Semiconductor carrier plate applicable to semiconductor elements of different sizes

Abstract

The utility model relates to the field of semiconductor carrier tray, and disclose a kind of semiconductor carrier tray applicable to different specifications semiconductor components, including carrier tray seat, the top of carrier tray seat is provided with carrier tray main body, the top of carrier tray main body is symmetrically provided with L type clamping plate, the both ends of carrier tray seat are provided with adjusting mechanism, the inside of L type clamping plate is provided with limit mechanism, this semiconductor carrier tray applicable to different specifications semiconductor components, the wafer needing processing is placed on carrier tray main body, then utilizes knob to drive bidirectional screw rod, under the action of adjusting block in adjusting groove, cooperate L type connecting arm to drive L type clamping plate to move to the middle and clamp wafer, clamping pad is contacted with wafer first in the process, and according to wafer size, multiple clamping blocks are compressed spring in respective movable slot, to clamp and fix wafer in this way, subsequent processing is facilitated, solve the problem that existing carrier tape reel is difficult to be stably fixed processing according to component size.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor carrier technology, specifically a semiconductor carrier that can be used for semiconductor components of different specifications. Background Technology

[0002] A semiconductor carrier disk is a tool used in semiconductor manufacturing to hold and hold wafers or other semiconductor materials. It is typically made of high-precision materials to ensure the stability and accuracy of the wafer during processing.

[0003] Patent CN219286359U discloses a semiconductor carrier disk applicable to semiconductor devices of different specifications. It includes a worktable and a carrier disk body. The outer wall of the carrier disk body has multiple through holes for airflow, and the inner wall of the carrier disk body has multiple chambers. A control valve for controlling the air pressure in the inner chamber of the carrier disk body is fixedly connected to the outer wall of the worktable. A vacuum pump is connected to the control valve. This device uses the vacuum pump to create a negative pressure in the inner chamber of the carrier disk body, which can adsorb wafers. By controlling the multiple chambers in the carrier disk body through the control valve, the device can achieve the adsorption effect of wafers of different sizes. This solves the problem of needing to change the carrier disk of the corresponding size when processing different wafers, which greatly reduces the efficiency of work and effectively improves work efficiency.

[0004] However, this device uses negative pressure adsorption. To ensure the stability of wafer adsorption, the surface of the carrier and the wafer must be kept clean. However, if dust in the environment and debris generated during wafer processing are trapped between the carrier and the wafer, it will significantly affect the adsorption effect of the carrier and thus affect wafer processing. To address this, a semiconductor carrier that can be used for semiconductor devices of different specifications is proposed to solve the problem that existing carriers are difficult to stably fix and process according to device size. Utility Model Content

[0005] (a) Technical problems to be solved

[0006] To address the shortcomings of existing technologies, this invention provides a semiconductor carrier disk that can be used with semiconductor components of different specifications, thus solving the aforementioned problems.

[0007] (II) Technical Solution

[0008] To achieve the above objectives, this utility model provides the following technical solution: a semiconductor carrier disk applicable to semiconductor components of different specifications, comprising a carrier disk base, a carrier disk body disposed on the top of the carrier disk base, L-shaped clamping plates symmetrically disposed on the top of the carrier disk body, adjustment mechanisms disposed at both ends of the carrier disk base, a limit mechanism disposed inside the L-shaped clamping plates, a unloading mechanism disposed on the top of the carrier disk body, the adjustment mechanism comprising an adjustment groove formed on the top of the carrier disk base, symmetrical adjustment blocks disposed in the inner cavity of the adjustment groove, a bidirectional lead screw rotatably disposed in the inner cavity of the adjustment groove, a knob fixedly connected to one end of the bidirectional lead screw, an L-shaped connecting arm disposed on the top of the carrier disk base, multiple movable grooves formed at the bottom of the L-shaped clamping plates, springs and clamping blocks disposed in the inner cavity of the movable grooves, and a clamping pad fixedly connected to one end of the clamping blocks.

[0009] Preferably, the L-shaped connecting arm is fixedly connected to both the adjusting block and the L-shaped clamping block, and the bidirectional lead screw passes through the adjusting groove and the carrier plate seat, and is rotatably connected to the carrier plate seat by a bearing at the intersection.

[0010] Preferably, the clamping block and the movable groove are slidably connected, and both ends of the spring are fixedly connected to the movable groove and the clamping block.

[0011] Preferably, the limiting mechanism includes a pressure plate disposed at the top of the inner cavity of the L-shaped clamp, a flexible pad is fixedly connected to the bottom of the pressure plate, and a screw is rotatably connected to the top of the pressure plate by means of a bearing.

[0012] Preferably, the screw passes through the L-shaped clamping plate and the two are threaded together. A rotating block is fixedly connected to the top of the screw, and sliding rods are fixedly connected to both sides of the top of the pressure plate. The sliding rods pass through the L-shaped clamping plate and the two are slidably connected.

[0013] Preferably, the unloading mechanism includes a movable groove formed on the top of the tray seat, the inner cavity of the movable groove is provided with a movable plate, and an arc-shaped stop is fixedly connected to one side of the top of the movable plate.

[0014] (III) Beneficial Effects

[0015] 1. This semiconductor carrier tray, applicable to semiconductor components of different specifications, places the wafer to be processed on the main body of the carrier tray. Then, using a knob to drive a bidirectional lead screw, under the action of the adjusting block in the adjusting groove, the L-shaped connecting arm moves the L-shaped clamping plate towards the center to clamp the wafer. During the process, the clamping pad first contacts the wafer, and according to the wafer size, multiple clamping blocks compress the springs in their respective movable grooves to clamp and fix the wafer, facilitating subsequent processing. This solves the problem that existing carrier trays are difficult to stably fix and process according to component size.

[0016] 2. This semiconductor carrier, which is applicable to semiconductor components of different specifications, clamps and fixes the wafer components through the adjustment mechanism and L-shaped clamping plate. Then, the rotating block drives the screw to rotate, which in turn drives the sliding rod to move the pressure plate and flexible pad down to press and fix the wafer from the top, thereby further improving the stability of this semiconductor carrier fixing component. Attached Figure Description

[0017] Figure 1 This is a structural diagram of the present utility model;

[0018] Figure 2 This is a cross-sectional view of the structure of this utility model;

[0019] Figure 3 This is a structural diagram of the present utility model;

[0020] Figure 4 The structure of this utility model Figure 2 Enlarged view of point A in the middle.

[0021] In the diagram: 1. Carrier base; 2. Carrier body; 3. L-shaped clamping plate; 4. Adjustment mechanism; 5. Adjustment groove; 6. Adjustment block; 7. Two-way lead screw; 8. Knob; 9. L-shaped connecting arm; 10. Movable groove; 11. Spring; 12. Clamping block; 13. Clamping pad; 14. Limiting mechanism; 141. Pressure plate; 142. Flexible pad; 143. Screw; 144. Rotating block; 145. Slide rod; 15. Unloading mechanism; 151. Moving groove; 152. Moving plate; 153. Arc-shaped stop block. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Example: Please refer to Figure 1-4A semiconductor carrier tray applicable to semiconductor components of different specifications includes a carrier tray base 1, a carrier tray body 2 on the top of the carrier tray base 1, L-shaped clamping plates 3 symmetrically arranged on the top of the carrier tray body 2, adjustment mechanisms 4 at both ends of the carrier tray base 1, a limit mechanism 14 inside the L-shaped clamping plate 3, a unloading mechanism 15 on the top of the carrier tray body 2, the adjustment mechanism 4 including an adjustment groove 5 opened on the top of the carrier tray base 1, symmetrical adjustment blocks 6 arranged in the inner cavity of the adjustment groove 5, a bidirectional lead screw 7 rotatably arranged in the inner cavity of the adjustment groove 5, a knob 8 fixedly connected to one end of the bidirectional lead screw 7, an L-shaped connecting arm 9 on the top of the carrier tray base 1, and multiple movable grooves 10 opened at the bottom of the L-shaped clamping plate 3, a spring 11 and a clamping block 12 arranged in the inner cavity of the movable groove 10, a clamping pad 13 fixedly connected to one end of the clamping block 12.

[0024] Furthermore, the L-shaped connecting arm 9 is fixedly connected to the adjusting block 6 and the L-shaped clamping block 12, and the bidirectional lead screw 7 passes through the adjusting groove 5 and the carrier plate 1 and is rotatably connected to the carrier plate 1 by bearings at the intersection.

[0025] Furthermore, the clamping block 12 is slidably connected to the movable groove 10, and both ends of the spring 11 are fixedly connected to the movable groove 10 and the clamping block 12.

[0026] Furthermore, the limiting mechanism 14 includes a pressure plate 141 disposed at the top of the inner cavity of the L-shaped clamping plate 3, a flexible pad 142 fixedly connected to the bottom of the pressure plate 141, and a screw 143 rotatably connected to the top of the pressure plate 141 by means of a bearing.

[0027] Furthermore, the screw 143 passes through the L-shaped clamping plate 3 and the two are threaded together. A rotating block 144 is fixedly connected to the top of the screw 143, and sliding rods 145 are fixedly connected to both sides of the top of the pressure plate 141. The sliding rods 145 pass through the L-shaped clamping plate 3 and the two are slidably connected. After the wafer element is clamped and fixed by the adjusting mechanism 4 in conjunction with the L-shaped clamping plate 3, the rotating block 144 can drive the screw 143 to rotate, which in turn, in conjunction with the sliding rods 145, drives the pressure plate 141 together with the flexible pad 142 to move down and press and fix the wafer from the top, thereby further improving the stability of this semiconductor carrier fixing element.

[0028] Furthermore, the unloading mechanism 15 includes a movable groove 151 opened on the top of the tray seat 1. The inner cavity of the movable groove 151 is provided with a movable plate 152. An arc-shaped stop 153 is fixedly connected to one side of the top of the movable plate 152. After the component on the top of the tray body 2 is processed, the movable plate 152 in the movable groove 151 can be moved to one side, and then cooperate with the arc-shaped stop 153 to remove the processed component from the tray body 2, so as to facilitate the removal of the processed semiconductor component.

[0029] Working principle: When using this semiconductor carrier tray, which is suitable for semiconductor components of different specifications, the wafer to be processed is placed on the carrier tray body 2. Then, the knob 8 drives the bidirectional lead screw 7. Under the action of the adjusting block 6 in the adjusting groove 5, the L-shaped connecting arm 9 drives the L-shaped clamping plate 3 to move towards the center to clamp the wafer. During the process, the clamping pad 13 first contacts the wafer, and according to the wafer size, multiple clamping blocks 12 compress the spring 11 in their respective movable grooves 10 to clamp and fix the wafer, which facilitates subsequent processing and solves the problem that existing carrier trays are difficult to stably fix and process according to the component size.

[0030] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0031] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A semiconductor carrier disk applicable to semiconductor devices of different specifications, comprising a carrier disk holder (1), characterized in that: The tray seat (1) is provided with a tray body (2) on the top. The tray body (2) is symmetrically provided with L-shaped clamps (3) on the top. The tray seat (1) is provided with adjustment mechanisms (4) at both ends. The L-shaped clamps (3) are provided with limit mechanisms (14) inside. The tray body (2) is provided with unloading mechanisms (15) on the top. The adjustment mechanism (4) includes an adjustment groove (5) on the top of the tray seat (1). The inner cavity of the adjustment groove (5) is provided with symmetrical adjustment blocks (6). The inner cavity of the adjustment groove (5) is rotatably provided with a two-way lead screw (7). One end of the two-way lead screw (7) is fixedly connected to a knob (8). The top of the tray seat (1) is provided with an L-shaped connecting arm (9). The bottom of the L-shaped clamping plate (3) is provided with multiple movable grooves (10). The inner cavity of the movable groove (10) is provided with a spring (11) and a clamping block (12). One end of the clamping block (12) is fixedly connected to a clamping pad (13).

2. The semiconductor carrier disk applicable to semiconductor devices of different specifications according to claim 1, characterized in that: The L-shaped connecting arm (9) is fixedly connected to the adjusting block (6) and the L-shaped clamping block (12). The bidirectional screw (7) passes through the adjusting groove (5) and the carrier plate seat (1) and is rotatably connected to the carrier plate seat (1) by bearings at the intersection.

3. A semiconductor carrier disk applicable to semiconductor devices of different specifications according to claim 1, characterized in that: The clamping block (12) is slidably connected to the movable groove (10), and both ends of the spring (11) are fixedly connected to the movable groove (10) and the clamping block (12).

4. A semiconductor carrier disk applicable to semiconductor devices of different specifications according to claim 1, characterized in that: The limiting mechanism (14) includes a pressure plate (141) set at the top of the inner cavity of the L-shaped clamp (3), a flexible pad (142) is fixedly connected to the bottom of the pressure plate (141), and a screw (143) is rotatably connected to the top of the pressure plate (141) by means of a bearing.

5. A semiconductor carrier disk applicable to semiconductor devices of different specifications according to claim 4, characterized in that: The screw (143) passes through the L-shaped clamp (3) and the two are threaded together. A rotating block (144) is fixedly connected to the top of the screw (143). Slide rods (145) are fixedly connected to both sides of the top of the pressure plate (141). The slide rods (145) pass through the L-shaped clamp (3) and the two are slidably connected.

6. A semiconductor carrier disk applicable to semiconductor devices of different specifications according to claim 1, characterized in that: The unloading mechanism (15) includes a movable groove (151) opened on the top of the tray seat (1), and a movable plate (152) is provided in the inner cavity of the movable groove (151). An arc-shaped stop block (153) is fixedly connected to one side of the top of the movable plate (152).

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