Wafer edge exposure device

Abstract

The utility model application relates to wafer edge exposure device belongs to semiconductor manufacturing and micro - nanometer processing technical field, and wafer edge exposure device includes: frame, horizontal shift subassembly, platform, first detection subassembly, second detection subassembly and exposure subassembly, horizontal shift subassembly, first detection subassembly, second detection subassembly and exposure subassembly are connected on the frame, platform bears wafer, horizontal shift subassembly drives platform to move along the preset direction, first detection subassembly detects and obtains the offset of wafer center and platform center, horizontal shift subassembly drives platform to drive wafer to move to compensate wafer offset according to the offset of wafer center and platform center, second detection subassembly includes camera, and camera obtains wafer surface image in the wafer movement or rotation process, exposure subassembly exposes to wafer edge. The utility model application can carry out the defect detection before and after wafer exposure.

Description

Technical Field

[0001] This utility model application relates to the fields of semiconductor manufacturing and micro / nano processing technology, and in particular to wafer edge exposure apparatus. Background Technology

[0002] In the field of existing semiconductor chip manufacturing technology, wafer photoresist coating and defect detection, wafer exposure and defect detection, and wafer development and defect detection are crucial process steps in semiconductor chip manufacturing. These process steps ensure the quality of each stage of wafer processing by uniformly coating photoresist on the wafer surface, accurately transferring circuit patterns, and developing patterns. Wafer photoresist coating and defect detection can identify uneven photoresist layer thickness, particles, or scratches; wafer exposure and defect detection ensure the integrity and accuracy of the exposed pattern; wafer development and defect detection verify the quality of pattern formation. These defect detection steps can promptly detect and correct defects, reducing the number of defective products flowing into the next process (such as development and etching), thereby significantly improving the yield of semiconductor chip manufacturing.

[0003] Existing invention patent application CN118588534A discloses a wafer edge exposure apparatus and its control method: a wafer chuck drives the wafer to rotate, and during the rotation, a detection device measures the amount of change in the wafer. After storing the amount of change, a moving axis is controlled to move the wafer, and the wafer is centered and compensated according to the stored amount of change. Subsequently, the exposure apparatus completes the wafer edge exposure. While the wafer edge exposure apparatus can achieve edge exposure, it cannot detect wafer defects before and after exposure. Due to the lack of real-time defect detection, defects that may exist before wafer edge exposure (such as uneven photoresist layer thickness, particles, or scratches after photoresist coating) cannot be detected and corrected in time. This increases the risk of defective products flowing into subsequent exposure, development, and etching processes, not only reducing the reliability of wafer edge exposure and development processes, but also making it difficult to effectively meet the high yield and high-efficiency production requirements of semiconductor chip manufacturing.

[0004] Therefore, developing integrated technology for wafer edge exposure defect detection, which seamlessly combines wafer defect detection with the edge exposure process, and integrates wafer offset compensation and pre-exposure defect detection, is of great significance in reducing the flow of defective products into subsequent wafer exposure, development, etching and other processes, thereby improving the overall yield of semiconductor chip manufacturing. Utility Model Content

[0005] The purpose of this utility model application is to provide a wafer edge exposure apparatus to partially or completely solve the technical problems in the existing semiconductor chip manufacturing technology field, such as the inability of a single wafer edge exposure apparatus to detect wafer defects before and after exposure, increasing the risk of defective products flowing into subsequent exposure, development, and etching processes. To achieve the above objective, this utility model application provides the following technical solution: A wafer edge exposure apparatus, comprising: The frame, traverse assembly, first inspection assembly, second inspection assembly, and exposure assembly. The transverse component, the first detection component, the second detection component, and the exposure component are connected to the frame; The stage carries the wafer; the traverse component drives the stage to move along a preset direction; The first detection component detects and acquires the offset between the wafer center and the stage center; The traverse component drives the stage to move the wafer based on the offset between the wafer center and the stage center to compensate for the wafer offset. The second detection component includes a camera that acquires images of the wafer surface during wafer movement or rotation. Exposure components expose the edges of the wafer.

[0006] Optionally, the second detection component further includes a light source and a light source adjustment component. The light source adjustment component includes a mounting plate, a first mounting plate, a first connecting plate, a second mounting plate, and a second connecting plate. The first mounting plate and the second mounting plate are both connected to the frame. The first connecting plate connects the mounting plate and the first mounting plate. The second connecting plate connects the mounting plate and the second mounting plate. A light source is mounted on the mounting plate.

[0007] Optionally, the first mounting plate is provided with a first vertical adjustment hole, the second mounting plate is provided with a second vertical adjustment hole, the first connecting plate is connected to the first vertical adjustment hole through a first connector, and the second connecting plate is connected to the second vertical adjustment hole through a second connector.

[0008] Optionally, the mounting plate is provided with a first lateral adjustment hole and a second lateral adjustment hole, the first connecting plate is connected to the first lateral adjustment hole through a connector one, and the second connecting plate is connected to the second lateral adjustment hole through a connector two.

[0009] Optionally, along the height direction of the exposure apparatus at the wafer edge, the distance between the light source and the wafer surface is D, satisfying: 10mm≤D≤40mm.

[0010] Optionally, along the height direction of the exposure apparatus at the wafer edge, the camera is at least partially located above the light source.

[0011] Optionally, the light source and the exposure component are spaced apart, with the light source located between the exposure component and the camera.

[0012] Optionally, cameras and light sources are provided on both sides of the platform, and the camera pitch angle is θ, which satisfies: 0°≤θ≤90°.

[0013] Optionally, the first detection component is located between the camera and the light source.

[0014] In summary, compared with the prior art, this utility model application has the following beneficial technical effects: The first detection component detects the offset between the wafer center and the stage center. The traverse component drives the stage to move according to the offset to complete wafer offset compensation. At the same time, the camera of the second detection component acquires images of the wafer surface during wafer movement or rotation. Before exposure, it detects defects such as uneven photoresist layer thickness, particles, and scratches to ensure the quality of the wafer before exposure. After exposure, it re-inspects and verifies the integrity of the pattern, reducing the risk of defective products flowing into subsequent exposure, development, and etching processes. It also reduces process failures caused by defects not being corrected in time, optimizes the overall performance of wafer edge exposure, and effectively improves the yield of semiconductor chip manufacturing. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the wafer edge exposure apparatus of this utility model application. Figure 1 ; Figure 2 This is a schematic diagram of the wafer edge exposure apparatus of this utility model application. Figure 2 ; Figure 3 This is a schematic diagram of the structure of the second detection component and stage of this utility model application. Figure 1 ; Figure 4 This is a schematic diagram of the structure of the second detection component and stage of this utility model application. Figure 2 ; Figure 5 This is a schematic diagram illustrating the working principle of the camera, stage, and traverse assembly acquiring images of the wafer surface during wafer movement, as described in this utility model application. Figure 6 This is a schematic diagram illustrating the working principle of the camera, stage, and transverse component acquiring images of the wafer surface during wafer rotation, as described in this utility model application. Detailed Implementation

[0016] The technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0017] In the description of this utility model application, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model application.

[0018] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model application, "multiple" means one, two, or more, unless otherwise explicitly specified.

[0019] In this utility model application, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, an integral molding, or an integrated unit; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model application according to the specific circumstances.

[0020] To make the purpose, technical solution, and advantages of this utility model application clearer, the technical solutions in the embodiments of this utility model application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model application without creative effort are within the scope of protection of this utility model application.

[0021] like Figures 1 to 6 As shown, a wafer edge exposure apparatus includes: The machine frame, the transverse assembly, the stage, the first inspection assembly, the second inspection assembly, and the exposure assembly; The transverse component, the first detection component, the second detection component, and the exposure component are connected to the frame; The stage carries the wafer; the traverse component drives the stage to move along a preset direction; The first detection component detects and acquires the offset between the wafer center and the stage center; The traverse component drives the stage to move the wafer based on the offset between the wafer center and the stage center to compensate for the wafer offset. The second detection component includes a camera that acquires images of the wafer surface during wafer movement or rotation. Exposure components expose the edges of the wafer.

[0022] In some embodiments, the stage 300 carries a wafer. Exemplarily, the stage adsorbs the wafer, and the stage can be driven to rotate by a rotary motor. The rotation of the stage can cause the wafer to rotate (i.e., the wafer rotates). The stage can be a common vacuum adsorption rotary stage in the existing semiconductor manufacturing technology field. Of course, the stage can also be the wafer chuck in invention patent application CN118588534A. The structure of the stage and the wafer chuck are exactly the same, and this utility model application will not elaborate further on this.

[0023] In some embodiments, the transverse component 200 includes a guide rail and a slider. The guide rail is mounted on the frame 100, and the slider is connected to the stage. The movement of the slider causes the stage 300 to move along the extension direction of the guide rail. At this time, the extension direction of the guide rail is a preset direction. Since the stage carries the wafer, the movement of the stage along the preset direction can realize the wafer movement. Of course, the transverse component 200 can also adopt the moving axis in the invention patent application CN118588534A. The structure of the transverse component 200 and the moving axis is exactly the same, and this utility model application will not describe it again.

[0024] In some embodiments, the wafer is a wafer after homogenization.

[0025] In some embodiments, the first detection component 400 may be located between the camera 502 and the light source 501. The first detection component 400 includes a mounting base and a centering sensor. The centering sensor is mounted on the mounting base, which is mounted on the frame. The centering sensor detects the offset of the wafer. The first detection component 400 determines whether the center of the wafer coincides with the center of the stage 300, and the magnitude of the offset when the two centers do not coincide. The stage rotates the wafer at least once. The first detection component detects the change in edge position during the wafer's rotation, thereby determining the offset between the wafer center and the stage center (the rotation center of the stage). In edge exposure, the wafer center is the center position of the wafer's arc-shaped edge. When the set edge exposure program is executed, the traverse component 200 drives the stage to move the wafer according to the offset, completing the compensation for the wafer offset. The exposure component 600 can then expose the wafer. Of course, the first detection component 400 and the exposure component can also adopt the detection device and exposure device in the invention patent application CN118588534A. The first detection component and the detection device have the same structure, the exposure component and the exposure device have the same structure, and the offset and variation are obtained and calculated in the same way. This utility model application will not elaborate on this further.

[0026] In some embodiments, the second detection component includes a camera 502. For illumination compensation, a corresponding light source 501 may also be added. Considering the sensitivity of the photoresist on the wafer surface to light after photoresist coating, the light source needs to be selected as a type that is not sensitive to photoresist; in practice, a yellow light source is generally used. The camera can acquire images of the wafer surface during wafer movement or rotation. The camera can be mounted on a rack, facing the wafer surface adsorbed on the stage. The light source provides uniform illumination to enhance the visibility of defects. The camera captures wafer surface images in real time using high-resolution imaging technology. Based on the wafer surface image data, common image processing software can be used to perform image preprocessing (de-manipulation, image segmentation, etc.), feature extraction, and classification on the wafer surface image data. Defects such as uneven photoresist layer thickness, particles, scratches, and photoresist peeling after photoresist coating before exposure can be detected. Detection can also be performed after exposure to ensure that defects at the wafer edge before and after exposure are detected and recorded in a timely manner.

[0027] Specifically, in this utility model application, when a camera uses a CMOS sensor to acquire a planar area image, it is difficult to obtain a complete and clear image of the wafer surface due to focal length limitations. Similarly, if a CCD sensor is used to acquire a linear array image via line scanning, only a local linear array image in a certain straight direction can be obtained. Therefore, in order to achieve defect detection on the wafer surface, it is usually necessary to use a second detection component in conjunction with a traverse component or the movement of a stage.

[0028] In some embodiments, such as Figure 5 As shown, camera 502 can be a CCD line scan camera. After the focal length and field of view of the CCD line scan camera are adjusted, the focal point is fixed on the wafer surface to obtain a clear image of the wafer surface. The field of view range covers at least both sides of the wafer. When the CCD line scan camera is centered relative to the wafer in the field of view direction, it means that the width of the field of view range of the CCD line scan camera in the wafer plane is at least greater than or equal to the wafer diameter. During the wafer movement, the CCD line scan camera acquires images of the wafer surface. The focal length and field of view can be adjusted through the lens parameters of the CCD line scan camera itself.

[0029] In some embodiments, such as Figure 6 As shown, the camera can be a CCD line scan camera. After the focal length and field of view of the CCD line scan camera are adjusted, the focal point is fixed on the wafer surface to obtain a clear image of the wafer surface, and the field of view is at least covering the wafer radius. During wafer rotation, the CCD line scan camera acquires images of the wafer surface. Of course, in... Figure 5 In addition, CCD line scan cameras can also acquire images of the wafer surface during wafer rotation.

[0030] In some embodiments, the orientation of the CCD line scan camera can be adjusted. In short, by adjusting the pitch angle of the CCD line scan camera, the viewing angle and imaging area of ​​the wafer surface can be changed to adapt to the needs of different wafer sizes or detection positions. By adjusting the pitch angle of the CCD line scan camera, the scanning path of the CCD line scan camera on the wafer surface can be changed to complete the detection of wafer surface defects.

[0031] In some embodiments, during wafer surface defect detection, the traverse component drives the stage carrying the wafer to move along a preset direction. The camera can acquire wafer surface images during wafer movement or wafer rotation. The camera can capture linear array images of the corresponding wafer surface. The first and last frames captured by the camera can cover the entire wafer surface (e.g., during wafer movement). Multiple linear array images can be stitched together into a complete planar image for wafer surface defect detection. Wafer surface defect detection can be performed during the process of the traverse component driving the stage carrying the wafer to move towards the exposure component.

[0032] In the wafer edge exposure apparatus provided by this utility model application, firstly, the first detection component detects the offset between the wafer center and the stage center. The traverse component drives the stage to move according to the offset, compensating for the wafer offset to meet the wafer edge exposure requirements. While the traverse component drives the stage to move or the wafer to rotate according to the offset, the second detection component can use a camera and a light source to acquire wafer surface image data before exposure and promptly detect defects such as uneven photoresist layer thickness, particles, scratches, and photoresist peeling after wafer homogenization. Simultaneously, wafer offset compensation and wafer defect detection before and after homogenization are achieved. In addition, the space of the existing wafer edge exposure apparatus is fully utilized to achieve the integration of wafer edge exposure and defect detection. After the wafer edge exposure is completed, the second detection component can again use a camera and a light source to acquire wafer surface image data after exposure and to detect subsequent wafer defects in real time, reducing or avoiding the risk of defective products flowing into subsequent development and etching processes.

[0033] Optionally, the second detection component further includes a light source and a light source adjustment component. The light source adjustment component includes a mounting plate 505, a first mounting plate 5031, a first connecting plate 5032, a second mounting plate 5041, and a second connecting plate 5042. The first mounting plate 5031 and the second mounting plate 5041 are both connected to the frame 100. The first connecting plate 5032 connects the mounting plate 505 and the first mounting plate 5031. The second connecting plate 5042 connects the mounting plate and the second mounting plate 5041. A light source 501 is mounted on the mounting plate 505.

[0034] In this utility model application, the mounting plate 505 can serve as a mounting platform for the light source 501. The first connecting plate 5032 can be connected to the mounting plate 505 and the first mounting plate 5031 using fasteners such as bolts, and the bolted connection can be secured with nuts. Similarly, the second connecting plate 5042 can also be connected to the mounting plate 505 and the second mounting plate 5041 using fasteners such as bolts, and the bolted connection can also be secured with nuts. Both the first mounting plate 5031 and the second mounting plate 5041 are connected to the frame 100, thus realizing the overall installation of the mounting plate 505 and the light source 501.

[0035] Optionally, the first mounting plate 5031 is provided with a first vertical adjustment hole, the second mounting plate 5041 is provided with a second vertical adjustment hole, the first connecting plate 5032 is connected to the first vertical adjustment hole through a first connector, and the second connecting plate 5042 is connected to the second vertical adjustment hole through a second connector.

[0036] In this utility model application, the first connecting plate 5032 can be L-shaped or the second connecting plate 5042 can be L-shaped or the first connecting member can pass through the first vertical adjustment hole and slide up and down along the first vertical adjustment hole. The first connecting member can be a fastener such as a bolt. Similarly, the second connecting member can pass through the second vertical adjustment hole and slide up and down along the second vertical adjustment hole. The second connecting member can be a fastener such as a bolt. Both the first connecting member and the second connecting member can be fixed with nuts.

[0037] In this utility model application, the operator can loosen the first connector and the second connector, so that the first connector and the second connector can slide up and down along the first vertical adjustment hole and the second vertical adjustment hole respectively, thereby changing the height of the first connecting plate 5032 and the second connecting plate 5042. The first connecting plate 5032 and the second connecting plate 5042 are both connected to the mounting plate 505 and the light source 501, thereby realizing the height adjustment of the light source 501. After adjusting the height position of the light source 501, the first connector and the second connector can be fixed again.

[0038] Optionally, the mounting plate 505 is provided with a first lateral adjustment hole and a second lateral adjustment hole. The first connecting plate 5032 is connected to the first lateral adjustment hole through a connector, and the second connecting plate 5042 is connected to the second lateral adjustment hole through a connector.

[0039] In this utility model application, connector one can pass through the first transverse adjustment hole and slide back and forth along the first transverse adjustment hole. Connector one can be fasteners such as bolts. Similarly, connector two can pass through the second transverse adjustment hole and slide back and forth along the second transverse adjustment hole. Connector two can be fasteners such as bolts. Similarly, both connector one and connector two can be fixed with nuts.

[0040] In this utility model application, the operator can loosen connector one and connector two, so that connector one and connector two can slide back and forth along the first lateral adjustment hole and the second lateral adjustment hole respectively, thereby changing the front and back position of the mounting plate 505. The mounting plate 505 is connected to the light source 501, thereby realizing the front and back direction adjustment of the light source 501. After adjusting the front and back position of the light source 501, connector one and connector two can be fixed again, and the front and back direction can be the same as the preset direction.

[0041] Optionally, along the height direction of the exposure apparatus at the wafer edge, the distance between the light source and the wafer surface is D, satisfying: 10mm≤D≤40mm.

[0042] In this utility model application, when the distance D between the light source 501 and the wafer surface is in the range of 10mm to 40mm, the light can uniformly illuminate the wafer surface, ensuring that the camera captures a clear image of defects (such as particles, scratches, or uneven photoresist). If the distance is too small (such as less than 10mm), the light may be too concentrated, resulting in shadows or overheating effects; if the distance is too large (such as greater than 40mm), the light will diffuse excessively, reducing the irradiation intensity and the accuracy of defect detection.

[0043] Optionally, along the height direction of the exposure apparatus at the wafer edge, the camera is at least partially located above the light source.

[0044] In this utility model application, the camera is at least partially located above the light source 501. The camera can view the wafer surface from a higher angle. The light source 501 emits light to illuminate the wafer surface. The camera can receive the light signals reflected or scattered from the wafer after being illuminated by the light source 501.

[0045] Optionally, the light source and the exposure component are spaced apart, with the light source located between the exposure component and the camera.

[0046] In this utility model application, the light source and the exposure component are distributed at intervals, and the light source 501 is located between the exposure component 600 and the camera, so that the light source 501 can provide sufficient illumination to the camera, and the exposure component and the camera can operate independently to acquire wafer surface images.

[0047] Optionally, cameras and light sources are arranged on both sides of the stage, with the camera pitch angle being θ, satisfying: 0°≤θ≤90°, and the first detection component is located between the camera and the light source.

[0048] In this utility model application, when the stage 300 rotates to drive the wafer, the camera and the light source work together to scan the wafer surface, and the first detection component can be located between the camera and the light source.

[0049] The wafer edge exposure apparatus of this utility model application can operate in the following manner: Step S100: The stage rotation drives the wafer rotation. During the rotation, the first detection component detects and acquires the offset between the wafer center and the stage center; the traverse component compensates for the wafer offset based on the offset between the wafer center and the stage center; the camera of the second detection component acquires images of the wafer surface during the wafer movement or rotation. In some embodiments, the stage rotation drives the wafer rotation to achieve wafer rotation. During the rotation, the first detection component detects and obtains the offset between the wafer center and the stage center, and completes the wafer offset compensation based on the offset between the wafer center and the stage center. The stage, the first detection component 400, and the transverse component can respectively adopt the wafer chuck, detection device, and moving axis in the invention patent application CN118588534A. The calculation methods for obtaining the offset and the change can be the same, and the wafer offset compensation method can be the same. This utility model application will not elaborate on this further.

[0050] In some embodiments, the camera of the second detection component acquires wafer surface images during wafer movement or rotation by: a light source providing uniform illumination to enhance the visibility of defects, and the camera capturing wafer surface images in real time using high-resolution imaging technology.

[0051] Step S200: Detect wafer defects based on wafer surface image data; when a wafer defect is detected, the device alarms and stops wafer edge exposure; when no wafer defect is detected, perform edge exposure on the wafer. In some embodiments, after obtaining wafer surface image data, common image processing software can be used to perform image preprocessing (de-manipulation, image segmentation, etc.), feature extraction and classification on the wafer surface image data, and detect defects including uneven photoresist layer thickness, particles, scratches, and photoresist peeling after wafer homogenization before exposure.

[0052] In some embodiments, when a wafer defect is detected, the wafer edge exposure device alarms and stops exposing the wafer edge, allowing the operator to remove the wafer from the table.

[0053] In some embodiments, when no wafer defects are detected, the exposure assembly performs edge exposure on the wafer.

[0054] In some embodiments, after the wafer edge exposure is completed, the second detection component can again use a camera and light source to acquire image data of the wafer surface after exposure and to detect wafer defects in real time, thereby reducing or avoiding the risk of defective products flowing into subsequent development and etching processes.

[0055] In this utility model application, the first detection component detects the offset between the wafer center and the stage center, and the lateral movement component drives the stage to move according to the offset to complete the wafer offset compensation. At the same time, the camera of the second detection component acquires the wafer surface image during the wafer movement or rotation. Before exposure, it detects defects such as uneven photoresist layer thickness, particles, and scratches to ensure the quality of the wafer before exposure. After exposure, it re-inspects and verifies the integrity of the pattern, reducing the risk of defective products flowing into subsequent exposure, development and etching processes, reducing process failures caused by defects not being corrected in time, optimizing the overall performance of wafer edge exposure, and effectively improving the yield of semiconductor chip manufacturing.

[0056] The technical features of the above embodiments can be combined in any way. In order to make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification. Those skilled in the art will understand that the steps, measures, and schemes in the various operations, methods, and processes discussed in this utility model application can be alternated, modified, combined, or deleted; furthermore, other steps, measures, and schemes in the various operations, methods, and processes discussed in this utility model application can also be alternated, modified, rearranged, decomposed, combined, or deleted; furthermore, the steps, measures, and schemes in the prior art that are similar to those disclosed in this utility model application can also be alternated, modified, rearranged, decomposed, combined, or deleted. The above-described embodiments are merely examples of several implementation methods of the present disclosure, and their descriptions are relatively specific and detailed. However, they should not be construed as limiting the scope of the patent for the present disclosure. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present disclosure, and these all fall within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be determined by the appended claims.

Claims

1. A wafer edge exposure apparatus, characterized in that, include: The machine frame, the transverse assembly, the stage, the first inspection assembly, the second inspection assembly, and the exposure assembly; The transverse component, the first detection component, the second detection component, and the exposure component are connected to the frame; The stage carries the wafer; the traverse component drives the stage to move along a preset direction; The first detection component detects and acquires the offset between the wafer center and the stage center; The traverse component drives the stage to move the wafer based on the offset between the wafer center and the stage center to compensate for the wafer offset. The second detection component includes a camera that acquires images of the wafer surface during wafer movement or rotation. Exposure components expose the edges of the wafer.

2. The wafer edge exposure apparatus according to claim 1, characterized in that, The second detection component also includes a light source and a light source adjustment component. The light source adjustment component includes a mounting plate, a first mounting plate, a first connecting plate, a second mounting plate, and a second connecting plate. The first mounting plate and the second mounting plate are both connected to the frame. The first connecting plate connects the mounting plate and the first mounting plate. The second connecting plate connects the mounting plate and the second mounting plate. The light source is mounted on the mounting plate.

3. The wafer edge exposure apparatus according to claim 2, characterized in that, The first mounting plate is provided with a first vertical adjustment hole, and the second mounting plate is provided with a second vertical adjustment hole. The first connecting plate is connected to the first vertical adjustment hole through a first connector, and the second connecting plate is connected to the second vertical adjustment hole through a second connector.

4. The wafer edge exposure apparatus according to claim 3, characterized in that, The mounting plate is provided with a first horizontal adjustment hole and a second horizontal adjustment hole. The first connecting plate is connected to the first horizontal adjustment hole through connector one, and the second connecting plate is connected to the second horizontal adjustment hole through connector two.

5. The wafer edge exposure apparatus according to claim 3, characterized in that, Along the height direction of the exposure apparatus at the edge of the wafer, the distance between the light source and the wafer surface is D, which satisfies: 10mm≤D≤40mm.

6. The wafer edge exposure apparatus according to claim 3, characterized in that, Along the height direction of the exposure apparatus at the edge of the wafer, the camera is at least partially located above the light source.

7. The wafer edge exposure apparatus according to claim 3, characterized in that, The light source and exposure components are distributed at intervals, with the light source located between the exposure components and the camera.

8. The wafer edge exposure apparatus according to claim 3, characterized in that, Cameras and light sources are set on both sides of the platform. The camera pitch angle is θ, which satisfies: 0°≤θ≤90°.

9. A wafer edge exposure apparatus according to claim 8, characterized in that, The first detection component is located between the camera and the light source.

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