Electronic package and thermally conductive structure thereof
Patent Information
- Application Number
- CN202521842168.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2025-08-11
- Filing Date
- 2025-08-28
- Publication Date
- 2026-08-18
- Estimated Expiration
- 2035-08-28
AI Technical Summary
[0005]然而，随着该半导体晶片的功能需求愈来愈多，其接点(I/O)数也愈来愈多，且所产生的热能也越来越高，仅靠传统散热件(铜片)及导热介面材(金属膏)的散热能力已经不敷现今产品需求
[0016]通过本申请的实施，主要提供包含有导热片及设于该导热片至少一侧的导热层的导热结构，且令该导热结构夹置于电子元件及散热件之间，其中，该导热片为其垂直导热系数达1500W/m·K的石墨片，可大幅提升导热能力，另该导热层为掺杂弹性颗粒的胶层，以通过弹性颗粒的接触达到电子元件与散热件的热传输，同时可抑制散热件、导热结构及电子元件之间应力，以避免导热结构覆盖率太低，造成热传导效果不佳问题，进而达到维持高导热能力、良好的接合能力以及承受外界造成应力的技术效果。
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Figure CN224653993U_ABST
Abstract
Description
Technical Field
[0001] This application relates to a semiconductor device, and more particularly to an electronic package and its thermally conductive structure. Background Technology
[0002] As electronic products demand higher functionality and processing speeds, semiconductor chips, as core components of these products, need to have higher density electronic circuits and components. Consequently, semiconductor chips generate a greater amount of heat during operation. Furthermore, the encapsulating colloids traditionally used to cover these semiconductor chips are poor heat transfer materials with a thermal conductivity of only 0.8 W / mk (i.e., poor heat dissipation efficiency). Therefore, if the heat generated by the semiconductor chip cannot be effectively dissipated, it will cause damage to the semiconductor chip and product reliability issues.
[0003] Therefore, in order to quickly dissipate heat to the outside, the industry usually equips semiconductor packages with heat sinks. These heat sinks are typically bonded to the back of the semiconductor chip through a heat dissipation material, such as a thermal interface material (TIM), so that the heat generated by the semiconductor chip can be dissipated through the heat dissipation material and the heat sink. Furthermore, the top surface of the heat sink is usually exposed to the encapsulation colloid or directly exposed to the atmosphere to achieve better heat dissipation.
[0004] Figure 1 This is a cross-sectional schematic diagram of a conventional semiconductor package 1. The conventional semiconductor package 1 first mounts a semiconductor wafer 11 onto a packaging substrate 10 using a flip-chip bonding method. Then, a heat sink 12 is bonded to the back side of the semiconductor wafer 11 via a thermally conductive interface material (TIM) 13. During operation, the heat generated by the semiconductor wafer 11 is conducted to the heat sink 12 via the thermally conductive interface material (TIM) 13 to dissipate heat to the outside of the semiconductor package 1.
[0005] However, as the functional requirements of semiconductor chips increase, the number of I / O points also increases, and the heat generated also increases. The heat dissipation capacity of traditional heat sinks (copper sheets) and thermal interface materials (metal paste) is no longer sufficient for the current product requirements.
[0006] Therefore, overcoming the problems of the existing technology has become an urgent issue that needs to be addressed. Utility Model Content
[0007] In view of the various deficiencies of the prior art, this application provides an electronic package, including: a carrier; an electronic component disposed on the carrier; a thermally conductive structure including an intermediate layer and a nanolayer disposed on at least one side of the intermediate layer; and a heat dissipation component bonded to the electronic component with respect to the thermally conductive structure.
[0008] This application also provides a thermally conductive structure disposed between an electronic component and a heat sink, comprising: an intermediate layer; and a nanolayer disposed on at least one side of the intermediate layer.
[0009] In the aforementioned electronic packaging components and their thermal conductive structures, the thermal conductive sheet is a graphite sheet.
[0010] In the aforementioned electronic packaging components and their thermally conductive structures, the elastic particles are rubber particles.
[0011] In the aforementioned electronic packaging components and their thermally conductive structures, the adhesive layer is a thermally conductive adhesive.
[0012] In the aforementioned electronic package and its thermal conductive structure, the thermal conductive layer is disposed on opposite sides of the thermal conductive sheet, so that the thermal conductive layer on one side connects to the electronic component, and the thermal conductive layer on the other side connects to the heat sink.
[0013] In the aforementioned electronic package and its thermally conductive structure, the carrier has a first side and a second side opposite to each other, so that the electronic component is disposed on the first side and a plurality of conductive elements are disposed on the second side.
[0014] In the aforementioned electronic package and its thermally conductive structure, the electronic component has opposing active and non-active surfaces, and is electrically connected to the carrier through multiple conductive bumps via the active surface.
[0015] In the aforementioned electronic package and its thermal conductive structure, the heat sink includes a body and a support extending outward from the body, and the heat sink is erected on the carrier with the support and the body covers the electronic component.
[0016] The implementation of this application mainly provides a thermally conductive structure comprising a thermally conductive sheet and a thermally conductive layer disposed on at least one side of the thermally conductive sheet, wherein the thermally conductive structure is sandwiched between electronic components and heat sinks. The thermally conductive sheet is a graphite sheet with a vertical thermal conductivity of 1500 W / m·K, which can significantly improve the thermal conductivity. The thermally conductive layer is an adhesive layer doped with elastic particles, so that heat transfer between electronic components and heat sinks can be achieved through the contact of elastic particles. At the same time, it can suppress the stress between heat sinks, thermally conductive structures and electronic components, so as to avoid the problem of poor heat conduction due to insufficient coverage of the thermally conductive structure. Thus, it achieves the technical effects of maintaining high thermal conductivity, good bonding ability and withstanding external stress. Attached Figure Description
[0017] Figure 1 This is a cross-sectional schematic diagram of an existing semiconductor package.
[0018] Figure 2 This is a cross-sectional view of the electronic package of this application.
[0019] Figure 3 This is a cross-sectional schematic diagram of the thermally conductive structure of this application.
[0020] Explanation of reference numerals in the attached figures
[0021] 1 Semiconductor package
[0022] 10 Packaging substrate
[0023] 11 Semiconductor wafers
[0024] 12 Heat sinks
[0025] 13 Thermally conductive interface materials
[0026] 2 Electronic Packages
[0027] 21. Bearing components
[0028] 21a First side
[0029] 21b Second side
[0030] 210 dielectric layer
[0031] 211 Line Layer
[0032] 22 Electronic components
[0033] 22a Working surface
[0034] 22b Non-operating surface
[0035] 220 conductive bump
[0036] 23 Heat sink
[0037] 231 Ontology
[0038] 232 Support section
[0039] 24 Thermally conductive structure
[0040] 241 Thermal Conductive Sheet
[0041] 242 Thermal Conductive Layer
[0042] 2420 adhesive layer
[0043] 2421 Elastic Particles
[0044] 25. Conductive elements. Detailed Implementation
[0045] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification.
[0046] It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the scope of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this application, should still fall within the scope of the technical content disclosed herein. Furthermore, the terms such as "above," "first," "second," and "a" used in this specification are merely for clarity of description and are not intended to limit the scope of this application. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this application's implementation.
[0047] Please see Figure 2 and Figure 3 This is a cross-sectional schematic diagram of the electronic package and its thermal conductive structure of this application.
[0048] like Figure 2 As shown, the electronic package 2 of this application mainly includes: a carrier 21, an electronic component 22 disposed on the carrier 21, a heat sink 23 disposed on the electronic component 22, and a heat-conducting structure 24 sandwiched between the electronic component 22 and the heat sink 23.
[0049] The carrier 21 can be, for example, a substrate with a core layer and a circuit structure, or a coreless circuit structure, having opposing first sides 21a and second sides 21b, and including a dielectric layer 210 and a circuit layer 211 (such as a redistribution layer) bonded to the dielectric layer 210. Alternatively, the carrier 21 can also be a lead frame, a silicon interposer, a wafer, or other board with metal routing, etc.
[0050] The electronic component 22 is disposed on the first side 21a of the carrier 21 and electrically connected to the circuit layer 211. The electronic component 22 may be an active component, a passive component, a package structure, or a combination thereof. The active component may be a semiconductor wafer, while the passive component may be, for example, a resistor, a capacitor, or an inductor. In this embodiment, the electronic component 22 is a semiconductor wafer having opposing active surfaces 22a and non-active surfaces 22b, and the active surface 22a is electrically connected to the carrier 21 via a plurality of conductive bumps 220 by flip-chip bonding.
[0051] Furthermore, multiple conductive elements 25 may be installed on the second side 21b of the carrier 21 to provide electrical connection to an external device.
[0052] The heat sink 23 includes a body 231 and a support portion 232 extending outward from the surface of the body 231. The heat sink 23 is erected on the carrier 21 with the support portion 232, and the body 231 covers the electronic component 22. The material of the heat sink 23 is, for example, copper.
[0053] Please refer to the following at the same time. Figure 3 The thermally conductive structure 24 is a thermally conductive interface material (TIM) structure, which includes a thermally conductive sheet 241 and a thermally conductive layer 242 disposed on at least one side of the thermally conductive sheet 241. Preferably, the thermally conductive sheet 241 has thermally conductive layers 242 formed on opposite sides, so that the thermally conductive layer 242 on one side can connect to the electronic component 22, and the thermally conductive layer 242 on the other side can connect to the heat sink 23.
[0054] In this embodiment, the heat-conducting sheet 241 is, for example, a graphite sheet with a high thermal conductivity, and its vertical thermal conductivity (TC) reaches 1500 W / m·K. Compared with the existing thermal paste, which has a vertical TC of only about 7 W / m·K, the heat conduction capacity can be greatly improved by using the heat-conducting sheet 241 (graphite sheet).
[0055] Alternatively, the thermally conductive layer 242 may be a glue layer 2420 doped with compressible elastic particles 2421, wherein the elastic particles 2421 may be rubber particles and the glue layer 2420 may be a thermally conductive adhesive.
[0056] In application, although the vertical TC of the heat-conducting sheet 241 (graphite sheet) made of high thermal conductivity material reaches 1500W / m·K, it is incompressible and cannot be bonded to the end of the electronic component 22 and the end of the heat sink 23. Therefore, an adhesive layer 2420 with internally added elastic particles 2421 is formed on both sides of the heat-conducting sheet 241 (graphite sheet) to improve heat conduction and suppress stress through the elastic particles 2421, and to provide good contact with the electronic component 22 and the heat sink 23 and reduce thermal resistance through the adhesive layer 2420. It can maintain high thermal conductivity, good bonding ability and withstand external stress.
[0057] In detail, heat transfer between the electronic component 22 and the heat sink 23 is achieved through the contact of the elastic particles 2421 with the electronic component 22 and the heat sink 23. In addition, since the elastic particles 2421 are added to the adhesive layer 2420, the stress generated by the heat sink 23 on the thermally conductive structure 24 (TIM structure) and the connection between the thermally conductive structure 24 (TIM structure) and the electronic component 22 can be suppressed, so as to avoid problems such as insufficient coverage of the surface of the thermally conductive structure 24 (TIM structure) on the surface of the electronic component 22 or the heat sink 23, or even poor heat conduction effect.
[0058] In practice, a thermally conductive layer 242 can be first placed on the non-functional surface 22b of the electronic component 22, then a thermally conductive sheet 241 can be placed on the thermally conductive layer 242, and then another thermally conductive layer 242 can be formed on the thermally conductive sheet 241. After that, pressure is applied to the other thermally conductive layer 242 by the heat sink 23 and heated to bond it, so that the thermally conductive structure 24 is sandwiched between the electronic component 22 and the heat sink 23.
[0059] In summary, the electronic package and its thermally conductive structure of this application mainly provide a thermally conductive structure comprising a thermally conductive sheet and a thermally conductive layer disposed on at least one side of the thermally conductive sheet, wherein the thermally conductive structure is sandwiched between the electronic component and the heat sink. The thermally conductive sheet is a graphite sheet with a vertical thermal conductivity of 1500 W / m·K, which can significantly improve the thermal conductivity. The thermally conductive layer is an adhesive layer doped with elastic particles, so that heat transfer between the electronic component and the heat sink can be achieved through the contact of the elastic particles. At the same time, it can suppress the stress between the heat sink, the thermally conductive structure and the electronic component, so as to avoid the problem of poor heat conduction due to the low coverage of the thermally conductive structure. Thus, it achieves the technical effects of maintaining high thermal conductivity, good bonding ability and withstanding external stress.
[0060] The above embodiments are used to illustrate the principles and effects of this application, and are not intended to limit this application. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of this application. Therefore, the scope of protection of this application should be as set forth in the claims.
Claims
1. An electronic package, characterized in that, include: Load-bearing components; Electronic components are mounted on the carrier. A thermally conductive structure includes a thermally conductive sheet and a thermally conductive layer disposed on at least one side of the thermally conductive sheet, wherein the thermally conductive layer is an adhesive layer doped with elastic particles. as well as The heat sink is integrated into the electronic component through the thermally conductive structure.
2. The electronic package as described in claim 1, characterized in that, The heat-conducting sheet is a graphite sheet.
3. The electronic package as described in claim 1, characterized in that, The elastic particle is a rubber particle.
4. The electronic package as described in claim 1, characterized in that, The adhesive layer is a thermally conductive adhesive.
5. The electronic package as described in claim 1, characterized in that, The thermal conductive layer is disposed on opposite sides of the thermal conductive sheet, so that the thermal conductive layer on one side can connect to the electronic component, and the thermal conductive layer on the other side can connect to the heat sink.
6. The electronic package as claimed in claim 1, characterized in that, The carrier has a first side and a second side opposite to each other, on which the electronic component is disposed, and on the second side a plurality of conductive elements are disposed.
7. The electronic package as claimed in claim 1, characterized in that, The electronic component has opposing active and non-active surfaces, and is electrically connected to the carrier via multiple conductive bumps through the active surface.
8. The electronic package as claimed in claim 1, characterized in that, The heat sink includes a body and a support extending outward from the body, and the heat sink is erected on the carrier with the support and the body covers the electronic component.
9. A thermally conductive structure disposed between an electronic component and a heat sink, characterized in that, include: Thermal pad; as well as A thermally conductive layer is disposed on at least one side of the thermally conductive sheet and is an adhesive layer doped with elastic particles.
10. The thermally conductive structure as described in claim 9, characterized in that, The heat-conducting sheet is a graphite sheet.
11. The thermally conductive structure as described in claim 9, characterized in that, The elastic particle is a rubber particle.
12. The thermally conductive structure as described in claim 9, characterized in that, The adhesive layer is a thermally conductive adhesive.
13. The thermally conductive structure as described in claim 9, characterized in that, The thermal conductive layer is disposed on opposite sides of the thermal conductive sheet, so that the thermal conductive layer on one side can connect to the electronic component, and the thermal conductive layer on the other side can connect to the heat sink.