Hot spot area heterogeneous needle fin distribution micro-channel heat sink

Abstract

The utility model provides a kind of hotspot area heterogeneous needle fin distribution microchannel radiator, including intermediate conductor;Intermediate conductor is equipped with liquid cooling cavity, liquid inlet and liquid outlet in it, and liquid cooling cavity includes liquid inlet area, microchannel area and liquid outlet area;Microchannel area has hotspot concentrated part and non-hotspot concentrated part;Several ribbed plates and several needle fins are equipped in microchannel area, ribbed plate is distributed on non-hotspot concentrated part, and first microchannel is formed between adjacent ribbed plate;Needle fin is set on hotspot concentrated part, and gap between needle fin is matched to form second microchannel, and spiral structure is equipped on each needle fin.The utility model sets hotspot concentrated part of high heat flux area corresponding to chip in microchannel area, then sets several needle fins with spiral structure on hotspot concentrated part, can realize the accurate efficient heat dissipation to the local high heat flux area of chip, ensure the uniformity of chip temperature.

Description

Technical Field

[0001] This utility model relates to the field of electronic device cooling technology, and in particular to a microchannel heat sink with heterogeneous needle fin distribution in hot spot areas. Background Technology

[0002] Chips are among the most critical components in modern computers, robots, electronic devices, and other industrial equipment. With the rapid development of technology, chip power output and assembly density are increasing, and they are becoming increasingly integrated into packaging designs. This leads to smaller chip sizes but larger heat dissipation per unit area, resulting in a dramatic increase in heat flux density and ultimately, higher chip temperatures. Excessively high operating temperatures can severely or even irreversibly affect the normal operation of chips and the reliable operation of equipment. The well-known 10°C rule states that the reliability of electronic components is closely related to temperature. When the temperature is between 70°C and 80°C, the reliability of electronic components decreases by 50% for every 10°C increase. The quality of heat dissipation directly affects the stability of the chip.

[0003] Conventional natural and forced air cooling methods are no longer sufficient to meet the heat dissipation requirements of chips. Therefore, researchers have proposed emerging technologies such as micro heat pipes, vacuum vapor chambers, carbon nanotubes, and microchannels. Among these, microchannel technology, which utilizes fluid cooling, has received the most extensive research. Microchannel heat sinks were first proposed by Tucherman and Pease in 1981. Compared to conventional heat sinks, microchannel heat sinks offer advantages such as a large heat exchange area, high heat exchange capacity, and small size. However, current research largely focuses on heat sinks with uniform heat sources, while heat dissipation for non-uniform heat sources has received relatively little attention.

[0004] In a chip, the core area generates significantly more heat flux than other areas. These areas with higher heat flux are called hotspots. Typically, heat transfer from within the chip to the heatsink is uneven, with the heat flux in hotspot areas being several times the average heat flux in the background area. The temperature difference caused by this difference in heat flux between hotspots and background areas can lead to chip deformation and reduce chip lifespan. Currently, most microchannel heatsinks used for chips have the same heat dissipation capacity across all areas of the chip, failing to provide independent enhanced heat dissipation for high-flux hotspots. This results in significant temperature differences during chip operation. Therefore, a heatsink capable of independently enhancing heat dissipation for high-flux hotspots is needed to reduce these temperature differences and ensure chip reliability. Utility Model Content

[0005] This invention provides a microchannel heat sink with heterogeneous needle-fin distribution in hotspot areas, which can solve the problem that existing microchannel heat sinks cannot independently enhance the heat dissipation effect for high-throughput hotspot areas of chips, resulting in large temperature differences in chips and affecting chip lifespan.

[0006] To achieve the above objectives, this utility model provides a microchannel radiator with heterogeneous needle-fin distribution in a hotspot area, comprising an intermediate conductor; the intermediate conductor is provided with a liquid cooling cavity, a liquid inlet, and a liquid outlet, the liquid cooling cavity being divided into an inlet area, a microchannel area, and an outlet area arranged sequentially along a first direction, the inlet area and the outlet area being connected to the inlet and the outlet respectively, the first direction being the direction of coolant flow; the microchannel area has a hotspot concentration section and a non-hotspot concentration section; the microchannel area is provided with a plurality of ribs and a plurality of needle-fins, the ribs being distributed on the non-hotspot concentration section, the ribs extending along the first direction and arranged sequentially at intervals along a second direction perpendicular to the first direction, the adjacent ribs forming a first microchannel extending along the first direction; the needle-fins are disposed on the hotspot concentration section, the gaps between the needle-fins cooperating to form a second microchannel, and each needle-fin is provided with a spiral structure.

[0007] In one embodiment, the number of hotspot concentration points is one or at least two.

[0008] In one embodiment, the needle fins on the hot spot concentration section are arranged in at least two rows toward the liquid inlet area and the liquid outlet area, with adjacent rows of needle fins staggered.

[0009] In one embodiment, the needle fins on the hot spot concentration section are arranged from sparse to dense in the direction from the liquid inlet area to the liquid outlet area.

[0010] In one embodiment, the intermediate conductor includes a substrate and a cover plate connected together, the cover plate being located on one side of the substrate, and the liquid cooling cavity being formed on the side of the substrate facing the cover plate.

[0011] In one embodiment, the cover plate and the substrate are made of LTCC, Cu or Al material.

[0012] In one embodiment, the cover plate and the substrate are non-detachably connected, and the cover plate and the substrate are connected by adhesive, welding or high-temperature bonding.

[0013] In one embodiment, the inlet and the outlet are located on the same side of the intermediate conductor.

[0014] In one embodiment, the liquid outlet and the liquid inlet are respectively located on different sides of the intermediate conductor.

[0015] In one embodiment, the cross-section of the needle fin is circular, square, triangular, rhomboid, or elliptical.

[0016] The above-mentioned solution of this utility model has the following beneficial effects:

[0017] This invention addresses high heat flux hotspot areas in chips by incorporating a hotspot concentration section within the liquid-cooled cavity of the intermediate conductor. This hotspot concentration section features fins with a larger heat transfer area than the ribs, enabling rapid heat dissipation from these high-heat flux hotspot areas. Furthermore, the spiral structure on the fins creates turbulence as the coolant flows into the hotspot area, further enhancing the coolant's heat absorption capacity. The spiral structure of the fins in the hotspot concentration section ensures precise and efficient heat dissipation from these areas. Combined with the synergistic heat dissipation effect of the ribs in non-hotspot concentration areas, this results in excellent heat dissipation for the chip, ensuring temperature uniformity.

[0018] Other beneficial effects of this invention will be described in detail in the following detailed description section. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural schematic diagram of a microchannel heat sink with heterogeneous needle-fin distribution in a hotspot area, as shown in some embodiments of this application;

[0020] Figure 2 This is an exploded view of a microchannel heat sink with heterogeneous needle-fin distribution in a hotspot area, as shown in some embodiments of this application.

[0021] Figure 3 This is a top view schematic diagram of the substrate shown in some embodiments of this application;

[0022] Figure 4 This is a simplified schematic diagram showing the region division of the liquid cooling cavity of the substrate in some embodiments of this application;

[0023] Figure 5 This is a diagram showing the arrangement of ribs in some embodiments of this application;

[0024] Figure 6 This is a diagram showing the arrangement of needle fins in some embodiments of this application;

[0025] Figure 7 This is a front view of the needle fin shown in some embodiments of this application.

[0026] [Explanation of Labels in the Attached Image]

[0027] 10-Intermediate conductor; 20-Substrate; 21-Liquid cooling cavity; 211-Liquid inlet area; 212-Liquid outlet area; 213-Microchannel area; 2131-Non-hot spot concentration area; 2132-Hot spot concentration area; 30-Rib plate; 31-First microchannel; 40-Fin needle; 41-Second microchannel; 42-Spiral structure; 50-Cover plate; 51-Liquid inlet; 52-Liquid outlet. Detailed Implementation

[0028] To make the technical problems, solutions, and advantages of this utility model clearer, a detailed description will be provided below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model. Furthermore, the technical features involved in the different embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.

[0029] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0030] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a locking connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0031] Please refer to the following: Figures 1 to 7This invention relates to a microchannel radiator with heterogeneous needle-fin distribution in a hotspot area, comprising an intermediate conductor 10. The intermediate conductor 10 contains a liquid cooling cavity 21, a liquid inlet 51, and a liquid outlet 52. The liquid cooling cavity 21 is divided into an inlet region 211, a microchannel region 213, and an outlet region 212 arranged sequentially along a first direction. The inlet region 211 and the outlet region 212 are respectively connected to the inlet 51 and the outlet 52. The first direction is the direction of coolant flow. The microchannel region 213 has a hotspot concentration area 2132 and a non-hotspot concentration area 2131. The 3 is provided with several ribs 30 and several needle fins 40. The ribs 30 are distributed on the non-hot spot concentration part 2131. The ribs 30 extend along the first direction and are arranged at intervals along the second direction perpendicular to the first direction. A first microchannel 31 extending along the first direction is formed between adjacent ribs 30. The needle fins 40 are arranged on the hot spot concentration part 2132. The gaps between the needle fins 40 are matched to form a second microchannel 41. Each needle fin 40 is provided with a right-handed or left-handed spiral structure 42, which is used to drive the coolant to form turbulence after the coolant flows into the hot spot concentration part 2132.

[0032] When the heat sink is working, the coolant first flows from the inlet 51 into the inlet area 211, and then flows from the inlet area 211 into the first microchannel 31 connected to the inlet area 211. The coolant absorbs the heat generated by the chip through the rib 30 and the intermediate conductor 10 in the first microchannel 31, and after absorbing the heat, it flows into the outlet area 212. The coolant in the outlet area 212 then flows out of the intermediate conductor 10 through the outlet 52. During the flow of coolant through the microchannel region 213, a portion of the coolant will flow into the second microchannel 41 formed by the gaps between the needle fins 40 on the hot spot concentration section 2132. This portion of coolant will quickly absorb the heat generated by the hot spots in the high heat flux hot spot area of ​​the chip through the needle fins 40 and the intermediate conductor 10. Due to the setting of the spiral structure 42 on the needle fins 40, the coolant will form turbulence under the action of the spiral structure 42, which greatly increases the heat absorption effect of the coolant on the high heat flux hot spot area of ​​the chip corresponding to the hot spot concentration section 2132. After passing through the second microchannel 41, the coolant will re-enter the first microchannel 31 formed between the ribs 30 and then flow into the outlet region 212, or flow directly into the outlet region 212 and then flow out through the outlet 52.

[0033] This invention addresses the high heat flux hotspot areas of a chip by incorporating a hotspot concentration section 2132 within the liquid cooling cavity 21 of the intermediate conductor 10. Fins 40 are mounted on this hotspot concentration section 2132, with a heat transfer area ratio greater than that of the ribs 30. This allows for rapid heat dissipation from the high heat flux hotspot areas of the chip. Furthermore, the spiral structure 42 on the fins 40 creates turbulence as the coolant flows into the hotspot concentration section 2132. This turbulence further enhances the coolant's heat absorption capacity in the high heat flux hotspot areas. The combination of the spiral structure 42 on the fins 40 in the hotspot concentration section 2132 and the fins 40 in the non-hotspot concentration section 2131 results in precise and efficient heat dissipation from the high heat flux hotspot areas of the chip. Combined with the synergistic heat dissipation effect of the ribs 30 in the non-hotspot concentration section 2131, this design achieves excellent heat dissipation for the chip, ensuring temperature uniformity.

[0034] Please see Figure 2 In one embodiment of this application, the intermediate conductor 10 includes a substrate 20 and a cover plate 50 connected to each other. The cover plate 50 is located on one side of the substrate 20, and a liquid cooling cavity 21 is formed on the side of the substrate 20 facing the cover plate 50.

[0035] Optionally, the cover plate 50 and the substrate 20 may be made of LTCC, Cu, or Al. LTCC, Cu, or Al are all materials with good heat dissipation properties. Using these materials to make the cover plate 50 and the substrate 20 allows the heat generated by the chip to be quickly transferred to the coolant through the intermediate conductor 10. Of course, the materials used to make the cover plate 50 and the substrate 20 are not limited to these; other materials that can achieve rapid heat transfer can also be used to make the cover plate 50 and the substrate 20.

[0036] Optionally, the intermediate conductor 10 may be square or other shapes. The shape of the intermediate conductor 10 may be modified according to the shape of the chip so that the heat sink of this invention can achieve the beneficial effect of maximizing heat dissipation over the chip area.

[0037] In one embodiment of this application, the inlet 51 and the outlet 52 are located on the same side of the intermediate conductor 10. For example, as Figure 2 The inlet 51 and outlet 52 shown are both disposed on the cover plate 50, or the inlet 51 and outlet 52 are disposed on the side of the substrate 20 facing away from the cover plate 50. In other optional embodiments, the outlet 52 and inlet 51 may be disposed on different sides of the intermediate conductor 10. For example, the inlet 51 may be disposed on the cover plate 50, and the outlet 52 may be disposed on the side of the substrate 20 facing away from the cover plate 50; or, for another example, the inlet 51 may be disposed on the side of the substrate 20 facing away from the cover plate 50, and the outlet 52 may be disposed on the cover plate 50.

[0038] Please see Figure 1In one embodiment of this application, the connection between the cover plate 50 and the substrate 20 is non-removable. Specifically, the cover plate 50 and the substrate 20 are connected by adhesive, welding, or high-temperature bonding. These connection methods not only ensure the sealing between the cover plate 50 and the substrate 20, but also make the overall volume of the intermediate conductor 10 small, suitable for heat dissipation of chips that are moving towards miniaturization. In other optional embodiments, the connection between the cover plate 50 and the substrate 20 can be made detachable, for example, the cover plate 50 and the substrate 20 can be connected by screws, and a sealing ring can be provided between the cover plate 50 and the substrate 20 to ensure that the coolant in the liquid cooling cavity 21 does not flow out from between the cover plate 50 and the substrate 20, thus ensuring the sealing between the cover plate 50 and the substrate 20.

[0039] In one embodiment of this application, the rib 30 and the substrate 20 are integrally formed, for example, the rib 30 is machined on the substrate 20 by CNC machining, or the rib 30 and the substrate 20 are integrally formed by casting.

[0040] In one embodiment of this application, such as Figure 6 As shown, the needle fins 40 on the hotspot concentration section 2132 are arranged in at least two rows along the direction from the liquid inlet area 211 to the liquid outlet area 212, and adjacent rows of needle fins 40 on the hotspot concentration section 2132 are staggered. Further, the needle fins 40 on the hotspot concentration section 2132 are arranged from sparse to dense along the direction from the liquid inlet area 211 to the liquid outlet area 212. In other feasible embodiments, the needle fins 40 on the hotspot concentration section 2132 can be arranged in an N-row, M-column matrix along the direction from the liquid inlet area 211 to the liquid outlet area 212.

[0041] Optionally, the fin 40 and the substrate 20 are integrally formed. For example, the fin 40 can be formed on the substrate 20 by CNC machining, or the fin 40 and the substrate 20 can be integrally formed by casting.

[0042] Optionally, the cross-section of the needle fin 40 can be circular, square, triangular, rhomboid, elliptical, etc.

[0043] The number of hot spot concentration sections 2132 is at least one, and the specific number is determined according to the number of high heat flux hot spot areas formed on the chip. For example, if there is one high heat flux hot spot area on the chip, then one hot spot concentration section 2132 is provided in the microchannel area 213. If there are at least two high heat flux hot spot areas on the chip, then the same number of hot spot concentration sections 2132 are provided in the microchannel area 213.

[0044] The above description is the preferred embodiment of this utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this utility model, and these improvements and modifications should also be considered within the protection scope of this utility model.

Claims

1. A hot spot area heterogeneous pin-fin distribution microchannel heat sink, characterized in that, The system includes an intermediate conductor; the intermediate conductor contains a liquid cooling cavity, a liquid inlet, and a liquid outlet. The liquid cooling cavity is divided into an inlet area, a microchannel area, and an outlet area arranged sequentially along a first direction. The inlet area and the outlet area are respectively connected to the inlet and the outlet. The first direction is the direction of coolant flow. The microchannel area has a hot spot concentration section and a non-hot spot concentration section. The microchannel area is provided with a plurality of ribs and a plurality of needle fins. The ribs are distributed on the non-hot spot concentration section. The ribs extend along the first direction and are arranged at intervals along a second direction perpendicular to the first direction. Adjacent ribs form a first microchannel extending along the first direction. The needle fins are arranged on the hot spot concentration section. The gaps between the needle fins cooperate to form a second microchannel. Each needle fin has a spiral structure.

2. The hotspot area heterogeneous finned microchannel heat sink of claim 1, wherein, The number of hotspot concentration points is one or at least two.

3. The hotspot area heterogeneous finned microchannel heat sink of claim 1, wherein, The needle fins on the hot spot concentration section are arranged in at least two rows toward the liquid inlet area and the liquid outlet area, with adjacent rows of needle fins staggered.

4. The hotspot area heterogeneous finned microchannel heat sink of claim 3, wherein, The needle fins on the hot spot concentration section are arranged from sparse to dense in the direction from the liquid inlet area to the liquid outlet area.

5. The hotspot area heterogeneous finned microchannel heat sink of claim 1, wherein, The intermediate conductor includes a substrate and a cover plate connected together. The cover plate is located on one side of the substrate, and the liquid cooling cavity is formed on the side of the substrate facing the cover plate.

6. The hotspot area heterogeneous finned microchannel heat sink of claim 5, wherein, The cover plate and the substrate are made of LTCC, Cu or Al materials.

7. The hotspot area heterogeneous finned microchannel heat sink of claim 5, wherein, The cover plate and the substrate are not detachably connected, and the cover plate and the substrate are connected by adhesive, welding or high-temperature bonding.

8. The hotspot area heterogeneous finned microchannel heat sink of claim 1, wherein, The inlet and outlet are located on the same side of the intermediate conductor.

9. The hotspot area heterogeneous finned microchannel heat sink of claim 1, wherein, The liquid outlet and the liquid inlet are respectively located on different sides of the intermediate conductor.

10. The hotspot area heterogeneous finned microchannel heat sink of claim 1, wherein, The cross-section of the needle fin is circular, square, triangular, rhomboid, or elliptical.

Images