An ejection device for MicroLED mass bonding

Abstract

The utility model discloses a kind of ejecting device of Micro Led huge bonding, comprising: fixture, is equipped with several first via, the bottom of first via is provided with first inner taper face;Jacking assembly, including mounting plate, driving part, ejector plate and several ejector pins, the driving part is installed on the mounting plate, several the ejector pin is set on the ejector plate, the ejector plate is located just below the fixture, several the ejector pin respectively with several the first via one-to-one correspondence, the driving part is used to drive the ejector plate to go up and down, the top of the ejector plate and the bottom of the ejector pin are connected by magnetism, the top of the ejector pin is provided with outer taper face, the ejector pin and the first via gap fit.The utility model can realize the self-adaptive alignment between ejector pin and first via, can eliminate air gap layer, improve the heat dissipation performance of fixture, so that fixture can be kept at appropriate working temperature, and then, guarantee the quality of substrate.

Description

Technical Field

[0001] This utility model relates to the field of welding equipment technology, specifically to an ejection device for Micro LED mass bonding. Background Technology

[0002] During the mass bonding process of Micro LED (Micro Light Emitting Diode), a large amount of heat is generated by laser heating and the melting of solder on the substrate. If the heat is not dissipated in time, it will cause thermal damage to the circuit layer of the substrate and the LED, thus affecting the bonding yield.

[0003] When mass bonding existing G2.5 and above substrates, positioning is achieved using a fixture, and loading and unloading are done by a robotic arm. When the robotic arm picks up the substrate from the fixture, there needs to be a certain amount of clearance on both sides of the substrate. Therefore, existing equipment is usually equipped with a lifting mechanism. The lifting mechanism includes a cylinder, an ejector plate located at the extension end of the cylinder, and multiple ejector pins located on the top plate. The fixture is provided with multiple first through holes. A drive unit drives the ejector plate and multiple ejector pins to rise together. The ejector pins pass through the first through holes to lift the substrate.

[0004] Since the fixture and the lifting mechanism are two different mechanisms with different installation standards, in order to ensure that the ejector pin does not interfere with the fixture when lifting, the first through hole is generally enlarged to accommodate the positional deviation between the ejector pin and the first through hole.

[0005] However, after the ejector pin retracts, a large air gap layer is formed between the first through hole and the ejector pin, resulting in poor heat dissipation of the fixture. Consequently, heat accumulates in the fixture, leading to poor substrate soldering. Utility Model Content

[0006] To overcome the shortcomings of the prior art, this utility model provides an ejection device for Micro LED mass bonding, which can achieve adaptive alignment between the ejector pin and the first via. The gap fit between the ejector pin and the first via can eliminate the air gap layer, improve the heat dissipation performance of the fixture, and enable the fixture to maintain a suitable working temperature, thereby ensuring the quality of the substrate.

[0007] The technical solution adopted by this utility model to solve its technical problem is:

[0008] An ejection device for mass bonding of Micro LEDs includes: a fixture for clamping a substrate, having a plurality of first through holes, the bottom of which has a first inner conical surface; and a lifting assembly for lifting the substrate on the fixture, including a mounting plate, a driving member, an ejector plate, and a plurality of ejector pins. The driving member is mounted on the mounting plate, and the plurality of ejector pins are disposed on the ejector plate, which is located directly below the fixture. Each ejector pin corresponds to one of the plurality of first through holes. The driving member drives the ejector plate to move up and down. The top of the ejector plate and the bottom of the ejector pins are magnetically connected. The top of each ejector pin has an outer conical surface, and the ejector pin is clearance-fitted with the first through hole.

[0009] As a further improvement to the above technical solution, a plurality of ejector pin seats are installed on the ejector pin plate, and magnetic components are provided on the ejector pin seats, with the top of the magnetic components attracting the bottom of the ejector pin.

[0010] As a further improvement to the above technical solution, the ejector plate is provided with several threaded holes, and the bottom of the ejector seat is provided with a screw, which is threadedly connected to the threaded holes.

[0011] As a further improvement to the above technical solution, the top of the ejector pin seat is provided with several receiving grooves, the magnetic component is installed in the receiving grooves, and the top of the magnetic component is flush with the top of the ejector pin seat.

[0012] As a further improvement to the above technical solution, the ejector pin includes an ejector head and an ejector rod. Both the ejector head and the ejector rod are cylindrical structures. The ejector head and the ejector rod are coaxial. The diameter of the ejector head is larger than the diameter of the ejector rod. The outer conical surface is disposed on the top of the ejector rod. The ejector rod is clearance-fitted with the first through hole.

[0013] As a further improvement to the above technical solution, the ejector pin further includes a support rod and a first transition section. The ejector pin head, the support rod, the first transition section, and the ejector rod are arranged sequentially from bottom to top. The support rod has a cylindrical structure. The ejector pin head is coaxial with the support rod. The diameter of the ejector pin head is larger than the diameter of the support rod, and the diameter of the support rod is larger than the diameter of the ejector rod. The fixture is provided with a second through hole. The second through hole is coaxial with the first through hole. The diameter of the second through hole is larger than the diameter of the first through hole. The bottom end of the first through hole communicates with the top end of the second through hole. The support rod is clearance-fitted with the second through hole.

[0014] As a further improvement to the above technical solution, the outer surface of the first transition section is a conical surface, the large end diameter of the first transition section is the same as the diameter of the support rod, the small end diameter of the first transition section is the same as the diameter of the ejector rod, and the bottom of the second through hole is provided with a second inner conical surface.

[0015] As a further improvement to the above technical solution, a second transition section is provided between the ejector head and the support rod. The outer surface of the second transition section is a conical surface. The diameter of the large end of the second transition section is the same as the diameter of the ejector head, and the diameter of the small end of the second transition section is the same as the diameter of the support rod.

[0016] As a further improvement to the above technical solution, the driving component includes a cylinder, and the telescopic end of the cylinder is connected to the bottom of the ejector plate via a connector.

[0017] As a further improvement to the above technical solution, the ejector plate and the mounting plate are parallel to each other, the mounting plate is provided with a plurality of sliding sleeves, the ejector plate is provided with a plurality of sliding rods, the sliding rods are perpendicular to the ejector rods, and the plurality of sliding rods are respectively slidably engaged with the plurality of sliding sleeves.

[0018] The beneficial effects of this utility model are as follows: This utility model provides an ejection device for Micro LED mass bonding. The ejector pin is magnetically connected to the ejector plate. The bottom of the first through hole is provided with a first inner conical surface, and the top of the ejector pin is provided with an outer conical surface. During the ejector pin's ascent, the outer conical surface of the ejector pin first contacts the first inner conical surface of the fixture. At this time, the ejector pin is subjected to the reaction force of the first inner conical surface. The reaction force is decomposed into radial and vertical components. Under the action of the radial component, the magnetic connection allows the ejector pin to produce a slight sliding on the ejector plate, enabling the ejector pin to automatically correct deviations and ensuring that the ejector pin smoothly enters the first through hole. Thus, adaptive alignment between the ejector pin and the first through hole can be achieved. At the same time, the assembly tolerance requirements between the lifting assembly and the fixture are relaxed, the installation and debugging difficulty is reduced, and the assembly efficiency is improved.

[0019] After the robot arm removes the substrate, the drive unit drives the ejector plate and several ejector pins to descend together, so that the upper part of the ejector pins stops in the first through hole and the top of the ejector pins is lower than the top of the fixture, so as to ensure that the substrate to be soldered can be completely placed on the fixture. At this time, the ejector pins and the first through hole are in clearance fit, thereby eliminating the air gap layer, improving the heat dissipation performance of the fixture, and enabling the fixture to maintain a suitable working temperature, thereby ensuring the quality of the substrate. Attached Figure Description

[0020] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0021] Figure 1This is a schematic diagram of the structure of a Micro LED mass bonding ejection device according to an embodiment of this utility model;

[0022] Figure 2 yes Figure 1 A sectional view;

[0023] Figure 3 yes Figure 2 Enlarged view of point A in the middle;

[0024] Figure 4 yes Figure 3 A partial sectional view of the central jig;

[0025] Figure 5 yes Figure 1 A three-dimensional structural diagram of the central lifting component;

[0026] Figure 6 yes Figure 5 Exploded view of the center ejector plate, ejector seat, magnetic components, and ejector pin.

[0027] Reference numerals: 1-Jig, 11-First through hole, 12-First inner conical surface, 13-Second through hole, 14-Second inner conical surface;

[0028] 2-Lifting assembly, 21-Mounting plate, 22-Driver, 23-Ejector plate, 24-Ejector, 25-Ejector seat, 26-Magnetic component, 27-Sliding sleeve, 28-Sliding rod, 231-Threaded hole, 241-Outer conical surface, 242-Ejector head, 243-Ejector rod, 244-Support rod, 245-First transition section, 246-Second transition section, 251-Screw, 252-Accommodation groove;

[0029] 3-Substrate. Detailed Implementation

[0030] The following will clearly and completely describe the concept, specific structure, and technical effects of this utility model in conjunction with embodiments and accompanying drawings, so as to fully understand the purpose, features, and effects of this utility model. Obviously, the described embodiments are only a part of the embodiments of this utility model, not all of them. Other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are all within the scope of protection of this utility model. Furthermore, all connections / linkages involved in the patent do not simply refer to direct contact between components, but rather to the ability to form a better connection structure by adding or reducing connecting accessories according to specific implementation conditions. The various technical features in this utility model can be combined interactively without contradicting each other.

[0031] Reference Figures 1 to 6An example of this utility model provides an ejection device for Micro LED mass bonding, including a fixture 1 and a lifting assembly 2. The fixture 1 is used to clamp a substrate 3, and the lifting assembly 2 is used to lift the substrate 3 on the fixture 1.

[0032] Structurally, the fixture 1 has several first through holes 11, and the bottom of the first through hole 11 is provided with a first inner conical surface 12.

[0033] The lifting assembly 2 includes a mounting plate 21, a driving component 22, a pin plate 23, and a plurality of pins 24. The driving component 22 is mounted on the mounting plate 21, and the plurality of pins 24 are disposed on the pin plate 23. The pin plate 23 is located directly below the fixture 1. The plurality of pins 24 correspond one-to-one with a plurality of first through holes 11. The driving component 22 is used to drive the pin plate 23 to rise and fall. The top of the pin plate 23 is magnetically connected to the bottom of the pins 24. The top of the pins 24 is provided with an outer conical surface 241, and the pins 24 are clearance-fitted with the first through holes 11.

[0034] In the initial state, the ejector pin 24 is vertically attached to the ejector plate 23 under the action of gravity and magnetic attraction, and the ejector pin 24 is located below the first through hole 11.

[0035] After the substrate 3 is soldered, the drive unit 22 drives the ejector plate 23 and several ejector pins 24 to rise together. The ejector pins 24 pass through the first through hole 11 to lift the substrate 3 on the fixture 1.

[0036] If there is a positional deviation between the ejector pin 24 and the first through hole 11, during the upward movement of the ejector pin 24, the outer conical surface 241 of the ejector pin 24 first contacts the first inner conical surface 12 of the fixture 1. At this time, the ejector pin 24 is subjected to the reaction force of the first inner conical surface 12. The reaction force is decomposed into radial and vertical components. Under the action of the radial component, the magnetic connection allows the ejector pin 24 to produce a small sliding on the ejector plate 23, so that the ejector pin 24 automatically corrects the deviation and ensures that the ejector pin 24 smoothly enters the first through hole 11. Thus, the adaptive alignment between the ejector pin 24 and the first through hole 11 can be achieved. At the same time, the assembly tolerance requirements between the lifting assembly 2 and the fixture 1 are relaxed, the installation and debugging difficulty is reduced, and the assembly efficiency is improved.

[0037] After the robot arm removes the substrate 3, the drive unit 22 drives the ejector plate 23 and several ejector pins 24 to descend together, so that the upper part of the ejector pins 24 stays in the first through hole 11 and the top of the ejector pins 24 is lower than the top of the fixture 1, so as to ensure that the substrate 3 to be welded can be completely placed on the fixture 1. At this time, the ejector pins 24 are in clearance fit with the first through hole 11, thereby eliminating the air gap layer, improving the heat dissipation performance of the fixture 1, and enabling the fixture 1 to maintain a suitable working temperature, thereby ensuring the quality of the substrate 3.

[0038] In some preferred embodiments, a plurality of ejector pin seats 25 are mounted on the ejector pin plate 23, and magnetic elements 26 are provided on the ejector pin seats 25. The top of the magnetic elements 26 is attracted to the bottom of the ejector pin 24.

[0039] Understandably, when installing the ejector pin 24, simply align the ejector pin 24 with the magnetic component 26 and place it down. The ejector pin 24 will be magnetically attached to the top of the magnetic component 26. When disassembling, the ejector pin 24 can be easily removed by overcoming the magnetic force of the magnetic component 26. Thus, the ejector pin 24 can be quickly disassembled and assembled without the need for complicated tools or disassembling the ejector plate 23, which greatly improves the efficiency of the ejector pin 24.

[0040] Furthermore, the ejector plate 23 is provided with several threaded holes 231, and the bottom of the ejector seat 25 is provided with a screw 251, which is threadedly connected to the threaded holes 231, thereby facilitating the installation and disassembly of the ejector seat 25 and improving assembly efficiency.

[0041] Furthermore, the top of the ejector pin seat 25 is provided with several receiving grooves 252, and the magnetic component 26 is installed in the receiving grooves 252 to achieve positioning of the magnetic component 26. The top of the magnetic component 26 is flush with the top of the ejector pin seat 25, so that the bottom of the ejector pin 24 is fully supported, avoiding the ejector pin 24 from tilting or getting stuck due to the unevenness between the top of the magnetic component 26 and the top of the ejector pin seat 25 during the adaptive floating process, and ensuring smooth radial movement of the ejector pin 24.

[0042] In some preferred embodiments, the ejector pin 24 includes an ejector head 242 and an ejector rod 243. Both the ejector head 242 and the ejector rod 243 are cylindrical structures. The ejector head 242 and the ejector rod 243 are coaxial. The diameter of the ejector head 242 is larger than the diameter of the ejector rod 243. An outer conical surface 241 is disposed on the top of the ejector rod 243. The ejector rod 243 is clearance-fitted with the first through hole 11.

[0043] Understandably, the larger diameter of the ejector head 242 increases the contact area between the ejector head 242 and the magnetic component 26, making the ejector 24 more stably installed.

[0044] Furthermore, the ejector pin 24 also includes a support rod 244 and a first transition section 245. The ejector pin head 242, support rod 244, first transition section 245 and ejector rod 243 are arranged sequentially from bottom to top. The support rod 244 has a cylindrical structure. The ejector pin head 242 is coaxial with the support rod 244. The diameter of the ejector pin head 242 is larger than the diameter of the support rod 244. The diameter of the support rod 244 is larger than the diameter of the ejector rod 243. The fixture 1 is provided with a second through hole 13. The second through hole 13 is coaxial with the first through hole 11. The diameter of the second through hole 13 is larger than the diameter of the first through hole 11. The bottom end of the first through hole 11 is connected to the top end of the second through hole 13. The support rod 244 and the second through hole 13 are clearance-fitted.

[0045] Understandably, during the upward movement of the ejector pin 24, the ejector rod 243 first enters the second through hole 13 until the outer conical surface 241 at the top of the ejector rod 243 contacts the first inner conical surface 12. The ejector pin 24 then adapts to radial sliding. Next, the ejector rod 243 enters the first through hole 11, and then the support rod 244 enters the second through hole 13. The wall of the second through hole 13 constrains the radial displacement of the support rod 244, thereby enabling secondary guidance of the ejector pin 24 and ensuring the stability of the ejector pin 24 during ejection.

[0046] Furthermore, the outer surface of the first transition section 245 is a conical surface, the large end diameter of the first transition section 245 is the same as the diameter of the support rod 244, the small end diameter of the first transition section 245 is the same as the diameter of the ejector rod 243, and the bottom of the second through hole 13 is provided with a second inner conical surface 14.

[0047] It is understandable that if the ejector pin 24 deviates slightly before the support rod 244 enters the second through hole 13, the conical surface of the first transition section 245 abuts against the second inner conical surface 14, and the resulting radial component force can cause the ejector pin 24 to slide radially to correct the deviation, thereby ensuring that the support rod 244 is aligned with the second through hole 13.

[0048] Furthermore, a second transition section 246 is provided between the ejector head 242 and the support rod 244. The outer surface of the second transition section 246 is a conical surface. The diameter of the large end of the second transition section 246 is the same as the diameter of the ejector head 242, and the diameter of the small end of the second transition section 246 is the same as the diameter of the support rod 244.

[0049] When the ejector pin 24 lifts the substrate 3 on the fixture 1, the conical surface of the second transition section 246 abuts against the second inner conical surface 14, thereby sealing the second through hole 13, completely eliminating the air gap layer, and further improving the heat dissipation performance of the fixture 1.

[0050] In some preferred embodiments, the drive component 22 includes a cylinder, the telescopic end of which is connected to the bottom of the ejector plate 23 via a connector. The telescopic movement of the cylinder can drive the ejector plate 23 to rise and fall. The cylinder has a simple structure, thereby reducing the manufacturing cost and assembly difficulty of the equipment.

[0051] Furthermore, the ejector plate 23 and the mounting plate 21 are parallel to each other. The mounting plate 21 is provided with a plurality of sliding sleeves 27, and the ejector plate 23 is provided with a plurality of sliding rods 28. The sliding rods 28 are perpendicular to the ejector pin 24 rod, and the plurality of sliding rods 28 are respectively slidably engaged with the plurality of sliding sleeves 27.

[0052] When the cylinder drives the ejector plate 23 to rise and fall, the ejector plate 23 drives several sliding rods 28 to rise and fall synchronously. The sliding rods 28 slide with the sliding sleeve 27, thereby preventing the ejector plate 23 from tilting during the rise and fall and improving the stability of the equipment.

[0053] The above is a detailed description of the preferred embodiments of the present utility model. However, the present utility model is not limited to the described embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present utility model. All such equivalent modifications or substitutions are included within the scope defined by the claims of this application.

Claims

1. An ejection device for mass bonding of Micro LEDs, characterized in that, include: A fixture for clamping a substrate has several first through holes, and the bottom of each first through hole has a first inner conical surface. A lifting assembly for lifting the base plate on the fixture includes a mounting plate, a driving component, an ejector plate, and a plurality of ejector pins. The driving component is mounted on the mounting plate, and the plurality of ejector pins are disposed on the ejector plate. The ejector plate is located directly below the fixture, and the plurality of ejector pins correspond one-to-one with a plurality of first through holes. The driving component is used to drive the ejector plate to rise and fall. The top of the ejector plate and the bottom of the ejector pins are magnetically connected. The top of the ejector pin is provided with an outer conical surface, and the ejector pin is clearance-fitted with the first through hole.

2. The ejection device for Micro LED mass bonding according to claim 1, characterized in that, The ejector plate is equipped with several ejector seats, and each ejector seat is provided with a magnetic element. The top of the magnetic element is attracted to the bottom of the ejector pin.

3. The ejection device for Micro LED mass bonding according to claim 2, characterized in that, The ejector plate has several threaded holes, and the bottom of the ejector seat is provided with a screw, which is threadedly connected to the threaded holes.

4. The ejection device for Micro LED mass bonding according to claim 2, characterized in that, The top of the ejector pin seat has several receiving slots, and the magnetic component is installed in the receiving slots, with the top of the magnetic component flush with the top of the ejector pin seat.

5. The ejection device for Micro LED mass bonding according to claim 1, characterized in that, The ejector pin includes an ejector head and an ejector rod, both of which are cylindrical structures. The ejector head and the ejector rod are coaxial, and the diameter of the ejector head is larger than the diameter of the ejector rod. The outer conical surface is disposed on the top of the ejector rod, and the ejector rod is clearance-fitted with the first through hole.

6. The ejection device for Micro LED mass bonding according to claim 5, characterized in that, The ejector pin also includes a support rod and a first transition section. The ejector pin head, the support rod, the first transition section and the ejector rod are arranged sequentially from bottom to top. The support rod has a cylindrical structure. The ejector pin head is coaxial with the support rod. The diameter of the ejector pin head is larger than the diameter of the support rod, and the diameter of the support rod is larger than the diameter of the ejector rod. The fixture is provided with a second through hole, which is coaxial with the first through hole. The diameter of the second through hole is larger than that of the first through hole. The bottom end of the first through hole is connected to the top end of the second through hole. The support rod is clearance-fitted with the second through hole.

7. The ejection device for Micro LED mass bonding according to claim 6, characterized in that, The outer surface of the first transition section is a conical surface. The diameter of the large end of the first transition section is the same as the diameter of the support rod, and the diameter of the small end of the first transition section is the same as the diameter of the ejector rod. The bottom of the second through hole is provided with a second inner conical surface.

8. The ejection device for Micro LED mass bonding according to claim 7, characterized in that, A second transition section is provided between the ejector pin and the support rod. The outer surface of the second transition section is a conical surface. The diameter of the large end of the second transition section is the same as the diameter of the ejector pin, and the diameter of the small end of the second transition section is the same as the diameter of the support rod.

9. The ejection device for Micro LED mass bonding according to claim 1, characterized in that, The driving component includes a cylinder, and the telescopic end of the cylinder is connected to the bottom of the ejector plate via a connector.

10. The ejection device for Micro LED mass bonding according to claim 1, characterized in that, The ejector plate and the mounting plate are parallel to each other. The mounting plate is provided with a plurality of sliding sleeves. The ejector plate is provided with a plurality of sliding rods. The sliding rods are perpendicular to the ejector rods. The plurality of sliding rods are slidably engaged with the plurality of sliding sleeves.

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