Turnover device and photovoltaic module production line

Abstract

The application relates to a turnover device and a photovoltaic module production line. The turnover device comprises a support and a material carrying mechanism. The support is provided with a vacuum cavity and a vacuum breaking cavity. The material carrying mechanism is arranged on the support and comprises a material carrying arm for carrying a silicon wafer. The material carrying arm is provided with a vacuum suction hole. The material carrying arm can rotate relative to the support so that the material carrying arm has an adsorption position and a release position. In the adsorption position, the vacuum suction hole is communicated with the vacuum cavity, and the silicon wafer is adsorbed on the material carrying arm, thereby avoiding the problems of scratches and breakage caused by shaking of the silicon wafer. In the release position, the vacuum suction hole is communicated with the vacuum breaking cavity. Under the action of the positive pressure gas in the vacuum breaking cavity, the pressure around the vacuum suction hole gradually rises to achieve the purpose of breaking the original vacuum environment, so that the silicon wafer falls off the material carrying arm. In this way, the turnover device can be used to turn over the silicon wafer, and the problems of scratches and breakage caused by shaking of the silicon wafer can be avoided.

Description

Technical Field

[0001] This application relates to the field of photovoltaic processing equipment technology, and in particular to a flipping device and a photovoltaic module production line. Background Technology

[0002] In processes such as double-sided grinding, double-sided polishing, and double-sided coating of silicon wafers, both sides of the wafer need to be processed. Typically, a flipping device is used to flip the silicon wafer. However, during the flipping process using common flipping devices, the silicon wafer is prone to scratches and damage. Utility Model Content

[0003] Therefore, it is necessary to provide a flipping device and a photovoltaic module production line to avoid problems such as scratches and breakage of silicon wafers.

[0004] In a first aspect, this application provides a flipping device, comprising:

[0005] The support frame includes a vacuum chamber and a vacuum breaking chamber; and

[0006] A material carrier mechanism is connected to the support. The material carrier mechanism includes a material carrier arm for carrying silicon wafers. The material carrier arm is provided with a vacuum suction hole. The material carrier arm can rotate relative to the support so that the material carrier arm has an adsorption position and a release position. In the adsorption position, the vacuum suction hole is connected to the vacuum chamber. In the release position, the vacuum suction hole is connected to the vacuum breaking chamber.

[0007] In one embodiment, the vacuum chamber is located above a horizontal line passing through the connection center of the support and the material loading mechanism; and / or, the vacuum breaking chamber is located on a horizontal line passing through the connection center of the support and the material loading mechanism.

[0008] In one embodiment, both the vacuum chamber and the vacuum breaking chamber extend along the rotation direction of the material carrier arm, and the vacuum chamber and the vacuum breaking chamber are spaced apart in the rotation direction of the material carrier arm.

[0009] In one embodiment, the material carrier arm is further provided with an air chamber, which is connected to the vacuum suction hole; at the adsorption position, the air chamber is connected to the vacuum chamber; at the release position, the air chamber is connected to the vacuum breaking chamber.

[0010] In one embodiment, the material loading mechanism further includes a rotating body and a drive shaft. The rotating body is rotatably connected to the support via the drive shaft, and the material loading arm is disposed on the rotating body.

[0011] In one embodiment, the material carrier arm is provided with a connecting hole; the rotating body is provided with an airflow channel, which communicates with the connecting hole; the rotating body can rotate relative to the support, and the airflow channel can communicate with the vacuum chamber or the vacuum breaking chamber, so that the material carrier arm can switch between the adsorption position and the release position.

[0012] In one embodiment, the flipping device further includes an isolation element comprising an isolation sleeve having vent holes, the isolation sleeve covering at least one side of the material carrier arm having the vacuum suction hole.

[0013] In one embodiment, the isolation sleeve has an isolation cavity and an opening communicating with the isolation cavity, and the material carrier arm is disposed in the isolation cavity; the isolation member further includes a connecting section, the connecting section connecting the open ends of two adjacent isolation sleeves, and the connecting section being connected to the material carrier mechanism.

[0014] In one embodiment, the material carrier arm is provided in multiple locations, and the multiple material carrier arms are spaced apart along their rotation direction. The vacuum suction hole is provided on one side of one adjacent material carrier arm facing the adjacent other material carrier arm in front of it in the rotation direction. And / or, the material carrier arm is also provided with a vacuum extraction hole and a vacuum breaking hole. The vacuum extraction hole communicates with the vacuum chamber, and the vacuum breaking hole communicates with the vacuum breaking chamber. And / or, the flipping device further includes a driving mechanism. The driving mechanism is connected to the material carrier mechanism and is used to drive the material carrier mechanism to rotate.

[0015] Secondly, this application also provides a photovoltaic module production line, including a conveying device and a flipping device as described in any of the above claims. The flipping device is provided corresponding to the conveying device. The conveying device is used to convey silicon wafers, and the flipping device is used to flip the silicon wafers and release the flipped silicon wafers onto the conveying device.

[0016] In the aforementioned flipping device and photovoltaic module production line, during production, silicon wafers are conveyed onto a carrier arm. At this point, the carrier arm is in the adsorption position, with its vacuum suction port connected to the vacuum chamber. The silicon wafer is adsorbed onto the carrier arm, preventing scratches and breakage caused by wafer movement. Then, the carrier arm rotates relative to the support, causing the silicon wafer to flip. Once the carrier arm reaches a predetermined position, it switches from the adsorption position to the release position. In the release position, the vacuum suction port connects to the vacuum breaking chamber. Under the positive pressure of the gas in the vacuum breaking chamber, the pressure around the vacuum suction port gradually increases, disrupting the original vacuum environment, thus causing the silicon wafer to detach from the carrier arm. In this way, the flipping device can flip silicon wafers while preventing scratches and breakage caused by wafer movement. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of a flipping device according to an embodiment of this application.

[0018] Figure 2 for Figure 1 A top view of the flipping device shown.

[0019] Figure 3 for Figure 2 Sectional view along the middle AA.

[0020] Figure 4 for Figure 3 A magnified view of a portion of point A in the middle.

[0021] Figure 5 for Figure 2 A cross-sectional view along the middle BB.

[0022] Figure 6 for Figure 5 A magnified view of a portion of point B in the middle.

[0023] Figure 7 This is a schematic diagram of the structure of a bracket according to an embodiment of this application.

[0024] Figure 8 This is a schematic diagram of the structure of a material carrier arm according to an embodiment of this application.

[0025] Figure 9 This is a schematic diagram of the structure of an isolation component according to an embodiment of this application.

[0026] Explanation of icon numbers:

[0027] 10. Tilting device; 11. Support; 111. Vacuum chamber; 112. Vacuum breaking chamber; 113. Vacuum extraction hole; 114. Vacuum breaking hole; 115. Mounting hole; 12. Material loading mechanism; 121. Material loading arm; 1211. Vacuum suction hole; 1212. Air chamber; 1213. Connecting hole; 122. Rotating body; 1221. Airflow channel; 123. Drive shaft; 1231. Bearing; 124. Isolator; 1241. Isolation sleeve; 1242. Connecting section; 13. Drive mechanism; 14. Sealing ring; 20. Silicon wafer. Detailed Implementation

[0028] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0029] See Figure 1 An embodiment of this application provides a photovoltaic module production line, including a conveying device and a flipping device 10. The conveying device is used to convey silicon wafers 20. The flipping device 10 is provided corresponding to the conveying device, and is used to flip the silicon wafers 20 and release the flipped silicon wafers 20 onto the conveying device.

[0030] Furthermore, the flipping device 10 has a material picking area and a material discharging area on both sides along the conveying direction of the silicon wafer 20.

[0031] During production, the conveying device transports the silicon wafer 20 to the picking area. In the picking area, the silicon wafer 20 is transported to the flipping device 10, which flips the silicon wafer 20. After the silicon wafer 20 is flipped from the picking area to the unloading area, the flipping device 10 releases the silicon wafer 20 onto the conveying device, which then transports the flipped silicon wafer 20 to the next process.

[0032] In one embodiment, see Figure 1 The flipping device 10 includes a support 11 and a loading mechanism 12. The loading mechanism 12 is connected to the support 11.

[0033] See Figure 5 and Figure 6 The support 11 is provided with a vacuum chamber 111 and a vacuum breaking chamber 112. It should be noted that the vacuum chamber 111 and the vacuum breaking chamber 112 are not connected to each other. A negative pressure gas is formed in the vacuum chamber 111, and a positive pressure gas is introduced into the vacuum breaking chamber 112.

[0034] See Figure 1 The material carrier mechanism 12 includes a material carrier arm 121 for supporting the silicon wafer 20. The material carrier arm 121 is provided with a vacuum suction hole 1211. The material carrier arm 121 can rotate relative to the support 11 so that the material carrier arm 121 has an adsorption position and a release position. In the adsorption position, the vacuum suction hole 1211 is connected to the vacuum chamber 111; in the release position, the vacuum suction hole 1211 is connected to the vacuum breaking chamber 112.

[0035] During production, the conveying device transports the silicon wafer 20 to the picking area. In the picking area, the carrier arm 121 is in the adsorption position, and the vacuum suction port 1211 of the carrier arm 121 is connected to the vacuum chamber 111. The silicon wafer 20 is adsorbed on the carrier arm 121, preventing scratches and breakage caused by the silicon wafer 20 shaking. Then, the carrier arm 121 rotates relative to the support 11 to flip the silicon wafer 20. When the carrier arm 121 rotates from the picking area to the unloading area, the carrier arm 121 switches from the adsorption position to the release position. In the release position, the vacuum suction port 1211 is connected to the vacuum breaking chamber 112. Under the action of the positive pressure gas in the vacuum breaking chamber 112, the pressure around the vacuum suction port 1211 gradually increases to break the original vacuum environment. In this way, the silicon wafer 20 falls off the carrier arm 121 onto the conveying device, which then transports the silicon wafer 20 to the next process. Thus, the flipping device 10 can flip the silicon wafer 20, while also preventing the silicon wafer 20 from shaking and causing scratches and damage.

[0036] In one embodiment, see Figure 6 The vacuum chamber 111 extends along the rotation direction of the material carrier arm 121. Optionally, the vacuum chamber 111 is a fan-shaped cavity. This configuration allows for uniform stress distribution within the vacuum chamber 111, reducing stress concentration points and improving the overall strength of the vacuum chamber 111. Furthermore, the rotation path of the vacuum chamber 111 matches that of the material carrier arm 121, ensuring that the vacuum suction port 1211 is accurately aligned and connected to the vacuum chamber 111 during the rotation of the material carrier arm 121.

[0037] In one embodiment, see Figure 6 The vacuum chamber 111 is located above the horizontal line connecting the support 11 and the material carrier 12. In this way, the material carrier arm 121 can maintain its adsorption on the silicon wafer 20 as it rotates from the material pick-up area to the material unload area.

[0038] Specifically, see Figure 3 and Figure 6 The bracket 11 is provided with a mounting hole 115, and the drive shaft 123 of the material loading mechanism 12 is rotatably disposed in the mounting hole 115. The vacuum chamber 111 is arranged around the mounting hole 115. The connection center between the bracket 11 and the material loading mechanism 12 is the center of the mounting hole 115.

[0039] In one embodiment, see Figure 6 The vacuum breaking chamber 112 extends along the rotation direction of the material carrier arm 121. Optionally, the vacuum breaking chamber 112 is a fan-shaped chamber. With this configuration, the vacuum breaking chamber 112 can distribute stress evenly, reduce stress concentration points, and improve the overall strength of the vacuum breaking chamber 112.

[0040] In one embodiment, see Figure 6The vacuum breaking chamber 112 is located on the horizontal line connecting the support 11 and the material loading mechanism 12. After the material loading arm 121 rotates 180° from the material picking area to the material discharging area, the material loading arm 121 is basically parallel to the conveying direction of the conveying device, which makes it easier to place the silicon wafer 20 on the conveying device.

[0041] In one embodiment, the vacuum chamber 111 and the vacuum breaking chamber 112 are spaced apart along the rotation direction of the material carrier arm 121. Optionally, the central arc of the vacuum chamber 111 coincides with the central arc of the vacuum breaking chamber 112. This arrangement facilitates communication between the vacuum suction port 1211 and the vacuum chamber 111 and the vacuum breaking chamber 112 during the rotation of the material carrier arm 121.

[0042] In one embodiment, see Figure 1 and Figure 7 The support 11 is also provided with a vacuum port 113, which communicates with the vacuum chamber 111 and is also used to connect to a vacuum pump. During production, the vacuum pump is connected to the vacuum port 113 and started. The vacuum pump extracts the gas from the vacuum chamber 111, causing the pressure inside the vacuum chamber 111 to gradually decrease, thereby creating a negative pressure environment inside the vacuum chamber 111. Under this negative pressure environment, the carrier arm 121 can adsorb the silicon wafer 20.

[0043] Optionally, see Figure 1 The vacuum hole 113 is located on the side of the bracket 11 away from the material loading mechanism 12. This facilitates the connection between the vacuum pump and the vacuum hole 113, while avoiding interference between the vacuum pump and the material loading mechanism 12.

[0044] In one embodiment, see Figure 1 and Figure 7 The support 11 is also provided with a vacuum breaking hole 114, which is connected to the vacuum breaking chamber 112 and is used to connect with the gas filling device. During production, the gas filling device introduces positive pressure gas into the vacuum breaking chamber 112 through the vacuum breaking hole 114. Under the action of the positive pressure gas, the pressure around the vacuum suction hole 1211 gradually increases to break the original vacuum environment. As a result, the silicon wafer 20 loses its vacuum adsorption force. At the same time, the positive pressure gas is blown out through the vacuum suction hole 1211 to blow the silicon wafer 20, thereby causing the silicon wafer 20 to fall off the carrier arm 121.

[0045] Optionally, see Figure 1 The vacuum breaking hole 114 is located on the side of the bracket 11 away from the material loading mechanism 12. This facilitates the connection between the inflation device and the vacuum breaking hole 114, while avoiding interference between the inflation device and the material loading mechanism 12.

[0046] In one embodiment, see 2. Figure 3 and Figure 8The material carrier arm 121 is also provided with an air cavity 1212, which is connected to the vacuum suction hole 1211. It should be noted that the material carrier arm 121 has a hollow structure to form the air cavity 1212.

[0047] Furthermore, at the adsorption position, the gas chamber 1212 is connected to the vacuum chamber 111. At the release position, the gas chamber 1212 is connected to the vacuum breaking chamber 112. It can be understood that during the rotation of the material carrier arm 121, the gas chamber 1212 can be connected to both the vacuum chamber 111 and the vacuum breaking chamber 112, so that the material carrier arm 121 can switch between the adsorption position and the release position.

[0048] By incorporating an air cavity 1212 into the carrier arm 121, the vacuum suction port 1211 can cover a longer area of ​​the carrier arm 121, increasing the adsorption area and ensuring that the silicon wafer 20 is firmly adsorbed onto the carrier arm 121. The air cavity 1212 in the carrier arm 121 also reduces gas flow resistance and achieves a more uniform pressure distribution, facilitating a faster pressure response during vacuum adsorption. Furthermore, it reduces pressure fluctuations caused by poor gas flow, improving the stability and reliability of the adsorption process. In addition, the elimination of additional piping makes the entire device more compact.

[0049] In one embodiment, see Figure 2 and Figure 3 The material loading mechanism 12 also includes a rotating body 122 and a drive shaft 123. The rotating body 122 is rotatably connected to the support 11 via the drive shaft 123.

[0050] Specifically, see Figure 3 , Figure 4 and Figure 6 The drive shaft 123 is equipped with a bearing 1231, which is embedded in the mounting hole 115, thereby forming a rotational fit between the drive shaft 123 and the wall of the mounting hole 115. A sealing ring 14 is fitted on the outer circumferential surface of the bracket 11, and the end of the rotating body 122 is sleeved on the bracket 11 and sealed with the bracket 11 through the sealing ring 14.

[0051] Further, see Figure 3 and Figure 4 The material carrier arm 121 is mounted on the rotating body 122. Optionally, the outer circumferential surface of the rotating body 122 is provided with a mounting hole, which extends radially along the rotating body 122, and one end of the material carrier arm 121 is inserted into the mounting hole. During production, an external force acts on the drive shaft 123, causing the drive shaft 123 to rotate around itself, thereby driving the rotating body 122 and the material carrier arm 121 to rotate. By providing the rotating body 122, the rotating body 122 provides an installation position for the material carrier arm 121.

[0052] In one embodiment, see Figure 4 and Figure 8 The loading arm 121 is provided with a connecting hole 1213. Specifically, the loading arm 121 has a connecting hole 1213 on one end face located in the assembly hole.

[0053] See Figure 4 and Figure 6 The rotating body 122 is provided with an airflow channel 1221. The airflow channel 1221 extends along the axial direction of the rotating body 122 and communicates with the connecting hole 1213.

[0054] It should be noted that the vacuum suction port 1211 is always connected to the airflow channel 1221 through the air cavity 1212 and the connecting hole 1213.

[0055] Further, see Figure 5 and Figure 6 The rotating body 122 rotates relative to the support 11, and the airflow channel 1221 can communicate with the vacuum chamber 111 or the vacuum breaking chamber 112, so that the material carrier arm 121 can switch between the adsorption position and the release position. By setting the connecting hole 1213 and the airflow channel 1221, the vacuum suction hole 1211 can be connected with the vacuum chamber 111 and the vacuum breaking chamber 112.

[0056] In one embodiment, see Figure 1 and Figure 3 Multiple loading arms 121 are provided, and the multiple loading arms 121 are arranged at intervals along the circumference of the rotating body 122. Optionally, multiple mounting holes are provided, and the multiple mounting holes are arranged at intervals along the circumference of the rotating body 122; the multiple loading arms 121 are correspondingly arranged in the multiple mounting holes. With this configuration, the loading mechanism 12 can load multiple silicon wafers 20 at the same time, which is beneficial to improving the flipping efficiency.

[0057] Further, see Figure 6 Multiple airflow channels 1221 are provided, and the multiple airflow channels 1221 are arranged at intervals along the circumference of the rotating body 122. The multiple airflow channels 1221 are arranged one-to-one with the multiple material carrier arms 121.

[0058] In one embodiment, see Figure 3 At least two material carrier arms 121 are provided along the axial direction of the rotating body 122. This provides better support for the silicon wafer 20 and improves the stability of the silicon wafer 20 on the material carrier arms 121.

[0059] In one embodiment, a vacuum suction port 1211 is provided on one side of an adjacent material carrier arm 121 facing the adjacent other material carrier arm 121 located in front of the rotation direction of the material carrier mechanism 12. Thus, when the material carrier arm 121 rotates to the unloading area, the silicon wafer 20 faces the conveying device, facilitating the release of the silicon wafer 20 onto the conveying device.

[0060] In one embodiment, see Figure 1 The flipping device 10 also includes a separator 124. The separator 124 includes a separator sleeve 1241 with ventilation holes, and the separator sleeve 1241 at least covers one side of the carrier arm 121 with the vacuum suction hole 1211. Thus, when the silicon wafer 20 is adsorbed onto the carrier arm 121, the silicon wafer 20 is separated from the carrier arm 121 by the separator 124, preventing the silicon wafer 20 from being scratched by the carrier arm 121 and ensuring the quality of the silicon wafer 20. Since the separator sleeve 1241 is located on the side of the carrier arm 121 with the vacuum suction hole 1211, the separator sleeve 1241 can block dust and other particles in the air, preventing the vacuum suction hole 1211 from becoming clogged and ensuring the reliability of the silicon wafer 20's adsorption.

[0061] Optionally, the isolation sleeve 1241 can be made of porous foam, sponge, etc., as long as the isolation sleeve 1241 has soft and breathable properties.

[0062] In one embodiment, see Figure 9 The isolation sleeve 1241 has an isolation cavity and an opening communicating with the isolation cavity. The material carrier arm 121 is disposed in the isolation cavity, and the opening is located close to the rotating body 122. Optionally, the isolation sleeve 1241 is U-shaped. This improves the ease of installation and removal of the isolation sleeve 1241, and at the same time, it can stably fit the isolation sleeve 1241 onto the material carrier arm 121.

[0063] Further, see Figure 5 and Figure 9 The isolation element 124 also includes a connecting section 1242. The connecting section 1242 connects to the open ends of two adjacent isolation sleeves 1241, and is also connected to the material loading mechanism 12. Specifically, the connecting section 1242 is arc-shaped, and its inner circumferential surface fits against the outer circumferential surface of the rotating body 122. In this way, the connecting section 1242 can connect all the isolation sleeves 1241 into a whole, facilitating the installation of the isolation element 124.

[0064] In one embodiment, see Figure 1 and Figure 3 The flipping device 10 also includes a drive mechanism 13. The drive mechanism 13 is connected to the material-carrying mechanism 12 and is used to drive the material-carrying mechanism 12 to rotate. Specifically, the drive mechanism 13 is driven by a transmission shaft 123, which rotates around its own axis, thereby causing the rotating body 122 and the material-carrying arm 121 to rotate. Thus, under the drive of the drive mechanism 13, the material-carrying mechanism 12 can rotate, realizing the automatic flipping of the silicon wafer 20, which helps save manpower and reduce labor intensity.

[0065] Optionally, see Figure 1 and Figure 3The drive mechanism 13 includes a motor, which is located on the side of the bracket 11 away from the material loading mechanism 12, and the output shaft of the motor is connected to the transmission shaft 123.

[0066] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0067] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0068] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0069] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0070] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0071] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0072] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A flipping device (10), characterized in that, include: The support (11) is provided with a vacuum chamber (111) and a vacuum breaking chamber (112). as well as The material carrier (12) is connected to the support (11). The material carrier (12) includes a material carrier arm (121) for carrying silicon wafers (20). The material carrier arm (121) is provided with a vacuum suction hole (1211). The material carrier arm (121) can rotate relative to the support (11) so that the material carrier arm (121) has an adsorption position and a release position. In the adsorption position, the vacuum suction hole (1211) is connected to the vacuum chamber (111). In the release position, the vacuum suction hole (1211) is connected to the vacuum breaking chamber (112).

2. The flipping device (10) according to claim 1, characterized in that, The vacuum chamber (111) is located above the horizontal line passing through the connection center of the support (11) and the material loading mechanism (12); And / or, the vacuum breaking chamber (112) is located on a horizontal line passing through the connection center of the support (11) and the material loading mechanism (12).

3. The flipping device (10) according to claim 1, characterized in that, The vacuum chamber (111) and the vacuum breaking chamber (112) both extend along the rotation direction of the material carrier arm (121), and the vacuum chamber (111) and the vacuum breaking chamber (112) are spaced apart in the rotation direction of the material carrier arm (121).

4. The flipping device (10) according to claim 1, characterized in that, The loading arm (121) is also provided with an air chamber (1212), which is connected to the vacuum suction hole (1211); At the adsorption position, the gas chamber (1212) is connected to the vacuum chamber (111); at the release position, the gas chamber (1212) is connected to the vacuum breaking chamber (112).

5. The flipping device (10) according to claim 1, characterized in that, The material loading mechanism (12) further includes a rotating body (122) and a transmission shaft (123). The rotating body (122) is rotatably connected to the bracket (11) through the transmission shaft (123), and the material loading arm (121) is disposed on the rotating body (122).

6. The flipping device (10) according to claim 5, characterized in that, The material carrier arm (121) is provided with a connecting hole (1213); the rotating body (122) is provided with an airflow channel (1221), which is connected to the connecting hole (1213); the rotating body (122) can rotate relative to the support (11), and the airflow channel (1221) can be connected to the vacuum chamber (111) or the vacuum breaking chamber (112) so that the material carrier arm (121) can switch between the adsorption position and the release position.

7. The flipping device (10) according to any one of claims 1 to 6, characterized in that, The flipping device (10) further includes an isolation member (124), which includes an isolation sleeve (1241) having a vent hole and covering at least one side of the material carrier arm (121) having the vacuum suction hole (1211).

8. The flipping device (10) according to claim 7, characterized in that, The isolation sleeve (1241) has an isolation cavity and an opening communicating with the isolation cavity, and the material carrier arm (121) is disposed in the isolation cavity; The isolation element (124) further includes a connecting section (1242) which connects the open ends of two adjacent isolation sleeves (1241) and is connected to the material loading mechanism (12).

9. The flipping device (10) according to any one of claims 1 to 6, characterized in that, The material carrier arm (121) is provided in multiple ways, and the multiple material carrier arms (121) are spaced apart along their rotation direction. The vacuum suction hole (1211) is provided on one side of one of the adjacent material carrier arms (121) facing the other adjacent material carrier arm (121) in front of the rotation direction of the material carrier arm (121). And / or, the material carrier arm (121) is also provided with a vacuum hole (113) and a vacuum breaking hole (114), the vacuum hole (113) is connected to the vacuum chamber (111), and the vacuum breaking hole (114) is connected to the vacuum breaking chamber (112); And / or, the flipping device (10) further includes a drive mechanism (13) connected to the loading mechanism (12), the drive mechanism (13) being used to drive the loading mechanism (12) to rotate.

10. A photovoltaic module production line, characterized in that, The device includes a conveying device and a flipping device (10) as described in any one of claims 1 to 9, wherein the flipping device (10) is provided corresponding to the conveying device, the conveying device is used to convey a silicon wafer (20), and the flipping device (10) is used to flip the silicon wafer (20) and release the flipped silicon wafer (20) onto the conveying device.

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