Swinging member and clamping assembly

Abstract

The application provides a swing member and a clamping assembly. The swing member comprises a pivot, an inner swing part and an outer swing part arranged on two sides of the pivot in a radial direction, the inner swing part and the outer swing part respectively extend away from the pivot, the outer swing part is provided with a connecting part, and a counterweight is detachably connected or slidably connected to the connecting part. The swing member can be pivotally connected to a rotary positioning mechanism to form the clamping assembly. The outer swing part is swung to drive the inner swing part to swing to the outside of the edge of a wafer under the action of centrifugal force, and the wafer is limited. The connecting part and the counterweight are arranged on the outer swing part to flexibly adjust the weight and the gravity center of the outer swing part, better control the swing amplitude of the outer swing part / inner swing part under the action of centrifugal force, and then the clamping force on the wafer can be adjusted, so that the problems of edge stress concentration and easy breakage of the wafer caused by the clamping force of the clamping assembly during rotation are avoided.

Description

Technical Field

[0001] This application relates to the field of wafer cleaning technology, and in particular to a swinging member and a clamping assembly formed based on the swinging member. Background Technology

[0002] In semiconductor manufacturing, wafer cleaning is a crucial process step designed to remove contaminants generated during wafer processing, shaping, and polishing from contact with various organic substances, particles, and metals. These contaminants include dust, metal ions, and organic residues. A common method for single-wafer wet cleaning involves positioning cleaning nozzles above the wafer and rotating it from below using a rotary positioning mechanism. Centrifugal force ensures that the cleaning solution sprayed from the nozzles evenly covers the entire wafer surface, resulting in high wafer cleaning efficiency.

[0003] Because the concentricity of the rotary positioning mechanism cannot be made very precisely, the wafer will deviate significantly during rotation due to centrifugal force. Therefore, existing monolithic wafer cleaning equipment typically includes a rotary positioning mechanism with multiple clamping components. These components clamp the wafer edge from multiple angles to limit its movement during rotation. However, the force applied to the wafer edge by the existing clamping components is fixed. Since the wafer edge is subjected to significant centrifugal force during rotation, stress concentration occurs at the wafer edge, which can easily lead to wafer breakage.

[0004] In view of this, it is necessary to improve the clamping components in the existing wafer cleaning equipment to solve the above problems.

[0005] It should be noted that the above description of the background technology is only for the purpose of providing a clear and complete explanation of the technical solutions of this application and facilitating understanding by those skilled in the art. It should not be assumed that these technical solutions are known to those skilled in the art simply because they have been described in the background technology section of this application. Utility Model Content

[0006] The purpose of this application is to improve the clamping assembly to solve the problem that when using existing clamping assemblies to clamp the wafer edge, stress concentration occurs at the wafer edge during rotation, which can easily lead to wafer breakage.

[0007] To achieve the above objectives, this application provides a swinging member, comprising:

[0008] Pivoting element;

[0009] An inner swing member and an outer swing member are disposed on both radial sides of the pivot member. The inner swing member and the outer swing member extend in a direction away from the pivot member, and the outer swing member is provided with a connecting portion.

[0010] The counterweight is detachably or slidably connected to the connecting part.

[0011] As a further improvement of this application, the connecting part is configured as a sliding groove, the sliding groove extends along the extension direction of the outer swing member, and the counterweight is fixedly connected or slidably connected relative to the sliding groove.

[0012] As a further improvement of this application, the outer swing member is provided with a plurality of connecting parts, the plurality of connecting parts are arranged at intervals along the extension direction of the outer swing member, and a plurality of counterweights of different weights and volumes are detachably connected to the connecting parts.

[0013] As a further improvement of this application, the inner sway member is configured with at least two levels of extended bodies, the more distant extended body having a smaller radial width than the more near extended body, and the adjacent extended bodies are constructed to form a stepped structure.

[0014] As a further improvement of this application, the at least two-level extension bodies are all configured as columnar structures, and the edges of the extension ends of the at least two-level extension bodies are all configured as arc-shaped.

[0015] As a further improvement of this application, the pivot member is configured with a pivot block and a pivot shaft passing through the pivot block, and the inner and outer swing members are configured on two radially opposite sides of the pivot block.

[0016] As a further improvement of this application, the weight of the outer swing member and the counterweight member is greater than the weight of the inner swing member.

[0017] To achieve the above objectives, this application also provides a clamping assembly, including the aforementioned swing member and a mounting base for mounting the swing member, the mounting base being arranged in a ring and configured to rotate about the center of its ring arrangement, the pivot member being pivotally connected to the mounting base.

[0018] As a further improvement of this application, the mounting base is arranged in a ring and forms a ring-shaped receiving area, and the pivot member is pivotally connected to the circumferential outer side of the receiving area.

[0019] When the mounting base is in a non-rotated state, the inner swing element is located outside the longitudinal projection area of ​​the accommodating area;

[0020] When the mounting base is in a rotating state, the outer swing member drives the inner swing member to swing, forming an annular clamping area. The range of the clamping area changes accordingly with the rotation speed of the mounting base.

[0021] As a further improvement of this application, the mounting base is provided with positioning posts, which enclose the receiving area. The upper end of the positioning posts is constructed into a cone shape. The inner swing member is constructed with a stepped structure. When the mounting base is in a rotating state, the stepped structure rotates toward the receiving area, and the stepped structure encloses the clamping area.

[0022] Compared with the prior art, the beneficial effects of this application are:

[0023] The swinging component provided in this application can be pivotally connected to the rotary positioning mechanism to form a clamping assembly. Using centrifugal force, the swinging of the outer swinging component drives the inner swinging component to swing to the outer edge of the wafer and limits the wafer.

[0024] By configuring a connecting part and a counterweight on the outer swing component, wherein the counterweight is configured to be detachably connected or slidably connected to the connecting part, the weight and center of gravity of the outer swing component can be flexibly adjusted, thereby better controlling the swing amplitude of the outer / inner swing component under centrifugal force. This allows the clamping force on the wafer to be adjusted, avoiding the problem of edge stress concentration and easy breakage caused by the clamping force fixed by the clamping components during the wafer rotation. Attached Figure Description

[0025] Figure 1 A schematic diagram illustrating the positioning of a rotary positioning mechanism and a wafer provided in this application;

[0026] Figure 2 A schematic diagram of the assembly of the wafer and the rotary positioning mechanism provided in this application;

[0027] Figure 3 This is a schematic diagram showing the positioning of the wafer by the positioning component when the rotary positioning mechanism is in a non-rotating state.

[0028] Figure 4 This is a schematic diagram of the clamping assembly holding the wafer when the rotary positioning mechanism is in a rotating state.

[0029] Figure 5 A three-dimensional schematic diagram of the positioning component;

[0030] Figure 6 A three-dimensional schematic diagram of the swinging component;

[0031] Figure label:

[0032] 100 - Rotary positioning mechanism; 101 - Accommodation area;

[0033] 10-Rotating component, 11-Support base, 12-Connecting base, 13-Telescopic rod, 131-Receiving cylinder, 132-Telescopic cylinder;

[0034] 20 - positioning component, 21 - mounting base, 211 - mounting hole, 22 - support pad, 23 - positioning post;

[0035] 30 - clamping component, 301 - swinging member, 31 - pivot member, 311 - rotating shaft, 312 - pivot block, 32 - inner swinging member, 320 - clamping area, 321 - body, 322 - end, 323 - step structure, 33 - outer swinging member, 331 - connecting portion, 332 - counterweight;

[0036] 40 - wafer. Detailed implementation manners

[0037] The present application will be described in detail below in conjunction with the embodiments shown in the drawings. However, it should be noted that these embodiments are not limitations on the present application. Any equivalent transformation or substitution in terms of function, method, or structure made by those of ordinary skill in the art according to these embodiments shall fall within the protection scope of the present application.

[0038] Combined with Figures 1 to 6 As shown, the present application provides a rotary positioning mechanism 100 for positioning a wafer 40 and driving the wafer 40 to rotate in a wafer cleaning device (not shown).

[0039] The rotary positioning mechanism 100 includes a rotating component 10, a positioning component 20 driven by the rotating component 10 to rotate, and a clamping component 30. The positioning component 20 encloses and forms a receiving area 101 for accommodating the wafer 40. During rotation, the clamping component 30 can automatically adjust the clamping force on the wafer 40 according to the rotation speed of the rotating component 10, so as to achieve the purpose of兼顾 the clamping stability and safety of the wafer 40.

[0040] Refer to Figure 1 and Figure 2 As shown, the rotating component 10 is configured with a support base 11, and several connecting seats 12 are arranged circumferentially above it with the axis a of the support base 11 as the center. The support base 11 is driven to rotate by a driving member (not shown), so as to带动 the connecting seats 12 to rotate around the axis a. For the connection manner between the connecting seats 12 and the support base 11, it can be that multiple connecting seats 12 are connected to the support base 11 through a component, or a single connecting seat 12 is connected to the support base 11 through a single component. No matter what the connection manner is, as long as it can实现带动 the connecting seats 12 to perform circumferential rotational motion by the support base 11, this embodiment does not make specific limitations on this, and in the following description, only one connection manner is shown for illustrative purposes.

[0041] In one embodiment, the rotating component 10 is configured such that the telescopic rod 13 is connected between the support base 11 and the connecting base 12. The telescopic rod 13 is pivotally connected to the support base 11 to adjust the angle formed between the telescopic rod 13 and the support base 11, thereby adjusting the size of the accommodating area 101 to adapt to wafers 40 of different sizes. The position of the pivotal connection between the telescopic rod 13 and the support base 11 is not specifically limited in this embodiment. The telescopic rod 13 can be pivotally connected to the side of the support base 11 or the top of the support base 11, etc. Further, the telescopic rod 13 includes a receiving cylinder 131 and a telescopic cylinder 132 movably received in the receiving cylinder 131. The telescopic cylinder 132 can extend and retract radially from within the receiving cylinder 131. By adjusting the length of the telescopic rod 13, the position and size of the accommodating area 101 can have a greater adjustment space.

[0042] As shown in Figure 2 and [[ID=⑥]] Figure 3 shown, the positioning component 20 includes a plurality of mounting seats 21, support pads 22 and positioning columns 23 disposed on each mounting seat 21. Among them, the mounting seats 21 are fixed to the connecting base 12. In the illustrated embodiment, one mounting seat 21 is fixed to each connecting base 12 as an illustration. Thus, by driving the rotating component 10, the mounting seat 21 is rotated around the axis a. The positioning columns 23 arranged in a ring construct an accommodating area 101 for accommodating the wafer 40. The support pads 22 are disposed on the inner side of the ring of the positioning columns 23, and the wafer 40 placed in the accommodating area 101 is supported by the support pads 22 constructed in a ring. When the wafer 40 is placed above the rotary positioning mechanism 100 by a manipulator (not shown), pre-positioning is performed by the positioning columns 23. As shown in Figure 3 shown, the upper end of the positioning column 23 is preferably constructed as a conical structure, so that the manipulator has a relatively wide positioning space for placing the wafer 40, which is convenient for placement. The construction principle is as follows: For example, at the height h1 position, when the manipulator senses that the wafer 40 touches the positioning column 23, the wafer 40 can be released. The wafer 40 freely slides down to the upper end surface of the support pad 22 (i.e., the height h2 position) through the positioning column 23 and stops, and then is stably supported by the support pad 22.

[0043] The parts of the support pads 22 and the positioning columns 23 in contact with the wafer 40 are preferably made of materials with relatively low hardness. For example, they are made of PP materials to reduce the impact force and friction force on the wafer 40 during the sliding and supporting processes of the wafer 40.

[0044] As shown in Figure 2 and Figure 6As shown, the clamping assembly 30 includes a swinging member 301 pivotally connected to the mounting base 21. During the rotation of the rotary positioning mechanism 100, the swinging member 301 encloses to limit the edge of the wafer 40, so as to prevent the wafer 40 from being greatly offset due to the action of centrifugal force.

[0045] The swinging member 301 is configured with a pivot member 31, inner swing members 32 and outer swing members 33 arranged on both radial sides of the pivot member 31. Among them, the pivot member 31 is used to be pivotally connected to the mounting base 21. Specifically, it is pivotally connected to the outside of the circumferential direction where the positioning column 23 is located. For example, the mounting base 21 is configured with a mounting hole 211, and the rotating shaft 311 of the pivot member 31 is pivotally connected to the mounting hole 211 of the mounting base 21, so that the swinging member 31 can rotate along the axis b where the rotating shaft 311 is located. In an embodiment, the pivot member 31 is configured with a pivot block 312, the rotating shaft 311 passes through the pivot block 312, and the inner swing members 32 and the outer swing members 33 are arranged on two opposite side surfaces of the pivot block 312 in the radial direction.

[0046] It should be noted that for the configuration of the swinging member 301, the weight of the outer swing member 33 is configured to be much greater than the weight of the inner swing member 32, and the inner swing member 32 encloses to construct a clamping area 320 to achieve the following performance:

[0047] Refer Figure 3 As shown, when the rotary positioning mechanism 100 is in the non-rotating state, the outer swing member 33 is naturally hung down under the action of gravity, and the inner swing member 32 and the outer swing member 33 are in a balanced state. At this time, the inner swing member 32 is located at the initial position, the end 322 faces upward, and the inner swing member 32 is located outside the longitudinal projection area of the accommodating area 101 (that is, outside the inner circumferential area formed by the surrounding of the positioning column 23) to avoid the inner swing member 32 interfering with the wafer 40 when the wafer 40 is inserted / removed;

[0048] Refer Figure 4 As shown, when the rotary positioning mechanism 100 is in the rotating state, the swinging member 301 positions the wafer 40 within the clamping area 320 constructed by the inner swing member 32;

[0049] During the rotation acceleration stage, the outer swing member 33 is affected by the centrifugal force,带动 the inner swing member 32 to rotate downward from the initial position towards the wafer 40, and positions the wafer 40 within the clamping area 320;

[0050] During rotation, the wafer 40 is subjected to centrifugal force and will shift up, down, left, and right within the receiving area 101. For the swinging component 301, the centrifugal force generated by different rotation speeds is different, and the magnitude of the centrifugal force of its internal components is proportional to its mass. The weight of the outer swinging component 33 is much greater than the weight of the inner swinging component 32. Therefore, the outer swinging component 33 will swing up and down with the change in the magnitude of the centrifugal force, thereby causing the inner swinging component 32 to swing up and down at the edge of the wafer 40. This adjusts the range of the clamping area 320 (including the position of the clamping area 320, the clamping angle, etc.) and adjusts the clamping force on the wafer 40 to avoid the problem of wafer breakage due to stress concentration at the edge of the wafer 40 during rotation.

[0051] During the process of rotational deceleration to stop rotation, the outer swing member 33 is subjected to centrifugal force and rotates downward to hang naturally, which drives the inner swing member 32 to rotate upward to the initial position and maintains balance under the action of gravity, thereby causing the wafer 40 to detach from the clamping area 320.

[0052] To better control the swing amplitude of the outer swing component 33 under centrifugal force, the following... Figure 6 As shown, a connecting portion 331 is further provided for the outer swing member 33, and a counterweight 332 is provided for sliding connection or detachable connection to the connecting portion 331. For example, in one embodiment, the connecting portion 331 is provided as a sliding groove, which extends along the extension direction of the outer swing member 33, and the counterweight 332 is fastened to a specific position in the sliding groove to fix the swing amplitude of the outer swing member 33. Alternatively, the counterweight 332 is slidably connected to the sliding groove, and the counterweight 332 slides to the corresponding position in the sliding groove according to the magnitude of the centrifugal force, so as to adaptively adjust the center of gravity of the outer swing member 33 according to the different rotation speeds during rotation. For example, in another embodiment, the counterweight 332 is detachably connected to the connecting part 331. The weight and size of the counterweight 332 can be replaced. Alternatively, multiple connecting parts 331 can be provided, and the multiple connecting parts 331 are spaced apart along the extension direction of the outer swing member 33. In addition to the sliding groove form, the structure of the connecting part 331 can also be a positioning post, a slot, or other structures, as long as it can achieve detachable connection of the counterweight 332, so as to flexibly adjust the weight and center of gravity of the outer swing member 33.

[0053] To enable the inner sway member 32 to form a clamping region 320, at least two levels of extension bodies are configured on the inner sway member 31. The more distant extension body has a smaller radial width than the closer extension body, and the adjacent extension bodies form a stepped structure. When the rotary positioning mechanism 100 is in a rotating state, the inner sway member 32 drives the stepped structure to rotate towards the receiving region 101, and the clamping region 320 is formed by the stepped structure. The edges of the extension ends of the at least two levels of extension bodies are all arc-shaped to reduce the holding stress on the wafer edge.

[0054] In one embodiment, the inner swing member 32 includes a body 321 extending outward from one side of the pivot member 31, and an end portion 322 extending further outward from the body 321. Both the body 321 and the end portion 322 are columnar structures, with the diameter of the end portion 322 being smaller than the diameter of the body 321. The extended edges of both the body 321 and the end portion 322 are arc-shaped to form a stepped structure 323 at the connection between the end portion 322 and the body 321. A plurality of stepped structures 323 are arranged in a ring around axis a to form a clamping region 320.

[0055] The inner support 32 is made of a lightweight and low-hardness material, such as PP, to reduce the impact and friction on the wafer 40 during clamping. The outer support 33 is made of a heavier material, such as stainless steel, to generate a larger centrifugal force relative to the inner support 32 under the same angular velocity.

[0056] Based on the technical solution of the rotary positioning mechanism 100 disclosed in the foregoing embodiments, the rotary positioning mechanism 100 can be further applied to a wafer cleaning equipment. The wafer cleaning equipment (not shown) includes: the rotary positioning mechanism 100 as disclosed in the above embodiments, used to clamp the wafer 40 and rotate it stably, and during rotation, a cleaning mechanism (not shown) including cleaning nozzles delivers cleaning fluid to the surface of the wafer 40 to clean the wafer 40.

[0057] The clamping assembly 30 formed by the swing member 301 disclosed in the foregoing embodiments is not limited to the rotation clamping of the wafer 40. Based on its technical features and functional principles, it can be applied to the clamping of other fragile sheet-like objects.

[0058] The detailed descriptions listed above are merely specific descriptions of feasible implementation methods of this application and are not intended to limit the scope of protection of this application. All equivalent implementation methods or modifications made without departing from the spirit of the art of this application should be included within the scope of protection of this application.

[0059] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A swinging component, characterized in that, include: Pivoting element; An inner swing member and an outer swing member are disposed on both radial sides of the pivot member. The inner swing member and the outer swing member extend in a direction away from the pivot member, and the outer swing member is provided with a connecting portion. The counterweight is detachably or slidably connected to the connecting part.

2. The swinging member according to claim 1, characterized in that, The connecting part is configured as a sliding groove, which extends along the extension direction of the outer swing member, and the counterweight is fixedly connected or slidably connected relative to the sliding groove.

3. The swinging member according to claim 1, characterized in that, The outer swing member is provided with a plurality of connecting parts, which are spaced apart along the extension direction of the outer swing member. A plurality of counterweights of different weights and volumes are provided and detachably connected to the connecting parts.

4. The swinging member according to claim 1, characterized in that, The inner component is configured with at least two levels of extension bodies, with the more distant extension body having a smaller radial width than the closer extension body, and the adjacent extension bodies forming a stepped structure.

5. The swinging member according to claim 4, characterized in that, The at least two-stage extension bodies are all configured as columnar structures, and the edges of the extension ends of the at least two-stage extension bodies are all configured as arc-shaped.

6. The swinging member according to claim 1, characterized in that, The pivot component is configured with a pivot block and a pivot shaft passing through the pivot block, and the inner and outer swing components are configured on two radially opposite sides of the pivot block.

7. The swinging member according to claim 1, characterized in that, The weight of the outer swing component and the counterweight is greater than the weight of the inner swing component.

8. A clamping assembly, characterized in that, The device includes the swing member as described in any one of claims 1-7, and a mounting base for mounting the swing member, the mounting base being arranged in a ring and configured to rotate about the center of its ring arrangement, the pivot member being pivotally connected to the mounting base.

9. The clamping assembly according to claim 8, characterized in that, The mounting base is arranged in a ring and forms a ring-shaped receiving area, and the pivot member is pivotally connected to the outer circumferential side of the receiving area; When the mounting base is in a non-rotated state, the inner swing element is located outside the longitudinal projection area of ​​the accommodating area; When the mounting base is in a rotating state, the outer swing member drives the inner swing member to swing, forming an annular clamping area. The range of the clamping area changes accordingly with the rotation speed of the mounting base.

10. The clamping assembly according to claim 9, characterized in that, The mounting base is equipped with positioning posts, which enclose the receiving area. The upper end of the positioning posts is conical. The inner swing member has a stepped structure. When the mounting base is in a rotating state, the inner swing member drives the stepped structure to rotate toward the receiving area. The stepped structure encloses the clamping area.

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