Press head capable of reducing module binding failure rate

Abstract

The utility model relates to the technical field of module binding production, especially the pressure head of reducing module binding defective rate, including pressure head body, the integral moulding has the cuboid pressure block on pressure head body, the cuboid pressure block includes a rectangular compression surface, the rectangular compression surface is used for directly contacting module compression, the length of rectangular compression surface is 33mm, the width of rectangular compression surface is 3mm, the heating rod hole position is set up in pressure head body side portion, the heating rod hole position is inserted with heating rod, the other side of pressure head body is provided with heating rod fixed hole position, heating rod fixed hole position is perpendicular with heating rod hole position, and heating rod fixed hole position is communicated with heating rod hole position, and heating rod fixed hole position is used for screwing heating rod. Compared with prior art, the pressure head of reducing module binding defective rate of the utility model can reduce the scrapping caused by binding defective, improve yield, and reduce material loss.

Description

[Technical Field] This utility model relates to the field of module bonding production technology, and in particular to a pressure head that can reduce the defect rate of module bonding. [Background Technology] In the existing module bonding production process, the COG pressure head is much larger than the IC, which easily causes uneven heating of the pressure head, resulting in the COG MURA phenomenon shown in the electrical test, with a high defect rate, which is not conducive to production. [Utility Model Content] To overcome the above problems, this utility model proposes a pressure head that can effectively solve the above problems and reduce the module bonding failure rate.

[0001] The present invention provides a technical solution to the above-mentioned technical problems: a pressure head that can reduce the module bonding failure rate, comprising a pressure head body, a cuboid pressure block integrally formed on the pressure head body, the cuboid pressure block including a rectangular pressing surface, the rectangular pressing surface being used for direct contact with the module for pressing, the length of the rectangular pressing surface being 33mm, the width of the rectangular pressing surface being 3mm; a heating rod hole is provided on the side of the pressure head body, a heating rod is inserted into the heating rod hole, and a heating rod fixing hole is provided on the other side of the pressure head body, the heating rod fixing hole being perpendicular to the heating rod hole and communicating with the heating rod hole, the heating rod fixing hole being used for screw fixing of the heating rod. Preferably, the height of the cuboid pressure block is 6mm.

[0002] Preferably, the pressure head body is made of ceramic.

[0003] Preferably, the pressure head body is provided with an inclined surface, which is close to the heating rod hole.

[0004] Preferably, the pressure head body is provided with a temperature sensing wire fixing hole, the temperature sensing wire fixing hole is located between the cuboid pressure block and the heating rod hole, and a temperature sensor is provided in the temperature sensing wire fixing hole.

[0005] Preferably, the distance between the temperature sensing wire fixing hole and the cuboid pressure block is between 1mm and 2mm.

[0006] Preferably, the distance between the temperature sensing wire fixing hole and the heating rod hole is between 2mm and 3mm.

[0007] Preferably, the pressure head body is provided with multiple mounting and fixing holes for screws to fix the pressure head body.

[0008] Compared with existing technologies, the pressure head of this invention, which can reduce the module bonding failure rate, reduces the contact area between the rectangular pressing surface and the IC, thereby reducing scrap caused by poor bonding, improving yield, reducing material loss, saving money for manufacturing enterprises, creating benefits, and facilitating production. [Attached Image Description] Figure 1 A perspective view of the pressure head of this utility model, which can reduce the module bonding failure rate; Figure 2 This is a side view of the pressure head of the present invention, which can reduce the module bonding failure rate.

Detailed Implementation Methods

[0009] It should be noted that in this embodiment of the invention, all directional indications (such as up, down, left, right, front, back, etc.) are limited to relative positions on the specified view, rather than absolute positions.

[0010] Furthermore, in this utility model, the use of terms such as "first," "second," etc., is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0011] Please see Figure 1 and Figure 2 The present invention relates to a pressure head that can reduce the module bonding failure rate. The pressure head body 10 includes a pressure head body 10. A cuboid pressure block 20 is integrally formed on the pressure head body 10. The cuboid pressure block 20 includes a rectangular pressing surface 21. The rectangular pressing surface 21 is used for direct contact with the module for pressing. The length of the rectangular pressing surface 21 is 33mm and the width of the rectangular pressing surface 21 is 3mm.

[0012] The pressure head body 10 has a heating rod hole 12 on one side, and a heating rod is inserted into the heating rod hole 12. The other side of the pressure head body 10 has a heating rod fixing hole 13, which is perpendicular to the heating rod hole 12 and is connected to the heating rod hole 12. The heating rod fixing hole 13 is used to fix the heating rod with a screw.

[0013] This invention relates to a pressure head that reduces module bonding failure rates. By reducing the contact area between the rectangular pressing surface 21 and the IC, it reduces scrap caused by bonding defects, improves yield, and reduces material loss. This saves manufacturing companies money, generates profits, and facilitates production.

[0014] The height h of the cuboid pressing block 20 is 6mm, which can effectively avoid other structures of the equipment during pressing and avoid structural interference.

[0015] The pressure head body 10 is made of ceramic and has good thermal conductivity.

[0016] The pressure head body 10 is provided with an inclined surface 15, which is close to the heating rod hole 12, to reduce the heat conduction volume and concentrate the heat on the cuboid pressure block 20.

[0017] The pressure head body 10 is provided with a temperature sensing wire fixing hole 14, which is located between the cuboid pressure block 20 and the heating rod hole 12. A temperature sensor is provided in the temperature sensing wire fixing hole 14 to monitor the heating temperature.

[0018] The distance between the temperature sensing wire fixing hole 14 and the cuboid pressure block 20 is between 1mm and 2mm.

[0019] The distance between the temperature sensing wire fixing hole 14 and the heating rod hole 12 is between 2mm and 3mm.

[0020] The pressure head body 10 is provided with a plurality of mounting and fixing holes 11 for screws to be inserted to fix the pressure head body 10.

[0021] Compared with the prior art, the pressure head of this utility model, which can reduce the module bonding failure rate, reduces the contact area between the rectangular pressing surface 21 and the IC by reducing the scrap caused by poor bonding, improving the yield, reducing material loss, thereby saving money for the manufacturing enterprise, creating benefits, and facilitating production.

[0022] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. Any modifications, equivalent substitutions and improvements made within the concept of the present utility model should be included within the patent protection scope of the present utility model.

Claims

1. A pressure head that can reduce the module bonding failure rate, characterized in that, Includes a pressure head body, on which a cuboid pressure block is integrally formed. The cuboid pressure block includes a rectangular pressing surface, which is used for direct contact with the module for pressing. The length of the rectangular pressing surface is 33mm and the width of the rectangular pressing surface is 3mm. The pressure head body has a heating rod hole on one side, and a heating rod is inserted into the heating rod hole. The other side of the pressure head body has a heating rod fixing hole, which is perpendicular to the heating rod hole and is connected to the heating rod hole. The heating rod fixing hole is used to fix the heating rod with a screw.

2. The pressure head as described in claim 1, which can reduce the module bonding failure rate, is characterized in that, The height of the cuboid pressure block is 6mm.

3. The pressure head as described in claim 1, which can reduce the module bonding failure rate, is characterized in that, The pressure head body is made of ceramic.

4. The pressure head as described in claim 1, which can reduce the module bonding failure rate, is characterized in that, The pressure head body is provided with an inclined surface, which is close to the heating rod hole.

5. The pressure head as described in claim 1, which can reduce the module bonding failure rate, is characterized in that, The pressure head body is provided with a temperature sensing wire fixing hole, which is located between the cuboid pressure block and the heating rod hole, and a temperature sensor is installed in the temperature sensing wire fixing hole.

6. The pressure head as described in claim 5, which can reduce the module bonding failure rate, is characterized in that, The distance between the temperature sensing wire fixing hole and the cuboid pressure block is between 1mm and 2mm.

7. The pressure head as described in claim 5, which can reduce the module bonding failure rate, is characterized in that, The distance between the temperature sensing wire fixing hole and the heating rod hole is between 2mm and 3mm.

8. The pressure head as described in claim 1, which can reduce the module bonding failure rate, is characterized in that, The pressure head body is provided with multiple mounting and fixing holes for screws to fix the pressure head body.

Images