Wafer glue scraping machine

Abstract

The utility model relates to wafer production technical field, especially a kind of wafer glue shoveling machine, including shovel glue frame, there is polishing mechanism, shovel glue mechanism and camera mechanism in order from left to right on the shovel glue frame;The polishing mechanism includes polishing support, and a polishing support plate is slidably arranged on the polishing support, polishing motor is vertically downward and arranged on the polishing support plate, polishing disc is fixed on the rotor of polishing motor, and polishing brush is arranged on the polishing disc;The shovel glue mechanism includes shovel glue support, and shovel glue support plate is slidably arranged on the shovel glue support, two mounting seats are fixed below the shovel glue support plate, and steel blade is installed between the two mounting seats.The utility model relates to a kind of wafer glue shoveling machine, can handle the colloid on the surface of silicon wafer in advance, to remove most of the colloid on its surface, improve the processing effect of glue boiling machine.

Description

Technical Field

[0001] This utility model relates to the field of wafer manufacturing technology, and in particular to a wafer adhesive scraping machine. Background Technology

[0002] Silicon wafer surface adhesive treatment is a critical step in semiconductor manufacturing, mainly including adhesive removal and cleaning, and removal of residual adhesive to ensure a clean silicon wafer surface and improve device performance. Among these processes, the adhesive cooking machine is a key piece of equipment for silicon wafer surface adhesive treatment.

[0003] Existing glue-cooking machines have problems with poor treatment effect when processing the glue on the surface of silicon wafers. Therefore, there is an urgent need for a processing device to pre-treat the glue on the silicon wafers before they enter the glue-cooking machine, so as to improve the surface treatment effect of the silicon wafers. Utility Model Content

[0004] The purpose of this invention is to provide a wafer adhesive removal machine that can pre-treat the adhesive on the surface of silicon wafers to remove most of the adhesive and improve the processing effect of the adhesive cooking machine.

[0005] To achieve the above objectives, the technical solution of this utility model is as follows:

[0006] A wafer scraping machine includes a scraping frame, on which a polishing mechanism, a scraping mechanism and a camera mechanism are arranged sequentially from left to right.

[0007] The polishing mechanism includes a polishing bracket, a polishing support plate is slidably mounted on the polishing bracket, a polishing motor is vertically mounted on the polishing support plate, a polishing disc is fixed on the rotor of the polishing motor, and a polishing brush is mounted on the polishing disc.

[0008] The adhesive scraping mechanism includes an adhesive scraping bracket, an adhesive scraping support plate is slidably mounted on the adhesive scraping bracket, two mounting seats are fixed below the adhesive scraping support plate, and a steel blade is installed between the two mounting seats.

[0009] As an improvement: several first telescopic cylinders are provided vertically downward on the top of the polishing bracket, and the piston rods of the first telescopic cylinders are fixedly connected to the polishing support plate; a second telescopic cylinder is provided vertically downward on the glue scraping bracket, and the piston rods of the second telescopic cylinders are fixedly connected to the glue scraping support plate.

[0010] As an improvement, a first air knife is fixed on the right side of the polishing support plate, and the first air knife is set at an angle.

[0011] As an improvement: two guide rails are provided on the inner right side of the adhesive scraping bracket, and the adhesive scraping support plate is slidably locked onto the guide rails by two sliders. A second air knife is fixed on the right side of the adhesive scraping support plate, and the second air knife is fixed vertically downward on the adhesive scraping support plate.

[0012] As an improvement, two guide limiting plates are symmetrically provided on the right side of the adhesive scraper bracket.

[0013] As an improvement: the camera mechanism includes a support column and an industrial camera. The support column is vertically fixed to the glue scraper frame. A camera support frame is detachably fixed to the support column. The industrial camera is fixed to the camera support frame. Several lamp tubes are detachably fixed to the camera support frame, and the industrial camera is located between the lamp tubes.

[0014] As an improvement, a linear guide rail is laid below the polishing mechanism, and a workpiece receiving plate is fixed on the slider of the linear guide rail.

[0015] In summary, this utility model has the following beneficial effects:

[0016] 1. Before the silicon wafers enter the glue-cooking machine, the equipment can pre-polish and remove the glue on the surface of the silicon wafers, thereby removing most of the glue on the surface and improving the subsequent processing effect of the glue-cooking machine;

[0017] 2. Linear guides are used to move silicon wafers on the workpiece receiving plate to the corresponding mechanism below, thereby improving processing efficiency. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in this utility model, the accompanying drawings used in the description of the embodiments or prior art will be briefly introduced below.

[0019] Figure 1 This is a schematic diagram of the overall structure of a wafer scraping machine.

[0020] Figure 2 A schematic cross-sectional view of a wafer scraper. Figure 1 ;

[0021] Figure 3 A schematic cross-sectional view of a wafer scraper. Figure 2 ;

[0022] Figure 4 A schematic cross-sectional view of a wafer scraper. Figure 3 ;

[0023] The components include: 1. Glue scraping frame; 2. Polishing bracket; 3. Polishing support plate; 4. Polishing motor; 5. Polishing disc; 6. Glue scraping bracket; 7. Glue scraping support plate; 8. Mounting base; 9. Steel blade; 10. First telescopic cylinder; 11. Second telescopic cylinder; 12. First air knife; 13. Second air knife; 14. Guide rail; 15. Guide limit plate; 16. Support column; 17. Industrial camera; 18. Camera support frame; 19. Lamp tube; 20. Linear guide rail; 21. Workpiece receiving plate; 22. Polishing brush. Detailed Implementation

[0024] The present invention will now be described in further detail with reference to the accompanying drawings.

[0025] Please refer to Figures 1-4 A wafer scraping machine includes a scraping frame 1, on which a polishing mechanism, a scraping mechanism and a camera mechanism are arranged sequentially from left to right;

[0026] The polishing mechanism includes a polishing bracket 2, a polishing support plate 3 is slidably mounted on the polishing bracket 2, a polishing motor 4 is vertically mounted on the polishing support plate 3, a polishing disc 5 is fixed on the rotor of the polishing motor 4, and a polishing brush 22 is mounted on the polishing disc 5.

[0027] The adhesive scraping mechanism includes an adhesive scraping bracket 6, an adhesive scraping support plate 7 is slidably mounted on the adhesive scraping bracket 6, two mounting seats 8 are fixed below the adhesive scraping support plate 7, and a steel blade 9 is installed between the two mounting seats 8.

[0028] In this embodiment, before the silicon wafer enters the glue-cooking machine, the equipment can pre-polish and remove the glue on the surface of the silicon wafer, thereby removing most of the glue on its surface and improving the subsequent processing effect of the glue-cooking machine.

[0029] Several first telescopic cylinders 10 are vertically downwardly arranged on the top of the polishing bracket 2, and the piston rods of the first telescopic cylinders 10 are fixedly connected to the polishing support plate 3. A second telescopic cylinder 11 is vertically downwardly arranged on the adhesive scraping bracket 6, and the piston rod of the second telescopic cylinder 11 is fixedly connected to the adhesive scraping support plate 7. In this embodiment, the first telescopic cylinders 10 are used to adjust the distance between the polishing brush 22 and the silicon wafer, so that the polishing brush 22 adheres to the surface of the silicon wafer to achieve the polishing operation. The second telescopic cylinders 11 are used to adjust the up-and-down movement of the steel blade 9, so that it adheres to both ends of the silicon wafer to achieve the adhesive scraping operation.

[0030] A first air knife 12 is fixed on the right side of the polishing support plate 3, and the first air knife 12 is set at an angle. Two guide rails 14 are provided on the inner right side of the glue scraping bracket 61. The glue scraping support plate 7 is slidably locked on the guide rails 14 by two sliders, and a second air knife 13 is fixed on the right side of the glue scraping support plate 7, and the second air knife 13 is fixed vertically downward on the glue scraping support plate 7.

[0031] Two guide limit plates 15 are symmetrically provided on the right side of the adhesive scraper bracket 61.

[0032] In this embodiment, the first air knife 12 and the second air knife 13 can improve the polishing and adhesive removal effect, and the guide rail 14 can improve the movement stability of the adhesive removal support plate 7.

[0033] The camera mechanism includes a support column 16 and an industrial camera 17. The support column 16 is vertically fixed to the glue scraper 1. A camera support frame 18 is detachably fixed to the support column 16. The industrial camera 17 is fixed to the camera support frame 18. Several lamp tubes 19 are detachably fixed to the camera support frame 18, and the industrial camera 17 is located among the lamp tubes 19.

[0034] In this embodiment, the camera mechanism can be used to observe the adhesive treatment on the surface of the silicon wafer.

[0035] A linear guide rail 20 is laid below the polishing mechanism, and a workpiece receiving plate 21 is fixed on the slider of the linear guide rail 20. In this embodiment, the linear guide rail 20 is used to move the silicon wafer on the workpiece receiving plate 21 to the area below the corresponding mechanism, thereby improving processing efficiency.

[0036] Working principle: The silicon wafer is placed on the workpiece receiving plate 21. Under the action of the linear guide 20, the workpiece receiving plate 21 moves to the right. When it moves below the polishing disc 5, the first telescopic cylinder 10 is activated to drive the polishing disc 5 downward, so that the polishing brush 22 contacts the surface of the silicon wafer to achieve polishing and removal. After polishing, when the right end of the silicon wafer moves below the steel blade 9, the second telescopic cylinder 11 is activated to drive the steel blade 9 to move up and down back and forth to remove the adhesive from the right side of the silicon wafer. When the left end of the silicon wafer moves below the steel blade 9, the second telescopic cylinder 11 is activated to drive the steel blade 9 to move up and down back and forth to remove the adhesive from the left side of the silicon wafer. After scraping, the silicon wafer moves to the area below the industrial camera 17 under the action of the linear guide 20 and the guide limit plate 15. The industrial camera 17 observes the surface of the silicon wafer. If it is not qualified, it is returned to be scraped again. If it is qualified, it enters the glue boiling machine.

[0037] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and not to limit it; although the utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications can still be made to the specific implementation of this utility model or equivalent substitutions can be made to some technical features without departing from the spirit of the technical solution of this utility model, and all such modifications and substitutions should be covered within the scope of the technical solution claimed by this utility model.

Claims

1. A wafer adhesive scraping machine, characterized in that, It includes a glue scraper frame, on which a polishing mechanism, a glue scraping mechanism, and a camera mechanism are arranged sequentially from left to right; The polishing mechanism includes a polishing bracket, a polishing support plate is slidably mounted on the polishing bracket, a polishing motor is vertically mounted on the polishing support plate, a polishing disc is fixed on the rotor of the polishing motor, and a polishing brush is mounted on the polishing disc. The adhesive scraping mechanism includes an adhesive scraping bracket, an adhesive scraping support plate is slidably mounted on the adhesive scraping bracket, two mounting seats are fixed below the adhesive scraping support plate, and a steel blade is installed between the two mounting seats.

2. The wafer scraping machine according to claim 1, characterized in that, A plurality of first telescopic cylinders are provided vertically downward on the top of the polishing bracket, and the piston rods of the first telescopic cylinders are fixedly connected to the polishing support plate; a second telescopic cylinder is provided vertically downward on the glue scraping bracket, and the piston rods of the second telescopic cylinders are fixedly connected to the glue scraping support plate.

3. The wafer scraping machine according to claim 1, characterized in that, A first air knife is fixed on the right side of the polishing support plate, and the first air knife is set at an angle.

4. The wafer scraping machine according to claim 1, characterized in that, The inner right side of the adhesive scraper bracket is provided with two guide rails. The adhesive scraper support plate is slidably mounted on the guide rails by two sliders. A second air knife is fixed on the right side of the adhesive scraper support plate, and the second air knife is fixed vertically downward on the adhesive scraper support plate.

5. The wafer scraping machine according to claim 1, characterized in that, Two guide limiting plates are symmetrically provided on the right side of the adhesive scraper bracket.

6. The wafer scraping machine according to claim 1, characterized in that, The camera mechanism includes a support column and an industrial camera. The support column is vertically fixed to the glue scraper frame. A camera support frame is detachably fixed to the support column. The industrial camera is fixed to the camera support frame. Several lamp tubes are detachably fixed to the camera support frame, and the industrial camera is located between the lamp tubes.

7. The wafer scraping machine according to claim 1, characterized in that, A linear guide rail is laid below the polishing mechanism, and a workpiece receiving plate is fixed on the slider of the linear guide rail.

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