A process chamber for wafer de-gluing

Abstract

The utility model provides a kind of process cavity for wafer degumming, including upper cup, annular check ring, lower cup and rotating platform, wherein, cup body of upper cup encloses a receiving space, and upper cup is equipped with top opening, annular check ring is set at the top opening of cup body and extends towards the inside of receiving space, lower cup is set in receiving space and has preset distance between top opening, rotating platform includes shaft and support disc, shaft is rotatably inserted into lower cup and exposes top end, support disc is located above lower cup and is connected with the top end of shaft.The process cavity for wafer degumming of the utility model can block the back rolling path of liquid medicine, thereby avoiding liquid medicine falling back to the front surface of wafer, improving the cleaning effect of wafer.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor integrated circuit manufacturing technology, and relates to a process cavity for wafer resist removal. Background Technology

[0002] In fields such as wafer-level chip-scale packaging (WLCSP), due to the fragility and warpage of thin wafers, their backside requires adhesives to fix them to carriers such as glass, relying on temporary carriers for subsequent processing. After wafer processing, the temporary carrier must be separated from the wafer, and residual adhesive must be removed using chemical cleaning solutions. However, conventional wet cleaning cups are insufficient to prevent the chemical solution from splashing outwards after impacting the inner wall of the cup, easily causing some of the dissolved adhesive solution to fall back onto the front side of the wafer. If this fallen solution is not cleaned effectively and promptly, it can adversely affect subsequent packaging processes.

[0003] Therefore, how to provide a process cavity for wafer resist removal that can block the rewind path of the reagent, thereby preventing the reagent from falling back onto the front side of the wafer and improving the wafer cleaning effect, has become an important problem that needs to be solved by those skilled in the art.

[0004] It should be noted that the above introduction to the technical background is only for the purpose of providing a clear and complete explanation of the technical solutions of this application and facilitating understanding by those skilled in the art. It should not be assumed that these technical solutions are known to those skilled in the art simply because they have been described in the background section of this application. Utility Model Content

[0005] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a process cavity for wafer desizing, which solves the problem in the prior art that wet cleaning integrated cups are unable to prevent the liquid from splashing outwards after hitting the inner wall of the cup, which easily causes the liquid to roll back onto the front side of the wafer.

[0006] To achieve the above and other related objectives, this utility model provides a process cavity for wafer resist removal, comprising:

[0007] The upper cup has a cup body that forms a receiving space, and the upper cup has a top opening;

[0008] An annular retaining ring is disposed at the top opening of the cup body and extends toward the interior of the receiving space;

[0009] The lower cup is positioned within the receiving space and is at a predetermined distance from the top opening;

[0010] A rotating platform includes a rotating shaft and a support plate. The rotating shaft is rotatably inserted into the lower cup and its top end is exposed. The support plate is located above the lower cup and is connected to the top end of the rotating shaft.

[0011] Optionally, the distance between the bottom end of the annular retaining ring and the upper surface of the wafer to be cleaned is in the range of 2cm-8cm.

[0012] Optionally, it also includes a reinforcing member located inside the lower cup and rotatably connected to the end of the pivot away from the support plate.

[0013] Optionally, it also includes an annular liquid guide port located between the upper cup and the lower cup.

[0014] Optionally, the upper surface of the support plate is provided with raised texture.

[0015] Optionally, a plurality of guide grooves are provided at intervals on the inner sidewall of the upper cup to guide the waste liquid downward.

[0016] Optionally, the spacing between two adjacent guide grooves is in the range of 5mm to 10mm.

[0017] Optionally, the inner wall of the upper cup is covered with a hydrophilic coating.

[0018] Optionally, it also includes a vacuum suction port, which is located on the upper surface of the support disk to adsorb the wafer to be cleaned.

[0019] Optionally, the number of vacuum suction ports may be one or more.

[0020] As described above, this utility model provides a process cavity for wafer resist removal, including an upper cup, an annular retaining ring, a lower cup, and a rotating stage. The upper cup's body forms a receiving space and has a top opening. The annular retaining ring is located at the top opening of the cup and extends into the receiving space. The lower cup is positioned within the receiving space and is at a predetermined distance from the top opening. The rotating stage includes a rotating shaft and a support plate. The rotating shaft is rotatably inserted into the lower cup, with its top end exposed. The support plate is located above the lower cup and connected to the top end of the rotating shaft. This process cavity for wafer resist removal can block the rewind path of the cleaning solution, thereby preventing the solution from falling back onto the front side of the wafer and improving the wafer cleaning effect. Attached Figure Description

[0021] Figure 1 This diagram illustrates the temporary bonding adhesive cleaning process.

[0022] Figure 2 The diagram shown is a structural schematic of an integrated cup for wet cleaning.

[0023] Figure 3The diagram shown is a structural schematic of the process cavity for wafer resist removal according to this invention.

[0024] Explanation of reference numerals in the attached figures

[0025] 1. Wafer

[0026] 2. Chemical solutions

[0027] 3 Integrated Cup

[0028] 301 Top baffle

[0029] 302 cup inner wall

[0030] 4. Wafers to be cleaned

[0031] 5. Serve.

[0032] 6. Top opening

[0033] 7. Circular retaining ring

[0034] 8 drinks

[0035] 9 Rotary Table

[0036] 901 Shaft

[0037] 902 Support Plate

[0038] 10. Firmware Enhancement

[0039] 11. Annular liquid guide port

[0040] The distance between the bottom of the L1 annular retaining ring and the upper surface of the wafer to be cleaned. Detailed Implementation

[0041] Please see Figure 1 The diagram shows a schematic of the temporary bonding adhesive cleaning process. The temporary bonding adhesive (TB adhesive) cleaning process usually adopts a two-fluid (high-pressure nitrogen gas mixed with chemical solution) cleaning: during the high-speed rotation of wafer 1, the TB adhesive dissolves in chemical solution 2 and is discharged from the gap of chip bump or C4 solder ball (C4) with the high-pressure liquid flow, thereby realizing the removal of TB adhesive.

[0042] However, please see Figure 2 The diagram shows a schematic of a wet cleaning integrated cup. The top baffle 301 of the integrated cup 3 forms an angle greater than 90° with the inner wall 302. When using two-fluid cleaning to remove TB adhesive, the two fluids sprayed from the nozzle temporarily remain on the surface of the wafer 4 to be cleaned. Due to the centrifugal force generated by the high-speed rotation of the wafer 4, these two fluids diffuse towards the edge of the wafer, ultimately impacting the inner wall of the cleaning cup with significant kinetic energy. The dissolved adhesive solution splashes outwards after impacting the inner wall 302 (e.g., ...). Figure 2As shown by the dashed arrow in the image, the upward-splashed portion, affected by the airflow generated by the high-speed rotation of the wafer 4 to be cleaned, will roll back towards the front side of the wafer 4 to be cleaned, where the air pressure is lower (as shown by the dashed arrow in the image). Figure 2 As shown by the solid arrow in the image, the rotation speed of the wafer to be cleaned gradually decreases along the direction of the arrow, causing some of the dissolved adhesive solution to fall back onto the front side of the wafer 4 to be cleaned (e.g., ...). Figure 2 As shown by the 3D arrows, this represents the path of the recirculated liquid mist. If this recirculated liquid cannot be cleaned up in a timely and effective manner, it will have an adverse effect on subsequent packaging processes.

[0043] Therefore, the inventors of this application propose a process cavity for wafer desizing that can block the rewind path of the chemical solution, thereby preventing the chemical solution from falling back onto the front side of the wafer and improving the wafer cleaning effect.

[0044] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.

[0045] It should be emphasized that the term "including / comprises" as used herein refers to the presence of a feature, whole, step, or component, but does not exclude the presence or addition of one or more other features, wholes, steps, or components.

[0046] Features described and / or illustrated for one embodiment may be used in the same or similar manner in one or more other embodiments, combined with features in other embodiments, or substituted for features in other embodiments.

[0047] In the detailed description of the embodiments of this utility model, for ease of explanation, the schematic diagrams illustrating the device structure may be partially enlarged without adhering to the general scale, and the schematic diagrams are merely examples and should not limit the scope of protection of this utility model. Furthermore, in actual manufacturing, the three-dimensional spatial dimensions of length, width, and depth should be included.

[0048] For ease of description, spatial relation terms such as “below,” “under,” “lower than,” “below,” “above,” and “upper” may be used herein to describe the relationship between one element or feature shown in the accompanying drawings and other elements or features. It will be understood that these spatial relation terms are intended to include directions other than those depicted in the drawings for devices in use or operation. Furthermore, when a layer is referred to as being “between” two layers, it may be the only layer between the two layers, or there may be one or more layers in between.

[0049] In the context of this application, the structure described above the first feature may include embodiments in which the first and second features are in direct contact, or embodiments in which additional features are formed between the first and second features, such that the first and second features may not be in direct contact.

[0050] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of the present invention. Therefore, the illustrations only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0051] Please see Figure 3 The diagram shows the structure of a process cavity for wafer resist removal according to this invention. The process cavity for wafer resist removal includes an upper cup 5, an annular retaining ring 7, a lower cup 8, and a rotating stage 9. The upper cup 5 has a cup body that forms a receiving space and has a top opening 6. The annular retaining ring 7 is disposed at the top opening 6 of the cup body and extends into the receiving space. The lower cup 8 is disposed within the receiving space and has a predetermined distance from the top opening 6. The rotating stage 9 includes a rotating shaft 901 and a support plate 902. The rotating shaft 901 is rotatably inserted into the lower cup 8 and its top end is exposed. The support plate 902 is located above the lower cup 8 and is connected to the top end of the rotating shaft 901.

[0052] Specifically, the distance L1 between the bottom end of the annular retaining ring 7 and the upper surface of the wafer 4 to be cleaned ranges from 2cm to 8cm.

[0053] Please see again Figure 3 When the process chamber for wafer resist removal is in operation, the annular retaining ring 7 extends vertically toward the interior of the upper cup 5 and maintains a distance of 2cm-8cm between it and the upper surface of the wafer 4 to be cleaned. At this time, the rewinding of the reagent toward the low-pressure area will be effectively blocked by the retaining ring (e.g., Figure 3 As shown by the dotted arrow in the image, a large amount of mist-like liquid will gather into droplets on the annular baffle 7 and then fall into the safe area of ​​the cavity, thereby preventing the liquid from falling back onto the front side of the wafer and improving the wafer cleaning effect.

[0054] As an example, it also includes an annular liquid guide port 11, which is located between the upper cup 5 and the lower cup 8, so as to discharge the liquid medicine on the inner wall of the upper cup 5 into the process cavity.

[0055] As an example, a reinforcement member 10 is also included, which is located inside the lower cup 8 and rotatably connected to one end of the rotating shaft 901 away from the support plate 902, so as to further enhance the stability of the rotating shaft 901.

[0056] As an example, the upper surface of the support disk 902 is provided with raised texture to increase the friction between the wafer 4 to be cleaned and the support disk 902, and to prevent the wafer 4 to be cleaned from slipping off during rotation.

[0057] As an example, the inner wall of the upper cup 5 is provided with multiple guide grooves at intervals to guide the waste liquid downward.

[0058] As an example, the spacing between two adjacent guide channels ranges from 5 mm to 10 mm.

[0059] As an example, the inner wall of the upper cup 5 is covered with a hydrophilic coating to increase the adhesion of the upper cup 5 to the impacted liquid and reduce the probability of the liquid rewinding.

[0060] As an example, a vacuum suction port is also included, which is located on the upper surface of the support disk 902 to adsorb the wafer 4 to be cleaned.

[0061] As an example, the number of vacuum suction ports is one or more.

[0062] In summary, this utility model provides a process cavity for wafer resist removal, including an upper cup, an annular retaining ring, a lower cup, and a rotating stage. The upper cup forms a receiving space and has a top opening. The annular retaining ring is located at the top opening of the cup and extends into the receiving space. The lower cup is positioned within the receiving space and is at a predetermined distance from the top opening. The rotating stage includes a rotating shaft and a support plate. The rotating shaft is rotatably inserted into the lower cup, with its top end exposed. The support plate is located above the lower cup and connected to the top end of the rotating shaft. This process cavity for wafer resist removal can block the backflow path of the cleaning solution, thereby preventing the solution from falling back onto the front side of the wafer and improving the wafer cleaning effect. Therefore, this utility model effectively overcomes the various shortcomings of the prior art and has high industrial application value.

[0063] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A process cavity for wafer resist removal, characterized in that, include: The upper cup has a cup body that forms a receiving space, and the upper cup has a top opening; An annular retaining ring is disposed at the top opening of the cup body and extends toward the interior of the receiving space; The lower cup is positioned within the receiving space and is at a predetermined distance from the top opening; A rotating platform includes a rotating shaft and a support plate. The rotating shaft is rotatably inserted into the lower cup and its top end is exposed. The support plate is located above the lower cup and is connected to the top end of the rotating shaft.

2. The process cavity for wafer resist removal according to claim 1, characterized in that: The distance between the bottom of the annular retaining ring and the upper surface of the wafer to be cleaned ranges from 2cm to 8cm.

3. The process cavity for wafer resist removal according to claim 1, characterized in that: It also includes a reinforcing member located inside the lower cup and rotatably connected to the end of the rotating shaft away from the support plate.

4. The process cavity for wafer resist removal according to claim 1, characterized in that: It also includes an annular liquid guide port, which is located between the upper cup and the lower cup.

5. The process cavity for wafer resist removal according to claim 1, characterized in that: The upper surface of the support plate is textured.

6. The process cavity for wafer resist removal according to claim 1, characterized in that: Multiple guide grooves are spaced apart on the inner wall of the upper cup to guide the waste liquid downward.

7. The process cavity for wafer resist removal according to claim 6, characterized in that: The spacing between two adjacent guide channels is 5mm to 10mm.

8. The process cavity for wafer resist removal according to claim 1, characterized in that: The inner wall of the upper cup is covered with a hydrophilic coating.

9. The process cavity for wafer resist removal according to claim 1, characterized in that: It also includes a vacuum suction port, which is located on the upper surface of the support disk to adsorb the wafer to be cleaned.

10. The process cavity for wafer resist removal according to claim 9, characterized in that: The number of vacuum suction ports is one or more.

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