A diode fast heat dissipation packaging device

Abstract

The utility model discloses a kind of diode quick heat dissipation packaging devices, belong to heat dissipation packaging device technical field. Including support frame and support frame, the outside of support frame is provided with support frame, the side wall top end of support frame is installed with support column, conveyor is installed on the side wall of support frame, the outside of support column is provided with rotary disc, the top end side wall of support frame is installed with glue storage barrel, the bottom of glue storage barrel is installed with first conveying pipeline, the bottom of first conveying pipeline is installed with first solenoid valve. The utility model not only realizes that heat dissipation packaging device is conveniently filled and encased to diode quantitatively, improves the convenience of heat dissipation packaging device to diode quantitatively filled and encased, and realizes that heat dissipation packaging device is conveniently filled to diode in turn, facilitates the air blowing heat dissipation of convenience, improves the efficiency of heat dissipation of heat dissipation packaging device and rotates in turn.

Description

Technical Field

[0001] This utility model relates to the technical field of heat dissipation packaging devices, specifically a diode rapid heat dissipation packaging device. Background Technology

[0002] A diode is an electronic device made of semiconductor materials. It is one of the earliest semiconductor devices and has a wide range of applications, especially in various electronic circuits. By connecting diodes with components such as resistors, capacitors, and inductors in a reasonable manner, circuits with different functions can be constructed to achieve various functions such as AC rectification, modulation signal detection, amplitude limiting and clamping, and voltage regulation of power supply.

[0003] For example, the rapid packaging device for light-emitting diodes disclosed in the patent announcement number CN114156390B includes: a support body, a mold mechanism mounted on the top of the support body, and a control mechanism mounted on the top of the support body; a fixing device mounted on the top side of the support body, and an auxiliary mechanism mounted on the top side of the support body; a connecting mechanism mounted on the top of the fixing device; and a potting mechanism mounted on the bottom of the auxiliary mechanism.

[0004] Compared with traditional packaging devices, its packaging mold design is more flexible, avoiding the problems of the integrated structure of traditional devices. It can quickly and easily remove the packaged light-emitting diodes and effectively fix the diodes to prevent them from shifting, thus laying the foundation for mass production of light-emitting diodes.

[0005] However, this does not solve the problem that existing heat dissipation packaging devices are generally not conducive to the convenient quantitative filling and packaging of diodes, which affects the convenience of quantitative filling and packaging of diodes, the convenient sequential filling of diodes, and the convenient air blowing for heat dissipation, thus affecting the efficiency of heat dissipation through sequential rotation of the heat dissipation packaging device. Utility Model Content

[0006] The purpose of this invention is to provide a diode rapid heat dissipation packaging device to solve the problems mentioned in the background art, such as the inconvenience of the heat dissipation packaging device in quantitatively filling and packaging diodes, the inconvenience of sequentially filling diodes, and the inconvenience of convenient air blowing for heat dissipation, which affect the efficiency of sequential rotation of the heat dissipation packaging device for heat dissipation.

[0007] To solve the above-mentioned technical problems, this utility model provides the following technical solution:

[0008] A diode rapid heat dissipation packaging device includes a support frame and a support bracket. The support bracket is disposed on the outside of the support frame. A support column is installed at the top of the side wall of the support frame. A conveyor is installed on the side wall of the support frame. A rotating disk is disposed outside the support column. A glue storage tank is installed on the top side wall of the support bracket. A first conveying pipe is installed at the bottom of the glue storage tank. A first solenoid valve is installed at the bottom of the first conveying pipe. A diversion pipe is installed on the side wall of the first solenoid valve. Two sets of three-way valves are symmetrically installed at the top of the support bracket. A second conveying pipe is installed on the side wall of one set of three-way valves. A third solenoid valve is fitted onto the surface of each of the second conveying pipes. Each diversion pipe is connected to a three-way valve. A second solenoid valve is fitted onto the surface of each diversion pipe. A support seat is symmetrically installed on the top of the support bracket away from the three-way valves. A first electric push rod is symmetrically installed on the top of the support bracket away from the support seat. A piston is installed at the output end of each of the first electric push rods.

[0009] Optionally, each of the support bases has a hollow column movably installed inside, the hollow column extending through the support base to its outside, the hollow column being connected to a three-way valve, the piston being slidably connected inside the hollow column, and a rotating shaft being movably installed on the top of the support frame near the first electric push rod, the surface of the rotating shaft being fitted with a second electric push rod.

[0010] Optionally, the output end of the second electric push rod is movably mounted with a support shaft, and a rocker arm is fitted on the surface of the support shaft. A rotating shaft is installed on the side of the rocker arm away from the three-way valve. A valve core is movably mounted inside the three-way valve. The valve core is connected to the rotating shaft. A sealing ring is symmetrically fitted on the surface of the valve core. The valve core is movably connected to the three-way valve through the sealing ring.

[0011] Optionally, a first guide plate is installed at the top of the conveyor, and a second guide plate is installed on the side of the top of the conveyor near the first guide plate.

[0012] Optionally, a third guide plate is installed on the side of the top of the conveyor away from the first guide plate, and a guide shroud is provided on the outside of the rotating disk.

[0013] Optionally, a servo motor is installed at the bottom of the support frame, and a worm gear is installed at the output end of the servo motor.

[0014] Optionally, a first shaft is movably mounted on the top of the side wall of the support frame, the first shaft extending through the support frame to its exterior and being movably connected thereto.

[0015] Optionally, the top end of the first shaft is connected to a rotating disk, and a worm gear is fitted onto the bottom end of the first shaft.

[0016] Optionally, the worm gear meshes with the worm wheel, the top of the support frame is equipped with four sets of equally spaced limiting posts, the limiting posts are in contact with the flow guide, and the side wall of the rotating disk is provided with multiple sets of equally spaced grooves.

[0017] Optionally, a mold is placed on the surface of each groove, a diode body is placed inside each mold, and an axial flow fan is installed on the side wall of the support column.

[0018] Compared with the prior art, the beneficial effects of this utility model are: the heat dissipation packaging device not only realizes the convenient quantitative filling and packaging of diodes, improving the convenience of quantitative filling and packaging of diodes, but also realizes the convenient sequential filling of diodes, facilitating convenient air blowing heat dissipation and improving the efficiency of heat dissipation by sequential rotation of the heat dissipation packaging device.

[0019] When using a diode rapid heat dissipation packaging device, the diode body is placed inside the mold, and the mold is then placed on the surface of a conveyor for transport. The diode is guided by the first and second guide plates on the conveyor surface to the groove on the rotating disk surface for rotation to the glue-filling area. The glue inside the storage tank flows into the two sets of distribution pipes through the first delivery pipe and the first solenoid valve. The second solenoid valve on the surface of one set of distribution pipes is opened, and the second solenoid valve on the surface of the other set of distribution pipes is closed, allowing glue to be filled through one set of distribution pipes while the other set is reserved. When the glue passes through the distribution pipes and the second solenoid valve to the three-way valve, the second electric push rod drives the support shaft to move, and the support shaft drives the rocker arm to rotate. The rotating shaft and valve core rotate, and under the sealing of multiple sets of sealing rings, glue leakage is prevented. One set of holes in the valve core is aligned with the distribution pipe, and the other set of holes is aligned with the hollow column. The first electric push rod drives the piston to move, and the piston slides inside the hollow column to extract a fixed amount of glue. After extraction, the second electric push rod is opened in the reverse direction, so that one set of holes in the valve core is aligned with the hollow column, and the other set of holes is aligned with the second delivery pipe. The third solenoid valve is opened, allowing the glue to be injected into the mold through the second delivery pipe for encapsulation. This enables the heat dissipation encapsulation device to conveniently encapsulate the diode with a fixed amount of glue, avoiding excessive glue leakage and improving the convenience of the heat dissipation encapsulation device for quantitative encapsulation of diodes.

[0020] When the diodes inside the mold need to be encapsulated sequentially, the servo motor drives the worm gear to rotate, which in turn drives the worm wheel to rotate. The worm wheel then drives the first shaft to rotate, which in turn drives the rotating disk, the groove, the mold, and the diode body to rotate. This causes the mold, after encapsulation, to move to the bottom of the support column and turn on the axial flow fan for cooling. The mold to be encapsulated then moves to the encapsulation area for encapsulation. After cooling is complete, the rotating disk continues to rotate, causing the cooled mold to move to the surface of the conveyor. With the help of the third guide plate, it is detached from the rotating disk and transported to the outside for collection. This allows the heat dissipation encapsulation device to conveniently encapsulate the diodes sequentially, facilitating convenient cooling, reducing manual labor intensity, and improving the efficiency of the heat dissipation encapsulation device for sequential cooling. Attached Figure Description

[0021] The accompanying drawings, which are incorporated herein and form part of the specification, illustrate embodiments of the present invention and, together with the specification, further serve to explain the principles of the present invention and enable those skilled in the art to implement and use the present invention.

[0022] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0023] Figure 2 This is a front view structural diagram of the present utility model;

[0024] Figure 3 This is a three-dimensional structural diagram of the support frame of this utility model;

[0025] Figure 4 This is a three-dimensional structural diagram of the second electric push rod of this utility model;

[0026] Figure 5 This is a three-dimensional structural diagram of the three-way valve of this utility model;

[0027] Figure 6 This is a side view sectional view of the three-way valve of this utility model.

[0028] Figure 7 This is a front view cross-sectional structural diagram of the three-way valve of this utility model;

[0029] Figure 8 This is a three-dimensional structural diagram of the rotating disk of this utility model;

[0030] Figure 9 This is a three-dimensional structural diagram of the support frame of this utility model;

[0031] Figure 10 This is a three-dimensional structural diagram of the air guide cover of this utility model;

[0032] Figure 11 This is a three-dimensional structural diagram of the axial flow fan of this utility model.

[0033] Figure label:

[0034] 1. Support frame; 2. Support bracket; 3. Support column; 4. Conveyor; 5. Rotary disc; 6. Glue storage tank; 7. First conveying pipe; 8. First solenoid valve; 9. Diversion pipe; 10. Three-way valve; 11. Second conveying pipe; 12. First electric push rod; 13. Support base; 14. Piston; 15. Hollow column; 16. Axial flow fan; 17. Rotating shaft; 18. Second electric push rod; 19. Support shaft; 20. Rocker arm; 21. Rotating shaft; 22. Second solenoid valve; 23. Third solenoid valve; 24. Valve core; 25. Sealing ring; 26. First guide plate; 27. Second guide plate; 28. Third guide plate; 29. ​​Flow guide cover; 30. Servo motor; 31. Worm gear; 32. First shaft; 33. Worm wheel; 34. Groove; 35. Mold; 36. Diode body; 37. Limiting post.

[0035] As shown in the figure, specific structures and devices are marked in the figure to clearly illustrate the structure of the embodiment of this utility model. However, this is only for illustrative purposes and is not intended to limit this utility model to this specific structure, device and environment. Those skilled in the art can adjust or modify these devices and environments according to specific needs. Detailed Implementation

[0036] The present invention provides a diode fast heat dissipation packaging device in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, to make the embodiments more detailed, the following embodiments are the best and preferred embodiments, and those skilled in the art can use other alternative methods to implement some known technologies; moreover, the accompanying drawings are only for more specific description of the embodiments and are not intended to specifically limit the present invention.

[0037] It should be noted that the use of terms such as "an embodiment," "an embodiment," "an exemplary embodiment," and "some embodiments" in the specification indicates that the described embodiment may include a specific feature, structure, or characteristic, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments (whether explicitly described or not) should be within the knowledge of those skilled in the art.

[0038] Generally, terms can be understood at least partly from their use in context. For example, depending at least partly on the context, the term "one or more" as used herein can be used to describe any feature, structure, or characteristic in a singular sense, or a combination of features, structures, or characteristics in a plural sense. Additionally, the term "based on" can be understood not necessarily to convey an exclusive set of factors, but rather, alternatively, depending at least partly on the context, to allow for the presence of other factors that are not necessarily explicitly described.

[0039] It is understood that the meanings of “on”, “above”, and “above” in this utility model should be interpreted in the broadest manner, such that “on” not only means “directly on” something, but also includes the meaning of being “on” something with an intervening feature or layer, and that “above” or “above” not only means “on” something, but also includes the meaning of being “on” something without an intervening feature or layer.

[0040] Furthermore, spatially related terms such as “below,” “under,” “lower,” “above,” and “upper” are used herein for convenience to describe the relationship of one element or feature to one or more other elements or features, as illustrated in the accompanying drawings. Spatially related terms are intended to cover different orientations in the use or operation of the device other than those depicted in the accompanying drawings. The device may be oriented in other ways, and the spatially related descriptive terms used herein can be interpreted similarly.

[0041] like Figures 1 to 11As shown, an embodiment of this utility model provides a diode rapid heat dissipation packaging device, including a support frame 1 and a support bracket 2. The support bracket 2 is disposed on the outside of the support frame 1. A support column 3 is installed on the top of the side wall of the support frame 1. A conveyor 4 is installed on the side wall of the support frame 1. A rotating disk 5 is disposed on the outside of the support column 3. A glue storage tank 6 is installed on the top side wall of the support bracket 2. A first conveying pipe 7 is installed at the bottom of the glue storage tank 6. A first solenoid valve 8 is installed at the bottom of the first conveying pipe 7. A diversion pipe 9 is installed on the side wall of the first solenoid valve 8. Two sets of three-way valves 10 are symmetrically installed on the top of the support bracket 2. A second conveying pipe 11 is installed on the side wall of one set of three-way valves 10. A third solenoid valve 23 is fitted on the surface of each of the second conveying pipes 11. The diversion pipes 9 are all connected to the three-way valves 10. A second solenoid valve 22 is fitted on the surface of each of the diversion pipes 9. Support seats 13 are symmetrically installed on the side of the top of the support bracket 2 away from the three-way valves 10. A first electric push rod 12 is symmetrically installed on the side of the support frame 2 away from the support base 13. A piston 14 is installed at the output end of each first electric push rod 12. A hollow column 15 is movably installed inside the support base 13. The hollow column 15 extends through the support base 13 to its outside. The hollow column 15 is connected to the three-way valve 10. The piston 14 is slidably connected inside the hollow column 15. A rotating shaft 17 is movably installed on the side of the support frame 2 near the first electric push rod 12. A second electric push rod 18 is fitted on the surface of the rotating shaft 17. A support shaft 19 is movably installed at the output end of each second electric push rod 18. A rocker arm 20 is fitted on the surface of the support shaft 19. A rotating shaft 21 is installed on the side of the rocker arm 20 away from the three-way valve 10. A valve core 24 is movably installed inside the three-way valve 10. The valve core 24 is connected to the rotating shaft 21. A sealing ring 25 is symmetrically fitted on the surface of the valve core 24. The valve core 24 is movably connected to the three-way valve 10 through the sealing ring 25.

[0042] When using a diode rapid heat dissipation packaging device, the diode body 36 is placed inside the mold 35, and the mold 35 is then placed on the surface of the conveyor 4 for conveying. The diode is guided by the first guide plate 26 and the second guide plate 27 on the surface of the conveyor 4 to the groove 34 on the surface of the rotating disk 5, where it rotates to the glue-filling area. The first solenoid valve 8 is opened, and under gravity, the glue inside the glue storage tank 6 flows through the first conveying pipe 7 and the first solenoid valve 8 into the two sets of diversion pipes 9. The second solenoid valve 22 on the surface of one set of diversion pipes 9 is opened, and the second solenoid valve 22 on the surface of the other set of diversion pipes 9 is closed, allowing glue to be filled through one set of diversion pipes 9 while the other set is reserved. When the glue passes through the diversion pipes 9 and the second solenoid valve 22 to the inside of the three-way valve 10, the second electric push rod 18 is opened. Under the movable support of the rotating shaft 17, the second electric push rod 18 drives the support shaft 19 to move. Under the limiting support of the rotating shaft 21, the support... The support shaft 19 drives the rocker arm 20 to rotate, which in turn drives the rotating shaft 21 and the valve core 24 to rotate. Multiple sealing rings 25 prevent glue leakage, aligning one set of holes in the valve core 24 with the distribution pipe 9 and the other set with the hollow column 15. The first electric push rod 12 is opened, and supported by the support frame 2, it drives the piston 14 to move. The piston 14 slides inside the hollow column 15, extracting a measured amount of glue. After extraction, the second electric push rod 18 is opened in the opposite direction, aligning one set of holes in the valve core 24 with the hollow column 15 and the other set with the second delivery pipe 11. The third solenoid valve 23 is opened, allowing glue to be injected into the mold 35 through the second delivery pipe 11 for encapsulation. This enables convenient quantitative encapsulation of diodes using the heat dissipation encapsulation device, avoiding excessive glue leakage and improving the convenience of quantitative encapsulation of diodes using the heat dissipation encapsulation device.

[0043] A first guide plate 26 is installed at the top of the conveyor 4, and a second guide plate 27 is installed on the side of the top of the conveyor 4 near the first guide plate 26.

[0044] A third guide plate 28 is installed on the top of the conveyor 4 away from the first guide plate 26, and a guide shroud 29 is provided on the outside of the rotary disk 5.

[0045] A servo motor 30 is installed at the bottom of the support frame 1, and a worm gear 31 is installed at the output end of the servo motor 30.

[0046] A first shaft 32 is movably mounted on the top of the side wall of the support frame 1. The first shaft 32 extends through the support frame 1 to its outside and is movably connected to it.

[0047] The top end of the first shaft 32 is connected to the rotating disk 5, and the bottom end of the first shaft 32 is fitted with a worm gear 33.

[0048] The worm 31 meshes with the worm wheel 33. The top of the support frame 1 is equipped with four sets of equally spaced limiting posts 37. The limiting posts 37 are in contact with the guide shroud 29. The side wall of the rotating disk 5 is provided with multiple sets of equally spaced grooves 34.

[0049] Molds 35 are placed on the surface of the grooves 34, and diode bodies 36 are placed inside the molds 35. An axial flow fan 16 is installed on the side wall of the support column 3.

[0050] When it is necessary to sequentially encapsulate the diode body 36 inside the mold 35, the servo motor 30 is activated. Supported by the support frame 1, the servo motor 30 drives the worm gear 31 to rotate. Under the meshing of the worm gear 31 and the worm wheel 33, and supported by the first shaft 32, the worm gear 31 drives the worm wheel 33 to rotate. The worm wheel 33 drives the first shaft 32 to rotate. Under the limitation of the flow guide shroud 29, the first shaft 32 drives the rotating disk 5, the groove 34, the mold 35, and the diode body 36 to rotate, causing the encapsulated mold 35 to move. The axial flow fan 16 is turned on below the support column 3 to blow air and dissipate heat. The mold 35 to be filled is moved to the filling area for filling. After the air blowing and heat dissipation are completed, the rotating disk 5 continues to rotate, so that the cooled mold 35 moves to the surface of the conveyor 4. With the cooperation of the third guide plate 28, it is separated from the rotating disk 5 and conveyed to the outside for collection. This realizes the convenient sequential filling of diodes by the heat dissipation packaging device, facilitates convenient air blowing and heat dissipation, reduces the labor intensity of manual labor, and improves the efficiency of heat dissipation packaging device for sequential rotation and heat dissipation.

[0051] The working principle of the technical solution provided by this utility model is as follows: When using the diode fast heat dissipation packaging device, the diode body 36 is placed inside the mold 35, and the mold 35 is placed on the surface of the conveyor 4 for conveying. It is guided by the first guide plate 26 and the second guide plate 27 on the surface of the conveyor 4 to the groove 34 on the surface of the rotating disk 5 to rotate to the glue-filling area. The glue inside the glue storage tank 6 flows into the two sets of diversion pipes 9 through the first conveying pipe 7 and the first solenoid valve 8. The second solenoid valve 22 on the surface of one set of diversion pipes 9 is opened, and the other set is closed. The second solenoid valve 22 on the surface of the diversion pipe 9 allows glue to be poured through one set of diversion pipes 9, while the other set is reserved for backup. When the glue passes through the diversion pipe 9 and the second solenoid valve 22 into the three-way valve 10, the second electric push rod 18 drives the support shaft 19 to move. The support shaft 19 drives the rocker arm 20 to rotate, which in turn drives the rotating shaft 21 and the valve core 24 to rotate. Under the sealing of multiple sets of sealing rings 25, glue leakage is prevented, so that one set of holes in the valve core 24 is aligned with the diversion pipe 9, and the other set of holes is aligned with the hollow column 15. The first electric push rod 12 drives the piston 14. The piston 14 moves and slides inside the hollow column 15, drawing out a fixed amount of glue. After drawing, the second electric push rod 18 is opened in reverse, aligning one set of holes in the valve core 24 with the hollow column 15 and the other set with the second delivery pipe 11. The third solenoid valve 23 is then opened, allowing the glue to be injected into the mold 35 through the second delivery pipe 11 for encapsulation. When it is necessary to encapsulate the diode body 36 inside the mold 35 sequentially, the servo motor 30 drives the worm gear 31 to rotate, which in turn drives the worm wheel 33 to rotate. 3 drives the first shaft 32 to rotate, which in turn drives the rotating disk 5, the groove 34, the mold 35, and the diode body 36 to rotate. This causes the mold 35, after filling, to move to the bottom of the support column 3 and turn on the axial flow fan 16 to blow air for heat dissipation. The mold 35 to be filled is then moved to the filling area for filling. After the air cooling is completed, the rotating disk 5 continues to rotate, causing the cooled mold 35 to move to the surface of the conveyor 4. With the cooperation of the third guide plate 28, it is detached from the rotating disk 5 and transported to the outside for collection, thus completing the use of the heat dissipation encapsulation device.

[0052] This utility model encompasses any substitutions, modifications, equivalent methods, and solutions made within the spirit and scope of this utility model. To provide the public with a thorough understanding of this utility model, specific details are described in detail in the following preferred embodiments; however, those skilled in the art will fully understand this utility model even without these detailed descriptions. Furthermore, to avoid unnecessary confusion regarding the essence of this utility model, well-known methods, processes, procedures, components, and circuits are not described in detail.

[0053] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A diode rapid heat dissipation packaging device, characterized in that: The system includes a support frame and a support bracket. A support bracket is installed on the exterior of the support frame. A support column is installed at the top of the side wall of the support frame. A conveyor is installed on the side wall of the support frame. A rotating disk is installed on the exterior of the support column. A glue storage tank is installed on the top side wall of the support bracket. A first conveying pipe is installed at the bottom of the glue storage tank. A first solenoid valve is installed at the bottom of the first conveying pipe. A diversion pipe is installed on the side wall of the first solenoid valve. Two sets of three-way valves are symmetrically installed on the top of the support bracket. A second conveying pipe is installed on the side wall of one set of three-way valves. A third solenoid valve is fitted onto the surface of each of the second conveying pipes. Each diversion pipe is connected to a three-way valve. A second solenoid valve is fitted onto the surface of each diversion pipe. A support seat is symmetrically installed on the top of the support bracket away from the three-way valves. A first electric push rod is symmetrically installed on the top of the support bracket away from the support seat. A piston is installed at the output end of each first electric push rod.

2. The diode rapid heat dissipation packaging device according to claim 1, characterized in that: Hollow columns are movably installed inside each support base, extending through the support base to its exterior. The hollow columns are connected to a three-way valve, and the piston is slidably connected inside the hollow columns. Rotary shafts are movably installed on the top of each support frame near the first electric push rod, and second electric push rods are fitted onto the surface of each rotating shaft.

3. The diode rapid heat dissipation packaging device according to claim 2, characterized in that: The output end of the second electric push rod is movably mounted with a support shaft. The surface of the support shaft is fitted with a rocker arm. A rotating shaft is mounted on the side of the rocker arm away from the three-way valve. A valve core is movably mounted inside the three-way valve. The valve core is connected to the rotating shaft. A sealing ring is symmetrically fitted on the surface of the valve core. The valve core is movably connected to the three-way valve through the sealing ring.

4. The diode rapid heat dissipation packaging device according to claim 3, characterized in that: A first guide plate is installed at the top of the conveyor, and a second guide plate is installed on the side of the top of the conveyor near the first guide plate.

5. The diode rapid heat dissipation packaging device according to claim 4, characterized in that: A third guide plate is installed on the top of the conveyor away from the first guide plate, and a guide shroud is provided on the outside of the rotating disk.

6. The diode rapid heat dissipation packaging device according to claim 5, characterized in that: A servo motor is installed at the bottom of the support frame, and a worm gear is installed at the output end of the servo motor.

7. The diode rapid heat dissipation packaging device according to claim 6, characterized in that: A first shaft is movably mounted on the top of the side wall of the support frame, and the first shaft extends through the support frame to the outside and is movably connected thereto.

8. The diode rapid heat dissipation packaging device according to claim 7, characterized in that: The top end of the first shaft is connected to the rotating disk, and a worm gear is fitted onto the bottom end of the first shaft.

9. The diode rapid heat dissipation packaging device according to claim 8, characterized in that: The worm gear meshes with the worm wheel, and four sets of equally spaced limiting posts are installed at the top of the support frame. The limiting posts are in contact with the flow guide, and multiple sets of equally spaced grooves are provided on the side wall of the rotating disk.

10. The diode rapid heat dissipation packaging device according to claim 9, characterized in that: Each groove has a mold placed on its surface, and each mold contains a diode body. An axial flow fan is installed on the side wall of the support column.

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