Device cooling system

Abstract

The application discloses a device cooling system, relates to the technical field of liquid cooling heat dissipation, and is characterized in that a flow monitor is arranged in a liquid cooling module, the flow monitor is used for monitoring the flow of cooling liquid of the liquid cooling module, and the flow of the cooling liquid distributed to multiple specified components by a cold distribution unit is adjusted according to the flow monitored by the flow monitor, so that dynamic flow adjustment is realized, resource waste is avoided, cooling efficiency is improved, the energy consumption of electronic equipment is reduced when the electronic equipment is in high-performance operation, energy saving and emission reduction are realized, and the problem of low cooling efficiency caused by a static liquid cooling scheme in the prior art is solved.

Description

Technical Field

[0001] This application relates to the field of liquid cooling technology, and more particularly to equipment cooling systems. Background Technology

[0002] To address the heat dissipation problem of internal components in electronic devices, static liquid cooling solutions are often used, where the coolant flow rate is constant. However, these static liquid cooling solutions cannot dynamically adjust the cooling strategy based on real-time flow, resulting in low cooling efficiency. Utility Model Content

[0003] This application provides a device cooling system to at least solve the problem of low cooling efficiency caused by static liquid cooling solutions in related technologies.

[0004] This application provides a device cooling system, including: a cold distribution unit, multiple liquid cooling modules, multiple flow regulating valves, multiple liquid supply branches, and a control unit. The multiple liquid cooling modules correspond one-to-one with multiple designated components of an electronic device, and each liquid cooling module contacts its corresponding designated component. Each liquid cooling module is equipped with a flow monitor. The multiple liquid cooling modules are divided into multiple liquid cooling module groups. The power consumption of the designated components served by each liquid cooling module group is within the same power consumption range. Each multiple liquid supply branch corresponds one-to-one with the multiple flow regulating valves. Each multiple flow regulating valve corresponds one-to-one with the multiple liquid cooling module groups. The coolant in the supply branch is regulated by the corresponding flow regulating valve and then delivered to the corresponding liquid cooling module group. The cold distribution unit is used to distribute the coolant to the multiple liquid cooling modules, and to recover and cool the coolant flowing through the multiple liquid cooling modules. The multiple liquid cooling modules are used to use the coolant distributed by the cold distribution unit to reduce the temperature of their corresponding designated components. The flow monitor is used to monitor the flow rate of the coolant in its respective liquid cooling module. The control unit is used to generate control commands based on the flow rates monitored by the flow monitors on the multiple designated component groups. The flow regulating valves among the multiple flow regulating valves are used to adjust the flow rate of the corresponding liquid cooling module group according to the control commands.

[0005] This application introduces a flow monitor within the liquid cooling module to monitor the coolant flow rate. Based on the monitored flow rate, the flow rate of coolant distributed to multiple designated components by the cooling distribution unit is adjusted, achieving dynamic flow regulation. This avoids resource waste, improves cooling efficiency, and ensures high-performance operation of electronic equipment while reducing energy consumption, thus achieving energy conservation and emission reduction. This solves the problem of low cooling efficiency caused by static liquid cooling solutions in related technologies. By grouping the liquid cooling modules according to component power consumption and using corresponding liquid supply branches and flow regulating valves, differentiated coolant flow rates can be provided for components with different power consumption, avoiding energy waste caused by "one-size-fits-all" cooling. The control unit dynamically adjusts the valve opening based on real-time flow monitoring, forming a "monitoring-analysis-control" closed loop. This ensures sufficient heat dissipation for high-power components while reducing overcooling of low-power components, significantly improving the energy efficiency and stability of the equipment cooling system. Attached Figure Description

[0006] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0007] Figure 1 This is a schematic diagram of a device cooling system provided in an embodiment of this application.

[0008] Figure 2 A cooling circuit for a device cooling system provided in this application embodiment.

[0009] Figure 3 This is a top view schematic diagram of a liquid cooling module used in a related technology, provided as an embodiment of this application.

[0010] Figure 4 A perspective view of an optional liquid cooling module provided in an embodiment of this application.

[0011] Figure 5 A side cross-sectional view of an optional liquid cooling module provided in an embodiment of this application. Detailed Implementation

[0012] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0013] It should be noted that, in the description of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. The terms "first," "second," etc., in this application are used to distinguish similar objects and are not used to describe a specific order or sequence.

[0014] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0015] In related technologies, static liquid cooling solutions are commonly used to address the heat dissipation issues of internal components in electronic devices, where the coolant flow rate is fixed. For example, in the case of servers, which are the core equipment in data centers, high performance, high availability, high cost-effectiveness, and high efficiency are crucial indicators of server quality. However, with the increasing power consumption of critical components such as the Central Processing Unit (CPU) and Graphics Processing Unit (GPU), the current technology, which uses a coolant distribution unit (CDU) combined with manifolds to continuously supply a specific flow rate of coolant to the cold plates, cannot adjust the flow rate according to the different coolant flow requirements of specific components, such as the CPU under standby or pressurized conditions. Furthermore, the actual flow rate distributed to each cold plate cannot be accurately monitored. Understandably, this static liquid cooling solution cannot dynamically adjust the cooling strategy based on real-time flow, resulting in low cooling efficiency.

[0016] To address the aforementioned issues, this application embodiment incorporates a flow monitor within the liquid cooling module. This monitor tracks the flow rate of the coolant within the module and adjusts the coolant flow rate allocated to multiple designated components by the cooling distribution unit based on the monitored flow rate. This dynamic flow regulation avoids resource waste, improves cooling efficiency, and ensures high-performance operation of electronic devices while simultaneously reducing energy consumption, thus achieving energy conservation and emission reduction. Precise control and monitoring enable rapid response to changes in heat load, enhancing overall heat dissipation efficiency and preventing performance degradation or hardware damage due to overheating. Furthermore, grouping the liquid cooling modules according to component power consumption, along with corresponding supply branches and flow regulating valves, allows for differentiated coolant flow rates to components with varying power consumption, avoiding energy waste caused by a "one-size-fits-all" cooling approach. The control unit dynamically adjusts valve openings based on real-time flow monitoring, forming a "monitoring-analysis-control" closed loop. This ensures adequate heat dissipation for high-power components while reducing overcooling of low-power components, significantly improving the energy efficiency and stability of the equipment's cooling system.

[0017] Embodiments of this application provide a device cooling system for dissipating heat from critical components of electronic devices. The electronic devices may be servers, personal computers, workstations, etc. Figure 1 This is a schematic diagram of a device cooling system provided in an embodiment of this application, such as... Figure 1 As shown, the equipment cooling system includes a cold distribution unit, multiple liquid cooling modules, multiple flow regulating valves, multiple liquid supply branches, and a control unit.

[0018] The cold distribution unit is used to distribute coolant to multiple liquid cooling modules and to recover and cool the coolant flowing through these modules. In this application, the cold distribution unit refers to a device responsible for distributing coolant from the supply system to each liquid cooling module, recovering the coolant after heat exchange in the modules, and then circulating it for cooling. The cold distribution unit ensures stable operation of the cooling system and effectively reduces the temperature of specified components in electronic equipment by controlling the distribution and recovery of coolant. For example, the cold distribution unit can be a coolant distribution unit (CDU).

[0019] Multiple liquid cooling modules correspond one-to-one with multiple designated components of the electronic device, and the cooling modules within these modules are in contact with their respective designated components. Each liquid cooling module is equipped with a flow monitor. These multiple liquid cooling modules use coolant distributed by the cold distribution unit to reduce the temperature of the corresponding designated component; the flow monitors monitor the flow rate of the coolant within their respective liquid cooling modules. A liquid cooling module is a cooling device that directly contacts the designated component in the electronic device, using liquid circulation to remove heat from the component. Each liquid cooling module is responsible for a specific high-heat component, such as a Central Processing Unit (CPU) or a Graphics Processing Unit (GPU). Each liquid cooling module is equipped with a flow monitor to achieve real-time monitoring of the coolant flow rate, supporting intelligent speed adjustment and anomaly detection. The flow monitor is located within the liquid cooling module and is used to monitor the coolant flow rate passing through it in real time. The collected flow data will be transmitted to the control unit via signal lines to intelligently control the coolant pump and electronic flow regulating valve, ensuring that the coolant flow meets the heat dissipation requirements of the specified components, while also supporting the optimization of system energy efficiency.

[0020] In this embodiment, placing flow monitors before the liquid cooling modules corresponding to different designated components to monitor flow has the following functions: 1) By monitoring the flow of key cooling pipes in real time, the internal flow distribution of the system can be accurately controlled, realizing the visualization of the system flow distribution. 2) By combining the power consumption-flow relationship table of the control unit and the liquid supply pump, the health status of cooling management can be understood in advance, so as to carry out maintenance before cooling management fails. 3) By combining the minimum flow trigger alarm set by the control unit, it can assist in quickly locating the problematic cold plate. 4) It can collect flow difference data of the same cold plate with different pipe configurations, forming an accurate comparison between simulation and actual measurement, which is beneficial to improving the accuracy of simulation.

[0021] In this embodiment, multiple liquid cooling modules are divided into multiple liquid cooling module groups; the power consumption of the designated components operated by the liquid cooling module groups in the multiple liquid cooling module groups is within the same power consumption range.

[0022] In this context, a liquid cooling module group refers to a subset formed by dividing multiple liquid cooling modules according to a specified component power consumption range. Each liquid cooling module group corresponds to components with power consumption within the same range (such as a CPU / GPU cluster). Centralized management enables on-demand cooling, avoiding the imbalance in power distribution caused by mixing components with different power consumption levels. For example, Figure 2 A cooling circuit for a device cooling system provided in this application embodiment, such as Figure 2As shown, since the power consumption of GPU and CPU is in different ranges, the eight GPUs (GPU1-GPU8) are set up as one liquid cooling module group, and the two CPUs (CPU1 and CPU2) are set up as another liquid cooling module group.

[0023] like Figure 2 As shown, the equipment cooling system also includes multiple flow regulating valves and multiple liquid supply branches; each of the multiple liquid supply branches corresponds to a single flow regulating valve; each of the multiple flow regulating valves corresponds to a single liquid cooling module group; the coolant in the multiple liquid supply branches is delivered to the corresponding liquid cooling module group after being regulated by the corresponding flow regulating valve.

[0024] Flow regulating valves are electrically controlled valves installed on each liquid supply branch and located before the liquid inlet pipe of the liquid cooling module. Each valve corresponds one-to-one with a liquid cooling module group. By receiving commands from the control unit, they dynamically adjust their opening degree to precisely control the flow rate of coolant entering the corresponding liquid cooling module group, achieving differentiated heat dissipation regulation based on component and power consumption. Optionally, flow regulating valves could be installed before each liquid cooling module. However, this approach is costly and bulky. Therefore, in this embodiment, flow regulating valves are only installed before each liquid cooling module group, reducing cost and size while still meeting flow regulation requirements.

[0025] The liquid supply branch refers to the piping system that branches off from the secondary side liquid supply tank and connects independently to each liquid-cooled module group. Each branch is equipped with a dedicated flow regulating valve, forming a hierarchical liquid supply structure of "main pipe - branch pipe - module group," supporting precise flow distribution to components with different power consumption. The liquid supply branch can be a section of piping from the equipment's liquid supply pump to the inlet of each liquid-cooled module group. For example, ... Figure 2 As shown, the section of pipe from the device's liquid supply pump to the liquid cooling module group corresponding to the GPU is the liquid supply branch, and the section of pipe from the device's liquid supply pump to the liquid cooling module group corresponding to the CPU is also the liquid supply branch. It can be understood that in this embodiment, with N liquid cooling module groups, there are N liquid supply branches, and similarly, N flow regulating valves.

[0026] The control unit is used to adjust the flow rate of coolant distributed by the cold distribution unit to multiple designated components based on the flow rate monitored by the flow monitor. Specifically, the control unit is a controller used to adjust the coolant flow rate distributed by the cold distribution unit to the designated components based on real-time flow information monitored by the flow monitor, using intelligent algorithms (such as Proportional Integral Derivative (PID) control), thereby achieving precise heat dissipation and optimizing system energy efficiency. For example, the electronic device can be a server, and the control unit can be a Baseboard Management Controller (BMC). In this embodiment, the control unit is also used to generate control commands based on the flow rates monitored by the flow monitors on multiple designated component groups; the flow regulating valves among the multiple flow regulating valves are used to adjust the flow rate of the corresponding liquid cooling module group according to the control commands from the control unit.

[0027] This embodiment incorporates a flow monitor within the liquid cooling module to monitor the coolant flow rate. Based on the monitored flow rate, the flow rate of coolant distributed to multiple designated components by the cold distribution unit is adjusted, achieving dynamic flow regulation. This avoids resource waste, improves cooling efficiency, and ensures high-performance operation of electronic equipment while reducing energy consumption, thus achieving energy conservation and emission reduction. This solves the problem of low cooling efficiency caused by static liquid cooling solutions in related technologies. By grouping the liquid cooling modules according to component power consumption and coordinating corresponding liquid supply branches and flow regulating valves, differentiated coolant flow rates can be provided for components with different power consumption, avoiding energy waste caused by "one-size-fits-all" cooling. The control unit dynamically adjusts the valve opening based on real-time flow monitoring, forming a "monitoring-analysis-control" closed loop. This ensures sufficient heat dissipation for high-power components while reducing overcooling of low-power components, significantly improving the energy efficiency and stability of the equipment cooling system.

[0028] In one exemplary embodiment, the equipment cooling system further includes multiple water distributors; each water distributor corresponds to a multiple liquid cooling module group; the water distributors in the multiple water distributors are installed between the corresponding flow regulating valves and the corresponding liquid cooling module groups for uniformly distributing coolant.

[0029] The coolant distributor is a fluid distribution device installed between the flow control valve and the liquid cooling module group, and it is set up one-to-one with each liquid cooling module group. Its core function is to evenly distribute the single-channel coolant output from the flow control valve to the inlet of multiple liquid cooling modules in the corresponding liquid cooling module group, ensuring that the coolant flow rate of each module in the group is consistent. This avoids some components being overcooled or overheated due to uneven distribution, thereby improving heat dissipation efficiency and server operating stability, while reducing the risk of equipment damage caused by flow differences.

[0030] like Figure 2 As shown, a water distributor is installed before the liquid cooling module group corresponding to the GPU, and a water distributor can also be installed before the liquid cooling module group corresponding to the CPU. Figure 2 The system involves only two CPUs, has a relatively simple structure, and a simple and short coolant flow distribution path. Nearly uniform coolant delivery can be achieved through a single supply pipe, and the heat dissipation requirements can be met without a distributor. In this embodiment, no distributor is set before the liquid cooling module group corresponding to the CPU.

[0031] This embodiment utilizes a water distributor to achieve uniform coolant distribution, ensuring consistent inlet flow rates for all modules within the same liquid cooling module group. This prevents insufficient or excessive cooling of some components due to flow rate differences, thus guaranteeing the operational stability of electronic equipment. Simultaneously, the water distributor simplifies the design of the liquid supply pipeline, reduces the number of branch pipes, and lowers system complexity and cost. Furthermore, its structure facilitates subsequent maintenance and flow balance adjustment. When modules are added, removed, or their layout changes within the module group, it can be quickly adapted without large-scale pipeline modifications, enhancing the flexibility and scalability of the equipment cooling system. This is particularly suitable for the heat dissipation needs of high-density computing scenarios such as GPUs.

[0032] In one exemplary embodiment, such as Figure 2 As shown, the cold distribution unit includes a cooling tower, a primary side supply tank, and a main supply pump. The coolant in the return pipe of the cold distribution unit releases heat in the cooling tower and is then transported to the primary side supply tank for storage. The main supply pump pumps the coolant from the primary side supply tank to multiple liquid cooling modules.

[0033] In this embodiment, the cold distribution unit refers to the integrated system responsible for the circulation and distribution of coolant, including a cooling tower, a primary-side supply tank, and a main supply pump. Through cooling tower heat dissipation, tiered liquid storage, and pumping regulation, a closed-loop management system is achieved from coolant storage to precise supply, ensuring the continuous heat dissipation needs of the liquid cooling module.

[0034] The primary supply tank is a container in the cold distribution unit that stores the low-temperature coolant after it has been cooled by the cooling tower. As the primary storage unit of the coolant circulation system, it provides a stable liquid source for the main supply pump by receiving the coolant returned from the cooling tower.

[0035] The main liquid supply pump is the core power equipment that connects the primary side liquid supply tank and the electronic equipment. It is responsible for intermittently pumping the coolant that has been cooled by the cooling tower in the primary side liquid supply tank to the liquid cooling module in the electronic equipment according to the heat dissipation requirements of the electronic equipment.

[0036] The return pipe of the cold distribution unit refers to the pipe that guides the high-temperature coolant from the liquid cooling module back to the cooling tower. Its function is to deliver the coolant, which has absorbed heat from critical components such as the CPU / GPU, to the cooling tower for heat release, completing the first stage of the heat dissipation cycle and ensuring that the coolant can continuously absorb heat. For example, Figure 2 As shown, the return pipe of the cold distribution unit refers to the pipe loop that extends from the outlet pipes of multiple liquid cooling modules to the cooling tower.

[0037] The liquid supply pipe of the cold distribution unit refers to the piping system connecting the main liquid supply pump and the liquid cooling modules. Its function is to accurately deliver the low-temperature coolant, which has been cooled and stored in the cooling tower, to the inlet of each liquid cooling module through the equipment's liquid supply pump, providing a continuous and stable coolant flow for key components such as CPUs / GPUs, and supporting intelligent speed regulation and energy-saving operation.

[0038] In this embodiment, the integration of the cooling tower effectively promotes the heat dissipation of the coolant, ensuring that the coolant can be cooled down rapidly during circulation and maintain its cooling efficiency; the combination of the primary side supply tank and the main supply pump ensures sufficient supply and stable circulation of coolant, and can continuously provide cooling services even under high load conditions.

[0039] In one exemplary embodiment, such as Figure 2 As shown, the equipment cooling system also includes a secondary-side coolant supply tank and an equipment coolant supply pump. The main coolant supply pump draws coolant from the primary-side coolant supply tank to the secondary-side coolant supply tank, while the equipment coolant supply pump draws coolant from the secondary-side coolant supply tank to multiple liquid-cooled modules via the coolant supply pipe of the cold distribution unit.

[0040] The secondary-side coolant supply tank is an intermediate storage device in the cold distribution unit that receives coolant from the main coolant supply pump and provides a liquid source for the equipment's coolant supply pumps. Its level is dynamically adjusted by the main coolant supply pump according to the needs of the internal components of the electronic equipment, ensuring that the equipment's coolant supply pumps can continuously draw coolant and deliver it to the liquid cooling module, meeting the flow requirements for heat dissipation of critical components. The main coolant supply pump pumps coolant from the primary-side coolant supply tank to the secondary-side coolant supply tank, maintaining a stable secondary-side liquid level and providing a basic flow guarantee for the precise distribution by the subsequent equipment's coolant supply pumps.

[0041] The equipment's liquid supply pump is a power unit installed between the secondary-side liquid supply tank and the liquid cooling module. It continuously draws coolant through the liquid supply pipes of the cold distribution unit and precisely delivers it to the inlet ends of multiple liquid cooling modules, ensuring a stable flow to critical components (such as CPUs / GPUs) and supporting intelligent speed regulation and energy-saving operation. For example... Figure 2 As shown, the liquid supply pipe of the cold distribution unit refers to the pipeline loop that extends from the liquid outlet of the secondary side liquid supply tank to the liquid supply pump of the equipment.

[0042] In this embodiment, the main coolant supply pump intermittently draws coolant from the primary coolant supply tank to the secondary coolant supply tank based on the coolant capacity of the secondary coolant supply tank, ensuring that the coolant capacity of the secondary coolant supply tank does not fall below a certain value (adjustable value). Then, the equipment's coolant supply pump continuously draws coolant from the secondary coolant supply tank for heat dissipation based on the internal components' needs. The internal regulating valve of the electronic equipment intelligently and dynamically adjusts its operation based on the temperature of key components and the coolant supply pump's flow rate, allowing the electronic equipment to meet its corresponding heat dissipation needs with the lowest possible coolant flow rate, thus achieving energy conservation and emission reduction.

[0043] This embodiment constructs a tiered coolant circulation system. Through the process design of cooling tower heat dissipation - primary side liquid storage - main liquid supply pump delivery - secondary side pressure stabilization - precise distribution by equipment liquid supply pump, it not only achieves effective release and recycling of coolant heat, but also ensures that the equipment liquid supply pump can continuously output a stable flow to the liquid cooling module by isolating the heat source and the energy consumption end through two-stage liquid storage tanks. This architecture not only ensures heat dissipation efficiency, but also supports subsequent intelligent flow adjustment and energy-saving optimization, improving the reliability and energy efficiency of the equipment liquid cooling system.

[0044] In one exemplary embodiment, such as Figure 2 As shown, the secondary-side coolant supply tank and equipment coolant pump are located inside the electronic equipment rack, while the cold distribution unit is located outside the rack. This arrangement places the secondary-side coolant supply tank and pump close to heat sources such as the CPU and GPU, shortening the coolant circulation path and reducing heat loss during transfer, thereby improving overall heat dissipation efficiency. Placing the cold distribution unit externally allows for independent maintenance and upgrades, reducing the impact of internal cooling system failures. It also facilitates more precise control of coolant temperature and pressure, ensuring stable system operation.

[0045] In this embodiment, as Figure 2 As shown, the coolant for the cabinets of multiple electronic devices is supplied through a main coolant supply pump. Each cabinet includes a secondary coolant supply tank and an equipment coolant supply pump to provide coolant to its corresponding cabinet. The cooling circuit for each cabinet is identical, and will not be described in detail here.

[0046] In one exemplary embodiment, such as Figure 2 As shown, the cold distribution unit also includes: a heat energy recovery and utilization device; the heat energy recovery and utilization device is connected to the cooling tower and is used to recover and utilize the heat released by the cooling tower when the cooling liquid releases heat.

[0047] Among them, heat energy recovery and utilization equipment refers to energy recovery devices connected to cooling towers. Their function is to capture and convert the heat carried by electronic equipment in the coolant from the cooling tower through evaporation or convection into reusable energy (such as hot water, steam, or electricity), thereby improving the overall energy efficiency of the data center and reducing energy waste caused by direct heat emissions. For example, heat energy recovery and utilization equipment can be a heat exchanger, which uses plate or tube heat exchange structures to transfer the heat discharged from the cooling tower to the heating system or industrial heat application. Alternatively, it can be a waste heat boiler, using high-temperature coolant steam to drive a turbine to generate electricity, realizing the conversion of heat energy into electrical energy. Finally, it can be an absorption chiller, using waste heat as a power source to drive a refrigeration cycle, providing cooling for other areas of the data center.

[0048] In this embodiment, a heat energy recovery and utilization device is set up to recover the waste heat emitted by the cooling tower and convert the originally lost heat into usable energy such as heating, power generation or recooling, forming a closed-loop system of "heat dissipation-heat utilization". This not only reduces the dependence on traditional energy and lowers operating costs, but also achieves energy conservation and emission reduction goals through waste heat reuse, helping data centers to achieve green and low-carbon standards.

[0049] In one exemplary embodiment, Figure 3 A top view schematic diagram of a liquid cooling module used in a related technology, provided as an embodiment of this application, is shown below. Figure 3 As shown, the liquid cooling module in the related technology only includes a liquid cooling plate, a liquid inlet pipe interface, a liquid outlet pipe interface, a liquid inlet pipe, and a liquid outlet pipe. The liquid inlet pipe and the liquid outlet pipe... Figure 3 Not shown in the image. Figure 4 A perspective view of an optional liquid cooling module provided for an embodiment of this application, as shown below. Figure 4 As shown in this embodiment, the liquid cooling module among the multiple liquid cooling modules includes not only a liquid cooling plate, an inlet pipe interface, an outlet pipe interface, an inlet pipe, and an outlet pipe, but also a flow monitor. The inlet pipe and outlet pipe... Figure 4(Not shown); In one of multiple liquid cooling modules, the liquid cooling plate has internal cooling channels. An inlet pipe interface connects to one end of the cooling channels, and an outlet pipe interface connects to the other end. A flow monitor is installed on the inlet pipe interface. Coolant in the inlet pipe is delivered to the cooling channels to absorb heat generated by designated components. After heat exchange, the coolant flows out from the outlet pipe interface and is then delivered to the cold distribution unit via the outlet pipe. The liquid cooling plate refers to a flat plate structure with internal cooling channels that directly contacts key components of electronic equipment. It removes heat generated by the components through the circulation of coolant within the cooling channels and is the core component of the liquid cooling system. The cooling channels inside the liquid cooling plate guide the coolant flow to absorb heat from the components; their design directly affects liquid cooling efficiency and component temperature control. The inlet pipe interface connects the liquid cooling plate to the inlet pipe, responsible for introducing external coolant into the cooling channels of the liquid cooling plate. It is also the installation location for the flow monitor, used to monitor the incoming coolant flow rate. The outlet pipe interface is located at the other end of the liquid cooling plate and is connected to the cooling channel outlet. This allows the cooled liquid, after heat exchange, to flow out from here, enter the outlet pipe, and return to the cold distribution unit for cooling. The inlet pipe refers to the pipe connected to the inlet pipe interface, used to transport coolant to the inlet pipe interface and then into the cooling channel. The outlet pipe refers to the pipe connected to the outlet pipe interface, responsible for leading the cooled liquid, after heat exchange, out from the outlet pipe interface and returning it to the cold distribution unit, completing the coolant circulation.

[0050] In this embodiment, the flow monitor is integrated into the inlet pipe interface of each liquid cooling module. Combined with the liquid cooling plate, cooling channel and other structures, the flow rate of the coolant is precisely monitored and dynamically controlled.

[0051] In one exemplary embodiment, the flow monitor includes a flow velocity monitoring probe and a signal converter; the flow velocity monitoring probe transmits the monitored flow information to the signal converter via a signal transmission line; the signal converter performs signal conversion on the flow information and transmits the converted signal to the control unit; the liquid cooling module among the multiple liquid cooling modules further includes: a fastening nut and a sealing ring; the flow velocity monitoring probe is installed on the liquid inlet pipe interface via the fastening nut, and the sealing ring is embedded between the fastening nut and the liquid inlet pipe interface to prevent coolant leakage.

[0052] The flow monitor is located on the pipe at the front end of the cold plate, and its external signal line connects to the main board. The flow monitor contains a flow rate monitoring probe and a signal converter, which can monitor the flow rate and volume of the coolant flowing through this pipe in real time. The monitored flow information is then transmitted to the control unit, such as the BMC, via a signal transmission line.

[0053] A signal converter is a device specifically designed for signal processing. Its primary function is to convert the raw signals collected by the flow monitor (which may be analog signals, digital signals in a specific format, etc.) into standardized signals (such as voltage or current signals within a specific range, or digital signals conforming to communication protocols) that the control unit can recognize and process. The converted signals are then accurately transmitted to the control unit to achieve data interaction and system control.

[0054] in, Figure 5 A side cross-sectional view of an optional liquid cooling module provided for an embodiment of this application, as shown below. Figure 5 As shown, the fastening nut is a component of the liquid cooling module, used to securely mount the flow rate monitoring probe to the inlet port. It provides sufficient pressure to hold the flow monitor in place by rotating and tightening, while simultaneously engaging with the sealing ring to prevent coolant leakage from the port. Figure 5 As shown, the sealing ring is an elastic element embedded between the fastening nut and the liquid inlet pipe interface. Its main function is to enhance the sealing performance of the interface and prevent coolant leakage during the operation of the liquid cooling module. Through its excellent elasticity and sealing properties, the sealing ring ensures the long-term stable operation of the cooling system while protecting the internal components of electronic equipment from coolant corrosion.

[0055] In this embodiment, by adding a fastening nut and a sealing ring to the liquid cooling module, the flow monitor can be securely installed on the inlet pipe interface. The fastening nut provides a firm fixation, preventing interface instability caused by vibration or loosening; while the sealing ring, embedded between the fastening nut and the inlet pipe interface, effectively prevents coolant leakage, avoiding system failures or performance degradation that may be caused by leakage.

[0056] In one exemplary embodiment, such as Figure 5 As shown, the liquid cooling module in the multiple liquid cooling modules also includes: anti-leakage fixing adhesive; the anti-leakage fixing adhesive is applied to the joint between the fastening nut and the sealing ring, and works in conjunction with the sealing ring to prevent coolant from leaking from the inlet pipe interface.

[0057] The leak-proof fixing adhesive is an adhesive material applied to the joint between the fastening nut and the sealing ring. It enhances the sealing performance by filling micro-gaps and forms a double leak-proof structure with the sealing ring to prevent coolant from leaking from the inlet pipe interface and ensure the long-term stable operation of the liquid cooling system.

[0058] In this embodiment, by applying anti-leakage fixing adhesive at the junction of the fastening nut and the sealing ring, the anti-leakage fixing adhesive can fill the micro-gaps and form a double anti-leakage structure, effectively preventing coolant from leaking from the inlet pipe interface, enhancing the sealing performance of the liquid cooling module interface. This not only solves the problem of local defects that may exist in a single sealing element, but also resists the risk of seal failure caused by long-term vibration or temperature changes, thereby ensuring the stable operation of the liquid cooling system of electronic equipment and reducing failures and maintenance costs caused by leakage.

[0059] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods according to the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method.

Claims

1. A device cooling system, characterized in that, include: The system comprises a cold distribution unit, multiple liquid cooling modules, multiple flow regulating valves, multiple liquid supply branches, and a control unit. Each liquid cooling module corresponds one-to-one with a designated component of the electronic device, and the cooling module within each liquid cooling module contacts its corresponding designated component. Each liquid cooling module is equipped with a flow monitor. The multiple liquid cooling modules are divided into multiple liquid cooling module groups. The power consumption of the designated components served by each liquid cooling module group is within the same power consumption range. Each liquid supply branch corresponds one-to-one with the multiple flow regulating valves. Each flow regulating valve corresponds one-to-one with each liquid cooling module group. The coolant in each of the multiple liquid supply branches is regulated by its corresponding flow regulating valve and then delivered to the corresponding liquid cooling module group. The cold distribution unit is used to distribute coolant to the plurality of liquid cooling modules and to recover and cool the coolant flowing through the plurality of liquid cooling modules; The plurality of liquid cooling modules are used to reduce the temperature of the corresponding designated components using the coolant distributed by the cold distribution unit; The flow monitor is used to monitor the flow rate of the coolant in the liquid cooling module it is located in; The control unit is used to generate control commands based on the flow rate monitored by the flow monitors on the plurality of designated component groups. The flow regulating valve among the plurality of flow regulating valves is used to regulate the flow rate of the corresponding liquid cooling module group according to the control command.

2. The equipment cooling system according to claim 1, characterized in that, The liquid cooling module among the plurality of liquid cooling modules further includes a liquid cooling plate, a liquid inlet pipe interface, a liquid outlet pipe interface, a liquid inlet pipe, and a liquid outlet pipe; wherein, In one of the plurality of liquid cooling modules, a cooling channel is provided inside the liquid cooling plate. The liquid inlet pipe interface is connected to one end of the cooling channel, and the liquid outlet pipe interface is connected to the other end of the cooling channel. The flow monitor is installed on the liquid inlet pipe interface. The coolant in the liquid inlet pipe is transported from the liquid inlet pipe interface to the cooling channel to absorb the heat generated by the designated components. The coolant after heat exchange flows out from the liquid outlet pipe interface and is transported to the cold distribution unit via the liquid outlet pipe.

3. The equipment cooling system according to claim 2, characterized in that, The flow monitor includes a flow velocity monitoring probe and a signal converter; the flow velocity monitoring probe transmits the monitored flow information to the signal converter via a signal transmission line; the signal converter performs signal conversion on the flow information and transmits the converted signal to the control unit; The liquid cooling module among the plurality of liquid cooling modules also includes: a fastening nut; The flow rate monitoring probe is mounted on the inlet pipe interface via the fastening nut.

4. The equipment cooling system according to claim 3, characterized in that, The liquid cooling module among the plurality of liquid cooling modules further includes: A sealing ring is fitted between the fastening nut and the inlet pipe interface to prevent coolant leakage.

5. The equipment cooling system according to claim 4, characterized in that, The liquid cooling module among the plurality of liquid cooling modules further includes: leak-proof fixing adhesive; The leak-proof adhesive is applied to the joint between the fastening nut and the sealing ring, and works in conjunction with the sealing ring to prevent coolant from leaking from the inlet pipe interface.

6. The equipment cooling system according to claim 1, characterized in that, The cold distribution unit includes: a cooling tower, a primary side liquid supply tank, and a main liquid supply pump; The coolant in the return pipe of the cold distribution unit releases heat in the cooling tower and is transported to the primary side supply tank for storage; the main supply pump pumps the coolant in the primary side supply tank to the plurality of liquid cooling modules.

7. The equipment cooling system according to claim 6, characterized in that, The cold distribution unit also includes: a heat energy recovery and utilization device; The heat energy recovery and utilization equipment is connected to the cooling tower and is used to recover and utilize the heat released by the cooling tower when the cooling liquid releases heat.

8. The equipment cooling system according to claim 6, characterized in that, The equipment cooling system also includes: a secondary side liquid supply tank and an equipment liquid supply pump; The main liquid supply pump pumps the coolant in the primary side liquid supply tank to the secondary side liquid supply tank, and the equipment liquid supply pump pumps the coolant in the secondary side liquid supply tank to the plurality of liquid cooling modules through the liquid supply pipe of the cold distribution unit.

9. The equipment cooling system according to claim 8, characterized in that, The secondary side liquid supply tank and the equipment liquid supply pump are located inside the cabinet of the electronic equipment, while the cold distribution unit is located outside the cabinet of the electronic equipment.

10. The equipment cooling system according to claim 1, characterized in that, The equipment cooling system also includes multiple water distributors; each of the multiple water distributors corresponds to one of the multiple liquid cooling module groups. The water distributors among the multiple water distributors are installed between the corresponding flow regulating valves and the corresponding liquid cooling module groups to evenly distribute the coolant.

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