A kind of hollowed-out wafer clamping device

Abstract

The utility model discloses a kind of clamping devices of hollowed-out wafer, it is related to wafer production technical field, including slider, the slider is the "U" shape structure of bottom end opening, and slider top end inboard is fixedly installed with support column, slider top end outboard is fixedly installed with stand, and stand side is rotatably installed with counterweight dog through pin shaft.This application provides a kind of clamping devices of hollowed-out wafer, stage is coupled with rotating main shaft through connector, and four extension arms are distributed with outer circle array in stage, and one slider is correspondingly set on each extension arm, the support column of slider top end inboard is used to support wafer body, the stand of slider top end outboard side is rotatably installed with counterweight dog through pin shaft, when stage rotates, using centrifugal principle, counterweight dog presses and holds wafer edge to realize clamping, centrifugal force increases with square of rotational speed, counterweight dog clamping force is automatically enhanced when rotation accelerates, avoid cleaning liquid impact to cause wafer body displacement.

Description

Technical Field

[0001] This utility model relates to the field of wafer manufacturing technology, specifically to a clamping device for hollowed-out wafers. Background Technology

[0002] In semiconductor wafer manufacturing, wafer cleaning and drying are key steps throughout the entire process, mainly used to remove contaminants, improve yield, and ensure the stability of subsequent processes.

[0003] However, the vacuum stage adsorption method used in traditional technology is insufficient because the wafer is hollow, which can cause the wafer to fall off during the cleaning process. Utility Model Content

[0004] The purpose of this invention is to provide a clamping device for hollowed-out wafers to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a clamping device for hollow wafers, comprising a slider, the slider having a "U"-shaped structure with an open bottom, a support column fixedly installed on the inner side of the top of the slider, a column fixedly installed on the outer side of the top of the slider, and a counterweight claw rotatably installed on the side of the column via a pin.

[0006] Furthermore, the slider has a protruding guide mark on its side end, and ear plates are fixed on both sides of the bottom end of the slider.

[0007] Furthermore, a connecting shaft is fixedly connected to the opposite surfaces of the two ear plates, and an eccentric wheel is rotatably mounted in the middle of the connecting shaft.

[0008] Furthermore, the slider is slidably mounted on the corresponding extension arm, and there are four extension arms in total.

[0009] Furthermore, ribs are fixed at both ends of the extension arm along the length direction, and scale markings are arranged at equal intervals on the ribs.

[0010] Furthermore, the four extended arm arrays are fixed to the outer circle of the stage, and a wafer body supported on a support column is mounted above the stage.

[0011] Furthermore, a connector is fixed at the middle of the bottom of the stage, and the connector is coupled to the rotating spindle.

[0012] Compared with the prior art, the present invention has the following beneficial effects:

[0013] 1. In use, the stage is coupled to the rotating spindle via a connector. Four extension arms are distributed in an outer circular array on the stage, and a slider is correspondingly provided on each extension arm. A support column on the inner side of the slider's top is used to support the wafer body. A counterweight claw is rotatably mounted on the side of the column on the outer side of the slider's top via a pin. When the stage rotates, the counterweight claw uses centrifugal force to press the wafer edge, achieving clamping. The centrifugal force increases with the square of the rotational speed (F = mω). 2 When the rotation is accelerated, the clamping force of the counterweight jaws is automatically increased, which avoids the displacement of the wafer body caused by the impact of the cleaning fluid. It is especially suitable for cleaning and processing of hollow wafers.

[0014] 2. When in use, the slider slides along the ribs at both ends of the corresponding extension arm. When it reaches the preset position, the change in the distance between the contour of the eccentric wheel and the center of rotation generates a radial displacement difference, which converts the rotational motion into a radial pressure force on the bottom surface of the extension arm, thereby achieving self-locking clamping. In this way, the distance between the slider on the four extension arms and the central stage can be adjusted, so that this application can be adapted to the clamping requirements of different wafer bodies. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of the device of this utility model;

[0016] Figure 2 This is a top view of the device of this utility model;

[0017] Figure 3 This is a bottom view of the structure of the device of this utility model.

[0018] In the diagram: 1. Slider; 2. Support column; 3. Column; 4. Counterweight claw; 5. Guide mark; 6. Ear plate; 7. Connecting shaft; 8. Eccentric wheel; 9. Extension arm; 10. Rib; 11. Scale mark; 12. Stage; 13. Wafer body; 14. Connector. Detailed Implementation

[0019] The embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of this utility model.

[0020] like Figures 1 to 3 As shown, a clamping device for a hollowed-out wafer includes a slider 1, which has a "U"-shaped structure with an open bottom. A support column 2 is fixedly installed on the inner side of the top of the slider 1, and a column 3 is fixedly installed on the outer side of the top of the slider 1. A counterweight claw 4 is rotatably installed on the side of the column 3 via a pin.

[0021] The specific operation is as follows: The stage 12 is coupled to the rotating spindle through the connector 14. The stage 12 has four extension arms 9 distributed in the outer circular array, and a slider 1 is set on each extension arm 9. The support column on the inner side of the top of the slider 1 is used to support the wafer body 13. The side of the column 3 on the outer side of the top of the slider 1 is equipped with a counterweight claw 4 through a pin. When the stage 12 rotates, the counterweight claw 4 presses the edge of the wafer to achieve clamping by utilizing the centrifugal principle. The centrifugal force increases with the square of the rotation speed. When the rotation accelerates, the clamping force of the counterweight claw 4 automatically increases, avoiding the impact of the cleaning fluid that causes the wafer body 13 to shift. It is especially suitable for cleaning and processing of hollow wafers.

[0022] like Figures 1 to 3 As shown, a guide mark 5 protrudes from the side of the slider 1, and ear plates 6 are fixed on both sides of the bottom of the slider 1. A connecting shaft 7 is fixedly connected to the opposite face of the ear plates 6, and an eccentric wheel 8 is rotatably installed in the middle of the connecting shaft 7. The slider 1 is slidably installed on the corresponding extension arm 9, and there are four extension arms 9 in total. Ribs 10 are fixed at both ends of the extension arm 9 along the length direction, and scale marks 11 are evenly arranged on the ribs 10. The four extension arms 9 are arrayed and fixed on the outer circle of the stage 12, and a wafer body 13 supported on the support column 2 is mounted on the stage 12. A connector 14 is fixed at the middle of the bottom of the stage 12, and the connector 14 is coupled to the rotating spindle.

[0023] The specific operation is as follows: the slider 1 slides along the ribs 10 at both ends of the corresponding extension arm 9. When it reaches the preset position, the change in the distance between the contour of the eccentric wheel 8 and the center of rotation generates a radial displacement difference, which converts the rotational motion into a radial pressure force on the bottom surface of the extension arm 9, thereby achieving self-locking clamping. In this way, the distance between the slider 1 on the four extension arms 9 and the central stage 12 can be adjusted, so that this application can adapt to the clamping requirements of different wafer bodies 13.

[0024] It is worth noting that the technical solution disclosed in CN119803007A (a wafer rotary drying mechanism) is a centrifugal clamping method that uses the centrifugal force generated by rotation to drive the jaws to press the wafer edge, thus proving the reliability of the wafer clamping technology solution achieved by centrifugal clamping.

[0025] Working principle: The stage 12 is coupled to the rotating spindle via connector 14. Four extension arms 9 are distributed in an outer circular array on the stage 12, and a slider 1 is correspondingly installed on each extension arm 9. The inner support column at the top of the slider 1 supports the wafer body 13. A counterweight claw 4 is rotatably mounted on the side of the column 3 at the top of the slider 1 via a pin. When the stage 12 rotates, the counterweight claw 4 uses centrifugal force to press and clamp the wafer edge. The centrifugal force increases with the square of the rotational speed (F = mω). 2When the rotation accelerates, the clamping force of the counterweight claw 4 automatically increases, avoiding displacement of the wafer body 13 caused by the impact of the cleaning fluid. It is especially suitable for cleaning and processing of hollow wafers. The slider 1 slides along the ribs 10 at both ends of the corresponding extension arm 9. When it reaches the preset position, it uses the change in the distance between the contour of the eccentric wheel 8 and the center of rotation to generate a radial displacement difference, which converts the rotational motion into a radial pressure force on the bottom surface of the extension arm 9, realizing self-locking clamping. In addition, the distance between the slider 1 on the four extension arms 9 and the central stage 12 can be adjusted, so that this application can adapt to the clamping requirements of different wafer bodies 13.

[0026] The embodiments of this utility model are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the utility model to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described in order to better illustrate the principles and practical applications of this utility model, and to enable those skilled in the art to understand this utility model and design various embodiments with various modifications suitable for a particular purpose.

Claims

1. A clamping device for a hollowed wafer comprising a slide (1), characterized in that, The slider (1) has a U-shaped structure with an open bottom. A support column (2) is fixedly installed on the inner side of the top of the slider (1). A column (3) is fixedly installed on the outer side of the top of the slider (1). A counterweight claw (4) is rotatably installed on the side of the column (3) via a pin. A guide mark (5) protrudes from the side of the slider (1). Ear plates (6) are fixed on both sides of the bottom of the slider (1). A connecting shaft (7) is fixedly connected to the opposite face of the ear plates (6) on both sides. An eccentric wheel (8) is rotatably installed in the middle of the connecting shaft (7).

2. The device according to claim 1, wherein The slider (1) is slidably mounted on the corresponding extension arm (9), and there are four extension arms (9).

3. The apparatus according to claim 2, wherein The extension arm (9) has ribs (10) fixed at both ends along the length direction, and scale markings (11) are arranged at equal intervals on the ribs (10).

4. The apparatus according to claim 3, wherein The four extension arms (9) array is fixed to the outer circle of the stage (12), and the wafer body (13) is mounted on the stage (12) and supported on the support column (2).

5. The apparatus according to claim 4, wherein A connector (14) is fixed at the bottom center of the stage (12), and the connector (14) is coupled to the rotating spindle.

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