VC heat dissipation module

Abstract

The utility model discloses a VC heat dissipation module, including body mechanism and heat dissipation mechanism, the body mechanism includes side plate, lower cover and upper cover, the lower cover and upper cover are integrally formed in the lower end and the upper end of side plate respectively, the side plate, lower cover and upper cover seal combination forms vacuum cavity, the heat dissipation mechanism includes multistage compound capillary structure, multistage compound capillary structure includes the multiple main support capillary structure of setting between lower cover and upper cover. The utility model passes on multistage compound capillary structure, has improved the comprehensive performance of VC heat dissipation module significantly, its internal wire mesh sintering column array provides high -strength support, effectively prevents the cavity collapse at the same time, creates the liquid high -speed backflow channel of low flow resistance by high porosity characteristics, and the function is complementary with the basic sintering layer of high capillary force, solves the contradiction of capillary force and permeability, strengthens the anti -gravity performance and heat transport limit.

Description

Technical Field

[0001] This utility model belongs to the field of VC heat dissipation technology, specifically relating to a VC heat dissipation module. Background Technology

[0002] With the rapid development of electronic technology, the computing speed and integration of chips are constantly improving, and their heat flux density per unit area is also rising sharply, posing a severe challenge to heat dissipation technology. Vapor chambers (VCs), due to their extremely high equivalent thermal conductivity and excellent temperature uniformity, have become one of the mainstream solutions for heat dissipation of high heat density chips.

[0003] Traditional VC cooling modules typically consist of upper and lower copper plates sealing a vacuum chamber. The inner wall of the chamber is sintered with copper powder capillary structures and filled with a small amount of working fluid. Its working principle is as follows: the working fluid at the heat-absorbing end evaporates upon heating; the vapor releases heat and condenses at the condensing end; the condensed liquid flows back to the heat-absorbing end through the capillary structure, thus achieving efficient heat dissipation through this cycle.

[0004] Existing VC heat dissipation modules use a single capillary structure, where capillary force and permeability are mutually constrained, resulting in low recirculation efficiency and poor anti-gravity performance. At the same time, the ultra-thin design makes the cavity prone to collapse under pressure.

[0005] The information disclosed in this background section is intended only to enhance the understanding of the overall background of this utility model and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Utility Model Content

[0006] The purpose of this utility model is to provide a VC heat dissipation module that can solve the problems of low reflux efficiency and poor anti-gravity performance caused by the mutual restriction of capillary force and permeability, as well as the problem of easy collapse of the cavity due to ultra-thin design.

[0007] To achieve the above objectives, the technical solution provided by a specific embodiment of this utility model is as follows: A VC heat dissipation module includes a main body and a heat dissipation mechanism. The main body includes a side plate, a lower cover plate, and an upper cover plate. The lower cover plate and the upper cover plate are integrally formed at the lower and upper ends of the side plate, respectively. The side plate, the lower cover plate, and the upper cover plate are sealed together to form a vacuum cavity. The heat dissipation mechanism includes a multi-level composite capillary structure. The multi-level composite capillary structure includes multiple main support capillary structures disposed between the lower cover plate and the upper cover plate, a base capillary layer sintered and covering the entire inner wall of the vacuum cavity, and a working fluid filling the vacuum cavity. The multiple main support capillary structures are all formed by stacking and sintering multiple metal wire meshes in an up-down manner.

[0008] In one or more embodiments of this utility model, the lower surface of the lower cover plate forms a heat-absorbing surface, the lower surface of the lower cover plate is provided with a heat-conducting layer made of thermally conductive silicone grease, and multiple mounting holes are provided at the four corners of the lower cover plate.

[0009] In one or more embodiments of this utility model, the side plate, the lower cover plate and the upper cover plate are all made of oxygen-free copper.

[0010] In one or more embodiments of this utility model, the plurality of main support capillary structures are metal wire mesh sintered column arrays or micro-column arrays.

[0011] In one or more embodiments of this utility model, the array of multiple main support capillary structures has a higher distribution density in the area directly opposite the heat-absorbing surface of the lower cover plate than in other areas.

[0012] In one or more embodiments of this utility model, the basic capillary layer is a sintered copper powder layer or a sintered fine copper mesh layer.

[0013] In one or more embodiments of this utility model, the porosity of the metal mesh sintered column of the main support capillary structure is greater than the porosity of the base capillary layer.

[0014] In one or more embodiments of this utility model, the working fluid is deionized water, acetone, or an alcohol.

[0015] In one or more embodiments of this utility model, a heat dissipation fin assembly is fixedly connected to the upper surface of the upper cover plate by brazing.

[0016] In one or more embodiments of this utility model, the heat dissipation fin group is a parallel arrangement of strip-shaped fins, an array of needle-shaped fins, or an interlaced grid fin.

[0017] Compared with existing technologies, this invention significantly improves the overall performance of the VC heat dissipation module by introducing a multi-level composite capillary structure. Its internal metal wire mesh sintered column array provides high-strength support and effectively prevents cavity collapse. At the same time, it creates a high-speed liquid return channel with low flow resistance due to its high porosity characteristics. It complements the high capillary force of the base sintered layer, solves the contradiction between capillary force and permeability, and enhances the anti-gravity performance and heat transfer limit. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a three-dimensional representation of a VC heat dissipation module in one embodiment of the present invention. Figure 1 ; Figure 2 This is a three-dimensional representation of a VC heat dissipation module in one embodiment of the present invention. Figure 2 ; Figure 3 This is a cross-sectional view of a VC heat dissipation module according to an embodiment of the present invention; Figure 4 This utility model Figure 3 A schematic diagram at point A in the middle; Figure 5 This is a schematic diagram of the distribution of the main support capillary structure in this utility model.

[0020] Explanation of key figure labels: 1-Main body structure, 11-Side plate, 12-Upper cover plate, 13-Lower cover plate, 14-Heat-conducting layer, 15-Mounting hole, 2-Heat dissipation mechanism, 21-Main support capillary structure, 22-Basic capillary layer, 23-Working fluid, 24-Heat dissipation fin assembly. Detailed Implementation

[0021] To enable those skilled in the art to better understand the technical solutions of this utility model, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.

[0022] like Figures 1-5 As shown, a VC heat dissipation module in one embodiment of the present invention includes a main body mechanism 1 and a heat dissipation mechanism 2. The main body mechanism 1 includes a side plate 11, a lower cover plate 12 and an upper cover plate 13. The lower cover plate 12 and the upper cover plate 13 are integrally formed on the lower end and the upper end of the side plate 11, respectively. The side plate 11, the lower cover plate 12 and the upper cover plate 13 are sealed together to form a vacuum cavity. The heat dissipation mechanism 2 includes a multi-level composite capillary structure. The multi-level composite capillary structure includes multiple main support capillary structures 21 disposed between the lower cover plate 12 and the upper cover plate 13, a basic capillary layer 22 sintered and covering the inner wall of the entire vacuum cavity, and a working liquid 23 filled in the vacuum cavity. The multiple main support capillary structures 21 are all formed by stacking and sintering multiple metal wire meshes in an up-down manner.

[0023] When using this VC cooling module, it is first installed on the heat source such as the CPU / GPU through the lower cover plate 12. The heat from the heat source is quickly conducted to the inside of the vacuum chamber through the lower cover plate 12, causing the working fluid in the working liquid 23 inside the vacuum chamber to evaporate. The vapor diffuses into the upper cover plate 13 inside the vacuum chamber, and then the vapor condenses into liquid and releases heat. The released heat is quickly conducted to the outside through the upper cover plate 13 and is finally carried away by the forced convection airflow. The condensed liquid flows back through the basic capillary layer 22 on the one hand, and quickly flows back to the heat absorption end through the low resistance channels in the multiple main support capillary structures 21 on the other hand, completing an efficient cycle. The multiple main support capillary structures 21 prevent the VC from deforming or collapsing under pressure or vacuum negative pressure, allowing the VC to be made thinner while ensuring reliability.

[0024] like Figures 1-3 As shown, the lower surface of the lower cover plate 12 forms a heat-absorbing surface, and a thermally conductive layer 14 made of thermally conductive silicone grease is provided on the lower surface of the lower cover plate 12. Multiple mounting holes 15 are provided at the four corners of the lower cover plate 12. The mounting holes 15 allow the heat dissipation module to be mounted on the heat source. Simultaneously, the highly efficient thermally conductive mounting holes 15 are provided between the heat source and the heat dissipation module, enabling the heat from the heat source to be quickly and efficiently transferred to the heat dissipation module.

[0025] Preferably, the side plate 11, the lower cover plate 12 and the upper cover plate 13 are all made of oxygen-free copper, which significantly improves the heat dissipation module's thermal conductivity.

[0026] like Figure 3 As shown, the multiple main support capillary structures 21 are sintered metal mesh column arrays or micro-column arrays. The lower ends of the main support capillary structures 21 are sintered and connected to the inner surface of the lower cover plate 12, and the upper ends are sintered and connected to the inner surface of the upper cover plate 13. This forms multiple pillars within the vacuum chamber, preventing the VC from deforming or collapsing under pressure or vacuum negative pressure, allowing the VC to be made thinner while maintaining reliability. The porous structure of the main support capillary structures 21 provides a smooth path with low flow resistance for the working fluid 23, which is particularly beneficial for efficient reflux over long distances and in the anti-gravity direction; it also increases the vaporization core points in the heat source region, improving evaporation efficiency.

[0027] like Figure 5 As shown, the array of multiple main support capillary structures 21 has a higher distribution density in the area directly opposite the heat absorption surface of the lower cover plate 12 than in other areas, so that the main support capillary structures 21 are set at a higher density in the core area of ​​the heat source, thereby improving their performance.

[0028] Preferably, the base capillary layer 22 is a sintered copper powder layer or a sintered fine copper mesh layer, which provides strong and uniform capillary force to transport the condensate from the condensation zone back to the evaporation zone, ensuring the foundation for the circulation of the working fluid.

[0029] Preferably, the porosity of the metal wire mesh sintered column of the main supporting capillary structure 21 is greater than that of the basic capillary layer 22, which resolves the contradiction between "capillary force" and "permeability" inside the VC, thereby maximizing the overall heat dissipation performance.

[0030] Preferably, the working liquid 23 is deionized water, acetone or alcohol. The working liquid 23 is the foundation of VC operation. The vacuum environment lowers the boiling point of the working liquid, making it easy to evaporate. The phase change process of "evaporation endothermic - condensation exothermic" efficiently transfers a large amount of heat.

[0031] like Figures 1-3 As shown, the upper surface of the upper cover plate 13 is fixedly connected to the heat dissipation fin assembly 24 by brazing, so that the upper cover plate 13 can quickly transfer heat to the heat dissipation fin assembly 24, and the heat is dissipated into the air through the huge surface area of ​​the heat dissipation fin assembly 24.

[0032] Preferably, the heat dissipation fin group 24 consists of parallel strip fins, arrayed needle fins, or staggered grid fins.

[0033] It should be noted that during heat dissipation, a fan will be set up to form a forced convection airflow to carry away and dissipate the heat on the heat dissipation fin assembly 24. This is a mature existing technology, and its installation position needs to be determined according to the specific installation position of the VC heat dissipation module. Therefore, it is not shown in the attached figure.

[0034] In use, the heat dissipation module is first installed on the heat source such as the CPU / GPU through the lower cover plate 12. The heat from the heat source is quickly conducted to the interior of the vacuum chamber through the lower cover plate 12, causing the working fluid in the working liquid 23 in the vacuum chamber to evaporate. The vapor diffuses into the upper cover plate 13 in the vacuum chamber, and then the vapor condenses into liquid and releases heat. The released heat is quickly conducted to the heat dissipation fin assembly 24 through the upper cover plate 13, and is finally carried away by the forced convection airflow. The condensed liquid flows back through the basic capillary layer 22 on the one hand, and quickly flows back to the heat absorption end through the low resistance channels in the multiple main support capillary structures 21 on the other hand, completing an efficient cycle. The multiple main support capillary structures 21 prevent the VC from deforming or collapsing under pressure or vacuum negative pressure, allowing the VC to be made thinner while ensuring reliability.

[0035] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0036] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A VC heat dissipation module, characterized in that, include: The main body structure includes a side plate, a lower cover plate, and an upper cover plate. The lower cover plate and the upper cover plate are integrally formed on the lower and upper ends of the side plate, respectively. The side plate, the upper cover plate, and the lower cover plate are sealed together to form a vacuum cavity. The heat dissipation mechanism includes a multi-level composite capillary structure, which includes multiple main support capillary structures disposed between the upper and lower cover plates, a base capillary layer sintered and covering the entire inner wall of the vacuum chamber, and a working fluid filling the vacuum chamber. The multiple main support capillary structures are all formed by stacking and sintering multiple metal wire meshes in an up-down manner.

2. The VC heat dissipation module according to claim 1, characterized in that, The lower surface of the lower cover plate forms a heat-absorbing surface, and a heat-conducting layer made of thermally conductive silicone grease is provided on the lower surface of the lower cover plate. Multiple mounting holes are provided at the four corners of the lower cover plate.

3. A VC heat dissipation module according to claim 2, characterized in that, The side plates, top cover plate, and bottom cover plate are all made of oxygen-free copper.

4. A VC heat dissipation module according to claim 1, characterized in that, The multiple main support capillary structures are metal wire mesh sintered column arrays or micro-column arrays.

5. A VC heat dissipation module according to claim 4, characterized in that, The array of multiple main support capillary structures has a higher distribution density in the area directly opposite the heat-absorbing surface of the upper cover plate than in other areas.

6. A VC heat dissipation module according to claim 5, characterized in that, The basic capillary layer is a sintered copper powder layer or a sintered fine copper mesh layer.

7. A VC heat dissipation module according to claim 6, characterized in that, The porosity of the sintered metal mesh column of the main supporting capillary structure is greater than that of the basic capillary layer.

8. A VC heat dissipation module according to claim 1, characterized in that, The working fluid is deionized water, acetone, or an alcohol.

9. A VC heat dissipation module according to claim 1, characterized in that, The upper surface of the lower cover plate is fixedly connected with a heat dissipation fin assembly by brazing.

10. A VC heat dissipation module according to claim 9, characterized in that, The heat dissipation fins are parallel strip-shaped fins, arrayed needle-shaped fins, or staggered grid fins.

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