Chip package structure with heat dissipation structure

Abstract

The utility model provides a kind of chip packaging structure with heat dissipation structure, including substrate, chip, radiator pipe and plastic package body;Chip is electrically connected with substrate by lead or solder ball or solder column, radiator pipe is attached with the surface of chip, plastic package body covers the lead or solder ball or solder column between chip and substrate, meanwhile plastic package body covers the main body of radiator pipe, the end of radiator pipe is communicated with the outside of plastic package body;Radiator pipe is made of metal material, fixed heat dissipation material is filled in radiator pipe, or the passage that fluid flows is formed in radiator pipe, the end of radiator pipe is communicated with external heat dissipation system.The utility model can establish more efficient heat dissipation path, so that the heat generated by chip or other heat source device is efficiently conducted to the outside, improves the heat dissipation performance of chip packaging structure, simultaneously need not to be operated on substrate etc. Punching, process is relatively simple, and the packaging quality of chip packaging structure is ensured.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging and heat dissipation technology, and in particular to a chip packaging structure with heat dissipation structure. Background Technology

[0002] Currently, chip heat dissipation solutions are evolving rapidly with the increasing power density of semiconductors. Especially in high-performance scenarios such as AI, electric vehicles, and 5G communications, heat dissipation has become a "ceiling" restricting chip reliability and performance. Traditional chip heat dissipation solutions mainly rely on heat conduction from the packaging substrate and heat dissipation through the molding compound. Another approach involves adding a heat sink (such as a heat sink cover) to the conventional packaging structure. However, the heat dissipation efficiency of such packaging structures is relatively low. If the chip generates a lot of heat or operates in a high-temperature environment, the chip's efficiency will be greatly reduced, or the chip's operating frequency will be directly reduced, preventing the chip from reaching its full potential.

[0003] A current chip packaging structure includes: a substrate with through-holes extending through both sides; a first chip electrically connected to the substrate; a heat dissipation assembly disposed on the substrate, having internal heat dissipation channels communicating with the through-holes; a second chip disposed on the side of the heat dissipation assembly opposite to the first chip and electrically connected to the substrate; and a molding compound encapsulating the first chip, the heat dissipation assembly, and the second chip. This solution achieves more efficient heat dissipation within the multi-chip package; however, the addition of through-holes on the substrate increases the difficulty of substrate manufacturing and may also reduce substrate strength and cause thermal deformation. Utility Model Content

[0004] The purpose of this invention is to provide a more flexible chip packaging and heat dissipation solution that does not damage the integrity of the substrate, addressing the shortcomings of the aforementioned background technology.

[0005] To achieve the above objectives, this utility model provides a chip packaging structure with a heat dissipation structure, including a substrate, a chip, a heat pipe, and a molding compound;

[0006] The chip is electrically connected to the substrate via leads, solder balls, or solder pillars. The heat sink is attached to the surface of the chip. The molding compound covers the leads, solder balls, or solder pillars between the chip and the substrate. At the same time, the molding compound covers the main body of the heat sink. The end of the heat sink is connected to the outside of the molding compound.

[0007] The heat dissipation pipe is made of metal and is filled with a fixed heat dissipation material, or a fluid flow channel is formed inside the heat dissipation pipe, and the end of the heat dissipation pipe is connected to an external heat dissipation system.

[0008] Furthermore, the heat dissipation pipe is bonded to the chip using adhesive.

[0009] Furthermore, the surface of the chip is provided with a solderable coating, and the heat dissipation pipe is soldered to the corresponding surface of the chip via solder paste.

[0010] Furthermore, the heat dissipation pipe is a square pipe.

[0011] Alternatively, the heat dissipation pipe may be a circular pipe.

[0012] Furthermore, the heat pipe is made of copper or aluminum.

[0013] Furthermore, the two ends of the heat pipe are located on different sides of the chip packaging structure, or on the same side of the chip packaging structure.

[0014] Furthermore, the heat dissipation pipe can be straight, L-shaped, U-shaped, or a three-dimensional spatial shape.

[0015] Furthermore, when the heat pipe has a three-dimensional shape, the heat pipe includes a horizontal pipe segment and an inclined pipe segment. The horizontal pipe segment is attached to the surface of the corresponding chip, and the inclined pipe segment connects adjacent horizontal pipe segments at different height positions.

[0016] The above-mentioned solution of this utility model has the following beneficial effects:

[0017] The chip packaging structure with heat dissipation structure provided by this utility model can establish a more efficient heat dissipation path by setting the heat pipe attached to the chip, so that the heat generated by the chip or other heat source devices can be efficiently conducted to the outside, improving the heat dissipation performance of the chip packaging structure. At the same time, there is no need to open the substrate, etc., the process is relatively simple, and the packaging quality of the chip packaging structure is ensured.

[0018] Other beneficial effects of this invention will be described in detail in the following detailed description section. Attached Figure Description

[0019] Figure 1 This is a front view of the overall structure of this utility model (single chip);

[0020] Figure 2 This is a front view of the overall structure of the present invention (multiple chips);

[0021] Figure 3 This is a front view of the overall structure of the present invention (multiple chips with height differences);

[0022] Figure 4 This is a top view of the overall structure of this utility model (multiple chips with height differences).

[0023] [Explanation of Labels in the Attached Image]

[0024] 1-Substrate; 2-Chip; 3-Heat pipe; 31-Horizontal pipe section; 32-Inclined pipe section; 4-Encapsulation. Detailed Implementation

[0025] To make the technical problems, solutions, and advantages of this utility model clearer, a detailed description will be provided below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model. Furthermore, the technical features involved in the different embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.

[0026] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0027] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a locking connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0028] like Figures 1-2As shown, an embodiment of this utility model provides a chip packaging structure with a heat dissipation structure, including a substrate 1, a chip 2, and a heat pipe 3. The chip 2 and substrate 1 can be electrically connected by leads; alternatively, a flip-chip configuration can be used, where the chip 2 and substrate 1 are directly connected by solder balls or solder pillars. For conventional chip packaging structures, after connecting the chip 2 and substrate 1, molding is required. The molded body 4, formed by the cured molded material, covers the leads, solder balls, or solder pillars between the chip 2 and substrate 1, and also covers the main body of the chip 2 to protect the chip 2 and the connection points. Typically, the upper surface of the chip 2 needs to have the molded body 4 removed to expose it to air for heat dissipation, or to contact a heat sink for heat dissipation.

[0029] In this embodiment, the heat pipe 3 is a separate component, positioned above the chip 2 and in contact with it to transfer the heat generated by the chip 2. The heat pipe 3 is also encapsulated within the molding compound 4 after the chip packaging structure is completed, making the entire chip packaging structure more compact and eliminating any noticeable protrusions. Therefore, the heat pipe 3 needs to be firmly connected to the chip 2 before molding to prevent displacement or complete detachment during molding. For example, the heat pipe 3 can be firmly bonded to the chip 2 using adhesive, or a solderable coating can be electroplated or coated on the upper surface of the chip 2, and the heat pipe 3 can be soldered to the upper surface of the chip 2 using solder paste. This ensures that the corresponding position of the heat pipe 3 remains tightly fitted to the chip 2 after molding, without a significant increase in thermal resistance, allowing the heat generated by the chip 2 to be efficiently transferred to the heat pipe 3.

[0030] It should be noted that in this embodiment, the heat pipe 3 can be either a circular pipe or a square pipe. A more preferred option is to use a square pipe, which can increase the contact area with the upper surface of the chip 2, thereby making the heat conduction efficiency higher and the connection usually more secure.

[0031] It should be noted that the heat pipe 3 itself can be made of a metal, such as copper. Copper, as a metal with high thermal conductivity, can improve the heat dissipation performance when used as the heat pipe 3. In other embodiments, the heat pipe 3 can also be made of aluminum. Although its heat dissipation performance is slightly worse than that of copper, it is lighter and easier to obtain, giving it certain advantages.

[0032] In this embodiment, both ends of the heat pipe 3 need to be connected to the outside of the molding compound 4. For example, both ends of the heat pipe 3 are flush with the outer surface of the molding compound 4, forming an integrated structure. This structure is formed by cutting after molding multiple sets of substrates 1, chips 2, and heat pipes 3. At this time, the heat pipe 3 is cut off and flush with the outer surface of the molding compound 4. The interior of the heat pipe 3 serves as a heat dissipation channel. It can be filled with solid thermally conductive materials, such as thermally conductive gel. The thermally conductive gel and the heat pipe 3 together conduct the heat generated by the chip 2 outward. Alternatively, it can be left unfilled and serve as a channel for fluid flow. Subsequently, both ends of the heat pipe 3 are connected to an external heat dissipation system. The external heat dissipation system circulates refrigerant, cooling water, and other fluids into the heat pipe 3 to dissipate heat for the entire chip packaging structure, thereby enhancing the heat dissipation capacity.

[0033] Therefore, before molding, resin glue can be filled and pre-cured inside the heat sink 3 to ensure that there is no air residue. When the molding compound forms the molding body 4, it will not fill the inside of the heat sink 3. Therefore, the resin glue inside the heat sink 3 can be removed and then filled with thermal conductive material, or it can be retained as a channel for fluid flow so that the fluid can flow smoothly.

[0034] It should be noted that in this embodiment, the heat pipe 3 is typically arranged parallel to the upper surface of the chip 2. The two ends of the heat pipe 3 can be located on different sides of the entire chip package structure, or on the same side. When the two ends of the heat pipe 3 are located on different sides of the entire chip package structure, the heat pipe 3 can typically be configured as a straight line or an L-shape. When the two ends of the heat pipe 3 are located on the same side of the entire chip package structure, the heat pipe 3 can typically be configured as a U-shape. Different configurations correspond to different ways of connecting to the external heat dissipation system and different internal arrangements within the chip package structure; those skilled in the art can flexibly choose based on actual conditions.

[0035] It should be noted that the chip packaging structure described above refers to a single chip 2. For the entire chip packaging structure, multiple chips 2, or other heat source devices, are typically placed in different (adjacent) areas of the substrate 1. Figure 3 , Figure 4As shown. Therefore, the heat pipe 3 can be further configured in other forms. For example, for multiple heat source devices, the heights of different heat source devices are different. In order for the heat pipe 3 to fully fit the upper surface of each heat source device, the heat pipe 3 can be configured as a three-dimensional shape. This type of heat pipe 3 usually needs to be prefabricated according to the distribution of heat source devices so that it can be smoothly matched and fitted when connected to each heat source device. Specifically, this heat pipe 3 can include a horizontal pipe section 31 and an inclined pipe section 32. The horizontal pipe section 31 is used to fit the upper surface of the corresponding heat source device, and the inclined pipe section 32 is used to connect adjacent horizontal pipe sections 31 at different height positions to form a continuous heat dissipation channel.

[0036] Furthermore, for vertically stacked chip packaging structures, which employ the vertical stacking of multiple chips 2 or other heat source devices to achieve high-density packaging of different chips 2, their heat dissipation performance also has bottlenecks, mainly manifested in the limited heat dissipation path, leading to local hot spots on the chip 2 causing thermal runaway and affecting performance. The heat pipe 3 provided in this embodiment is also applicable to vertically stacked chip packaging structures. It can be located between the upper chip 2 and the lower chip 2 to adhere to the lower surface of the upper chip 2 and / or the upper surface of the lower chip 2, thereby establishing a more efficient heat dissipation path for the upper chip 2 and / or the lower chip 2. Similarly, the heat pipe 3 can also include a horizontal pipe section 31 and an inclined pipe section 32. The horizontal pipe section 31 is used to adhere to the surface of the corresponding heat source device, and the inclined pipe section 32 is used to connect adjacent horizontal pipe sections 31 at different height positions.

[0037] It should be noted that the terms "upper surface" and "lower surface" mentioned above refer to the surface positions of chip 2 after it is packaged, not the front and back of chip 2. For both normally connected and flip-chip connected chip 2, the uppermost surface is the upper surface, and the lowermost surface is the lower surface.

[0038] In summary, the chip packaging structure with heat dissipation structure provided in this embodiment can establish a more efficient heat dissipation path by setting the heat pipe 3 attached to the chip 2, so that the heat generated by the chip 2 or other heat source devices can be efficiently conducted to the outside, thereby improving the heat dissipation performance of the chip packaging structure. At the same time, there is no need to open the substrate 1, etc., the process is relatively simple, and the packaging quality of the chip packaging structure is ensured.

[0039] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0040] The above embodiments are merely illustrative of several implementation methods of this application, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A chip packaging structure with a heat dissipation structure, characterized in that, Includes substrate, chip, heat pipes, and molding compound; The chip is electrically connected to the substrate via leads, solder balls, or solder pillars. The heat sink is attached to the surface of the chip. The molding compound covers the leads, solder balls, or solder pillars between the chip and the substrate. At the same time, the molding compound covers the main body of the heat sink. The end of the heat sink is connected to the outside of the molding compound. The heat dissipation pipe is made of metal and is filled with a fixed heat dissipation material, or a fluid flow channel is formed inside the heat dissipation pipe, and the end of the heat dissipation pipe is connected to an external heat dissipation system.

2. The chip packaging structure with heat dissipation structure according to claim 1, characterized in that, The heat pipe is bonded to the chip using adhesive.

3. The chip packaging structure with heat dissipation structure according to claim 1, characterized in that, The chip has a solderable coating on its surface, and the heat sink is soldered to the corresponding surface of the chip using solder paste.

4. The chip packaging structure with heat dissipation structure according to claim 1, characterized in that, The heat dissipation pipe is a square tube.

5. A chip packaging structure with a heat dissipation structure according to claim 1, characterized in that, The heat dissipation pipe is a circular pipe.

6. A chip packaging structure with a heat dissipation structure according to claim 1, characterized in that, The heat pipe is made of copper or aluminum.

7. A chip packaging structure with a heat dissipation structure according to claim 1, characterized in that, The two ends of the heat pipe are located on different sides of the chip package structure, or on the same side of the chip package structure.

8. A chip packaging structure with a heat dissipation structure according to claim 7, characterized in that, The heat pipe can be straight, L-shaped, U-shaped, or a three-dimensional shape.

9. A chip packaging structure with a heat dissipation structure according to claim 8, characterized in that, When the heat pipe has a three-dimensional shape, the heat pipe includes a horizontal pipe segment and an inclined pipe segment. The horizontal pipe segment is attached to the surface of the corresponding chip, and the inclined pipe segment connects adjacent horizontal pipe segments at different height positions.

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