Semiconductor processing apparatus

Abstract

The utility model discloses a kind of semiconductor processing equipment, the semiconductor processing equipment includes: first device, first device has conveying cavity;Second device, second device has main cavity;First valve, first valve is used to connect and disconnect conveying cavity and main cavity;Second valve, second valve is connected between conveying cavity and main cavity, the opening and closing degree of second valve is controllable, for balancing the pressure difference between conveying cavity and main cavity.According to the semiconductor processing equipment of the utility model embodiment, when first valve is completely opened, transient impact and turbulence appear are reduced, and then the risk that sealing material is abraded to produce particulate matter is reduced, effectively avoid particulate matter to drop on wafer or with airflow or wafer into main cavity, ensure that main cavity is clean, and then ensure product yield, improve semiconductor processing equipment reliability.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a semiconductor processing equipment. Background Technology

[0002] The main cavity of semiconductor processing equipment is used to perform critical steps in wafer fabrication, such as chemical vapor deposition, physical vapor deposition, plasma etching, and ion implantation. Because these processes require extremely high vacuum levels, the vacuum level in the main cavity must be maintained at a certain level. to Within this range, the transfer cavity serves as a buffer for wafer transfer between different process modules. Its internal transfer mechanism is responsible for feeding or removing wafers into or from the main cavity. The vacuum level of the transfer cavity is typically maintained at [value missing]. However, due to the large pressure difference between the transfer chamber and the main chamber, transient pressure shocks can cause deformation and stress concentration at the sealing interface connecting the main chamber and the transfer chamber. This can lead to wear of the sealing material and the generation of particulate matter. After entering the main chamber with the airflow, the particulate matter can contaminate the wafer surface or be adsorbed inside the main chamber, resulting in abnormal product yield. Utility Model Content

[0003] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a semiconductor processing equipment that reduces transient impacts and turbulence, thereby reducing the risk of particulate matter generated by wear of sealing materials. This effectively prevents particulate matter from falling onto the wafer or entering the main cavity with the airflow or wafer, ensuring a clean environment within the main cavity, thus guaranteeing product yield and improving the reliability of the semiconductor processing equipment.

[0004] A semiconductor processing apparatus according to an embodiment of the present invention includes: a first device having a transfer cavity; a second device having a main cavity; a first valve for connecting and disconnecting the transfer cavity and the main cavity; and a second valve connected between the transfer cavity and the main cavity, the opening degree of the second valve being controllable for balancing the pressure difference between the transfer cavity and the main cavity.

[0005] According to an embodiment of the present invention, a semiconductor processing equipment includes a first device having a transfer chamber and a second device having a main chamber. A first valve is used to connect and disconnect the transfer chamber and the main chamber. A second valve is connected between the transfer chamber and the main chamber. The opening degree of the second valve is controllable and is used to balance the pressure difference between the transfer chamber and the main chamber. This reduces transient impacts and turbulence when the first valve is fully open, thereby reducing the risk of particulate matter generated by wear of the sealing material. It effectively prevents particulate matter from falling onto the wafer or entering the main chamber with the airflow or wafer, ensuring a clean environment in the main chamber, thereby ensuring product yield and improving the reliability of the semiconductor processing equipment.

[0006] In some embodiments of this utility model, the semiconductor processing equipment further includes: a balance tube, the two ends of which are respectively connected to the transfer cavity and the main cavity in the length direction, and the second valve is disposed on the flow path of the balance tube.

[0007] In some embodiments of this utility model, the second valve is a pendulum valve or a butterfly valve.

[0008] In some embodiments of this utility model, when the second valve is a pendulum valve, the pendulum valve includes: a valve body, on which the valve port of the second valve is disposed; a swing arm, rotatably disposed on the valve body; and a valve plate, which is connected to one end of the swing arm along its length direction. When the line connecting the central axis of the valve port and the rotation axis of the swing arm is parallel to the length direction of the swing arm on a cross section perpendicular to the central axis of the valve port, the valve plate completely blocks the valve port. The maximum angle between the length direction of the swing arm and the connecting line is α, and satisfies: 35°≤α≤45°.

[0009] In some embodiments of this utility model, the valve is located between the first device and the second device. The first device has a first opening communicating with the conveying cavity, and the second device has a second opening communicating with the main cavity. A portion of the valve is located within the first opening and has a first sealing ring between it and the first device. A portion of the valve is located within the second opening and has a second sealing ring between it and the second device.

[0010] In some embodiments of this utility model, it further includes: a first pressure gauge located in the transmission cavity; and a second pressure gauge located in the main cavity.

[0011] In some embodiments of this utility model, a transfer component is further included, which is located within the transfer cavity and is used to transfer the wafer to the main cavity.

[0012] In some embodiments of this invention, a molecular pump is also included, which is connected to the main cavity and is used to extract gas from the main cavity.

[0013] In some embodiments of this utility model, it further includes: an industrial control computer, which is connected to the first valve, and the industrial control computer is used to control the opening and closing states of the first valve and the second valve according to the pressure difference between the transmission chamber and the main chamber.

[0014] In some embodiments of this utility model, the industrial control computer is configured to control the second valve to open before the first valve when there is a pressure difference between the conveying chamber and the main chamber.

[0015] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0016] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0017] Figure 1 This is a schematic diagram of the structure of a semiconductor processing equipment according to the first embodiment of the present invention;

[0018] Figure 2 This is a schematic diagram of the structure of a semiconductor processing equipment according to the second embodiment of the present invention;

[0019] Figure 3 This is a schematic diagram of the structure of the second valve according to the second embodiment of the present utility model, which is a pendulum valve, wherein the valve port of the second valve is completely blocked;

[0020] Figure 4 This is a schematic diagram of the structure of the second valve according to the second embodiment of the present invention, which is a pendulum valve, wherein the valve port of the second valve is open.

[0021] Figure label:

[0022] 100. Semiconductor processing equipment;

[0023] 1. First device; 11. Conveying cavity;

[0024] 2. Second device; 21. Main cavity;

[0025] 3. First valve;

[0026] 4. Balance pipe;

[0027] 5. Second valve; 51. Valve body; 511. Valve port of the second valve; 52. Swing arm; 53. Valve plate. Detailed Implementation

[0028] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0029] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, features defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0030] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0031] The semiconductor processing apparatus 100 according to an embodiment of the present invention is described below with reference to the accompanying drawings.

[0032] like Figure 1 and Figure 2 As shown, the semiconductor processing equipment 100 according to the first embodiment of the present invention includes a first device 1, a second device 2, a first valve 3, and a second valve 5. The first device 1 has a transfer chamber 11, the second device 2 has a main chamber 21, the first valve 3 is used to connect and disconnect the transfer chamber 11 and the main chamber 21, and the second valve 5 is connected between the transfer chamber 11 and the main chamber 21. The opening degree of the second valve 5 is controllable and is used to balance the pressure difference between the transfer chamber 11 and the main chamber 21.

[0033] Understandably, the main cavity 21 is used to perform key wafer processing steps such as chemical vapor deposition, physical vapor deposition, plasma etching, and ion implantation. The vacuum level of the main cavity 21 is... to Within a certain range, the transfer cavity 11 serves as a buffer for wafer transfer between different process modules. Its internal transfer components are responsible for feeding or removing wafers into or from the main cavity 21. The vacuum level of the transfer cavity 11 is typically maintained at [value missing]. Left and right. The first valve 3 is used to connect and disconnect the transfer chamber 11 and the main chamber 21, and can isolate the transfer chamber 11 and the main chamber 21. The isolation by the first valve 3 can maintain the vacuum environment of the transfer chamber 11 and the main chamber 21 respectively.

[0034] When a wafer needs to be fed into or removed from the main cavity 21, a second valve 5 is connected between the transfer cavity 11 and the main cavity 21. The opening and closing degree of the second valve 5 is controllable so that the second valve 5 balances the pressure difference between the transfer cavity 11 and the main cavity 21, thereby gradually reducing the pressure difference between the transfer cavity 11 and the main cavity 21. When the pressure in the transfer cavity 11 and the pressure in the main cavity 21 are balanced, the valve port 511 of the second valve 5 is completely blocked, and then the first valve 3 is opened to connect the transfer cavity 11 and the main cavity 21 so that the transfer component in the transfer cavity 11 can feed or remove the wafer into or from the main cavity 21.

[0035] Therefore, by reducing transient impacts and turbulence through the second valve 5, the risk of particulate matter generated by the wear of the sealing material is reduced, effectively preventing particulate matter from falling onto the wafer or entering the main cavity 21 with the airflow or wafer, ensuring a clean environment inside the main cavity 21, thereby ensuring product yield and improving the reliability of the semiconductor processing equipment 100.

[0036] According to the semiconductor processing equipment 100 of this utility model embodiment, the first device 1 has a transfer cavity 11, the second device 2 has a main cavity 21, the first valve 3 is used to connect and disconnect the transfer cavity 11 and the main cavity 21, and the second valve 5 is connected between the transfer cavity 11 and the main cavity 21. The opening degree of the second valve 5 is controllable and is used to balance the pressure difference between the transfer cavity 11 and the main cavity 21. This reduces transient impact and turbulence when the first valve 3 is fully open, thereby reducing the risk of particulate matter generated by the wear of the sealing material. It effectively prevents particulate matter from falling onto the wafer or entering the main cavity 21 with the airflow or wafer, ensuring a clean environment inside the main cavity 21, thereby ensuring product yield and improving the reliability of the semiconductor processing equipment 100.

[0037] In some embodiments of this utility model, such as Figure 1 and Figure 2 As shown, the semiconductor processing equipment 100 also includes a balance tube 4, with both ends of the balance tube 4 connected to the transfer cavity 11 and the main cavity 21 respectively in the length direction; a second valve 5 is disposed on the flow path of the balance tube 4.

[0038] It is understandable that the balancing pipe 4 provides a controlled pressure difference balancing channel for the second valve 5. When the opening degree of the second valve 5 gradually increases according to the preset curve, the transmission chamber 11 and the main chamber 21 are slowly ventilated through the balancing pipe 4. Thus, the pressure difference between the transmission chamber 11 and the main chamber 21 is eliminated by the balancing pipe 4 and the second valve 5 before the first valve 3 is opened, so as to achieve pressure balance between the transmission chamber 11 and the main chamber 21. This effectively avoids transient impact and turbulence when the first valve 3 is opened, thereby reducing the risk of particulate matter generated by the wear of the sealing material. It also effectively prevents particulate matter from falling onto the wafer or entering the main chamber 21 with the airflow or wafer, ensuring a clean environment inside the main chamber 21, thereby ensuring product yield and improving the reliability of the semiconductor processing equipment 100.

[0039] In one specific embodiment, such as Figure 1 and Figure 2 As shown, the time required for the valve port of the first valve 3 to go from being completely blocked to being fully open is 20-30 seconds.

[0040] It should be noted that the time required for the valve port of the first valve 3 to go from being completely blocked to being completely open can be 20 seconds, 21 seconds, 22 seconds, 23 seconds, 24 seconds, 25 seconds, 26 seconds, 27 seconds, 28 seconds, 29 seconds, or 30 seconds. Furthermore, during the 20-30 second process of the valve port of the first valve 3 going from being completely blocked to being completely open, it can be opened gradually in multiple stages, allowing partial pressure balance at each stage before continuing to open, further reducing transient impacts and turbulence.

[0041] like Figure 2 As shown, the semiconductor processing equipment 100 according to the second embodiment of the present invention includes a first device 1, a second device 2, a first valve 3, a balancing tube 4, and a second valve 5. The first device 1 has a transfer chamber 11, the second device 2 has a main chamber 21, the first valve 3 is used to connect and disconnect the transfer chamber 11 and the main chamber 21, the two ends of the balancing tube 4 are respectively connected to the transfer chamber 11 and the main chamber 21, the second valve 5 is located inside the balancing tube 4, and the time required for the valve port 511 of the second valve 5 to go from completely blocked to completely open is 20-30 seconds.

[0042] Understandably, the main cavity 21 is used to perform key wafer processing steps such as chemical vapor deposition, physical vapor deposition, plasma etching, and ion implantation. The vacuum level of the main cavity 21 is... to Within a certain range, the transfer cavity 11 serves as a buffer for wafer transfer between different process modules. Its internal transfer components are responsible for feeding or removing wafers into or from the main cavity 21. The vacuum level of the transfer cavity 11 is typically maintained at [value missing]. about.

[0043] The two ends of the balance tube 4 along its length are connected to the transfer chamber 11 and the main chamber 21, respectively. The second valve 5 is located inside the balance tube 4. When the valve port 511 of the second valve 5 is opened, the transfer chamber 11 and the main chamber 21 are connected through the balance tube 4. By limiting the time required for the valve port 511 of the second valve 5 to go from being completely blocked to being fully open to 20-30 seconds, the second valve 5 is opened slowly so that the pressure difference between the transfer chamber 11 and the main chamber 21 gradually decreases. When the pressure in the transfer chamber 11 and the pressure in the main chamber 21 are balanced, the valve port 511 of the second valve 5 is completely blocked again, and then the first valve 3 is opened so that the transfer chamber 11 and the main chamber 21 are connected, so that the transfer component in the transfer chamber 11 can send the wafer into or take out the main chamber 21.

[0044] Therefore, by eliminating the pressure difference between the transfer chamber 11 and the main chamber 21 before the first valve 3 is opened through the balance pipe 4 and the second valve 5, the pressure in the transfer chamber 11 and the main chamber 21 are balanced. This effectively avoids transient impacts and turbulence when the first valve 3 is opened, thereby reducing the risk of particulate matter generated by the wear of the sealing material. It also effectively prevents particulate matter from falling onto the wafer or entering the main chamber 21 with the airflow or wafer, ensuring a clean environment inside the main chamber 21, thereby ensuring product yield and improving the reliability of the semiconductor processing equipment 100.

[0045] Specifically, the valve port 511 of the second valve 5 can be opened in multiple stages during the 20-30 second process from being completely blocked to being fully opened. Each stage allows for partial pressure balance before continuing to open, further reducing the impact of transient shocks and turbulence on the balance pipe 4, and further improving the reliability of the semiconductor processing equipment 100.

[0046] It should be noted that the time required for the valve port 511 of the second valve 5 to go from being completely blocked to being completely open can be 20 seconds, 21 seconds, 22 seconds, 23 seconds, 24 seconds, 25 seconds, 26 seconds, 27 seconds, 28 seconds, 29 seconds, or 30 seconds. Meanwhile, the pressure balance between the transmission chamber 11 and the main chamber 21 can be determined within a preset range by the pressure difference between the transmission chamber 11 and the main chamber 21, which is typically between 2 mt and 8 mt.

[0047] In some embodiments of this utility model, when the semiconductor processing equipment 100 includes a balance tube 4 and a second valve 5, the time required for the valve port 511 of the second valve 5 to go from being completely blocked to being completely open is greater than the time required for the valve port of the first valve 3 to go from being completely blocked to being completely open.

[0048] Understandably, before opening the first valve 3 to connect the transfer chamber 11 and the main chamber 21, the valve port 511 of the second valve 5 is first slowly opened to eliminate the pressure difference between the transfer chamber 11 and the main chamber 21. Therefore, by limiting the time required for the valve port 511 of the second valve 5 to fully open from being completely blocked to being fully open to being longer than the time required for the valve port of the first valve 3 to be fully open, it is effectively ensured that the valve port 511 of the second valve 5 opens slowly and eliminates the pressure difference between the transfer chamber 11 and the main chamber 21. This achieves pressure balance between the transfer chamber 11 and the main chamber 21 before the first valve 3 is opened, improving the reliability of the semiconductor processing equipment 100.

[0049] In some embodiments of this utility model, the second valve 5 is a pendulum valve or a butterfly valve. It is understood that, because the valve plate 53 of the pendulum valve swings along an arc-shaped path to adjust the valve opening, the flow area increases linearly with the increase of the swing angle when the valve is open, and the flow rate changes gradually. Therefore, the time required for the valve port 511 of the second valve 5 to go from completely blocked to fully open is 20-30 seconds, thus achieving a slow opening of the valve port 511. The butterfly valve, on the other hand, uses a rotating disc to control the flow rate. The rotation angle of the disc is proportional to the flow area. By continuously adjusting the rotation angle, the flow rate can be precisely controlled from fully closed to fully open, thus achieving a time required for the valve port 511 of the second valve 5 to go from completely blocked to fully open is 20-30 seconds, thus achieving a slow opening of the valve port 511.

[0050] In some embodiments of this utility model, such as Figure 3 and Figure 4 As shown, when the second valve 5 is a pendulum valve, the pendulum valve includes a valve body 51, a swing arm 52, and a valve plate 53. The valve port 511 of the second valve 5 is located on the valve body 51, the swing arm 52 is rotatably mounted on the valve body 51, and the valve plate 53 is connected to one end of the swing arm 52 along its length. On a cross-section perpendicular to the central axis of the valve port, when the line connecting the central axis of the valve port and the rotation axis of the swing arm 52 is parallel to the length direction of the swing arm 52, the valve plate 53 completely seals the valve port. The maximum angle between the length direction of the swing arm 52 and the connecting line is α, and satisfies: 35°≤α≤45°.

[0051] Understandably, when the line connecting the central axis of the valve port and the rotation axis of the swing arm 52 is parallel to the length direction of the swing arm 52, the valve plate 53 completely seals the valve port; when the line connecting the central axis of the valve port and the rotation axis of the swing arm 52 is perpendicular to the length direction of the swing arm 52, the valve plate 53 fully opens the valve port. Thus, the time for the line connecting the central axis of the valve port and the rotation axis of the swing arm 52 to go from parallel to perpendicular to the length direction of the swing arm 52 is 20-30 seconds, thereby ensuring that the moving speed of the valve plate 53 is slow enough to allow the pressure between the transmission chamber 11 and the main chamber 21 to gradually balance.

[0052] Meanwhile, when the maximum angle between the length direction of the swing arm 52 and the connecting line is less than 35°, the limited rotation range of the swing arm 52 and the limited movement distance of the valve plate 53 result in an excessively long opening time for the first valve 3. This may prevent timely balancing of the pressure difference between the transmission chamber 11 and the main chamber 21, leading to system delays or equipment overload. Conversely, when the maximum angle between the length direction of the swing arm 52 and the connecting line is greater than 45°, the excessive rotation angle of the swing arm 52 may cause the valve plate 53 to rapidly disengage from the valve port, resulting in sudden changes in flow rate and pressure surges. Therefore, this application achieves a balance between response speed and opening smoothness by limiting the maximum angle between the length direction of the swing arm 52 and the connecting line to between 35° and 45°, ensuring that the pressure difference between the transmission chamber 11 and the main chamber 21 can gradually disappear.

[0053] It should be noted that the maximum angle between the length direction of the swing arm 52 and the connecting line can be 35°, 36°, 37°, 38°, 39°, 40°, 41°, 42°, 43°, 44° or 45°.

[0054] In some embodiments of this utility model, such as Figure 2 As shown, the balance tube 4 is connected to the bottom wall of the transfer chamber 11 and the bottom wall of the main chamber 21, respectively. This arrangement reduces the length of the balance tube 4, thereby reducing the resistance to fluid flow within it and effectively preventing flow instability or blockage caused by an excessively long balance tube 4. Consequently, when the valve port 511 of the second valve 5 is slowly opened, the pressure difference between the transfer chamber 11 and the main chamber 21 disappears, improving the operational reliability of the semiconductor processing equipment 100.

[0055] Furthermore, the bottom wall of the balance pipe 4 and the conveying cavity 11 are welded together, thereby ensuring both communication and sealing between the balance pipe 4 and the conveying cavity 11, without the need for additional sealing structures. The bottom wall of the balance pipe 4 and the main cavity 21 are also welded together, ensuring both communication and sealing between the balance pipe 4 and the main cavity 21, without the need for additional sealing structures.

[0056] In some embodiments of this utility model, such as Figure 2As shown, the second valve 5 is located at the midpoint of the length of the balancing pipe 4. It is understood that if the second valve 5 is closer to either the transfer chamber 11 or the main chamber 21, the fluid travels a longer distance from the second valve 5 to the other. A longer pipe increases fluid resistance, leading to pressure loss. When the valve port 511 of the second valve 5 is open, the fluid encounters greater resistance on the longer side, requiring a longer time to balance the pressure in the transfer chamber 11 and the main chamber 21. Therefore, by positioning the second valve 5 at the midpoint of the length of the balancing pipe 4, this application ensures that the distance from the fluid in the transfer chamber 11 to the valve port is the same as the distance from the fluid in the main chamber 21 to the valve port. This makes the flow resistance of the fluid in the transfer chamber 11 and the main chamber 21 the same, facilitating rapid balance of the pressure difference between the transfer chamber 11 and the main chamber 21 and improving the reliability of the semiconductor processing equipment 100.

[0057] In some embodiments of this utility model, such as Figure 1 and Figure 2 As shown, the first valve 3 is located between the first device 1 and the second device 2. The first device 1 has a first opening that communicates with the conveying chamber 11, and the second device 2 has a second opening that communicates with the main chamber 21. A portion of the first valve 3 is located in the first opening and has a first sealing ring between it and the first device 1. A portion of the first valve 3 is located in the second opening and has a second sealing ring between it and the second device 2.

[0058] Thus, the first sealing ring achieves a sealed connection between the first valve 3 and the transmission chamber 11, and the second sealing ring achieves a sealed connection between the first valve 3 and the main chamber 21. This double sealing ensures a leak-free sealed connection between the transmission chamber 11 and the main chamber 21, improving overall reliability.

[0059] In some embodiments of this utility model, the semiconductor processing equipment 100 further includes a first pressure gauge and a second pressure gauge. The first pressure gauge is located inside the transfer chamber 11, and the second pressure gauge is located inside the main chamber 21. Thus, the pressure inside the transfer chamber 11 can be measured in real time using the first pressure gauge, and the pressure inside the main chamber 21 can be measured in real time using the second pressure gauge. Based on the measurement results of the first and second pressure gauges, it can be determined whether the pressure in the transfer chamber 11 and the main chamber 21 is balanced. When the pressure difference between the transfer chamber 11 and the main chamber 21 is determined to be between 2 mt and 8 mt, the valve port 511 of the second valve 5 is completely sealed, and then the first valve 3 is opened to connect the transfer chamber 11 and the main chamber 21, allowing the transfer assembly in the transfer chamber 11 to feed or remove the wafer into or from the main chamber 21.

[0060] At the same time, by reducing the transient impact and turbulence when the first valve 3 is fully open, the impact on the first and second pressure gauges is reduced, thereby extending the service life of the first and second pressure gauges.

[0061] In some embodiments of this invention, the semiconductor processing equipment 100 further includes a transfer assembly. This transfer assembly is located within the transfer cavity 11 and is used to transfer the wafer to the main cavity 21. Thus, once the pressure difference between the transfer cavity 11 and the main cavity 21 is balanced, the valve of the first valve 3 is fully opened, connecting the transfer cavity 11 and the main cavity 21. The transfer assembly within the transfer cavity 11 can then feed the wafer into or remove it from the main cavity 21, thereby enabling the transfer of the wafer between the transfer cavity 11 and the main cavity 21, and facilitating the feeding of the wafer into or removing it from the main cavity 21.

[0062] In some embodiments of this invention, the semiconductor processing equipment 100 further includes a molecular pump. The molecular pump is connected to the main cavity 21 and is used to extract gas from the main cavity 21. Thus, the molecular pump compresses the gas through high-speed rotating turbine blades, ensuring that the vacuum level in the main cavity 21 remains within a certain range. to Within a certain range, the molecular pump offers advantages such as fast pumping speed, no oil contamination, and suitability for long-term stable operation. Furthermore, by reducing the transient impact and turbulence when the first valve 3 is fully open, the impact on the molecular pump is reduced, thereby extending its service life.

[0063] In some embodiments of this invention, the semiconductor processing equipment 100 further includes a dry pump. The dry pump is connected to the transfer chamber 11 and is used to extract gas from the transfer chamber 11. It is understood that the advantages of a dry pump are its oil-free design, avoiding oil vapor contamination, simple maintenance, and low cost. It is suitable for applications requiring frequent switching and rapid evacuation, and the vacuum level of the transfer chamber 11 is typically maintained at [value missing]. about.

[0064] In some embodiments of this utility model, the semiconductor processing equipment 100 further includes an industrial control computer. The industrial control computer is connected to the first valve 3 and is used to control the opening and closing states of the first valve 3 and the second valve 5 based on the pressure difference between the transfer chamber 11 and the main chamber 21.

[0065] It is understandable that the industrial control computer is communicatively connected to the first valve 3 and the second valve 5, respectively, and controls the opening and closing states and degrees of the two valves based on the pressure difference between the transfer chamber 11 and the main chamber 21. When it is necessary to send or take out the wafer into or out of the main chamber 21, the second valve 5 is first connected between the transfer chamber 11 and the main chamber 21, and the opening and closing degree of the second valve 5 is controlled to gradually balance the pressure difference between the two chambers. When it is detected that the pressure between the transfer chamber 11 and the main chamber 21 has reached equilibrium, the valve port 511 of the second valve 5 is completely sealed, and then the first valve 3 is opened to connect the transfer chamber 11 and the main chamber 21, so that the transfer component in the transfer chamber 11 sends or takes out the wafer into or out of the main chamber 21. Thus, by setting up the industrial control computer, the reliability and intelligence of the control of the first valve 3 and the second valve 5 can be achieved, transient shocks and turbulence can be avoided, and the cleanliness of the main chamber 21 and the stability of equipment operation can be improved.

[0066] In some embodiments of this invention, the industrial control computer is configured to control the second valve 5 to open before the first valve 3 when a pressure difference exists between the transmission chamber 11 and the main chamber 21. It is understood that the industrial control computer is configured to: control the second valve 5 to open before the first valve 3 when a pressure difference exists between the transmission chamber 11 and the main chamber 21, and slowly adjust according to a preset opening curve to reduce the pressure difference; when the pressure difference is eliminated or reaches a balance threshold, control the second valve 5 to close, and then open the first valve 3 to complete the connection between the transmission chamber 11 and the main chamber 21. Thus, through the above sequential control, transient impacts and turbulence can be effectively avoided at the moment the first valve 3 opens, reducing the impact load and shear stress at the sealing interface, reducing abrasive wear and particle generation of the sealing ring, maintaining the cleanliness of the main chamber 21, and improving the overall reliability of the machine.

[0067] In some embodiments of this utility model, the industrial control computer is communicatively connected to the first pressure gauge and the second pressure gauge, so that the pressure result in the transmission cavity 11 measured by the first pressure gauge and the pressure result in the main cavity 21 measured by the second pressure gauge are transmitted to the industrial control computer in real time, so that the industrial control computer can control the opening or closing of the first valve 3 according to the pressure difference between the transmission cavity 11 and the main cavity 21.

[0068] In one specific embodiment, when the time required for the valve port of the first valve 3 to go from being completely blocked to being fully open is 20-30 seconds, and the transfer chamber 11 and the main chamber 21 need to be connected, the industrial control computer can slowly control the opening of the first valve 3 according to the pressure difference between the transfer chamber 11 and the main chamber 21. Alternatively, it can control the valve port of the first valve 3 to go from being completely blocked to being fully open in stages according to the pressure difference between the transfer chamber 11 and the main chamber 21, thereby achieving a slow opening of the first valve 3. This allows the pressure difference between the transfer chamber 11 and the main chamber 21 to gradually decrease, so that when the valve port is fully open, the pressure between the transfer chamber 11 and the main chamber 21 is relatively close. This reduces transient impacts and turbulence, thereby reducing the risk of particulate matter generated by the wear of the sealing material. It effectively prevents particulate matter from falling onto the wafer or entering the main chamber 21 with the airflow or wafer, ensuring a clean environment inside the main chamber 21, thereby ensuring product yield and improving the reliability of the semiconductor processing equipment 100.

[0069] Specifically, during the 20-30 second process from complete sealing to complete opening of the valve port of the first valve 3, the industrial control computer gradually opens the first valve 3 in multiple stages based on the pressure difference between the transmission chamber 11 and the main chamber 21. Each stage is set with a preset pressure difference value. When the pressure difference between the transmission chamber 11 and the main chamber 21 meets the preset pressure difference value for each stage, the valve continues to open, further reducing transient impacts and turbulent impacts, and further improving the reliability of the semiconductor processing equipment 100.

[0070] When the semiconductor processing equipment 100 includes a balance tube 4 and a second valve 5, by limiting the time required for the valve port 511 of the second valve 5 to go from being completely blocked to being fully open to 20-30 seconds, the second valve 5 is opened slowly, so that the pressure difference between the transfer chamber 11 and the main chamber 21 gradually decreases. The industrial control computer determines that the pressure of the transfer chamber 11 and the pressure of the main chamber 21 are balanced based on the pressure difference between the transfer chamber 11 and the main chamber 21, and then controls the opening of the first valve 3 to connect the transfer chamber 11 and the main chamber 21. This allows the transfer components in the transfer chamber 11 to send the wafer into or out of the main chamber 21. Thus, when the first valve 3 is opened, transient impacts and turbulence are effectively avoided, thereby reducing the risk of particulate matter generated by the wear of the sealing material. This effectively prevents particulate matter from falling onto the wafer or entering the main chamber 21 with the airflow or the wafer, ensuring a clean environment inside the main chamber 21, thereby ensuring product yield and improving the reliability of the semiconductor processing equipment 100.

[0071] It should be noted that the industrial control computer can also communicate with the second valve 5, thereby controlling the opening of the valve port 511 of the second valve 5 according to the pressure difference between the transmission chamber 11 and the main chamber 21.

[0072] Specifically, during the 20-30 second process of the valve port 511 of the second valve 5 opening from complete blockage to complete opening, the industrial control computer gradually opens the second valve 5 in multiple stages based on the pressure difference between the transmission chamber 11 and the main chamber 21. Each stage has a preset pressure difference value. Once the pressure difference between the transmission chamber 11 and the main chamber 21 meets the preset pressure difference value for each stage, the valve continues to open, further reducing the impact of transient shocks and turbulence on the balance tube 4 and further improving the reliability of the semiconductor processing equipment 100. Simultaneously, when the pressure difference between the transmission chamber 11 and the main chamber 21 is within the preset range of 2-8 mt, the industrial control computer determines that the pressure difference between the transmission chamber 11 and the main chamber 21 is balanced, and then controls the valve port 511 of the second valve 5 to be completely blocked again. Then, the first valve 3 is opened, connecting the transmission chamber 11 and the main chamber 21.

[0073] Other configurations and operations of the semiconductor processing equipment 100 according to embodiments of the present invention are known to those skilled in the art and will not be described in detail here.

[0074] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0075] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A semiconductor processing apparatus, characterized in that, include: A first device, the first device having a transfer cavity; A second device, the second device having a main cavity; A first valve, the first valve being used to connect and disconnect the transfer chamber and the main chamber; A second valve is connected between the conveying chamber and the main chamber. The opening degree of the second valve is controllable and is used to balance the pressure difference between the conveying chamber and the main chamber.

2. The semiconductor processing equipment according to claim 1, characterized in that, The semiconductor processing equipment also includes: A balancing pipe, the two ends of which are connected to the conveying cavity and the main cavity respectively along its length, and the second valve is disposed on the flow path of the balancing pipe.

3. The semiconductor processing equipment according to claim 2, characterized in that, The second valve is a pendulum valve or a butterfly valve.

4. The semiconductor processing equipment according to claim 3, characterized in that, When the second valve is a pendulum valve, the pendulum valve includes: The valve body, wherein the valve port of the second valve is located on the valve body; A swing arm, which is rotatably mounted on the valve body; A valve plate is connected to one end of the swing arm along its length. When the line connecting the central axis of the valve port and the rotation axis of the swing arm is parallel to the length direction of the swing arm on a cross section perpendicular to the central axis of the valve port, the valve plate completely blocks the valve port. The maximum angle between the length direction of the swing arm and the connecting line is α, and satisfies: 35°≤α≤45°.

5. The semiconductor processing equipment according to claim 1, characterized in that, The valve is located between the first device and the second device. The first device has a first opening communicating with the conveying cavity, and the second device has a second opening communicating with the main cavity. A portion of the valve is located within the first opening and has a first sealing ring between it and the first device. A portion of the valve is located within the second opening and has a second sealing ring between it and the second device.

6. The semiconductor processing equipment according to claim 1, characterized in that, Also includes: A first pressure gauge is located inside the transmission cavity; The second pressure gauge is located inside the main cavity.

7. The semiconductor processing equipment according to claim 1, characterized in that, Also includes: A transfer assembly, located within the transfer cavity, is used to transfer the wafer to the main cavity.

8. The semiconductor processing equipment according to claim 1, characterized in that, Also includes: A molecular pump, which is connected to the main chamber, is used to extract gas from the main chamber.

9. The semiconductor processing equipment according to claim 1, characterized in that, Also includes: An industrial control computer is connected to the first valve. The industrial control computer is used to control the opening and closing states of the first valve and the second valve according to the pressure difference between the conveying chamber and the main chamber.

10. The semiconductor processing equipment according to claim 9, characterized in that, The industrial control computer is configured to control the second valve to open before the first valve when there is a pressure difference between the conveying chamber and the main chamber.

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