Wafer carrier apparatus and semiconductor apparatus

Abstract

The application provides a wafer carrying device and a semiconductor device, the wafer carrying device comprising a device support and at least two clamping assemblies, the at least two clamping assemblies being respectively arranged on the device support, and the at least two clamping assemblies being spaced apart along a first direction, the first direction being a circumferential direction of a wafer clamped on the wafer carrying device; each clamping assembly comprising two clamping arms, the two clamping arms being oppositely arranged in a second direction to form a clamping opening between the two clamping arms for clamping and fixing the wafer, and the position of at least one of the two clamping arms in the second direction being adjustable, so that the opening size of the clamping opening is adjustable, the first direction being a thickness direction of the wafer clamped on the wafer carrying device. The technical scheme of the application can simultaneously clamp and fix wafers with two or more different thicknesses, so as to meet the production requirements of wafers with different thicknesses.

Description

Technical Field

[0001] This application belongs to the field of semiconductor equipment technology, and more specifically, relates to a wafer carrier device and a semiconductor device. Background Technology

[0002] Currently, semiconductor equipment such as silicon carbide wet processing equipment requires a wafer carrier to hold and clamp the wafer before performing semiconductor processes such as wet etching. This prevents the wafer from shifting during the etching process and affecting the results. In related technologies, these wafer carriers primarily use two radially opposite rectangular clamping openings to hold and fix the wafer. Therefore, these wafer carriers can only clamp wafers of a single thickness whose thickness matches the opening size of the rectangular clamping openings, and cannot accommodate wafers of different thicknesses. Utility Model Content

[0003] This application provides a wafer carrier device and a semiconductor device, aiming to improve the problem that existing semiconductor devices cannot simultaneously accommodate the clamping and fixing of wafers of different thicknesses.

[0004] In a first aspect, embodiments of this application provide a wafer carrier device for clamping and fixing a wafer. The wafer carrier device includes a device support and at least two clamping components. The at least two clamping components are respectively mounted on the device support, and the at least two clamping components are spaced apart along a first direction, which is the circumferential direction of the wafer clamped in the wafer carrier device.

[0005] The clamping assembly includes two clamping arms, which are arranged opposite each other in a second direction to form a clamping opening between the two clamping arms for clamping and fixing the wafer. At least one of the two clamping arms is positioned adjustable in the second direction so that the opening size of the clamping opening is adjustable. The second direction is the thickness direction of the wafer clamped in the wafer carrier.

[0006] Optionally, in some embodiments of this application, the device bracket is provided with at least two mounting shafts, the at least two mounting shafts are spaced apart along the first direction, and each mounting shaft extends along the second direction;

[0007] In each of the two clamping arms of the clamping assembly, at least one of them can move along the second direction to any part on the corresponding mounting shaft for corresponding installation and fixation.

[0008] Optionally, in some embodiments of this application, the clamping assembly is further configured such that at least the distance between the clamping port and the wafer clamped in the wafer carrier is adjustable;

[0009] The clamping arm includes a first clamping section, and two first clamping sections are arranged opposite each other in a second direction to form the clamping opening. The first clamping section is configured to form a first acute angle with the radial surface of the wafer clamped in the wafer carrier, and the opening of the clamping opening is a funnel shape that is closer to the wafer and farther away from the wafer.

[0010] Optionally, in some embodiments of this application, an elastic pad layer is laid on one side surface of each of the first clamping segments facing the other first clamping segment along the second direction; or,

[0011] Each of the first clamping segments has a multi-level stepped structure on one side facing the other first clamping segment.

[0012] Optionally, in some embodiments of this application, the clamping arm further includes a connecting section, the extending direction of which is parallel to the radial surface of the wafer clamped in the wafer carrier, the first clamping section being rotatably connected to the device support through the connecting section, and the rotation plane of the connecting section being parallel to the radial surface.

[0013] Optionally, in some embodiments of this application, the clamping arm further includes a second clamping section, the first clamping section is fixedly connected to the connecting section through the second clamping section, the two second clamping sections are arranged opposite to each other in a second direction to form another clamping opening, the second clamping section is configured to form a second acute angle with the radial surface of the wafer clamped on the wafer carrier, and the opening of the other clamping opening is a funnel shape that is closer to the wafer and farther away from the wafer.

[0014] Optionally, in some embodiments of this application, the angle of the second acute angle is smaller than the angle of the first acute angle.

[0015] Optionally, in some embodiments of this application, an elastic pad layer is laid on the side surface of each of the second clamping segments facing the other second clamping segment.

[0016] Optionally, in some embodiments of this application, the side surface of each of the second clamping segments facing the other second clamping segment is a multi-level stepped structure.

[0017] Secondly, embodiments of this application provide a semiconductor device, which includes the wafer carrier device described above.

[0018] The wafer carrier device and semiconductor equipment provided in this application, through the above-described structural configuration, allow the wafer carrier device of the semiconductor equipment to form at least two clamping openings with different sizes in a first direction (specifically, the circumferential direction of the wafer clamped in the wafer carrier device) by adjusting the position of at least one of the two clamping arms of each clamping component in a second direction. This adjustment supports and clamps the corresponding side of the wafer. Therefore, clamping and fixing of two or more wafers of different thicknesses can be achieved through the clamping openings of different sizes. Thus, the technical solution of this application can simultaneously accommodate the clamping and fixing of two or more wafers of different thicknesses to meet the production requirements of wafers with different thicknesses. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of a first structure of the wafer carrier device provided in an embodiment of this application;

[0021] Figure 2 for Figure 1 The diagram shows a wafer carrier clamping a wafer of a first thickness in use.

[0022] Figure 3 for Figure 1 The diagram shows a wafer carrier clamping a wafer with a second thickness in use.

[0023] Figure 4 This is a schematic diagram of a second structure of the wafer carrier device provided in the embodiments of this application;

[0024] Figure 5 This is a schematic diagram illustrating the usage state of a third structure of the wafer carrier device provided in the embodiments of this application;

[0025] Figure 6 for Figure 5 A partial enlarged structural diagram of the wafer carrier device shown;

[0026] Figure 7 This is a schematic diagram of a fourth structure of the wafer carrier device provided in the embodiments of this application.

[0027] The following are the labeling elements in the figure:

[0028] 10. Wafer carrier; 11. Device support; 12. Clamping assembly; 121. Clamping arm; 1211. First clamping section; 1212. Connecting section; 1213. Second clamping section; 122. Clamping port; 13. Mounting shaft; 14. Movable buckle; 15. Bearing. Detailed Implementation

[0029] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0030] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0031] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0032] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0033] Furthermore, the accompanying drawings are not drawn to a 1:1 scale, and the relative dimensions of the components are shown in the drawings only as examples and not necessarily to actual scale.

[0034] Currently, semiconductor equipment such as silicon carbide wet processing equipment requires a wafer carrier to hold and clamp the wafer before performing semiconductor processes such as wet etching. This prevents the wafer from shifting during the etching process and affecting the results. In related technologies, these wafer carriers primarily use two radially opposite rectangular clamping openings to hold and fix the wafer. Therefore, these wafer carriers can only clamp wafers of a single thickness whose thickness matches the opening size of the rectangular clamping openings, and cannot accommodate wafers of different thicknesses.

[0035] Therefore, it is necessary to provide a wafer carrier device and a semiconductor device to improve the problem that the existing wafer carrier device of the semiconductor device cannot simultaneously accommodate the clamping and fixing of wafers of different thicknesses.

[0036] Please see Figures 1 to 3 The wafer carrier device 10 provided in this application embodiment will now be described. The wafer carrier device 10 includes a device support 11 and at least two clamping assemblies 12. The at least two clamping assemblies 12 are respectively mounted on the device support 11, and are spaced apart (preferably equally spaced) along a first direction, which is the circumferential direction of the wafer 20 clamped in the wafer carrier device 10. Each clamping assembly 12 includes two clamping arms 121, which are positioned along a second direction (i.e.,...) Figure 1 The two clamping arms 121 are arranged opposite each other in the direction indicated by the middle arrow Z to form a clamping opening 122 for clamping and fixing the wafer 20 between the two clamping arms 121. At least one of the two clamping arms 121 is positioned in a second direction that is adjustable so that the opening size of the clamping opening 122 is adjustable. The second direction is the thickness direction of the wafer 20 clamped in the wafer carrier device 10.

[0037] It should be noted that the wafer carrier device 10 in this application embodiment is mainly used in semiconductor equipment such as silicon carbide wet processing equipment, so as to carry the wafer and clamp and fix the wafer while the wafer is subjected to semiconductor processes such as wet etching.

[0038] The aforementioned device bracket 11, in this embodiment, is primarily used as a support structure for at least two clamping components 12. Therefore, its shape and structure can be any shape and structure that meets the support requirements of at least two clamping components 12. The specific number of at least two clamping components 12 can be arbitrarily adjusted according to the clamping and fixing requirements of the wafer 20, preferably using... Figure 1The two clamping assemblies 12 shown are arranged opposite each other in the horizontal direction to better clamp and fix the wafer on both opposite sides. Of the two clamping arms 121 mentioned above, at least one is adjustable in position in the second direction so that the opening size of the clamping port 122 is adjustable. Specifically, in each clamping assembly 12, at least one clamping arm 121 can be adjusted in position in the second direction, that is, the clamping arm 121 can be displaced in the second direction, so that the clamping port 122 formed between the two clamping arms 121 has different opening sizes. The opening size specifically refers to the distance between the two clamping arms 121 in the second direction.

[0039] Thus, the wafer carrier device 10 provided in this embodiment, through the above-described structural configuration, allows for the formation of at least two clamping openings 122 with different sizes in the first direction (specifically, the circumferential direction of the wafer 20 clamped in the wafer carrier device 10) by adjusting the position of at least one of the two clamping arms 121 of each clamping component 12 in a second direction (specifically, the thickness direction of the wafer 20 clamped in the wafer carrier device 10). These openings respectively support and clamp the corresponding sides of the wafer 20. Therefore, clamping and fixing of two or more wafers of different thicknesses can be achieved through the clamping openings 122 with different opening sizes. It is evident that the technical solution of this application can simultaneously accommodate the clamping and fixing of two or more wafers of different thicknesses, thus meeting the production requirements for wafers of different thicknesses.

[0040] In some examples, such as Figures 1 to 3 As shown, the device bracket 11 is provided with at least two mounting shafts 13 (specifically corresponding one-to-one with at least two clamping assemblies 12). The at least two mounting shafts 13 are spaced apart along a first direction, and each mounting shaft 13 extends along a second direction. At least one of the two clamping arms 121 of each clamping assembly 12 can move along the corresponding mounting shaft 13 to any position in the second direction for corresponding installation and fixation. Thus, with the above structural arrangement, one clamping arm 121 can be moved along the extension direction of the corresponding mounting shaft 13 to any position for corresponding installation and fixation, thereby making the position of the corresponding clamping arm 121 adjustable in the second direction.

[0041] It should be noted that, in this example, when the position of the adjustable clamping arm 121 in the second direction is set along the extension direction of the corresponding mounting shaft 13, and it moves to the target part on the corresponding mounting shaft 13, it can be installed and fixed by a detachable fixing structure such as a movable buckle 14 or screws.

[0042] In some examples, such as Figure 4As shown, the clamping assembly 12 is further configured such that the distance between at least the clamping opening 122 and the wafer 20 clamped in the wafer carrier 10 is adjustable. The clamping arm 121 includes a first clamping section 1211, and two first clamping sections 1211 are arranged opposite each other in a second direction to form a clamping opening 122. The first clamping section 1211 is configured to form a first acute angle with the radial surface of the wafer 20 clamped in the wafer carrier 10, and the opening of the clamping opening 122 is a funnel shape that is larger closer to the wafer 20 and smaller further away from the wafer 20.

[0043] Thus, through the above structural arrangement, in addition to being able to clamp and fix two or more wafers of different thicknesses through the clamping ports 122 with different opening sizes, this example can also form at least two flared clamping ports 122 in the first direction to support and clamp the corresponding side of the wafer 20. In this way, since the two first clamping segments 1211 constituting each flared clamping port 122 have different distances in the second direction (specifically corresponding to the thickness direction of the wafer clamped in the wafer carrier 10) at different locations in their extension direction, the opening of the clamping port 122 is larger closer to the wafer 20. Therefore, with the adjustable distance between the clamping port 122 and the wafer 20 clamped in the wafer carrier 10, it is possible to further clamp and fix two or more wafers of different thicknesses through the different locations of the two first clamping segments 1211 in their extension direction.

[0044] It should be noted that the aforementioned clamping component 12 being configured such that the distance between the clamping port 122 and the wafer 20 clamped in the wafer carrier 10 is adjustable specifically refers to the mounting method of the clamping component 12 on the device support 11. This allows the distance between its clamping port 122 and the wafer 20 clamped in the wafer carrier 10 to be adaptively adjusted according to the diameter of wafers of different thicknesses, so that the clamping portions of the two clamping components 12 can better accommodate the clamping and fixing of wafers of different thicknesses. The aforementioned radial surface of the wafer clamped in the wafer carrier 10 specifically refers to the surface on the wafer perpendicular to the second direction.

[0045] In some examples, such as Figure 4 As shown, the angle of the first acute angle can be specifically 10° to 45°. In this way, by setting this parameter, it can be ensured that the funnel-shaped clamping opening 122 formed by each clamping component 12 can maintain sufficient clamping force on the corresponding side of the wafer, while being compatible with clamping and fixing wafers of a wider variety of thicknesses.

[0046] In some examples, such as Figure 4As shown, each first clamping segment 1211 has an elastic pad layer (not shown) on one side of its surface facing the other first clamping segment 1211. Thus, through the structure of the elastic pad layer, when the funnel-shaped clamping opening 122 formed by each clamping assembly 12 clamps the corresponding side of the wafer, it can provide a more favorable clamping effect on the corresponding side of the wafer, while also providing a certain degree of buffer protection to effectively prevent wafer compression deformation.

[0047] It should be noted that the elastic pad layer in this example can specifically be a rubber pad, polyurethane elastomer, or other structures.

[0048] In some examples, such as Figure 5 and Figure 6 As shown, the surface of each first clamping segment 1211 facing the other first clamping segment 1211 has a multi-level stepped structure. In this way, through the above structural arrangement, multiple rectangular bayonet structures of different widths can be formed in the funnel-shaped clamping opening 122 formed by each clamping component 12, so as to better accommodate the clamping and fixing of wafers of more different thicknesses.

[0049] In some examples, such as Figure 4 As shown, the clamping arm 121 also includes a connecting section 1212. The extending direction of the connecting section 1212 is parallel to the radial surface of the wafer clamped in the wafer carrier 10. The first clamping section 1211 is rotatably connected to the device support 11 through the connecting section 1212, and the rotation plane of the connecting section 1212 is parallel to the radial surface. Thus, with the above structural arrangement, the first clamping section 1211 can rotate relative to the device support 11 in a plane parallel to the radial surface of the wafer clamped in the wafer carrier 10, following the connecting section 1212, thereby making the distance between the clamping port 122 of the clamping assembly 12 and the wafer 20 clamped in the wafer carrier 10 adjustable.

[0050] It should be noted that in this example, each first clamping segment 1211 is rotatably connected to the device bracket 11 via the connecting segment 1212. Specifically, the mounting shaft 13 mentioned above can be rotatably set to the device bracket 11 via the bearing 15.

[0051] In some examples, such as Figure 7As shown, the clamping arm 121 also includes a second clamping section 1213. The first clamping section 1211 is fixedly connected to the connecting section 1212 through the second clamping section 1213. The two second clamping sections 1212 are arranged opposite each other in a second direction to form another clamping opening 122. The second clamping section 1213 is configured to form a second acute angle with the radial surface of the wafer 20 clamped in the wafer carrier 10, and the opening of the other clamping opening 122 is a funnel shape that is larger closer to the wafer 20 and smaller further away from the wafer 20. In this way, through the above structural arrangement, the two second clamping sections 1213 of each clamping assembly 12 can also form another funnel-shaped clamping opening 122 to meet the clamping and fixing needs of wafers with different thicknesses.

[0052] In some examples, such as Figure 7 As shown, the angle of the second acute angle is smaller than the angle of the first acute angle. Thus, through the above structural arrangement, the wafer thickness that can be clamped and fixed by the flared clamping opening 122 formed by the two second clamping segments 1213 of each clamping component 12 is different from the wafer thickness that can be clamped and fixed by the flared clamping opening 122 formed by the two first clamping segments 1211 of each clamping component 12, thereby meeting the clamping and fixing needs of wafers with more different thicknesses.

[0053] It should be noted that the angle of the second acute angle in this example is preferably 5° to 15°. The angle of the first acute angle in this example is preferably 20° to 45°.

[0054] In some examples, such as Figure 7 As shown, each second clamping segment 1213 has an elastic pad layer on the surface facing the other second clamping segment 1213. Thus, through the structure of the elastic pad layer, when each clamping assembly 12 clamps the corresponding side of the wafer through the funnel-shaped clamping opening 122 formed by the two second clamping segments 1213, it can provide a more favorable clamping effect on the corresponding side of the wafer, while also providing a certain degree of buffer protection to effectively prevent wafer compression deformation.

[0055] It should be noted that the elastic pad layer in this example can specifically be a rubber pad, polyurethane elastomer, or other structures.

[0056] In some examples, such as Figure 7 As shown, the surface of each second clamping segment 1213 facing the other second clamping segment 1213 has a multi-level stepped structure. In this way, with the above structural arrangement, multiple rectangular bayonet structures of different widths can be formed on the funnel-shaped clamping opening 122 formed by the two second clamping segments 1213 on each clamping assembly 12, so as to better accommodate the clamping and fixing of wafers of more different thicknesses.

[0057] In one embodiment, this application provides a semiconductor device including the wafer carrier 10 described above. Thus, through the above structural arrangement, the semiconductor device is equipped with the wafer carrier 10 described in the above embodiment, thereby enabling simultaneous clamping and fixing of two or more wafers of different thicknesses to meet the production requirements of wafers with different thicknesses.

[0058] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A wafer carrier device for clamping and fixing wafers, characterized in that, The wafer carrier includes a device support and at least two clamping assemblies. The at least two clamping assemblies are respectively mounted on the device support, and the at least two clamping assemblies are spaced apart along a first direction, which is the circumferential direction of the wafer clamped in the wafer carrier. The clamping assembly includes two clamping arms, which are arranged opposite each other in a second direction to form a clamping opening between the two clamping arms for clamping and fixing the wafer. At least one of the two clamping arms is positioned adjustable in the second direction so that the opening size of the clamping opening is adjustable. The second direction is the thickness direction of the wafer clamped in the wafer carrier.

2. The wafer carrier device as described in claim 1, characterized in that, The device support is provided with at least two mounting shafts, the at least two mounting shafts are spaced apart along the first direction, and each mounting shaft extends along the second direction; In each of the two clamping arms of the clamping assembly, at least one of them can move along the second direction to any part on the corresponding mounting shaft for corresponding installation and fixation.

3. The wafer carrier device as described in claim 1 or 2, characterized in that, The clamping assembly is further configured such that at least the distance between the clamping port and the wafer clamped in the wafer carrier is adjustable; The clamping arm includes a first clamping section, and two first clamping sections are arranged opposite each other in a second direction to form the clamping opening. The first clamping section is configured to form a first acute angle with the radial surface of the wafer clamped in the wafer carrier, and the opening of the clamping opening is a funnel shape that is closer to the wafer and farther away from the wafer.

4. The wafer carrier device as described in claim 3, characterized in that, Each of the first clamping segments has an elastic pad layer laid on one side of its surface facing the other first clamping segment along the second direction; or, Each of the first clamping segments has a multi-level stepped structure on one side facing the other first clamping segment.

5. The wafer carrier device as described in claim 3, characterized in that, The clamping arm further includes a connecting section, the extending direction of which is parallel to the radial surface of the wafer clamped in the wafer carrier device. The first clamping section is rotatably connected to the device support through the connecting section, and the rotation plane of the connecting section is parallel to the radial surface.

6. The wafer carrier device as described in claim 5, characterized in that, The clamping arm further includes a second clamping section. The first clamping section is fixedly connected to the connecting section through the second clamping section. The two second clamping sections are arranged opposite each other in a second direction to form another clamping opening. The second clamping section is configured to form a second acute angle with the radial surface of the wafer clamped on the wafer carrier device, and the opening of the other clamping opening is a funnel shape that is closer to the wafer and farther away from the wafer.

7. The wafer carrier device as described in claim 6, characterized in that, The angle of the second acute angle is smaller than the angle of the first acute angle.

8. The wafer carrier device as described in claim 6, characterized in that, Each of the second clamping segments has an elastic pad layer on the side surface facing the other second clamping segment.

9. The wafer carrier device as described in claim 6, characterized in that, Each of the second clamping segments has a multi-level stepped structure on one side facing the other second clamping segment.

10. A semiconductor device, characterized in that, The semiconductor device includes a wafer carrier as described in any one of claims 1-9.

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