A package structure for improving optical coupling insulation distance

Abstract

The utility model relates to a light coupling technical field especially relates to a kind of packaging structure for promoting the insulation distance of light coupling;The utility model is by adding insulation reinforcing component on input pin assembly, the minimum spacing of first chip component and second chip component, the minimum spacing of first chip component and output pin assembly, the minimum spacing of input pin assembly and second chip component and the minimum spacing of input pin assembly and output pin assembly are systematically increased, break the limit of the relative position of traditional light coupling internal component fixed, the physical distance of key insulation path is extended to above safety threshold under the premise of not changing chip layout and production mould, insulation withstand voltage strength is greatly improved, the problem of increased leakage current and signal crosstalk caused by insufficient insulation distance is solved, its reliability is significantly improved;Solve the current light coupling's insulation distance is shorter, leading to the technical problem of poor insulation performance and stability of light coupling.

Description

Technical Field

[0001] This utility model relates to the field of optocoupler technology, and in particular to a packaging structure for improving the insulation distance of optocouplers. Background Technology

[0002] like Figure 1 and Figure 2 As shown, in an optocoupler, the insulation distance is the shortest distance between the optocoupler signal input side and the optocoupler signal output side. If the optocoupler signal input side and the optocoupler signal output side are respectively an input pin assembly and an output pin assembly, and if a first chip assembly and a second chip assembly are respectively mounted on the base islands of the input pin assembly and the output pin assembly, then after the optocoupler is packaged, there is a gap between the input pin assembly and the output pin assembly, a gap between the input pin assembly and the second chip assembly, a gap between the first chip assembly and the second chip assembly, and a gap between the first chip assembly and the output pin assembly. At this time, the insulation distance is the minimum value among these four distances. However, in a finished optocoupler, due to the design requirements of the optocoupler and the limitations of the molds already completed in various production processes, the relative positions of the input pins, output pins, first chip assembly, and second chip assembly inside the optocoupler are almost fixed. Therefore, its insulation distance is difficult to change, which makes it difficult to further improve the insulation performance of the optocoupler, resulting in poor stability of the optocoupler. Utility Model Content

[0003] To address the shortcomings of existing technologies, this invention provides a packaging structure for increasing the insulation distance of optocouplers, thus solving the technical problem that the current optocouplers have a short insulation distance, resulting in poor insulation performance and stability.

[0004] To solve the above technical problems, this utility model provides the following technical solution: a packaging structure for improving the insulation distance of an optocoupler, comprising a package body, an input pin assembly and an output pin assembly disposed within the package body, a first chip assembly disposed on the input pin assembly for converting electrical energy into light energy, a second chip assembly disposed on the output pin assembly for receiving light energy transmitted by the first chip assembly and converting it into electrical energy, an insulation enhancement assembly disposed on the input pin assembly, the insulation enhancement assembly being used to increase the minimum value among the minimum spacing between the first chip assembly and the second chip assembly, the minimum spacing between the first chip assembly and the output pin assembly, the minimum spacing between the input pin assembly and the second chip assembly, and the minimum spacing between the input pin assembly and the output pin assembly.

[0005] Preferably, the input pin assembly includes several IR pins connected to an external circuit, and an IR base island for mounting the first chip assembly is provided in the package, with a bend provided between the IR base island and the IR pins.

[0006] Preferably, the insulation enhancement component is a chamfer located at the connection between the bent portion and the IR pin, on the side near the output pin assembly.

[0007] Preferably, the chamfer is a rounded corner, and the radius of the rounded corner is greater than or equal to 0.25 mm.

[0008] Preferably, the insulation enhancement component is a mounting slot formed on the IR base island for mounting the first chip assembly.

[0009] By employing the above technical solution, this utility model provides a packaging structure for improving the insulation distance of optocouplers, which has at least the following beneficial effects: 1. This utility model systematically increases the minimum spacing between the first chip assembly and the second chip assembly, the minimum spacing between the first chip assembly and the output pin assembly, the minimum spacing between the input pin assembly and the second chip assembly, and the minimum spacing between the input pin assembly and the output pin assembly by adding an insulation enhancement component to the input pin assembly. This breaks through the limitation of the fixed relative positions of the internal components of the traditional optocoupler. Without changing the chip layout and production mold, this design extends the physical distance of the critical insulation path to above the safety threshold, significantly improves the insulation withstand voltage strength, solves the problem of increased leakage current and signal crosstalk caused by insufficient insulation distance, and significantly improves its reliability.

[0010] 2. To address the potential for tip discharge at the connection between the bent portion and the IR pin, this utility model provides a rounded corner structure with a radius greater than or equal to 0.25mm on the side near the output pin assembly, thereby increasing the insulation distance and thus improving the insulation withstand voltage strength.

[0011] 3. This utility model increases the physical height of the light-emitting chip by opening an installation groove on the IR base island and installing the first chip assembly in a sunken manner. This structure directly expands the distance between the first chip assembly and the output pin assembly and the second chip assembly, thereby improving the insulation distance and the insulation withstand voltage strength of the product. Attached Figure Description

[0012] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings: Figure 1 This is a top view of the internal structure of an existing optocoupler; Figure 2 This is a side view of the internal structure of an existing optocoupler; Figure 3 This is a top view of the internal structure of the optical coupler of this utility model; Figure 4 This is a side view of the internal structure of the optocoupler of this utility model.

[0013] In the figure: 1. Package; 2. Input pin assembly; 21. IR pin; 22. IR base island; 23. Bending section; 3. Output pin assembly; 4. First chip assembly; 5. Second chip assembly; 6. Insulation reinforcement assembly. Detailed Implementation

[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0015] To address the technical problem of short insulation distance in current optocouplers, which leads to poor insulation performance and stability, this invention provides a packaging structure for improving the insulation distance of optocouplers, such as... Figure 3 and Figure 4 As shown, the package 1 contains an input pin assembly 2 and an output pin assembly 3. The input pin assembly 2 has a first chip assembly 4 for converting electrical energy into light energy. The output pin assembly 3 has a second chip assembly 5 for receiving the light energy transmitted from the first chip assembly 4 and converting it into electrical energy. An insulation reinforcement assembly 6 is provided on the input pin assembly 2. The insulation reinforcement assembly 6 is used to increase the minimum value among the following: the minimum distance between the first chip assembly 4 and the second chip assembly 5, the minimum distance between the first chip assembly 4 and the output pin assembly 3, the minimum distance between the input pin assembly 2 and the second chip assembly 5, and the minimum distance between the input pin assembly 2 and the output pin assembly 3. The following details the method of increasing the insulation distance without changing the relative positions of the components: To provide a clearer explanation, the structure of the input pin assembly 2 is first analyzed. The input pin assembly 2 includes several IR pins 21 connected to external circuits. An IR base island 22 for mounting the first chip assembly 4 is provided within the package 1. A bend 23 is provided between the IR base island 22 and the IR pins 21. At this point, the insulation reinforcement component 6 is a chamfer located at the connection point between the bend 23 and the IR pins 21, near the output pin assembly 3. Figure 1As can be seen, the corner tip at the connection between the bend 23 and the IR pin 21 is relatively close to the second chip assembly 5 and the output pin assembly 3. Therefore, this tip can be removed. The main removal method is chamfering, which can be done in two ways: beveling and rounding. When beveling, if the distance between the beveling and the beveling is too close, a new tip will be generated. Chamfering can continue while ensuring performance. This process is repeated until it approximates a rounded corner. Therefore, the structure with a rounded corner is the best choice here. Moreover, after testing, the maximum withstand voltage of the product is 5000V before rounding. When the radius of the rounded corner is greater than or equal to 0.25mm, the maximum withstand voltage of the product increases to at least 6500V, which greatly improves the performance of the product.

[0016] Additionally, the insulation reinforcement component 6 can be a mounting groove formed on the IR base island 22 for mounting the first chip assembly 4. This means either creating a mounting groove on the bottom surface of the IR base island 22, or grinding the bottom surface of the IR base island 22 to reduce its thickness, and then mounting the first chip assembly 4 within the mounting groove. (Comparison is then performed.) Figure 2 and Figure 4 It can be observed that the first chip assembly 4 installed in the mounting slot is significantly offset upwards, which can greatly increase the insulation distance and improve the insulation withstand voltage performance.

[0017] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0018] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A packaging structure for improving the insulation distance of an optocoupler, comprising a package body (1), wherein an input pin assembly (2) and an output pin assembly (3) are disposed within the package body (1), wherein a first chip assembly (4) for converting electrical energy into light energy is disposed on the input pin assembly (2), and a second chip assembly (5) for receiving light energy transmitted by the first chip assembly (4) and converting it into electrical energy is disposed on the output pin assembly (3), characterized in that, An insulation enhancement component (6) is provided on the input pin assembly (2). The insulation enhancement component (6) is used to increase the minimum value of the minimum spacing between the first chip assembly (4) and the second chip assembly (5), the minimum spacing between the first chip assembly (4) and the output pin assembly (3), the minimum spacing between the input pin assembly (2) and the second chip assembly (5), and the minimum spacing between the input pin assembly (2) and the output pin assembly (3).

2. The packaging structure for improving the insulation distance of optocouplers according to claim 1, characterized in that, The input pin assembly (2) includes several IR pins (21) connected to external circuits. An IR base island (22) for mounting the first chip assembly (4) is provided inside the package (1). A bend (23) is provided between the IR base island (22) and the IR pins (21).

3. The packaging structure for improving the insulation distance of optocouplers according to claim 2, characterized in that, The insulation reinforcement component (6) is a chamfer located at the connection between the bent portion (23) and the IR pin (21) on the side near the output pin assembly (3).

4. The packaging structure for improving the insulation distance of optocouplers according to claim 3, characterized in that, The chamfer is a rounded corner, and the radius of the rounded corner is greater than or equal to 0.25mm.

5. A packaging structure for improving the insulation distance of an optocoupler according to claim 2, characterized in that, The insulation enhancement component (6) is a mounting slot opened on the IR base island (22) for mounting the first chip component (4).

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