A COF heat dissipation patch structure
Patent Information
- Application Number
- CN202521485976.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-16
- Publication Date
- 2026-08-18
- Estimated Expiration
- 2035-07-16
AI Technical Summary
[0004]为了提高市场竞争力，业内显示屏越发先进，其功率也越来越大，常规散热贴对散热效果的提升已不能满足市场需求；且为了匹配显示屏结构，散热贴大小及厚度都被受限在一定范围内，无法通过简单的加大、加厚散热贴达成效果
[0022]本公开实施例的COF散热贴结构，通过在散热层上设置多个直接与COF产品接触的第一散热凸起，在有限的散热贴范围内增加有效散热层的表面积，实现COF产品-散热层的热传导路径，避免导热性不佳的第一胶层影响热传导的效率，提升散热效果；该散热贴结构在不改变散热贴整体范围及厚度的基础上提升散热贴的散热效率，增强封装后COF产品的散热效果。
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Figure CN224653991U_ABST
Abstract
Description
Technical Field
[0001] This disclosure pertains to the field of semiconductor integrated circuit packaging technology, specifically relating to a COF thermal pad structure. Background Technology
[0002] COF (Chip on Film) products are a special chip structure with long, thin silicon crystals and a thin, flexible substrate, often used as driver chips for displays. Because displays operate at high power, a thin thermal pad is added during packaging to improve the heat dissipation of COF products.
[0003] Currently, the commonly used thermal pad structures in the industry are as follows: Figure 1 As shown, the structure can be divided into four layers according to the material of each layer. From the outside to the inside, they are: outer protective layer 1, which is used to protect the heat dissipation patch structure and prevent the internal structure from being scratched; first adhesive layer 2, which is used to bond the various layers of the heat dissipation patch structure; heat dissipation layer 3, which is the structure in the heat dissipation patch that actually performs the heat dissipation effect; and second adhesive layer 4, which is used to attach the heat dissipation patch to the surface of the COF product.
[0004] To enhance market competitiveness, displays in the industry are becoming increasingly advanced, with ever-increasing power. Conventional heat dissipation pads can no longer meet market demands for improved heat dissipation. Furthermore, to match the structure of the display, the size and thickness of heat dissipation pads are limited to a certain range, making it impossible to achieve the desired effect simply by increasing their size or thickness.
[0005] To address the aforementioned issues, it is necessary to propose a reasonably designed COF heat dissipation patch structure that can effectively improve these problems. Utility Model Content
[0006] The present disclosure aims to at least solve one of the technical problems existing in the prior art and provide a COF heat dissipation patch structure.
[0007] This disclosure provides a COF thermal pad structure, including:
[0008] The first adhesive layer is used to fix the heat dissipation patch structure to the COF product;
[0009] A heat dissipation layer is disposed on the side of the first adhesive layer opposite to the COF product;
[0010] The second adhesive layer is disposed on the side of the heat dissipation layer opposite to the first adhesive layer;
[0011] A protective layer is disposed on the side of the second adhesive layer opposite to the heat dissipation layer; wherein,
[0012] The heat dissipation layer is provided with a plurality of first heat dissipation protrusions, which protrude toward and pass through the first adhesive layer for contact with the COF product.
[0013] Optionally, the height of the first heat dissipation protrusion is the same as the thickness of the first adhesive layer.
[0014] Optionally, the height of the first heat dissipation protrusion is greater than the thickness of the first adhesive layer.
[0015] Optionally, a plurality of the first heat dissipation protrusions are integrally formed with the heat dissipation layer.
[0016] Optionally, the first heat dissipation protrusion may be dot-shaped, strip-shaped, or block-shaped.
[0017] Optionally, the heat dissipation layer is further provided with a plurality of second heat dissipation protrusions, which protrude toward the second adhesive layer.
[0018] Optionally, the height of the second heat dissipation protrusion is less than the thickness of the second adhesive layer.
[0019] Optionally, a plurality of the second heat dissipation protrusions are integrally formed with the heat dissipation layer.
[0020] Optionally, the second heat dissipation protrusion may be in the form of dots, strips, or blocks.
[0021] Optionally, the orthographic projection of the protective layer onto the second adhesive layer falls on the outer side of the second adhesive layer.
[0022] The COF heat dissipation patch structure of this disclosure increases the surface area of the effective heat dissipation layer within a limited area by setting multiple first heat dissipation protrusions on the heat dissipation layer that directly contact the COF product. This realizes the heat conduction path between the COF product and the heat dissipation layer, avoids the first adhesive layer with poor thermal conductivity from affecting the efficiency of heat conduction, and improves the heat dissipation effect. This heat dissipation patch structure improves the heat dissipation efficiency of the heat dissipation patch without changing the overall range and thickness of the heat dissipation patch, and enhances the heat dissipation effect of the COF product after encapsulation. Attached Figure Description
[0023] Figure 1 This is a cross-sectional view of a COF thermal pad structure in the prior art;
[0024] Figure 2 This is a three-dimensional schematic diagram of a COF heat dissipation patch structure according to an embodiment of the present disclosure;
[0025] Figure 3 This is a cross-sectional view of a COF heat dissipation patch structure according to Embodiment 1 of this disclosure;
[0026] Figure 4 This is a cross-sectional view of a COF heat dissipation patch structure according to Embodiment 2 of this disclosure;
[0027] Figure 5This is a cross-sectional view of a COF heat dissipation patch structure according to Embodiment 3 of this disclosure;
[0028] Figure 6 This is a cross-sectional view of a COF heat dissipation patch structure according to Embodiment 4 of this disclosure;
[0029] Figure 7 This is a perspective view of a COF heat dissipation patch structure according to Embodiment 5 of this disclosure. Detailed Implementation
[0030] To enable those skilled in the art to better understand the technical solutions of the embodiments of this disclosure, the embodiments of this disclosure will be further described in detail below with reference to the accompanying drawings and specific implementation methods.
[0031] like Figures 2 to 7 As shown, this embodiment of the present disclosure provides a COF heat dissipation patch structure 100, including a first adhesive layer 110, a heat dissipation layer 120, a second adhesive layer 130, and a protective layer 140.
[0032] The first adhesive layer 110 is used to fix the heat dissipation patch structure to the COF product. The material of the first adhesive layer 110 can be glue or double-sided tape, and both sides are adhesive.
[0033] The heat dissipation layer 120 is disposed on the side of the first adhesive layer 110 facing away from the COF product. Specifically, as shown... Figures 3 to 6 As shown, the heat dissipation layer 120 is adhered and fixed to the top wall of the first adhesive layer 110.
[0034] The heat dissipation layer 120 is typically a thin sheet that comes into contact with the COF product. It is made of materials with good thermal conductivity, such as aluminum, copper, or graphene, to help improve the heat dissipation performance of the COF product.
[0035] The second adhesive layer 130 is disposed on the side of the heat dissipation layer 120 opposite to the first adhesive layer 110. Specifically, as shown in the figure... Figures 3 to 6 As shown, the second adhesive layer 130 is adhered and fixed to the top wall of the heat dissipation layer 120. The second adhesive layer 130 can be made of glue or double-sided tape, and is adhesive on both sides, used to fix the various structures of the heat dissipation patch.
[0036] The protective layer 140 is disposed on the side of the second adhesive layer 130 opposite to the heat dissipation layer 120. Specifically, as shown... Figures 3 to 6 As shown, the protective layer 140 is adhered and fixed to the top wall of the second adhesive layer 130. The material of the protective layer 140 can be a soft PI (polyimide) sheet, used to protect the heat dissipation pad and prevent the heat dissipation layer 120 from being scratched during installation or use.
[0037] The heat dissipation layer 120 is provided with a plurality of first heat dissipation protrusions 121, which protrude toward and pass through the first adhesive layer 110 for contact with the COF product. Specifically, as shown in... Figures 3 to 5 As shown, a plurality of first heat dissipation protrusions 121 are provided on the bottom wall of the heat dissipation layer 120.
[0038] The COF heat dissipation patch structure of this disclosure increases the surface area of the effective heat dissipation layer within a limited area by setting multiple first heat dissipation protrusions on the heat dissipation layer that directly contact the COF product. This realizes the heat conduction path between the COF product and the heat dissipation layer, avoids the first adhesive layer with poor thermal conductivity from affecting the efficiency of heat conduction, and improves the heat dissipation effect. This heat dissipation patch structure improves the heat dissipation efficiency of the heat dissipation patch without changing the overall range and thickness of the heat dissipation patch, and enhances the heat dissipation effect of the COF product after encapsulation.
[0039] Exemplary, in one embodiment, such as Figure 3 , Figure 5 and Figure 6 As shown, the height of the first heat dissipation protrusion 121 is the same as the thickness of the first adhesive layer 110. That is, the bottom wall of the first heat dissipation protrusion 121 is flush with the bottom wall of the first adhesive layer 110.
[0040] Exemplary, in another embodiment, such as Figure 4 As shown, the height of the first heat dissipation protrusion 121 is greater than the thickness of the first adhesive layer 110. That is, the first heat dissipation protrusion 121 protrudes beyond the first adhesive layer 110.
[0041] For example, in this embodiment, a plurality of first heat dissipation protrusions 121 are integrally formed with the heat dissipation layer 120. Specifically, the plurality of first heat dissipation protrusions 121 can be formed by stamping on the surface of the heat dissipation layer 120 or by adjusting the casting mold of the heat dissipation layer 120.
[0042] For example, such as Figure 2 and Figure 7 As shown, the first heat dissipation protrusion 121 can be in the form of dots, strips, or blocks. It should be noted that the shape of the first heat dissipation protrusion 121 is not specifically limited in this embodiment and can be selected according to actual needs. Furthermore, the distribution of multiple first heat dissipation protrusions 121 is not specifically limited in this embodiment and can be selected according to actual needs.
[0043] For example, such as Figures 2 to 5 As shown, the heat dissipation layer 120 is also provided with a plurality of second heat dissipation protrusions 122, which protrude toward the second adhesive layer 130. Specifically, a plurality of second heat dissipation protrusions 122 are provided on the bottom wall of the heat dissipation layer 120.
[0044] In this embodiment, by providing multiple second heat dissipation protrusions on the heat dissipation layer, the usable space of the heat dissipation patch structure can be utilized to the maximum extent, further increasing the surface area of the heat dissipation layer and further improving the heat dissipation effect.
[0045] For example, such as Figures 3 to 5 As shown, the height of the second heat dissipation protrusion 122 is less than the thickness of the second adhesive layer 130. That is, the second heat dissipation protrusion 122 protrudes into the second adhesive layer 130 but does not penetrate the second adhesive layer 130.
[0046] For example, a plurality of second heat dissipation protrusions 122 are integrally formed with the heat dissipation layer 120. Specifically, the plurality of second heat dissipation protrusions 122 can be formed by stamping on the surface of the heat dissipation layer 120 or by adjusting the casting mold of the heat dissipation layer 120.
[0047] For example, the second heat dissipation protrusion 122 may be dot-shaped, strip-shaped, or block-shaped. It should be noted that the shape of the second heat dissipation protrusion 122 is not specifically limited in this embodiment and can be selected according to actual needs. Furthermore, the distribution of multiple second heat dissipation protrusions 122 is not specifically limited in this embodiment and can be selected according to actual needs.
[0048] For example, such as Figures 3 to 6 As shown, the orthographic projection of the protective layer 140 onto the second adhesive layer 130 falls on the outer side of the second adhesive layer 130. That is, the area of the protective layer 140 is larger than the area of the second adhesive layer 130, providing better protection for the various structures of the heat dissipation patch, and also avoiding the risk of adhesive overflow caused by excessive application of the first adhesive layer 110 and the second adhesive layer 130. The area of the protective layer 140 is larger than the areas of the heat dissipation layer 120, the second adhesive layer 130, and the first adhesive layer 110. In other words, the protective layer 140 covers the heat dissipation layer 120, the second adhesive layer 130, and the first adhesive layer 110, thus protecting the structure of the heat dissipation patch.
[0049] like Figures 3 to 7 As shown in the embodiments of this disclosure, the structural features of the COF heat dissipation patch structure 100 of this disclosure are specifically illustrated through several embodiments.
[0050] Example 1
[0051] like Figure 3The figure shows a cross-sectional view of the COF thermal pad structure 100 of this embodiment. The COF thermal pad structure 100 is provided with a first adhesive layer 110, a heat dissipation layer 120, a second adhesive layer 130, and a protective layer 140 sequentially from bottom to top. The heat dissipation layer 120 has multiple first heat dissipation protrusions 121 and multiple second heat dissipation protrusions 122 on its upper and lower surfaces, respectively. The first heat dissipation protrusions 121 protrude towards and pass through the first adhesive layer 110, while the second heat dissipation protrusions 122 protrude towards the second adhesive layer 130. The height of the first heat dissipation protrusions 121 is the same as the thickness of the first adhesive layer 110, and the height of the second heat dissipation protrusions 122 is less than the thickness of the second adhesive layer 130. The multiple first heat dissipation protrusions 121 and multiple second heat dissipation protrusions 122 are formed by stamping the surface of the heat dissipation layer, with an indentation formed during stamping behind each heat dissipation protrusion. The first heat dissipation protrusions 121 and the second heat dissipation protrusions 122 are both arranged in a dot-like pattern.
[0052] Example 2
[0053] like Figure 4 The figure shows a cross-sectional view of the COF thermal pad structure 100 of this embodiment. The COF thermal pad structure 100 is provided with a first adhesive layer 110, a heat dissipation layer 120, a second adhesive layer 130, and a protective layer 140 sequentially from bottom to top. The heat dissipation layer 120 has multiple first heat dissipation protrusions 121 and multiple second heat dissipation protrusions 122 on its upper and lower surfaces, respectively. The first heat dissipation protrusions 121 protrude towards and pass through the first adhesive layer 110, while the second heat dissipation protrusions 122 protrude towards the second adhesive layer 130. The height of the second heat dissipation protrusions 122 is less than the thickness of the second adhesive layer 130. Due to process deviations, in actual production, the thickness of the first adhesive layer 110 will inevitably be lower than the height of the first heat dissipation protrusions 121. As shown in the figure, because the process of applying the thermal pad includes a rolling step, the first heat dissipation protrusions 121 are pressed inward during rolling, and the first adhesive layer 110 contacts and adheres to the COF product. After encapsulation, the thermal pad structure in this embodiment can be considered as... Figure 3 The structure shown is formed by stamping the surface of the heat dissipation layer, creating multiple first heat dissipation protrusions 121 and multiple second heat dissipation protrusions 122. Each heat dissipation protrusion has a recessed indentation formed during the stamping process behind it. Both the first and second heat dissipation protrusions 121 and 122 are arranged in a dotted pattern.
[0054] Example 3
[0055] like Figure 5The figure shows a cross-sectional view of the COF thermal pad structure 100 of this embodiment. The COF thermal pad structure 100 is provided with a first adhesive layer 110, a heat dissipation layer 120, a second adhesive layer 130, and a protective layer 140 sequentially from bottom to top. The heat dissipation layer 120 has multiple first heat dissipation protrusions 121 and multiple second heat dissipation protrusions 122 on its upper and lower surfaces, respectively. The first heat dissipation protrusions 121 protrude towards and pass through the first adhesive layer 110, while the second heat dissipation protrusions 122 protrude towards the second adhesive layer 130. The height of the first heat dissipation protrusions 121 is the same as the thickness of the first adhesive layer 110, and the height of the second heat dissipation protrusions 122 is less than the thickness of the second adhesive layer 130. By adjusting the casting mold of the heat dissipation layer to form multiple first heat dissipation protrusions 121 and multiple second heat dissipation protrusions 122 on the heat dissipation layer 120, there are no indentations or marks on the inner side of each heat dissipation protrusion. The first heat dissipation protrusions 121 and the second heat dissipation protrusions 122 are both arranged in a dot-like pattern.
[0056] Example 4
[0057] like Figure 6 The image shown is a cross-sectional view of the COF thermal pad structure 100 of this embodiment. The COF thermal pad structure 100, from bottom to top, comprises a first adhesive layer 110, a heat dissipation layer 120, a second adhesive layer 130, and a protective layer 140. The lower surface of the heat dissipation layer 120 has multiple first heat dissipation protrusions 121. The first heat dissipation protrusions 121 protrude towards and pass through the first adhesive layer 110. The height of the first heat dissipation protrusions 121 is the same as the thickness of the first adhesive layer 110. The multiple first heat dissipation protrusions 121 are formed by stamping the surface of the heat dissipation layer, with an indentation formed during stamping behind each protrusion. The first heat dissipation protrusions 121 are arranged in a dotted pattern.
[0058] Example 5
[0059] like Figure 7 The image shown is a cross-sectional view of the COF thermal pad structure 100 of this embodiment. The COF thermal pad structure 100 is provided with a first adhesive layer 110, a heat dissipation layer 120, a second adhesive layer 130, and a protective layer 140 sequentially from bottom to top. The heat dissipation layer 120 has multiple first heat dissipation protrusions 121 and multiple second heat dissipation protrusions 122 on its upper and lower surfaces, respectively. The multiple first heat dissipation protrusions 121 and multiple second heat dissipation protrusions 122 are arranged in a strip shape.
[0060] The preparation and mounting process of the COF heat dissipation patch structure 100 in this embodiment is as follows:
[0061] The COF thermal pad structure 100 of this disclosure is applicable to COF products that require thermal pads, and includes thermal pad materials required for the front (silicon crystal surface) bonding process and the back (substrate surface) bonding process.
[0062] In preparing this heat dissipation patch structure, firstly, multiple first heat dissipation protrusions 121 and multiple second heat dissipation protrusions 122 are formed by stamping both sides of the foil strip used as the raw material for the heat dissipation layer 120. Then, adhesive is applied to both sides of the foil strip to form a first adhesive layer 110 and a second adhesive layer 130. After applying the adhesive, a soft brush is used to scrape off the excess adhesive on the first adhesive layer 110 to ensure that the thickness of the first adhesive layer 110 does not exceed the height of the first heat dissipation protrusions 121.
[0063] The release film for collecting the heat dissipation sticker is placed at the bottom layer, and the release film is aligned with the foil strip. Then, the heat dissipation layer 120 structure of this embodiment is punched out using a corresponding fixture and collected onto the release film. In the same way, the elongated protective layer strip is aligned with the release film, and the punching position of the protective strip is adjusted to correspond to the previous heat dissipation layer 120, so that the punched protective layer 140 can completely cover the second adhesive layer 130, the heat dissipation layer 120, and the first adhesive layer 110.
[0064] During the preparation process, the adhesive material of the first adhesive layer 110 comes into contact with the release film. However, since an oily substance is pre-applied to the release film, this oily substance acts as a barrier between the release film and the second adhesive layer, ensuring that the heat dissipation patch is only slightly adhered to the surface of the release film and is not tightly stuck to it. When removing the patch, a suitable suction force can be used to separate it from the release film.
[0065] When applying the thermal pad, simply remove it from the COF product surface using the thermal pad application machine and place it on the COF product surface. Then, press it with a small amount of force to ensure that the thermal pad is in place. After that, use a flexible roller to roll along a fixed line on the surface of the thermal pad, which will expel air from the thermal pad application area and make the thermal pad completely adhere to the COF product.
[0066] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the embodiments of this disclosure, and the embodiments of this disclosure are not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the embodiments of this disclosure, and these modifications and improvements are also considered to be within the protection scope of the embodiments of this disclosure.
Claims
1. A COF heat dissipation patch structure, characterized in that, include: The first adhesive layer is used to fix the heat dissipation patch structure to the COF product; A heat dissipation layer is disposed on the side of the first adhesive layer opposite to the COF product; The second adhesive layer is disposed on the side of the heat dissipation layer opposite to the first adhesive layer; A protective layer is disposed on the side of the second adhesive layer opposite to the heat dissipation layer; wherein, The heat dissipation layer is provided with a plurality of first heat dissipation protrusions, which protrude toward and pass through the first adhesive layer for contact with the COF product.
2. The COF heat dissipation patch structure of claim 1, wherein, The height of the first heat dissipation protrusion is the same as the thickness of the first adhesive layer.
3. The COF heat dissipation patch structure of claim 1, wherein, The height of the first heat dissipation protrusion is greater than the thickness of the first adhesive layer.
4. The COF heat dissipation patch structure according to any one of claims 1 to 3, characterized in that, Multiple first heat dissipation protrusions are integrally formed with the heat dissipation layer.
5. The COF heat dissipation patch structure according to any one of claims 1 to 3, wherein, The first heat dissipation protrusion is in the form of dots, strips, or blocks.
6. The COF heat dissipation patch structure according to any one of claims 1 to 3, characterized in that, The heat dissipation layer is further provided with a plurality of second heat dissipation protrusions, which protrude toward the second adhesive layer.
7. The COF heat dissipation patch structure according to claim 6, characterized in that, The height of the second heat dissipation protrusion is less than the thickness of the second adhesive layer.
8. The COF heat dissipation patch structure according to claim 6, characterized in that, Multiple second heat dissipation protrusions are integrally formed with the heat dissipation layer.
9. The COF heat dissipation patch structure according to claim 6, characterized in that, The second heat dissipation protrusion is in the form of dots, strips, or blocks.
10. The COF heat dissipation patch structure according to any one of claims 1 to 3, characterized in that, The orthographic projection of the protective layer onto the second adhesive layer falls on the outer side of the second adhesive layer.