Transport mechanism and pick-and-place machine

Abstract

The utility model discloses a transfer mechanism and paster, relate to patch equipment technical field, wherein, transfer mechanism includes: taking material module, buffer module, pasting material module, taking material module is located buffer module upstream, and buffer module is located pasting material module upstream, buffer module includes first drive structure, a plurality of carrier plates, is provided with a plurality of receiving parts on the carrier plate, and the receiving part is used for placing material, and the receiving part is equipped with the material receiving position relative to taking material module, and is equipped with the feeding position relative to pasting material module, and first drive structure can drive the carrier plate to make the receiving part reciprocatingly move in material receiving position and feeding position, taking material module can receive material, and transfer material to the receiving part in material receiving position, and pasting material module can take out the material in the receiving part in feeding position and transfer to the designated position, the technical scheme provided by the utility model can solve the technical problem of lower paster efficiency of two transfer structures using twice transfer mode.

Description

Technical Field

[0001] This utility model relates to the field of chip placement equipment technology, and in particular to a transfer mechanism and a chip placement machine. Background Technology

[0002] Bulk components are typically arranged in an orderly manner using a vibratory feeder, and then tested and inspected by a transfer device before being placed onto a tape or mounted onto a substrate. Currently, two transfer structures are used to transfer the components onto the substrate in two stages.

[0003] However, the two-transfer structure with two transfers has the problem of low placement efficiency. The low placement efficiency is mainly because the material is inspected during the first transfer. When the material is found to be unqualified, it will not enter the second transfer. This will cause a pause during the second transfer, resulting in low placement efficiency. Utility Model Content

[0004] To address the technical problem of low chip placement efficiency caused by the two transfer methods mentioned above, the purpose of this utility model is to propose a transfer mechanism and a chip placement machine.

[0005] To achieve the above objectives, the transfer mechanism proposed in this utility model includes:

[0006] The system includes a material picking module, a cache module, and a material placing module, wherein the material picking module is located upstream of the cache module, and the cache module is located upstream of the material placing module.

[0007] The buffer module includes a first driving structure and multiple carrier plates. The carrier plates are provided with multiple receiving parts. The receiving parts are used for placing materials. The receiving parts are provided with receiving positions relative to the material picking module and feeding positions relative to the material attaching module. The first driving structure can drive the carrier plates so that the receiving parts reciprocate between the receiving positions and the feeding positions.

[0008] The material receiving module can receive materials and transfer them to the receiving part located at the receiving position;

[0009] The material applicator module can remove the material from the receiving part located at the feeding position and transfer it to a designated location.

[0010] In one embodiment, the material handling module is configured as a turret module or a swing arm module.

[0011] In one embodiment, the material handling module is provided with at least one first material handling unit, wherein a plurality of the first material handling units are capable of transferring a plurality of the materials.

[0012] In one embodiment, the material application module is configured as a swing arm module or a turret module.

[0013] In one embodiment, the material applicator module has at least one second material handling section, wherein a plurality of the second material handling sections are capable of transferring a plurality of the materials.

[0014] In one embodiment, the first driving structure includes a first driving component and a second driving component. The carrier plate is mounted on the first driving component, and the first driving component is mounted on the second driving component. The first driving component can drive the carrier plate to move along a first direction, and the second driving component can drive the first driving component and the carrier plate to move along a second direction.

[0015] In one embodiment, the first driving component is configured as a linear driving module;

[0016] And / or, the second drive component is configured as a linear drive module.

[0017] In one embodiment, two carrier boards are configured, and two sets of the first driving structure are configured, wherein one set of the first driving structure corresponds to one carrier board.

[0018] In one embodiment, the material picking module, the buffer module, and the material pasting module are each configured as two sets;

[0019] And / or, the plurality of receiving portions on the carrier plate are arranged in a matrix.

[0020] This utility model also proposes a chip mounter, including a transfer mechanism, a material loading platform, and a detection mechanism as described above. The material loading platform is used for placing a substrate, and the mounting module is used for attaching materials to the substrate placed on the material loading platform. The substrate is movable relative to the mounting module, and the detection mechanism is located around the material picking module for detecting the material before it enters the receiving part.

[0021] The technical solution of this utility model employs multiple carrier plates, each with multiple receiving parts. The material picking module gradually transfers the material from the feeding mechanism to the carrier plate. When the carrier plate is full, the first driving structure moves it to a position close to the feeding position. At this time, the bonding module picks up and bonds the material from the full carrier plate. During the picking and bonding process, another empty carrier plate can be positioned to receive the material transferred by the picking module. When the material is found to be substandard, it does not enter the carrier plate but is discarded into the waste box. During this process, the bonding module can still pick up and bond the material from the full carrier plate without any pauses or gaps, thus ensuring bonding efficiency and solving the problem of low bonding efficiency in the prior art. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0023] Figure 1 A schematic diagram of the structure of an embodiment of the transfer mechanism provided by this utility model;

[0024] Figure 2 for Figure 1 A top view of part of the transfer mechanism;

[0025] Figure 3 for Figure 1 A schematic diagram of the first drive structure, carrier plate, and receiving part in the transfer mechanism;

[0026] Figure 4 for Figure 3 Enlarged view of the intermediate carrier board;

[0027] Figure 5 A schematic diagram of another embodiment of the buffer module in the transfer mechanism provided by this utility model;

[0028] Figure 6 This is a schematic diagram of another embodiment of the buffer module in the transfer mechanism provided by this utility model.

[0029] Explanation of icon numbers:

[0030] 100. Material handling module; 110. First material handling section; 120. Turret;

[0031] 200. Cache module; 210. First driving structure; 211. First driving component; 212. Second driving component; 213. Third turntable; 214. Driving part; 216. First turntable; 217. Second turntable; 220. Carrier board; 230. Receiving part;

[0032] 300. Material loading module; 310. Second material handling unit; 320. Swing arm;

[0033] 400. Feeding position;

[0034] 500, receiving position.

[0035] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0036] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0037] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0038] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0039] This utility model proposes a transfer mechanism for use in a pick-and-place machine. The pick-and-place machine includes a feeding mechanism, a detection mechanism, and a loading platform. The feeding mechanism can employ a vibratory feeder structure. The detection mechanism can be selected based on the function of the material, such as polarity detection or appearance inspection. It should be noted that there can be one or multiple detection mechanisms, the specific number depending on the material's detection requirements. Furthermore, when multiple detection mechanisms are configured, their arrangement order can be set independently. The loading platform is used to place the substrate, where the material can be transferred to the loading platform via a conveyor belt or a robotic arm. It is understood that the pick-and-place machine also includes commonly used structures such as racks.

[0040] Please see Figure 1 , Figure 2 In one embodiment of the present invention, the transfer mechanism includes: a material picking module 100, a buffer module 200, and a material attaching module 300. The material picking module 100 is located upstream of the buffer module 200, and the buffer module 200 is located upstream of the material attaching module 300.

[0041] Furthermore, in some embodiments, the material handling module 100 is configured as a turret module, wherein the turret module includes a turret 120 and a suction nozzle disposed on the turret 120, wherein the suction nozzle in the material handling module 100 defines a first material handling part 110, and at least one first material handling part 110 is provided. However, this design is not limited to this. In some embodiments, the material handling module 100 can be configured as a swing arm module, wherein the swing arm module is configured as a single swing arm 320 or a multi-swing arm 320 structure, and each swing arm 320 is provided with a suction nozzle. In this case, the suction nozzle in the swing arm module can also be defined as the first material handling part 110. It should be noted that the first material handling part 110 on a swing arm 320 can be one or more. That is, when the material handling module 100 is configured as a single swing arm 320 structure for material handling, the first material handling part 110 on a swing arm 320 can be one or more. When the first material handling part 110 is configured as multiple (not shown), multiple materials can be transferred simultaneously during material transfer.

[0042] Furthermore, in some embodiments, reference is made to... Figure 1 , Figure 2The material application module 300 can be configured as a turret module, wherein the turret module includes a turret 120 and a suction nozzle disposed on the turret 120. The suction nozzle in the material application module 300 is defined as a second material picking unit 310, and at least one second material picking unit 310 is provided. However, this design is not limited to this. In some embodiments, the material application module 300 can be configured as a swing arm module, wherein the swing arm module is configured as a single swing arm 320 or a swing arm 320 structure, and each swing arm 320 is provided with a suction nozzle. In this case, the suction nozzle in the swing arm module can also be defined as a second material picking unit 310. It should be noted that there can be one or more second material picking units 310 on a single swing arm 320. That is, when the material application module 300 is configured as a single swing arm 320 structure for material application, there can be one or more second material picking units 310 on a single swing arm 320. When there are multiple second material picking units 310, multiple materials can be transferred simultaneously during material transfer, further improving efficiency.

[0043] Further, refer to Figure 2 , Figure 3 , Figure 4 The buffer module 200 includes a first driving structure 210 and multiple carrier plates 220. Multiple receiving portions 230 are provided on the carrier plates 220, each receiving portion 230 being used for placing materials. It should be noted that one receiving portion 230 is used for placing one material. Each receiving portion 230 has a receiving position 500 relative to the material picking module 100 and a feeding position 400 relative to the material attaching module 300. The first driving structure 210 can drive the carrier plates 220 to reciprocate between the receiving position 500 and the feeding position 400. The material picking module 100 can receive materials and transfer them to the receiving portion 230 located at the receiving position 500. The material attaching module 300 can remove the materials from the receiving portion 230 located at the feeding position 400 and transfer them to a designated location.

[0044] Furthermore, in some embodiments, the material handling module 100 is configured as a turret module, the material application module 300 is configured as a swing arm module, and the explanation is based on the example of a second material handling part 310 provided on the swing arm 320. It is understood that multiple receiving parts 230 are configured. The first driving structure 210 drives the carrier plate 220 so that multiple receiving parts 230 on one carrier plate 220 are sequentially positioned at receiving positions 500 or sequentially positioned at feeding positions 400. It should be noted that "sequentially positioned" can mean that the receiving parts 230 are sequentially positioned one at the feeding position 400 or sequentially positioned two at the feeding position 400. When multiple receiving parts 230 are sequentially positioned at receiving positions 500, the material handling module 100 can sequentially transfer qualified materials to the receiving parts 230. After multiple receiving parts 230 on one carrier plate 220 are full of materials, multiple receiving parts 230 on the next carrier plate 220 are sequentially positioned at receiving positions 500 to receive qualified materials. For a carrier plate 220 filled with material, the first drive structure 210 can drive it to move to the feeding position 400. At this time, the first drive structure 210 drives the carrier plate 220 filled with material so that multiple receiving parts 230 are sequentially positioned at the feeding position 400. When the receiving part 230 filled with material is at the feeding position 400, the mounting module 300 can remove the material located at the feeding position 400 from the receiving part 230 and transfer it to a designated position, which is the mounting position on the substrate or the position of other products. Further, in some embodiments, the receiving position 500 and the feeding position 400 can be arranged opposite to each other. In this case, the first drive structure 210 includes a rotatable third turntable 213 (see reference). Figure 5 Multiple drive units 214 are provided on the third turntable 213, with multiple carrier plates 220 correspondingly mounted on each drive unit 214. The rotation of the third turntable 213 moves the carrier plates 220 and drive units 214 to positions close to the receiving position 500 or the feeding position 400. At this point, the drive units 214 drive the carrier plates 220, causing them to move and thus positioning the multiple receiving portions 230 on the carrier plates 220 sequentially at the feeding position 400 or the receiving position 500. It should be noted that the multiple receiving portions 230 on the carrier plates 220... The receiving portion 230 is arranged in a straight line. When the driving unit 214 drives the carrier plate 220 to move in a straight line, it is understood that when the third turntable 213 moves the carrier plate 220 closer to the receiving position 500 or the feeding position 400, the receiving position 500 or the feeding position 400 is located in the straight line direction when the driving unit 214 drives the carrier plate 220 to move. At this time, when the driving unit drives the carrier plate 220 to move in a straight line, it can ensure that the multiple receiving portions 230 arranged in the straight line are sequentially positioned at the receiving position 500 or the feeding position 400. However, this design is not limited to this. In some embodiments, the driving unit 214 can drive the carrier plate 220 to move in multiple directions to ensure that the multiple receiving portions 230 on the carrier plate 220 are sequentially positioned at the receiving position 500 or the feeding position 400.

[0045] However, this design is not limited to this; in some embodiments, reference is made to... Figure 6 The first drive structure 210 includes a first turntable 216 and a plurality of second turntables 217 disposed on the first turntable 216, wherein the number of the plurality of second turntables 217 is at least two, the carrier plate 220 is configured as a second turntable 217, and a plurality of the receiving parts 230 are arranged on the second turntable 217 along a circumferential direction, wherein the first turntable 216 is driven by a drive motor, and the second turntable 217 is driven by another drive motor. It can be understood that the second turntable 217 is capable of rotating on the first turntable 216. When the method in this embodiment is adopted, during material transfer, the material picking module 100 takes out the material from the feeding mechanism and tests it through the detection mechanism. After passing the test, it is transferred to the receiving part 230 on the second turntable 217. Specifically, the second turntable 217 can rotate when receiving materials. When the second turntable 217 is set close to the receiving position 500, one receiving part 230 on the second turntable 217 can be in the receiving position 500. By rotating the second turntable 217, multiple receiving parts 230 on the second turntable 217 are sequentially in the receiving position 500 and receive materials. When the material on the second turntable 217 is full, the first turntable 216 drives multiple second turntables 217 to rotate synchronously, rotating the second turntable 217 full of material to a position close to the feeding position. At this time, one receiving part 230 on the second turntable 217 corresponds to the feeding position 400. The material attaching module 300 then removes the material from the feeding position 400. After the material in one receiving part 230 is removed, the second turntable 217 rotates so that the next receiving part 230 carrying material enters the feeding position 400, waiting for the material attaching module 300 to pick up the material.

[0046] It should be noted that in some embodiments, when the material application module 300 is configured as a swing arm module, and a swing arm 320 is provided with multiple second material picking parts 310, the number of feeding positions 400 is also configured to be multiple, and multiple material application modules 300 can simultaneously pick up multiple materials from multiple receiving parts 230. Similarly, when the material picking module 100 is configured as a swing arm module, and a swing arm 320 is provided with multiple first material picking parts 110, the number of receiving positions 500 is also configured to be multiple, and the material picking module 100 can simultaneously transfer multiple materials to multiple receiving parts 230.

[0047] It should be noted that this application employs multiple carrier plates 220, each carrier plate 220 having multiple receiving parts 230. The material handling module 100 gradually transfers the material from the feeding mechanism to the carrier plate 220. When the carrier plate 220 is full of material, the first driving structure 210 moves the full carrier plate 220 to a position close to the feeding position 400. At this time, the material attaching module 300 picks up and attaches the material from the full carrier plate 220. During the material picking and attaching process, another unloaded module 100... The board 220 can be positioned at the receiving position 500 to receive materials transferred by the material picking module 100. When the material is found to be unqualified, the unqualified material will not enter the carrier board 220, but will be thrown into the waste box. During this process, the material placement module 300 can still pick up and place materials from the carrier board 220 which is full of materials, without causing the material placement module 300 to have any pauses or gaps, and will not affect the efficiency of the material placement module 300. This ensures the placement efficiency and solves the technical problem of low placement efficiency in the prior art.

[0048] Unlike the aforementioned first driving structure 210, in one embodiment, reference... Figure 3 The first driving structure 210 includes a first driving component 211 and a second driving component 212. The carrier plate 220 is mounted on the first driving component 211, and the first driving component 211 is mounted on the second driving component 212. The first driving component 211 can drive the carrier plate 220 to move along a first direction, and the second driving component 212 can drive the first driving component 211 and the carrier plate 220 to move along a second direction. Further, in this embodiment, the first and second directions are set at a 90-degree angle. In other embodiments, the first and second directions can also be at other angles, such as 80 degrees or 70 degrees, and a suitable angle can be selected according to the usage. In this embodiment, the first driving component 211 and the second driving component 212 enable the carrier plate 220 to move along the first and second directions, so that the material handling module 100 can transfer materials to multiple receiving parts 230, or so that the material attaching module 300 can pick up materials from the multiple receiving parts 230.

[0049] In one embodiment, the first drive component 211 is configured as a linear drive module, wherein the linear drive module may be a motor guide rail slider module or a cylinder module, etc., and there is no limitation on which type of linear drive module is used.

[0050] In one embodiment, the second drive component 212 is configured as a linear drive module, wherein the linear drive module may be a motor guide rail slider module or a cylinder module, etc., and there is no limitation on which type of linear drive module is used.

[0051] In one embodiment, reference Figure 1 , Figure 2 The carrier plate 220 is configured in two sets, and the first driving structure 210 is configured in two groups, with one group of the first driving structure 210 corresponding to one carrier plate 220. It can be understood that one group of first driving structures 210 can drive one carrier plate 220. The two carrier plates 220 are independently configured. In practical application, the two carrier plates 220 can alternately feed materials. For example, one carrier plate 220 is located near the feeding position 400 for the material loading module 300 to pick up materials, and the other carrier plate 220 is located near the receiving position 500 to receive qualified materials transferred from the picking module 100. Although the picking module 100 cannot continuously place materials into the carrier plate 220 during the transfer process due to the influence of unqualified materials, the carrier plate 220 located near the feeding position 400 still has materials buffered for the material loading module 300 to pick up and load, thus ensuring that the material loading module 300 does not experience any pauses and ensuring loading efficiency. However, this design is not limited to this. In some embodiments, the carrier board 220 can also be configured as three, in which case the first drive structure 210 can be configured as three groups.

[0052] In one embodiment, the material picking module 100, the buffer module 200, and the material attaching module 300 are each configured as two sets. It should be noted that configuring them as two sets can improve the transfer efficiency of the transfer mechanism. However, this design is not limited to this; in some embodiments, they can also be configured as three sets.

[0053] In some embodiments, reference Figure 4 The multiple receiving parts 230 on the carrier plate 220 are arranged in a matrix. It should be noted that the matrix arrangement facilitates the receiving parts 230 to enter the receiving position 500 or the feeding position 400 in sequence. On the other hand, when a material picking part is provided on the swing arm 320, the multiple material picking parts are usually arranged in a straight line, which facilitates the picking or discharging of materials by the multiple material picking parts.

[0054] This utility model also proposes a pick-and-place machine, which includes a transfer mechanism, a material loading platform (not shown), and a detection mechanism (not shown). The specific structure of the transfer mechanism is as described in the above embodiments. Since this pick-and-place machine adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, and will not be described in detail here. The material loading platform is used to place the substrate, and the placement module 300 is used to attach the material to the substrate placed on the material loading platform. The substrate can move relative to the placement module 300. The detection mechanism is located around the material picking module 100 and is used to detect the material before it enters the receiving part 230. Further, in some embodiments, the pick-and-place machine also includes a feeding mechanism, which can adopt a vibratory feeder structure. Further, the detection mechanism can be selected according to the function of the material, such as polarity detection, appearance detection, etc. It should be noted that there can be one or more detection mechanisms, and the specific number of detection mechanisms is selected according to the detection requirements of the material. Further, when multiple detection mechanisms are configured, the arrangement order of the multiple detection mechanisms can be set independently. Furthermore, the loading platform is used to place the substrate, where materials can be transferred to the loading platform via conveyor belt or robotic arm. Understandably, the pick-and-place machine also includes commonly used structures such as racks.

[0055] It should be noted that the substrate can move relative to the mounting module 300. This movement can be achieved by the mounting platform driving the substrate, thereby moving the substrate relative to the mounting module 300. It should be noted that there are many ways to move the mounting platform. A multi-axis drive structure can be used to move the mounting platform, thereby moving the substrate placed on the mounting platform. In this case, the substrate moves along with the mounting platform. However, this design is not limited to this. In some embodiments, the substrate is different, but the mounting module 300 moves. The mounting module 300 can be driven to move using a multi-axis drive structure.

[0056] Understandably, the movement of the substrate relative to the mounting module 300 enables fine-pitch mounting during the mounting process. Specifically, after mounting the first material, the distance between the mounting position of the second material and the first material is adjusted by changing the position of the substrate relative to the mounting module 300, thus achieving fine-pitch mounting. Similarly, if it is necessary to increase the spacing between materials on the substrate, the same method can be used.

[0057] The above description is merely an exemplary embodiment of the present utility model and does not limit the scope of protection of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the scope of protection of the present utility model.

Claims

1. A transfer mechanism, characterized by, include: The system includes a material picking module, a cache module, and a material placing module, wherein the material picking module is located upstream of the cache module, and the cache module is located upstream of the material placing module. The buffer module includes a first driving structure and multiple carrier plates. The carrier plates are provided with multiple receiving parts. The receiving parts are used for placing materials. The receiving parts are provided with receiving positions relative to the material picking module and feeding positions relative to the material attaching module. The first driving structure can drive the carrier plates so that the receiving parts reciprocate between the receiving positions and the feeding positions. The material receiving module can receive materials and transfer them to the receiving part located at the receiving position; The material applicator module can remove the material from the receiving part located at the feeding position and transfer it to a designated location.

2. The transfer mechanism as described in claim 1, characterized in that, The material handling module is configured as a turret module or a swing arm module.

3. The transfer mechanism as described in claim 2, characterized in that, The material handling module has at least one first material handling unit, wherein multiple first material handling units are capable of transferring multiple materials.

4. The transfer mechanism as described in claim 1, characterized in that, The material application module is configured as a swing arm module or a turret module.

5. The transfer mechanism as described in claim 4, characterized in that, The material application module is provided with at least one second material handling section, wherein multiple second material handling sections are capable of transferring multiple materials.

6. The transfer mechanism as described in claim 1, characterized in that, The first driving structure includes a first driving component and a second driving component. The carrier plate is mounted on the first driving component, and the first driving component is mounted on the second driving component. The first driving component can drive the carrier plate to move along a first direction, and the second driving component can drive the first driving component and the carrier plate to move along a second direction.

7. The transfer mechanism as described in claim 6, characterized in that, The first driving component is configured as a linear driving module; And / or, the second drive component is configured as a linear drive module.

8. The transfer mechanism as described in claim 6, characterized in that, The carrier board is configured in two ways, and the first driving structure is configured in two sets, with one set of the first driving structure corresponding to one carrier board.

9. The transfer mechanism according to any one of claims 1 to 8, characterized in that, The material picking module, the cache module, and the material pasting module are each configured as two sets; And / or, the plurality of receiving portions on the carrier plate are arranged in a matrix.

10. A pick-and-place machine, characterized in that, Includes a transfer mechanism, a material loading platform, and a detection mechanism as described in any one of claims 1 to 9, wherein the material loading platform is used for placing a substrate, the material attaching module is used for attaching material to the substrate placed on the material loading platform, the substrate is movable relative to the material attaching module, and the detection mechanism is located around the material taking module for detecting the material before it enters the receiving part.

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