Eight-inch wafer detection high-efficiency probe station device

Abstract

The utility model discloses eight inch wafer detection high -efficient probe platform device relates to semiconductor detection equipment technical field, including box, the inside controller of box is provided with, the inner top wall middle part fixed mounting of box has wafer optical detection equipment, the right side fixed mounting of box inner top wall has probe detection equipment, the inner bottom wall fixed mounting of box has first electric sliding rail, the first electric sliding rail is installed in the sliding slot and has first electric sliding block. The utility model discloses design reasonable structure, it can provide stable installation base for each part through the box, and first electric sliding rail and first electric sliding block cooperate and realize the accurate transfer of wafer chuck, and servo motor drives wafer chuck rotation, combines wafer optical detection equipment and probe detection equipment, reduces the position adjustment time -consuming of wafer in the detection process, does not need additional calibration station, and the detection continuity and efficiency are improved greatly, guarantee the comprehensiveness of detection angle and the accuracy of result simultaneously.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor testing equipment technology, specifically an eight-inch wafer testing high-efficiency probe station device. Background Technology

[0002] In the manufacturing process of 8-inch wafers, electrical performance testing of the chips on the wafer is required to ensure that the chips meet design requirements. The probe station, as a key device connecting the testing instruments and the wafer chips, enables precise contact between the probes and the chip pads, thereby completing the transmission and testing of various electrical signals. It is an indispensable part of the 8-inch wafer inspection process.

[0003] Existing 8-inch wafer inspection probe station devices offer a certain level of positioning accuracy, meeting routine wafer testing needs to some extent. Their automated loading and unloading systems also contribute to improved testing efficiency and ensure environmental stability within a certain temperature range. However, during the wafer transport process by the robotic arm, the wafer needs to be picked up and placed at the wafer calibration station for position calibration, and then picked up again and sent to the wafer inspection station for testing. This repeated wafer handling is time-consuming and labor-intensive, hindering overall testing efficiency. To address these issues, we provide an 8-inch wafer inspection high-efficiency probe station device. Utility Model Content

[0004] 1) Technical problems to be solved

[0005] This invention proposes an efficient probe station device for 8-inch wafer inspection. Through the cooperation of components such as the first electric slide rail, servo motor, and wafer chuck, it solves the problem that during the wafer transport process of the loading and unloading robotic arm, it is necessary to pick up the wafer and place it at the wafer calibration station for position calibration, and then pick up the wafer and send it to the wafer inspection station for inspection. This process involves multiple pick-up and drop-off of wafers, which is time-consuming and labor-intensive and restricts the overall inspection efficiency.

[0006] (ii) Technical Solution

[0007] To achieve the above objectives, the present invention provides the following technical solution: an 8-inch wafer inspection high-efficiency probe station device, comprising a housing, a controller being provided inside the housing, a wafer optical inspection device being fixedly installed in the middle of the inner top wall of the housing, a probe inspection device being fixedly installed on the right side of the inner top wall of the housing, and a first electric slide rail being fixedly installed on the inner bottom wall of the housing, with a first electric slider installed in the slide groove of the first electric slide rail;

[0008] A storage frame is fixedly connected to the upper surface of the first electric slider. A storage cavity is opened on the upper surface of the storage frame. A servo motor is fixedly installed on the inner bottom wall of the storage cavity. A sealing plate is fixedly connected to the upper surface of the storage frame. A through hole is opened on the upper surface of the sealing plate. The top end of the servo motor rotating shaft passes through the through hole opened in the sealing plate and is fixedly connected to a wafer chuck.

[0009] Furthermore, the drive motor of the first electric slide rail is electrically connected to the controller, the servo motor is electrically connected to the controller, and the drive motor of the second electric slide rail is electrically connected to the controller.

[0010] Furthermore, the wafer chuck is used to carry the wafer and can rotate under the drive of the servo motor. The probe inspection device is equipped with a lifting component that can drive the probe of the probe inspection device to move up and down.

[0011] Furthermore, the controller can send control signals to the drive motor and servo motor of the first electric slide rail to control the movement state of the first electric slider and the wafer chuck, respectively.

[0012] Furthermore, a positioning plate is fixedly installed on the left side of the bottom wall of the box, a wafer box is fixedly positioned above the positioning plate, and a second electric slide rail is fixedly installed on the left side of the top wall of the box.

[0013] Furthermore, a second electric slider is installed in the groove of the second electric slide rail, and an electric telescopic rod is fixedly installed on the lower surface of the second electric slider. A material picker is fixedly installed at the output end of the electric telescopic rod. The controller can send control signals to the drive motor of the second electric slide rail to control the movement state of the second electric slider.

[0014] Furthermore, the pick-up rack can remove the wafers inside the wafer cassette by moving the second electric slider left and right and raising and lowering the electric telescopic rod up and down, and place them in the slot of the wafer chuck.

[0015] (iii) Beneficial effects:

[0016] Compared with existing technologies, this high-efficiency probe station device for 8-inch wafer inspection has the following advantages:

[0017] I. This 8-inch wafer inspection high-efficiency probe station device provides a stable mounting base for each component through the housing. The first electric slide rail and the first electric slider work together to achieve precise transfer of the wafer chuck. The servo motor drives the wafer chuck to rotate. Combined with wafer optical inspection equipment and probe inspection equipment, it reduces the time spent on wafer position adjustment during the inspection process, eliminates the need for additional calibration stations, and greatly improves the continuity and efficiency of inspection, while ensuring the comprehensiveness of the inspection angle and the accuracy of the results.

[0018] II. This 8-inch wafer inspection high-efficiency probe station device uses a positioning plate to accurately position the wafer cassette. The second electric slide rail, the second electric slider, the electric telescopic rod, and the pick-up rack work together to realize the automated pick-up and transfer of wafers from the wafer cassette to the wafer chuck. This replaces the traditional multiple pick-up and drop operations, reduces the cost of manual intervention, further improves the overall automation level and process continuity of inspection, and reduces the risk of wafer damage caused by multiple pick-up and drop operations. Attached Figure Description

[0019] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.

[0020] Figure 1 This is a front view structural diagram of the present utility model;

[0021] Figure 2 This is a three-dimensional front view of a portion of the structure of this utility model.

[0022] Figure 3 This utility model Figure 1 Enlarged structural diagram at point A in the middle;

[0023] Figure 4 This utility model Figure 1 Enlarged structural diagram at point B;

[0024] Figure 5 This utility model Figure 2 Enlarged structural diagram at point C.

[0025] In the diagram: 1. Housing; 2. Wafer optical inspection equipment; 3. Probe inspection equipment; 4. First electric slide rail; 5. First electric slider; 6. Storage frame; 7. Storage cavity; 8. Servo motor; 9. Sealing plate; 10. Wafer chuck; 11. Positioning plate; 12. Wafer box; 13. Second electric slide rail; 14. Second electric slider; 15. Electric telescopic rod; 16. Pick-up rack. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] The first electric slide rail 4, servo motor 8, second electric slide rail 13, and electric telescopic rod 15 in this utility model are all common electrical devices in the prior art, and this application will not elaborate on their models or internal structures.

[0028] like Figure 1-5 As shown, this utility model provides a technical solution: an 8-inch wafer inspection high-efficiency probe station device, including a housing 1, a controller installed inside the housing 1, a wafer optical inspection device 2 fixedly installed in the middle of the inner top wall of the housing 1, a probe inspection device 3 fixedly installed on the right side of the inner top wall of the housing 1, a first electric slide rail 4 fixedly installed on the inner bottom wall of the housing 1, a first electric slider 5 installed in the slide groove of the first electric slide rail 4, a storage frame 6 fixedly connected to the upper surface of the first electric slider 5, a storage cavity 7 opened on the upper surface of the storage frame 6, a servo motor 8 fixedly installed on the inner bottom wall of the storage cavity 7, a sealing plate 9 fixedly connected to the upper surface of the storage frame 6, and a sealing plate 9 opened on the upper surface of the sealing plate 9. The servo motor 8's rotating shaft passes through the through hole in the sealing disc 9 and is fixedly connected to the wafer chuck 10. The drive motor of the first electric slide rail 4 is electrically connected to the controller, the servo motor 8 is electrically connected to the controller, and the drive motor of the second electric slide rail 13 is electrically connected to the controller. The wafer chuck 10 is used to carry the wafer and can rotate under the drive of the servo motor 8. The probe detection device 3 is equipped with a lifting component that can drive the probe of the probe detection device 3 to move up and down. The controller can send control signals to the drive motor of the first electric slide rail 4 and the servo motor 8 to control the movement state of the first electric slider 5 and the wafer chuck 10 respectively.

[0029] The wafer optical inspection equipment 2 and probe inspection equipment 3 are both mature devices in the existing technology, and their models or internal structures will not be described in detail here.

[0030] The controller controls the drive motor of the first electric slide rail 4, causing the first electric slider 5 to move the storage frame 6 and the wafer chuck 10. When it moves to below the wafer optical inspection equipment 2, the wafer optical inspection equipment 2 performs preliminary optical inspection on the wafer. If multi-angle inspection is required, the controller can send a signal to the servo motor 8 to control the wafer chuck 10 to rotate and adjust the wafer angle to complete the comprehensive inspection. After the preliminary inspection is completed, the first electric slider 5 continues to move the wafer chuck 10 to below the probe inspection equipment 3. The lifting component inside the probe inspection equipment 3 drives the probe to descend and contact the chip pads on the wafer for electrical performance testing. During the test, the inspection position can be adjusted by rotating the wafer chuck 10 to ensure the comprehensiveness of the inspection, reduce the time spent on wafer position adjustment during the inspection process, eliminate the need for additional calibration stations, greatly improve the continuity and efficiency of the inspection, and at the same time ensure the comprehensiveness of the inspection angle and the accuracy of the results.

[0031] A positioning plate 11 is fixedly installed on the left side of the bottom wall inside the housing 1. A wafer box 12 is fixedly positioned above the positioning plate 11. A second electric slide rail 13 is fixedly installed on the left side of the top wall inside the housing 1. A second electric slider 14 is installed in the slide groove of the second electric slide rail 13. An electric telescopic rod 15 is fixedly installed on the lower surface of the second electric slider 14. A pick-up rack 16 is fixedly installed at the output end of the electric telescopic rod 15. The controller can send a control signal to the drive motor of the second electric slide rail 13 to control the movement state of the second electric slider 14. The pick-up rack 16 can remove the wafers inside the wafer box 12 by moving the second electric slider 14 left and right and lifting the electric telescopic rod 15 up and down, and place them in the slot of the wafer chuck 10.

[0032] The positioning card 11 and wafer box 12 are both mature devices in the existing technology, and their models or internal structures will not be described in detail here.

[0033] The controller sends a signal to the drive motor of the second electric slide rail 13, controlling the second electric slider 14 to move the pick-up rack 16 to the side and above the wafer cassette 12. Then, the electric telescopic rod 15 is extended and retracted to raise and lower the pick-up rack 16 to the designated position. Next, the second electric slider 14 is controlled to slide, moving the pick-up rack 16 below the wafer. Then, the electric telescopic rod 15 is controlled to retract, and the pick-up rack 16 raises with the wafer. Then, the second electric slider 14 moves, transferring the wafer to above the wafer chuck 10. The electric telescopic rod 15 extends, the pick-up rack 16 descends, and places the wafer in the slot of the wafer chuck 10, completing the wafer loading. This replaces the traditional multiple pick-up and drop operations, reduces manual intervention costs, further improves the automation level and process continuity of the overall inspection, and reduces the risk of wafer damage caused by multiple pick-up and drop operations.

[0034] Working principle: In use, the first step is wafer loading and unloading. The controller sends a signal to the drive motor of the second electric slide rail 13, controlling the second electric slider 14 to move the pick-up rack 16 to the side and above the wafer cassette 12. Then, the electric telescopic rod 15 is extended and retracted to raise and lower the pick-up rack 16 to the designated position. Next, the second electric slider 14 is controlled to slide, moving the pick-up rack 16 below the wafer. Then, the electric telescopic rod 15 is controlled to retract, and the pick-up rack 16 raises with the wafer. Then, the second electric slider 14 moves, transferring the wafer to above the wafer chuck 10. The electric telescopic rod 15 extends, the pick-up rack 16 descends, and places the wafer in the slot of the wafer chuck 10, completing the wafer loading. After the wafer is placed, the transfer and inspection stage begins. The controller controls the drive motor of the first electric slide rail 4, causing the first electric slider 5 to move... The storage frame 6 and wafer chuck 10 move. When they move to below the wafer optical inspection equipment 2, the wafer optical inspection equipment 2 performs preliminary optical inspection on the wafer. If multi-angle inspection is required, the controller can send a signal to the servo motor 8 to control the wafer chuck 10 to rotate and adjust the wafer angle to complete the comprehensive inspection. After the preliminary inspection is completed, the first electric slider 5 continues to move the wafer chuck 10 to below the probe inspection equipment 3. The lifting component inside the probe inspection equipment 3 drives the probe to descend and contact the chip pads on the wafer to perform electrical performance testing. During the test, the inspection position can be adjusted by rotating the wafer chuck 10 to ensure the comprehensiveness of the inspection. After the inspection is completed, the first electric slider 5 moves the wafer chuck 10 to the initial position, and then the pick-up rack 16 takes out the wafer and puts it back into the wafer box 12, completing the entire inspection process.

[0035] In the description of this utility model, it should be understood that the terms "left", "right", "up", "down", "top", "bottom", "front", "back", "inner", "outer", "back", "middle", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0036] However, the above description is only a specific embodiment of this utility model and should not be construed as limiting the scope of implementation of this utility model. Therefore, any substitution of equivalent components or equivalent changes and modifications made in accordance with the scope of protection of this utility model should still fall within the scope of the claims of this utility model.

Claims

1. An 8-inch wafer inspection high-efficiency probe station device, comprising a housing (1), characterized in that: The box (1) is equipped with a controller. A wafer optical inspection device (2) is fixedly installed in the middle of the inner top wall of the box (1). A probe inspection device (3) is fixedly installed on the right side of the inner top wall of the box (1). A first electric slide rail (4) is fixedly installed on the inner bottom wall of the box (1). A first electric slider (5) is installed in the slide groove of the first electric slide rail (4). A storage frame (6) is fixedly connected to the upper surface of the first electric slider (5). A storage cavity (7) is opened on the upper surface of the storage frame (6). A servo motor (8) is fixedly installed on the inner bottom wall of the storage cavity (7). A sealing disk (9) is fixedly connected to the upper surface of the storage frame (6). A through hole is opened on the upper surface of the sealing disk (9). The top end of the rotating shaft of the servo motor (8) passes through the through hole opened in the sealing disk (9) and is fixedly connected to a wafer chuck (10).

2. The high-efficiency probe station device for eight-inch wafer inspection according to claim 1, characterized in that: The drive motor of the first electric slide rail (4) is electrically connected to the controller, and the servo motor (8) is electrically connected to the controller.

3. The high-efficiency probe station device for eight-inch wafer inspection according to claim 2, characterized in that: The wafer chuck (10) is used to carry the wafer and can rotate under the drive of the servo motor (8). The probe detection device (3) is equipped with a lifting component inside, which can drive the probe of the probe detection device (3) to move up and down.

4. The high-efficiency probe station device for eight-inch wafer inspection according to claim 3, characterized in that: The controller can send control signals to the drive motor and servo motor (8) of the first electric slide rail (4) to control the movement state of the first electric slider (5) and the wafer chuck (10) respectively.

5. The high-efficiency probe station device for eight-inch wafer inspection according to claim 4, characterized in that: A positioning plate (11) is fixedly installed on the left side of the bottom wall of the box (1), and a wafer box (12) is fixedly positioned above the positioning plate (11). A second electric slide rail (13) is fixedly installed on the left side of the top wall of the box (1), and the drive motor of the second electric slide rail (13) is electrically connected to the controller.

6. The high-efficiency probe station device for eight-inch wafer inspection according to claim 5, characterized in that: The second electric slide rail (13) has a second electric slider (14) installed in its groove. An electric telescopic rod (15) is fixedly installed on the lower surface of the second electric slider (14). A material picker (16) is fixedly installed at the output end of the electric telescopic rod (15). The controller can send a control signal to the drive motor of the second electric slide rail (13) to control the movement state of the second electric slider (14).

7. The high-efficiency probe station device for eight-inch wafer inspection according to claim 6, characterized in that: The pick-up rack (16) can remove the wafers inside the wafer box (12) by moving the second electric slider (14) left and right and raising and lowering the electric telescopic rod (15) up and down, and place them in the slot of the wafer chuck (10).

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