; the second power board includes a second power conversion area, a current rectification area, and a reverse protection area; the first heat sink fins are mounted on the surface of the first power conversion area by attaching ceramic sheets to the heat sink and the first heat sink fins; the second power board is mounted in the second power conversion area, the current rectification area, and the reverse protection area by the thermally conductive sealing layer.

[0018] In the above implementation process, the external interface receives the input current and transmits it to the first power board. The first power board's first power conversion section converts the input current into the required output current. The second power board's second power conversion section further processes the current, the current rectification section rectifies the current, and the reverse protection zone prevents current from flowing in reverse, thus protecting the circuit safety.

[0019] Optionally, the components in the first functional conversion zone are arranged at intervals, and the regions in the second power conversion zone, the current rectification zone, and the anti-reverse protection zone are arranged at intervals to form air duct gaps; the air duct gaps are configured to guide the airflow through them.

[0020] In the above implementation process, the components in the first power conversion zone are arranged at intervals to form airflow gaps. Similarly, the areas in the second power conversion zone, current rectification zone, and anti-reverse protection zone are arranged at intervals to form airflow gaps. These airflow gaps are configured to guide airflow and optimize heat dissipation. The airflow generated by the convection unit passes through the surface of the heat sink fins and the airflow gaps, carrying away heat and dissipating it into the external environment, thereby ensuring the normal operating temperature of the power board.

[0021] Optionally, the housing further includes a third side; wherein the third side is perpendicular to the plane containing the first side and the second side; the convection unit includes a fan and a fan mounting plate; the fan mounting plate is arranged parallel to the third side, the fan is mounted on the surface of the fan mounting plate and located in the space between the fan mounting plate and the third side; the airflow direction of the fan is towards the first power plate and the second power plate.

[0022] In the above implementation process, the fan is mounted on a fan mounting plate, and the airflow direction of the fan is towards the first power board and the second power board. The airflow passes through the gaps in the air duct and the surface of the heat sink fins, carrying away heat and dissipating it into the external environment, thereby ensuring the normal operating temperature of the power boards. The airflow direction of the fan towards the power boards also ensures that the airflow effectively removes heat.

[0023] Optionally, the fan mounting plate includes: a flow guiding structure; the flow guiding structure is an inclined surface extending downstream of the central through hole of the fan mounting plate; the flow guiding structure is located at the air outlet of the fan; the flow guiding structure is configured to guide the direction of airflow and prevent airflow from repeating.

[0024] In the above implementation process, the airflow guiding structure uses an inclined plane to direct the airflow generated by the fan to the surface of the power board, ensuring that the airflow can evenly cover the heat sink fins and the gaps in the airflow channel. This design can improve heat dissipation efficiency and reduce localized overheating. It can also effectively reduce airflow turbulence at the fan outlet. Turbulent airflow can lead to reduced heat dissipation efficiency and may even form eddies in some areas, further affecting the heat dissipation effect. Through the airflow guiding structure, the airflow can flow more smoothly to the power board, reducing energy loss. Attached Figure Description

[0025] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a first schematic diagram of a battery module provided in an embodiment of this application; Figure 2 A schematic diagram of the first heat dissipation fin provided in an embodiment of this application; Figure 3 This is a schematic diagram of the second heat dissipation fin provided in an embodiment of this application; Figure 4 This is a second schematic diagram of a battery module provided in an embodiment of this application; Figure 5A schematic diagram of the first power board provided in an embodiment of this application; Figure 6 A schematic diagram of the second power board provided in an embodiment of this application.

[0027] Icons: 100 - Housing; 110 - First side; 111 - First power board; 120 - Second side; 121 - Second power board; 130 - Third side; 131 - Convection unit; 132 - Fan mounting plate; 133 - Fan; 140 - Heat exchange unit; 141 - First heat sink fin; 142 - Second heat sink fin. Detailed Implementation

[0028] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of the embodiments of this application.

[0029] This application provides a power module; please refer to [link / reference]. Figure 1 , Figure 1 This is a first schematic diagram of a battery module provided in an embodiment of this application.

[0030] The power module includes a housing 100, a power board assembly, and a heat dissipation system. The housing 100 has a first side 110 and a second side 120 inside. The power board assembly includes a first power board 111 and a second power board 121. The planes containing the first side 110 and the second side 120 are parallel to each other. The first power board 111 is disposed on the first side 110 inside the housing 100, and the second power board 121 is disposed on the second side 120 inside the housing 100. The first power board 111 is connected to an external interface, and the second power board 121 is electrically connected to the first power board 111. The external interface is used to provide input current. The second power board 121 is used to supply power to the power module based on the input current provided by the first power board 111. The heat dissipation system includes a heat exchange unit 140 and a convection unit 131. The heat exchange unit 140 is connected to the first power board 111 and the second power board 121. The airflow generated by the heat exchange unit 140 and the convection unit 131 works together to remove the heat generated by the first power board 111 and the second power board 121 during operation.

[0031] In the above implementation, the interior of the housing 100 is divided into a first side 110 and a second side 120. These two sides are parallel to each other and their main function is to provide physical support and protection for the internal components, while also providing necessary space for the heat dissipation system. The power board assembly includes a first power board 111 and a second power board 121. The first power board 111 is installed on the first side 110 inside the housing 100, and the second power board 121 is installed on the second side 120 inside the housing 100. The first power board 111 is connected to an external power source via an external interface to receive input current. The second power board 121 is electrically connected to the first power board 111 and supplies power to the power module based on the input current provided by the first power board 111. The heat dissipation system includes a heat exchange unit 140 and a convection unit 131. The heat exchange unit 140 is connected to the first power board 111 and the second power board 121 and is used to absorb the heat generated during the operation of the power boards. The convection unit 131 generates airflow, which, in conjunction with the heat exchange unit 140, carries heat away from the power boards, thereby achieving the heat dissipation function. An external interface receives input current and transmits it to the first power board 111. The first power board 111 transmits the input current to the second power board 121, which further processes the current and supplies power to other parts of the power module. During operation, the power boards generate heat. The heat exchange unit 140 absorbs this heat and, in conjunction with the airflow generated by the convection unit 131, dissipates the heat into the external environment, thereby ensuring the normal operating temperature of the power boards.

[0032] Optionally, please refer to Figure 2 and Figure 3 , Figure 2 A schematic diagram of the first heat dissipation fin provided in an embodiment of this application; Figure 3 This is a schematic diagram of the second heat dissipation fin provided in an embodiment of this application.

[0033] The heat exchange unit 140 includes: a first heat dissipation fin 141 and a second heat dissipation fin 142; the first heat dissipation fin 141 and the second heat dissipation fin 142 include continuous periodic undulating ridge-like protrusions.

[0034] In the above implementation process, the heat dissipation system includes a heat exchange unit 140 and a convection unit 131. The heat exchange unit 140 includes a first heat dissipation fin 141 and a second heat dissipation fin 142. Both the first heat dissipation fin 141 and the second heat dissipation fin 142 have continuous, periodically undulating ridge-like protrusions. This structural arrangement can significantly increase the heat dissipation area and improve heat dissipation efficiency. The convection unit 131 generates airflow, which, in conjunction with the heat exchange unit 140, carries away heat from the power board, thereby achieving the heat dissipation function. During operation, the power board generates heat, which is first absorbed by the first heat dissipation fin 141 and the second heat dissipation fin 142. Because the heat dissipation fins have continuous, periodically undulating ridge-like protrusions, this structure can significantly increase the surface area in contact with the air, thereby improving heat dissipation efficiency. The airflow generated by the convection unit 131 passes through the surface of the heat dissipation fins, carrying away heat and dissipating it into the external environment, thereby ensuring the normal operating temperature of the power board.

[0035] Alternatively, to ensure good contact between the heat sink fins and the power board for efficient heat conduction, thermal adhesive or thermal pads can be used to enhance the contact.

[0036] Optionally, the tooth height of the ridge protrusion is 0.1-0.5 mm, the tooth spacing is 0.2-1 mm, and each row of fins contains 20-30 protrusions.

[0037] In the above implementation process, the heat dissipation system includes a heat exchange unit 140 and a convection unit 131. The heat exchange unit 140 includes a first heat dissipation fin 141 and a second heat dissipation fin 142. The first and second heat dissipation fins 141 and 142 have continuously periodically undulating ridge-like protrusions with a tooth height of 0.1-0.5 mm. This height of protrusion significantly increases the heat dissipation area without increasing the volume excessively. The tooth spacing is 0.2-1 mm; a reasonable tooth spacing ensures smooth airflow while maintaining sufficient heat dissipation efficiency. Each row of fins contains 20-30 protrusions; this density of protrusions further optimizes the heat dissipation effect while avoiding airflow obstruction due to excessive density. The convection unit 131 generates airflow, which, in conjunction with the heat exchange unit 140, removes heat from the power board, thereby achieving the heat dissipation function. An external interface receives input current and transmits it to the first power board 111. The first power board 111 transmits the input current to the second power board 121, which further processes the current and supplies power to other parts of the power module. During operation, the power board generates heat, which is absorbed by the first heat sink fin 141 and the second heat sink fin 142. The airflow generated by the convection unit 131 passes through the surface of the heat sink fins, carrying away the heat and dissipating it into the external environment, thereby ensuring the normal operating temperature of the power board.

[0038] Optionally, the cross-section of the ridge protrusion is arc-shaped or trapezoidal.

[0039] In the above implementation process, the cross-section of the ridge protrusion is arc-shaped or trapezoidal, which can optimize the airflow path, reduce airflow resistance, and increase the heat dissipation area.

[0040] Optionally, the main body plane of the first heat dissipation fin 141 is parallel to the mounting plane of the first power board 111; the main body plane of the second heat dissipation fin 142 is perpendicular to the mounting plane of the second power board 121.

[0041] In the above implementation process, the heat dissipation system includes a heat exchange unit 140 and a convection unit 131. The heat exchange unit 140 includes a first heat dissipation fin 141 and a second heat dissipation fin 142. The main body plane of the first heat dissipation fin 141 is parallel to the mounting plane of the first power plate 111. It has continuous, periodically undulating ridge-like protrusions with a tooth height of 0.1-0.5 mm and a tooth spacing of 0.2-1 mm. Each row of fins contains 20-30 protrusions, and the cross-section is arc-shaped or trapezoidal. The main body plane of the second heat dissipation fin 142 is perpendicular to the mounting plane of the second power plate 121. It also has continuous, periodically undulating ridge-like protrusions with a tooth height of 0.1-0.5 mm and a tooth spacing of 0.2-1 mm. Each row of fins contains 20-30 protrusions, and the cross-section is arc-shaped or trapezoidal. The convection unit 131 generates airflow, which, in conjunction with the heat exchange unit 140, carries heat away from the power plate, thereby achieving the heat dissipation function. Because the main plane of the first heat sink fin 141 is parallel to the mounting plane of the first power board 111, this design maximizes contact with the first power board 111, ensuring efficient heat conduction. The ridge-like protrusions (tooth height 0.1-0.5 mm, tooth spacing 0.2-1 mm, 20-30 protrusions per row, with a circular or trapezoidal cross-section) further increase the heat dissipation area and optimize the airflow path. Because the main plane of the second heat sink fin 142 is perpendicular to the mounting plane of the second power board 121, it ensures that airflow passes perpendicularly through the heat sink fins, reducing airflow resistance and improving heat dissipation efficiency. The ridge-like protrusions also increase the heat dissipation area and optimize the airflow path. The airflow generated by the convection unit 131 passes through the surface of the heat sink fins, carrying away heat and dissipating it into the external environment, thereby ensuring the normal operating temperature of the power board.

[0042] Optionally, please refer to Figure 4 , Figure 4 This is a second schematic diagram of a battery module provided in an embodiment of this application.

[0043] The heat exchange unit 140 also includes a thermally conductive sealing layer; the thermally conductive sealing layer covers the surfaces of the first power plate 111 and the second power plate 121, and fills the interface gap between the first power plate 111 and the second power plate 121 and the first heat dissipation fin 141 and the second heat dissipation fin 142.

[0044] In the above implementation process, a thermally conductive sealing layer covers the surfaces of the first power board 111 and the second power board 121, and fills the interface gap between the first power board 111 and the second power board 121 and the first heat dissipation fin 141 and the second heat dissipation fin 142. The function of the thermally conductive sealing layer is to improve heat conduction efficiency, reduce thermal resistance, and ensure that heat can be efficiently transferred from the power board to the heat dissipation fins. The convection unit 131 generates airflow, which, in conjunction with the heat exchange unit 140, carries heat away from the power board, thereby achieving the heat dissipation function.

[0045] Optionally, please refer to Figure 5 and Figure 6 , Figure 5 A schematic diagram of the first power board provided in an embodiment of this application; Figure 6 A schematic diagram of the second power board provided in an embodiment of this application.

[0046] The first power board 111 includes a first power conversion area; the second power board 121 includes a second power conversion area, a current rectification area, and a reverse protection area; the first heat sink fin 141 is mounted on the surface of the first power conversion area by attaching a ceramic sheet, and the heat sink is mounted on the first heat sink fin 141; the second power board 121 is mounted on the second power conversion area, the current rectification area, and the reverse protection area by a thermally conductive sealing layer.

[0047] In the above implementation, the power board assembly includes a first power board 111 and a second power board 121. The first power board 111 is installed on a first side 110 inside the housing 100 and includes a first power conversion region for converting the input current into the required output current. The second power board 121 is installed on a second side 120 inside the housing 100 and includes a second power conversion region, a current rectification region, and a reverse protection region. The second power conversion region is used to further process the current, the current rectification region is used to rectify the current, and the reverse protection region is used to prevent the current from flowing in reverse and protect the circuit safety.

[0048] Combination Figure 5 and Figure 6The first power board 111 can be a PFC power board, and the second power board 121 can be a DC power board. The first power board 111 is connected to an external interface, and the second power board 121 is electrically connected to the first power board 111. The PFC primary-side assembly refers to all the key power components and control circuits in the power board that are directly connected to the AC input or handle the unisolated primary high-voltage DC bus. The PFC inductor assembly is the core energy storage component of the PFC circuit, usually located after the input rectifier bridge, connected to the PFC switch (usually a MOSFET) and the boost diode. In the DC power board, the primary-side assembly contains the core devices that handle the input power, such as the input EMI filter, the rectifier bridge assembly responsible for converting the AC input to pulsating DC, the key reverse protection components (such as series diodes or MOSFET circuits to prevent damage from reverse connection), and the high-voltage DC bus capacitor; the transformer assembly realizes the electrical isolation and voltage conversion between the primary and secondary sides. Its primary winding is part of the primary-side assembly, connected to the switch (such as a MOSFET), chopping the DC bus voltage into high-frequency AC and coupling it to the secondary side through the magnetic core, together forming a complete power conversion front-end link.

[0049] Optionally, the components in the first functional conversion zone are arranged at intervals, and the areas in the second power conversion zone, current rectification zone, and anti-reverse protection zone are arranged at intervals to form air duct gaps; the air duct gaps are configured to guide airflow through them.

[0050] In the above implementation, the power board assembly includes a first power board 111 and a second power board 121. The first power board 111 is installed on a first side 110 inside the housing 100 and includes a first power conversion area for converting the input current into the required output current. Components in the first power conversion area are arranged at intervals to form airflow gaps. The second power board 121 is installed on a second side 120 inside the housing 100 and includes a second power conversion area, a current rectification area, and a reverse protection area. Regions in the second power conversion area, the current rectification area, and the reverse protection area are arranged at intervals to form airflow gaps. The airflow gaps are configured to guide airflow and optimize heat dissipation.

[0051] Optionally, the housing 100 also includes a third side 130 inside; wherein the third side 130 is perpendicular to the plane containing the first side 110 and the second side 120; the convection unit 131 includes a fan 133 and a fan mounting plate 132; the fan mounting plate 132 is arranged parallel to the third side 130, the fan 133 is mounted on the surface of the fan mounting plate 132 and is located in the space between the fan mounting plate 132 and the third side 130; the airflow direction of the fan 133 is towards the first power plate 111 and the second power plate 121.

[0052] In the above implementation process, the interior of the housing 100 is divided into a first side 110, a second side 120, and a third side 130. The planes containing the first side 110 and the second side 120 are parallel to each other and are used to mount the first power board 111 and the second power board 121, respectively. The third side 130 is perpendicular to the planes containing the first side 110 and the second side 120 and is used to mount the convection unit 131. The main function of the housing 100 is to provide physical support and protection for the internal components, while providing the necessary space for the heat dissipation system. The convection unit 131 includes a fan 133 and a fan mounting plate 132. The fan mounting plate 132 is arranged parallel to the third side 130 and is used to mount the fan 133. The fan 133 is mounted on the surface of the fan mounting plate 132 and is located within the space between the fan mounting plate 132 and the third side 130. The airflow of the fan 133 blows towards the first power board 111 and the second power board 121, and guides the airflow through the air duct gaps to pass through the heat dissipation fins, carrying away heat.

[0053] Optionally, the fan mounting plate 132 includes: a flow guiding structure; the flow guiding structure is an inclined surface extending downstream of the central through hole of the fan mounting plate; the flow guiding structure is located at the air outlet of the fan 133; the flow guiding structure is configured to guide the direction of airflow and prevent airflow from repeating.

[0054] In the above implementation, the airflow guiding structure is located at the central through-hole of the fan mounting plate 132 and extends downstream of the airflow. The airflow guiding structure is sloping, gradually expanding downstream from the air outlet of the fan 133, effectively guiding the direction of the airflow and distributing it more evenly across the power board surface. This optimizes the airflow path, ensuring efficient airflow through the heat sink fins and airflow channel gaps. The sloping design of the airflow guiding structure also prevents repeated backflow of airflow at the fan 133 air outlet. This backflow phenomenon can lead to airflow turbulence and reduce heat dissipation efficiency. Through the airflow guiding structure, the airflow can flow more smoothly to the power board, reducing energy loss and heat dissipation dead zones.

[0055] In summary, this application provides a power module, relating to the field of power module technology. The power module includes a housing 100, a power board assembly, and a heat dissipation system. The housing 100 has a first side 110 and a second side 120 inside. The power board assembly includes a first power board 111 and a second power board 121. The planes containing the first side 110 and the second side 120 are parallel to each other. The first power board 111 is disposed on the first side 110 inside the housing 100, and the second power board 121 is disposed on the second side 120 inside the housing 100. The first power board 111 is connected to an external interface, and the second power board 121 is electrically connected to the first power board 111. The external interface is used to provide input current. The second power board 121 is used to supply power to the power module based on the input current provided by the first power board 111. The heat dissipation system includes a heat exchange unit 140 and a convection unit 131. The heat exchange unit 140 is connected to the first power board 111 and the second power board 121. The airflow generated by the heat exchange unit 140 and the convection unit 131 works together to remove the heat generated by the first power board 111 and the second power board 121 during operation.

[0056] In the several embodiments provided in this application, it should be understood that the disclosed device can also be implemented in other ways. The device embodiments described above are merely illustrative. For example, the block diagrams in the accompanying drawings show the possible architecture, functions, and operations of the device according to multiple embodiments of this application. Furthermore, the functional modules in the various embodiments of this application can be integrated together to form an independent part, or each module can exist independently, or two or more modules can be integrated to form an independent part. The above descriptions are merely embodiments of this application and are not intended to limit the scope of protection of this application. For those skilled in the art, this application can have various modifications and variations. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application. It should be noted that similar reference numerals and letters in the following drawings indicate similar items; therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0057] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application.

[0058] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

Claims

1. A power module, characterized in that, The power module includes: a housing, a power board assembly, and a heat dissipation system; The housing interior includes a first side and a second side; the power board assembly includes a first power board and a second power board; wherein the planes containing the first side and the second side are parallel to each other; The first power board is disposed on the first side inside the housing, and the second power board is disposed on the second side inside the housing; the first power board is connected to an external interface, and the second power board is electrically connected to the first power board; wherein, the external interface is used to provide input current; the second power board is used to supply power to the power module based on the input current provided by the first power board; The heat dissipation system includes a heat exchange unit and a convection unit; the heat exchange unit is connected to the first power board and the second power board. The heat exchange unit and the airflow generated by the convection unit work together to remove the heat generated by the first power board and the second power board during operation.

2. The power module according to claim 1, characterized in that, The heat exchange unit includes: a first heat dissipation fin and a second heat dissipation fin; The first and second heat dissipation fins include continuous, periodically undulating ridge-like protrusions.

3. The power module according to claim 2, characterized in that, in, The ridge-like protrusions have a tooth height of 0.1-0.5 mm and a tooth spacing of 0.2-1 mm. Each row of fins includes 20-30 protrusions.

4. The power module according to claim 2, characterized in that, in, The cross-section of the ridge-like protrusion is circular or trapezoidal.

5. The power module according to claim 2, characterized in that, in, The main body plane of the first heat dissipation fin is parallel to the mounting plane of the first power board; the main body plane of the second heat dissipation fin is perpendicular to the mounting plane of the second power board.

6. The power module according to claim 2, characterized in that, The heat exchange unit also includes a thermally conductive sealing layer; The thermally conductive sealing layer covers the surfaces of the first power board and the second power board, and fills the interface gaps between the first power board and the second power board and the first heat dissipation fins and the second heat dissipation fins.

7. The power module according to claim 6, characterized in that, in, The first power board includes a first power conversion area; the second power board includes a second power conversion area, a current rectification area, and a reverse protection area. The first heat dissipation fin is attached to the surface of the first power conversion area by attaching a ceramic sheet to the heat sink and the first heat dissipation fin; The second power board is installed in the second power conversion area, the current rectification area, and the anti-reverse protection area through the thermally conductive sealing layer.

8. The power module according to claim 7, characterized in that, in, The components in the first power conversion zone are arranged at intervals, and the regions in the second power conversion zone, the current rectification zone, and the anti-reverse protection zone are arranged at intervals to form air duct gaps; the air duct gaps are configured to guide the airflow through.

9. The power module according to claim 1, characterized in that, The housing also includes a third side; wherein the third side is perpendicular to the plane containing the first side and the second side; The convection unit includes a fan and a fan mounting plate; the fan mounting plate is arranged parallel to the third side, the fan is mounted on the surface of the fan mounting plate and is located in the space between the fan mounting plate and the third side; the airflow direction of the fan is towards the first power plate and the second power plate.

10. The power module according to claim 9, characterized in that, The fan mounting plate includes: a flow guiding structure; The airflow guiding structure is an inclined surface extending downstream from the central through hole of the fan mounting plate; the airflow guiding structure is located at the air outlet of the fan; the airflow guiding structure is configured to guide the direction of airflow and prevent airflow from repeating.

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