An end effector

Abstract

The utility model discloses a kind of end execution devices, comprising: substrate;Clamping assembly, including at least 3 support arms of the substrate outside, positioning block being arranged at the support arm terminal, for rotating the driving piece one of the support arm;The driving piece acts on the support arm first end;Execution unit, including push block, driving piece two acting on the push block;Matrix, for the placement of the execution unit;Symmetrical distribution design is adopted at least 3 support arms, cooperate the secondary reinforcement of push block, realize the uniform clamping of multiple points to wafer, effectively prevent wafer deviation, slip, guarantee clamping stability, and driving piece one is realized synchronous control by controller, to adjust for wafer size.

Description

Technical Field

[0001] This utility model is an end effector, belonging to the field of semiconductor equipment. Background Technology

[0002] A wafer is a silicon wafer used in the fabrication of silicon semiconductor integrated circuits. It is called a wafer because of its circular shape. Wafers are the carriers used in the production of integrated circuits and are the most commonly used semiconductor material. They are available in various sizes, such as 6 inches and 8 inches, based on their diameter.

[0003] Existing technology discloses an end effector, a wafer gripper, and a wafer transfer device (publication number: CN119626959A). The end effector includes a substrate, a clamping mechanism, and a detection mechanism. The substrate is Y-shaped, with a front positioning block on each of the two front branches and two rear positioning blocks on the rear root. The surfaces of both the front and rear positioning blocks are inclined relative to the surface of the substrate. The clamping mechanism, located between the two rear positioning blocks, includes a driver and a clamping block. The driver can drive the clamping block to move closer to or further away from the wafer. The detection mechanism includes a sensor baffle, a photoelectric sensor, and a controller. The sensor baffle and the clamping block move accordingly. When the sensor baffle blocks the photoelectric sensor, the photoelectric sensor can send a trigger signal to the controller. This device only contacts the edge of the wafer when gripping it, effectively avoiding contact contamination.

[0004] However, existing technologies require disassembling and replacing different substrates to adapt the wafers when clamping wafers of different sizes, which is quite troublesome. Utility Model Content

[0005] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide an end effector to solve the problem.

[0006] To achieve the above objectives, this utility model provides the following technical solution: an end effector, comprising: substrate; The clamping assembly includes at least three support arms located on the outside of the base plate, a positioning block disposed at the end of the support arm, and a drive member for rotating the support arm; the drive member acts on the head end of the support arm. The execution unit includes a push block and a second driving component acting on the push block; A base for placing the execution unit; The wafer is placed on the positioning block; the second driving component drives the pushing block to move toward the substrate, so that the pushing block is in close contact with the edge of the wafer.

[0007] Preferably, the substrate is circular.

[0008] Preferably, the driving member is fixed to the back of the substrate, and each driving member acts on one of the support arms.

[0009] Preferably, the driving component is a servo motor.

[0010] Preferably, the positioning block is provided with a protrusion, the protrusion is inclined, and the cross-section of the protrusion has an arc edge.

[0011] Preferably, the back side of the substrate is mounted on the base via a connecting arm.

[0012] Preferably, the plurality of driving components are uniformly controlled by the controller, so that the rotation angles of the plurality of driving components are the same.

[0013] Beneficial effects This invention employs a symmetrical design with at least three support arms, combined with secondary reinforcement of the push block, to achieve multi-point uniform clamping of the wafer, effectively preventing wafer offset and slippage, ensuring clamping stability, and the drive component is synchronously controlled by a controller to adjust for wafer size. Attached Figure Description

[0014] Other features, objects, and advantages of this invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings: Figure 1 This is a front view structural diagram of an end effector according to the present invention; Figure 2 This is a schematic diagram of the rear view structure of the substrate of this utility model; Figure 3 This utility model Figure 2 A schematic diagram of the structure of the driving component after it has been activated; Figure 4 This is a schematic diagram of the protrusion of this utility model; Figure 5 This is a schematic diagram of the existing technology. Detailed Implementation

[0015] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0016] Please see Figures 1-4 This utility model provides a technical solution for an end effector, comprising: The substrate 1, with its circular design, provides a stable mounting and support base for the clamping assembly. The back of the substrate 1 is fixedly connected to the base 4 via the connecting arm 5.

[0017] The clamping assembly includes support arms 21, positioning blocks 22, and drive components 23. At least three support arms 21 (four in this embodiment) are evenly distributed on the outer side of the substrate 1 to ensure balanced force on the wafer. Positioning blocks 22 are mounted at the ends of the support arms 21 and are the components that directly contact the wafer. The positioning blocks 22 have inclined protrusions 221 with curved edges on their cross-sections. This design serves two purposes: first, to prevent sharp edges from scratching the wafer; and second, the inclined and curved contact surface ensures that the positioning blocks 22 can still adapt to the current wafer size even after relocation. Servo motors are used as drive components 23, with one servo motor corresponding to each support arm 21, and all servo motors are uniformly controlled by a controller. The controller can precisely control the rotation angle of each servo motor, ensuring synchronous movement of all support arms 21 and achieving centered wafer positioning. The drive components 23 are fixed to the back side of the substrate 1.

[0018] The existing execution unit 3 includes a push block 31 and a second drive unit (not shown in the figure): the second drive unit is a linear drive mechanism (such as an electric push rod) that acts on the push block 31 and can drive the push block 31 to move smoothly in the direction toward the substrate 1, so that the push block 31 is close to the edge of the wafer, further strengthening the clamping state of the wafer and preventing the wafer from being displaced in subsequent movements.

[0019] Furthermore, the end effector also includes a conventional detection mechanism (not shown in the figure). In one embodiment, the detection mechanism includes a sensor baffle, a photoelectric sensor, and a controller. The sensor baffle is connected to the clamping block and can move synchronously with the movement of the clamping block. The photoelectric sensor is disposed on one side of the sensor baffle, and the sensor baffle has alternating openings and blocking portions, so that the photoelectric sensor can be blocked or not blocked during movement. When the sensor baffle blocks the photoelectric sensor, the photoelectric sensor can send a trigger signal to the controller, indicating that the wafer clamping is successful.

[0020] Working principle: According to the pre-set parameters, the positions of the four positioning blocks 22 are adjusted to adapt to the current wafer size to be clamped, so that the wafer is placed between the four positioning blocks 22, and then the wafer is fixed again by the execution unit 3.

[0021] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the scope of the invention. No reference numerals in the claims should be construed as limiting the scope of the claims. Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. An end effector, characterized by: include: substrate; The clamping assembly includes at least three support arms positioned on the outside of the substrate, a positioning block disposed at the end of each support arm, and a drive unit for rotating the support arm; the drive unit acts on the head end of each support arm; the drive unit is fixed to the back of the substrate, and each drive unit acts on one support arm; the positioning block is provided with a protrusion, the protrusion is inclined, and the cross-section of the protrusion has an arc edge; several drive units are uniformly controlled by a controller, so that the rotation angle of several drive units is the same; The execution unit includes a push block and a second driving component acting on the push block; A base for placing the execution unit; The wafer is placed on the positioning block; the second driving component drives the pushing block to move toward the substrate, so that the pushing block is in close contact with the edge of the wafer.

2. The end effector according to claim 1, characterized in that: The substrate is circular.

3. The end effector according to claim 1, characterized in that: The driving component is a servo motor.

4. The end effector according to claim 1, characterized in that: The back side of the substrate is mounted on the base via a connecting arm.

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