A high-efficiency high-power device crystal heat dissipation structure

Abstract

The utility model relates to high power device crystal technical field, concretely for a kind of high-efficiency high-power device crystal's heat dissipation structure, including power device body, the power device body is equipped with mounting plate and T-shaped plate, the bottom end left side of T-shaped plate is equipped with fastening groove, the bottom end right side of mounting plate is equipped with mounting groove, the right side of mounting plate is equipped with T-shaped groove and screw hole, T-shaped plate extends into the T-shaped groove, the right side of power device body is in the fastening groove, the left side of power device body is in the mounting groove, this structure is slidably matched by T-shaped plate and the T-shaped groove of mounting plate, the threaded drive adjusting function of combination screw rod, the spacing between mounting groove and fastening groove can be flexibly adjusted, so as to adapt to the power device body of different width size, without replacing special support for different specifications device, substantially improve the versatility of structure.

Description

Technical Field

[0001] This utility model relates to the field of high-power device crystal technology, specifically to a heat dissipation structure for a high-efficiency, high-power device crystal. Background Technology

[0002] As is well known, with the development of power electronics technology, power devices such as IGBTs and thyristors are increasingly widely used in new energy vehicles, industrial frequency converters, and smart grids. These power devices generate a large amount of heat under high load conditions, and the stability and compatibility of their installation directly affect the overall operational reliability of the equipment. Currently, existing power device installation and heat dissipation structures generally have the following shortcomings: Traditional power devices are often fixed by bolts or special brackets. Special brackets are usually only compatible with a single model or size of device. When changing to a different specification of power device, the bracket must be replaced, which not only increases equipment maintenance costs but also reduces assembly efficiency. Bolts can easily cause installation difficulties due to hole misalignment and can also cause pressure damage to the device surface.

[0003] Current heat dissipation methods mostly rely on heat sinks attached to the device itself or a single air-cooling structure, lacking a coordinated design of "heat conduction-forced cooling-air convection". Heat is difficult to transfer quickly from the device to the heat dissipation component, and a single heat dissipation method cannot meet the heat dissipation requirements of high-power devices, causing the devices to be in a high-temperature environment for a long time, shortening their lifespan, and even causing the risk of burnout.

[0004] In traditional structures, the installation and removal of components require tightening multiple bolts one by one, which is cumbersome and difficult to maintain, especially in confined spaces, increasing labor costs and downtime.

[0005] In view of the problems of poor installation adaptability, unreliable fixation, low heat dissipation efficiency and inconvenient maintenance of power devices in the existing technology, there is an urgent need to design an integrated structure that combines flexible adaptation, stable fixation and efficient heat dissipation to meet the comprehensive requirements of modern power electronic equipment for power device installation and heat dissipation. Utility Model Content

[0006] Technical problems to be solved In view of the shortcomings of existing technologies, such as poor installation compatibility, unreliable fixing, low heat dissipation efficiency and inconvenient maintenance of power devices, this utility model provides a heat dissipation structure for high-efficiency, high-power device crystals.

[0007] (II) Technical Solution To achieve the above objectives, this utility model provides the following technical solution: a heat dissipation structure for a high-efficiency, high-power device crystal, comprising a power device body, a mounting plate and a T-shaped plate on the power device body, a fastening groove on the left side of the bottom end of the T-shaped plate, a mounting groove on the right side of the bottom end of the mounting plate, a T-shaped groove and a threaded hole on the right side of the mounting plate, the T-shaped plate extending into the T-shaped groove, the right side of the power device body abutting in the fastening groove, the left side of the power device body abutting in the mounting groove, an adjusting plate at the top of the T-shaped plate, an adjusting hole on the adjusting plate, a screw in the adjusting hole, the screw threadedly connected to the threaded hole, a limiting ring on the screw, a heat dissipation groove at the top of the mounting plate, a cooling fan in the heat dissipation groove, ventilation holes around the mounting plate, and a heat conduction mechanism between the mounting plate and the T-shaped plate.

[0008] Furthermore, the present invention is improved in that the heat conduction mechanism includes a first heat conduction plate, a docking hole, and a second heat conduction plate. The first heat conduction plate is installed inside the mounting plate and extends to the left side of the inner wall of the mounting groove and the T-shaped groove. The docking hole is opened on the left side of the T-shaped plate. The second heat conduction plate is installed inside the T-shaped plate and extends to the docking hole and the right side of the inner wall of the fastening groove.

[0009] Furthermore, an improvement of this utility model is that a copper tube is provided inside the first heat-conducting plate.

[0010] Furthermore, the present invention is improved in that the copper tubes are provided in multiple and arranged in an array.

[0011] Furthermore, the present invention is improved in that the inner wall of the mounting groove and the inner wall of the fastening groove are both provided with rubber pads.

[0012] Furthermore, the present invention is improved in that the bottom end of the heat dissipation groove is provided with heat dissipation fins, and the heat dissipation fins are provided in a plurality of them and arranged in a ring array.

[0013] Furthermore, the present invention is improved by providing anti-slip texture on the rubber pad.

[0014] (III) Beneficial Effects Compared with the prior art, this utility model provides a heat dissipation structure for high-efficiency, high-power device crystals, which has the following beneficial effects: The heat dissipation structure of this high-efficiency, high-power device crystal utilizes a sliding fit between a T-shaped plate and a T-slot on the mounting plate, combined with the threaded drive adjustment function of the screw. This allows for flexible adjustment of the distance between the mounting slot and the fastening slot, accommodating power device bodies of different widths. This eliminates the need to replace dedicated brackets for different device specifications, significantly improving the structure's versatility and reducing equipment maintenance and replacement costs. The threaded connection between the screw and the threaded hole provides stable clamping force, and the anti-loosening positioning of the screw by the limit ring effectively prevents loosening caused by equipment vibration or thermal expansion and contraction. Simultaneously, the left-right clamping method of the mounting slot and fastening slot for the power device body replaces the direct pressing of traditional bolts, reducing the risk of pressure damage to the surface of the power device body and improving installation stability and safety. The installation and removal of the power device body can be completed simply by rotating the screw to adjust the position of the T-shaped plate, eliminating the need to tighten multiple bolts one by one. This simple and quick operation is particularly suitable for maintenance work in confined spaces. Furthermore, the guiding fit between the T-slot and the T-shaped plate ensures accurate positioning during assembly, improving assembly efficiency and reducing downtime for maintenance. Attached Figure Description

[0015] Figure 1 This is a first-view structural diagram of the present invention; Figure 2 This is a schematic diagram of the second-view structure of the present invention; Figure 3 This is a front half-sectional view of the structure of this utility model; Figure 4 This utility model Figure 1 Left half-section view of the structure of the T-shaped plate.

[0016] In the diagram: 1. Power device body; 2. Mounting plate; 3. T-shaped plate; 4. Threaded hole; 5. Adjusting plate; 6. Screw; 7. Limiting ring; 8. Heat sink; 9. Cooling fan; 10. Ventilation hole; 11. First heat conduction plate; 12. Connecting hole; 13. Second heat conduction plate; 14. Copper pipe; 15. Rubber pad; 16. Heat dissipation fins. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] Please see Figures 1-4This utility model relates to a heat dissipation structure for a high-efficiency, high-power device crystal, comprising a power device body 1, a mounting plate 2 and a T-shaped plate 3 on the power device body 1, a fastening groove on the left side of the bottom end of the T-shaped plate 3, a mounting groove on the right side of the bottom end of the mounting plate 2, a T-shaped groove and a threaded hole 4 on the right side of the mounting plate 2, the T-shaped plate 3 extending into the T-shaped groove, the right side of the power device body 1 abutting in the fastening groove, and the left side of the power device body 1 abutting in the mounting groove, an adjusting plate 5 at the top of the T-shaped plate 3, an adjusting hole on the adjusting plate 5, and a screw 6 in the adjusting hole, the screw 6 being screwed... The threaded hole 4 is connected to the screw 6, a limiting ring 7 is provided on the screw 6, a heat dissipation groove 8 is provided at the top of the mounting plate 2, a cooling fan 9 is provided in the heat dissipation groove 8, ventilation holes 10 are provided around the mounting plate 2, and a heat conduction mechanism is provided between the mounting plate 2 and the T-shaped plate 3. In this embodiment, the part of the T-shaped plate 3 extending into the T-groove is inserted into the T-groove of the mounting plate 2, so that the T-shaped plate 3 slides smoothly along the T-groove, and the relative position of the T-shaped plate 3 and the mounting plate 2 is initially adjusted to reserve space for placing power devices; the cooling fan 9 is pre-installed in the heat dissipation groove 8 of the mounting plate 2, the power supply of the cooling fan 9 (which is an external power supply) is connected, and the fan is tested to ensure normal operation. Place the left edge of the power device body 1 against the inner wall of the mounting groove of the mounting plate 2 and press gently to position it; push the T-shaped plate 3 to slide towards the mounting groove, so that the right edge of the power device body 1 is close to the fastening groove of the T-shaped plate 3; pass the screw 6 through the adjustment hole on the adjustment plate 5, align it with the threaded hole 4 of the mounting plate 2 and rotate it clockwise, using the threaded transmission to drive the adjustment plate 5 and the T-shaped plate 3 to gradually approach the mounting groove; continue to rotate the screw 6, the limiting ring 7 on the screw 6 contacts and pushes the adjustment plate 5 until the mounting groove and the fastening groove together clamp the power device body 1, and the power device is powered on. After operation, the heat generated is quickly conducted to the mounting plate 2 and T-shaped plate 3 through the heat conduction mechanism; the cooling fan 9 in the heat dissipation slot 8 is activated, and the airflow generated by the fan blows towards the mounting plate 2 and the area of ​​the heat dissipation slot 8. At the same time, the ventilation holes 10 around the mounting plate 2 form air convection, which quickly dissipates the heat conducted to the mounting plate 2 and T-shaped plate 3; the airflow enters through the ventilation holes 10 and is discharged through the cooling fan 9, forming a continuous heat dissipation cycle. By splicing the T-shaped plate 3 with the mounting plate 2 and clamping the power device body 1, it can be adapted to power device bodies 1 of different sizes, improving adaptability.

[0019] To facilitate the conduction of heat from the power device body 1, in this design, the heat conduction mechanism includes a first heat conduction plate 11, a docking hole 12, and a second heat conduction plate 13. The first heat conduction plate 11 is installed inside the mounting plate 2 and extends to the left side of the inner wall of the mounting groove and into the T-shaped groove. The docking hole 12 is located on the left side of the T-shaped plate 3. The second heat conduction plate 13 is installed inside the T-shaped plate 3 and extends to the docking hole 12 and into the right side of the inner wall of the fastening groove. The first heat conduction plate 11 is integrated into the mounting plate 2, covering the inner wall of the mounting groove and directly contacting the left side of the power device body 1 and the T-shaped groove to indirectly conduct heat. The second heat conduction plate 13 is integrated into the T-shaped plate 3, covering the inner wall of the fastening groove and directly contacting the right side of the power device body 1 and the docking hole 12. After the T-shaped plate 3 is inserted into the T-shaped groove, the docking hole 12 allows the first and second heat conduction plates 13 to form a continuous heat conduction channel that is physically close or in contact, realizing the synchronous heat dissipation from both sides of the device. The increased thermal contact area avoids the limitations of heat conduction from a single side; it accelerates the transfer of heat from the power device body 1 to the mounting plate 2 and the T-shaped plate 3, providing a more sufficient heat source for the subsequent cooling fan 9.

[0020] To improve the overall heat dissipation response speed, in this design, the first heat-conducting plate 11 is internally equipped with a copper pipe 14. The thermal conductivity of the copper pipe 14 is much higher than that of ordinary aluminum or steel plates. Embedding the copper pipe 14 into the first heat-conducting plate 11 creates a composite structure where the first heat-conducting plate 11 forms a substrate support plus a copper pipe 14 for efficient heat conduction. The copper pipe 14 acts as a heat conduction channel, rapidly transferring the heat absorbed by the first heat-conducting plate 11. This significantly enhances the thermal conductivity of the first heat-conducting plate 11, preventing heat accumulation within it. Heat from the left side of the device is preferentially conducted to the mounting plate 2 via the copper pipe 14, where it is quickly dissipated with the cooling fan 9, thus improving the overall heat dissipation response speed.

[0021] In order to further improve the total heat conduction capacity of the first heat conduction plate 11, in this solution, multiple copper pipes 14 are provided and arranged in an array. The multiple copper pipes 14 are distributed in an array to cover different areas of the first heat conduction plate 11, increase the total heat conduction cross-sectional area, further improve the total heat conduction capacity of the first heat conduction plate 11, and adapt to the high heat output scenario of high power devices.

[0022] To improve the clamping and securing of the power device body 1 by the mounting plate 2 and the T-shaped plate 3, in this design, the inner wall of the mounting groove and the inner wall of the fastening groove are both provided with rubber pads 15. The elasticity of the rubber pads 15 can fill the gap between the device and the groove wall, and increase the friction force through elastic pre-tightening; at the same time, the insulation of the rubber can isolate the conductive parts of the power device from the metal mounting plate 2 / T-shaped plate 3, avoiding the risk of short circuit.

[0023] In order to improve the overall heat exchange efficiency of the heat dissipation system, in this solution, the bottom end of the heat dissipation slot 8 is provided with heat dissipation fins 16. There are multiple heat dissipation fins 16 arranged in a ring array. The ring array layout of the heat dissipation fins 16 greatly increases the contact area with the air. The airflow blown out by the cooling fan 9 can flow evenly through the ring-distributed fins and quickly remove the heat absorbed by the mounting plate 2 by the fins.

[0024] To further improve the clamping stability of the power device body 1, in this solution, the rubber pad 15 is provided with anti-slip texture. The anti-slip texture on the surface of the rubber pad 15 can increase the static friction with the surface of the power device, further resisting the sliding tendency of the device caused by vibration, handling or thermal expansion and contraction.

[0025] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation structure for a high-efficiency, high-power device crystal, comprising a power device body (1), characterized in that, The power device body (1) is provided with a mounting plate (2) and a T-shaped plate (3). A fastening groove is provided on the left side of the bottom end of the T-shaped plate (3), and a mounting groove is provided on the right side of the bottom end of the mounting plate (2). A T-shaped groove and a threaded hole (4) are provided on the right side of the mounting plate (2). The T-shaped plate (3) extends into the T-shaped groove. The right side of the power device body (1) abuts against the fastening groove, and the left side of the power device body (1) abuts against the mounting groove. The T-shaped plate (3) The top of the mounting plate (2) is provided with an adjustment plate (5), the adjustment plate (5) is provided with an adjustment hole, the adjustment hole is provided with a screw (6), the screw (6) is threaded to the threaded hole (4), the screw (6) is provided with a limiting ring (7), the top of the mounting plate (2) is provided with a heat dissipation groove (8), the heat dissipation groove (8) is provided with a cooling fan (9), the mounting plate (2) is provided with ventilation holes (10) around its perimeter, and a heat conduction mechanism is provided between the mounting plate (2) and the T-shaped plate (3).

2. The heat dissipation structure for a high-efficiency, high-power device crystal according to claim 1, characterized in that, The heat conduction mechanism includes a first heat conduction plate (11), a docking hole (12), and a second heat conduction plate (13). The first heat conduction plate (11) is installed inside the mounting plate (2) and extends to the left side of the inner wall of the mounting groove and the T-shaped groove. The docking hole (12) is opened on the left side of the T-shaped plate (3). The second heat conduction plate (13) is installed inside the T-shaped plate (3) and extends to the docking hole (12) and the right side of the inner wall of the fastening groove.

3. The heat dissipation structure for a high-efficiency, high-power device crystal according to claim 2, characterized in that, The first heat-conducting plate (11) has a copper tube (14) inside.

4. The heat dissipation structure for a high-efficiency, high-power device crystal according to claim 3, characterized in that, The copper tubes (14) are provided in multiple and arranged in an array.

5. The heat dissipation structure for a high-efficiency, high-power device crystal according to claim 1, characterized in that, The inner wall of the mounting groove and the inner wall of the fastening groove are both provided with rubber pads (15).

6. The heat dissipation structure for a high-efficiency, high-power device crystal according to claim 1, characterized in that, The bottom end of the heat sink (8) is provided with heat dissipation fins (16), and there are multiple heat dissipation fins (16) arranged in a ring array.

7. The heat dissipation structure for a high-efficiency, high-power device crystal according to claim 5, characterized in that, The rubber pad (15) has anti-slip texture.

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