A low thermal resistance power module

Abstract

The utility model discloses a low heat resistance power module which is composed of a frame, a connecting layer material, a chip and a plastic sealing material. The chip is directly connected and arranged on the upper surface of the frame through the connecting layer material. The plastic sealing material encapsulates the chip on the upper surface of the frame to form an electrically insulated plastic sealing body. The two sides of the frame are extended and arranged by pins. The pins are outwardly and upwardly folded inwardly in a U shape and lead out of the plastic sealing body. Each electrode of the chip is interconnected with the outside through the pins. The frame and the pins are integrally formed of a metal frame and have the same thickness. The frame is combined with a heat sink through an interface material to shorten the heat transfer path. The application realizes the reduction of the board area of the module, the improvement of the integration degree and the reduction of the thermal resistance of the module with the frame scheme for the module with the same encapsulation and substrate.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, and in particular to a low thermal resistance power module. Background Technology

[0002] In the semiconductor packaging field, with the continuous development of electronic integration technology, the number of electronic components integrated on circuit boards is increasing. Intelligent power modules (IPMs) are advanced power switching devices with advantages such as high current density, low saturation voltage drop, and high withstand voltage, as well as high input impedance, high switching frequency, and low drive power. Specific electrical functions can be achieved by integrating different electronic components into the same circuit. Furthermore, to reduce the space occupied in electronic devices, these integrated electronic components are also developing towards increasingly smaller modular designs. Modular design not only facilitates installation but also reduces operating costs.

[0003] Power modules are formed by packaging power devices in a specific way, providing protection for the devices. However, power module packaging involves a series of complex processes, including a wide variety of packaging structures, materials, and technologies. Due to design limitations, packaged power devices can cause interference between different signals, affecting the module's performance, leading to high thermal resistance in the entire system, instability, and reduced integration. Furthermore, the related structures and processes are also related to manufacturing costs, material costs, and production efficiency. Utility Model Content

[0004] The purpose of this invention is to provide a low thermal resistance power module that addresses and compensates for the shortcomings of current technology. Without changing the customer's original installation foundation, it reduces the module's board area, improves integration, and lowers the module's thermal resistance.

[0005] To achieve the above technical objectives, this utility model provides a low thermal resistance power module, which is a packaged structure consisting of a frame, a connecting layer material, a chip, and a molding compound. The chip is directly connected to the upper surface of the frame only through the connecting layer material. The molding compound encapsulates the chip on the upper surface of the frame to form an electrically insulating molding body. Pins extend from both sides of the frame, and the pins are folded outward and upward inward into a U-shape and led out of the molding body. The electrodes of the chip are interconnected with the outside through the pins. The frame and the pins are integrally formed metal frames with the same thickness. The frame is combined with a heat sink through an interface material to shorten the heat transfer path.

[0006] This utility model provides a low thermal resistance power module that reduces the module's board area and improves integration without changing the customer's original installation foundation. Furthermore, for modules with substrates in the same package, the frame design reduces the module's thermal resistance.

[0007] As a further improvement, the chip is connected to the upper surface of the frame by welding, sintering or pressing. The electrodes of the chip include DC±, AC and G electrodes, and the pins include drive pins and power pins.

[0008] As a further improvement, the upper surface of the frame has multiple sets of horizontally arranged connection areas, each connection area having two chip arrangement areas facing each other end to end. The chip arrangement area is P-shaped, with its head connected to the chip and its tail extending to both sides of the frame and connected to the power pin. The drive pin is correspondingly arranged on the outer side of the head.

[0009] As a further improvement, the width of the drive pin is smaller than the width of the power pin.

[0010] As a further improvement, the soldering surface of the power pin has a semi-corroded area to relieve stress and increase soldering reliability.

[0011] As a further improvement, the depth of the semi-corroded region is greater than 0 and less than or equal to 1 / 2 the thickness of the power pin; the width is greater than 0 and less than or equal to 1 / 3 the width of the power pin.

[0012] This invention provides a low thermal resistance power module that reduces the board area by 15% and significantly reduces thermal resistance compared to similar packages with substrates. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the suction frame of this utility model; Figure 2 This is a schematic cross-sectional view of the suction frame of this utility model; Figure 3 This is a schematic diagram of the blister packaging of this utility model; Figure 4 This is a schematic diagram of the cross-section of the blister pack of this utility model; Figure 5 For existing technologies, a junction temperature separation curve is provided; Figure 6 This is the junction temperature separation curve of this utility model.

[0014] Reference numerals: 1. Frame, 2. Connector material, 3. Chip, 4. Molding compound, 5. Drive pin, 6. Power pin, 7. Semi-etched area. Detailed Implementation

[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0016] like Figures 1 to 6 As shown, this utility model provides a low thermal resistance power module, which is a packaged structure composed of a frame 1, a connecting layer material 2, a chip 3, and a molding compound 4. The chip 3 is directly connected to the upper surface of the frame 1 only through the connecting layer material 2. The molding compound 4 encapsulates the chip 3 on the upper surface of the frame 1 to form an electrically insulating molding body. The two sides of the frame 1 are extended with pins. The pins are folded outward and upward inward into a U-shape and led out of the molding body. The electrodes of the chip 3 are interconnected with the outside through the pins. The frame 1 and the pins are integrally formed metal frames with the same thickness. The frame 1 is combined with the heat sink through an interface material to shorten the heat transfer path.

[0017] This utility model provides a low thermal resistance power module that reduces the module's board area and improves integration without changing the customer's original installation foundation. Furthermore, for modules with substrates in the same package, the frame design reduces the module's thermal resistance.

[0018] As a further improvement, the chip 3 is connected to the upper surface of the frame 1 by welding, sintering or pressing. The electrodes of the chip 3 include DC±, AC and G electrodes, and the pins include drive pins 5 and power pins 6.

[0019] As a further improvement, the upper surface of the frame 1 has multiple sets of horizontally arranged connection areas, each connection area having two chip arrangement areas facing each other end to end. The chip arrangement area is P-shaped, with its head connected to the chip 3 and its tail extending to both sides of the frame 1 and connected to the power pin 6. The drive pin 5 is correspondingly arranged on the outer side of the head.

[0020] As a further improvement, the width of the drive pin 5 is smaller than the width of the power pin 6.

[0021] As a further improvement, the soldering surface of the power pin 6 has a semi-corroded area 7 to relieve stress and increase soldering reliability.

[0022] As a further improvement, the depth of the semi-corroded region 7 is greater than 0 and less than or equal to 1 / 2 the thickness of the power pin 6; the width is greater than 0 and less than or equal to 1 / 3 the width of the power pin 6.

[0023] This invention provides a low thermal resistance power module that reduces the board area by 15% and significantly reduces thermal resistance compared to similar packages with substrates.

[0024] In a preferred embodiment of this utility model, this utility model provides a low thermal resistance power module that reduces the module's footprint and improves integration without changing the customer's original installation foundation. Furthermore, for modules with the same package and substrate, the frame design reduces the module's thermal resistance.

[0025] like Figures 1 to 4 As shown, this utility model discloses a low thermal resistance frame-type pin-folded module, belonging to the field of power electronic chip packaging technology. The packaging structure includes a frame 1, a connecting layer material 2, a chip 3, and a molding compound 4. The frame can be a metal frame such as copper. The chip can be connected to the frame through the connecting layer by means of welding, sintering, or pressing, and then encapsulated by the molding compound to form electrical insulation. The DC±, AC, and G electrodes are led out of the molding compound through pin folds for interconnection with the outside.

[0026] In contrast, existing technologies use six TOLLs connected in parallel to form a three-phase full-bridge circuit, with a module size of 33.8*25.5 mm. Without altering the customer's original installation method, this invention uses an integrated frame design to replace the six TOLLs, reducing the board area to 34.9*21 mm. This represents a 15% reduction in board area.

[0027] This utility model discloses a low thermal resistance frame-type pin-folded module. The chip 3 is directly bonded to the frame via adhesive material, and the frame 1 is bonded to the heat sink via interface material, shortening the heat transfer path and effectively reducing thermal resistance. Compared with the same packaged solution with a substrate, the thermal resistance of the substrate solution is 0.75℃ / W, while the thermal resistance of the frame solution is 0.5℃ / W.

[0028] This invention provides a low thermal resistance power module with inward-folded pins, resulting in a smaller board area, higher integration, and multi-pin soldering, which improves soldering reliability and mechanical strength. The pin soldering surface has semi-etched properties, which can release stress and increase soldering reliability. The depth of the semi-etched area is greater than 0 and less than or equal to 1 / 2 of the frame thickness; the width is greater than 0 and less than or equal to 1 / 3 of the frame pin width.

[0029] It should be understood that the scope of protection sought by this utility model is not limited to the non-limiting embodiments, which are merely illustrative examples. The substantive scope of protection claimed in this application is further embodied in the scope provided by the independent claims and their dependent claims.

Claims

1. A low thermal resistance power module, characterized in that: The package structure consists of a frame, a connecting layer material, a chip, and a molding compound. The chip is directly connected to the upper surface of the frame only through the connecting layer material. The molding compound encapsulates the chip on the upper surface of the frame to form an electrically insulating molded body. Pins extend from both sides of the frame, and the pins are folded outward and upward inward into a U-shape and led out of the molded body. The electrodes of the chip are interconnected with the outside through the pins. The frame and the pins are integrally formed metal frames with the same thickness. The frame is combined with a heat sink through an interface material to shorten the heat transfer path.

2. The low thermal resistance power module according to claim 1, characterized in that: The chip is connected to the upper surface of the frame by welding, sintering or pressing. The electrodes of the chip include DC±, AC and G electrodes, and the pins include drive pins and power pins.

3. A low thermal resistance power module according to claim 2, characterized in that: The upper surface of the frame has multiple sets of horizontally arranged connection areas. Each connection area has two chip arrangement areas that are opposite each other. The chip arrangement area is P-shaped, with its head connected to the chip and its tail extending to both sides of the frame and connected to the power pin. The drive pin is arranged on the outer side of the head.

4. A low thermal resistance power module according to claim 3, characterized in that: The width of the drive pin is smaller than the width of the power pin.

5. A low thermal resistance power module according to claim 4, characterized in that: The soldering surfaces of the power pins have a semi-corroded area to relieve stress and increase soldering reliability.

6. A low thermal resistance power module according to claim 5, characterized in that: The depth of the semi-corroded region is greater than 0 and less than or equal to 1 / 2 the thickness of the power pin; the width is greater than 0 and less than or equal to 1 / 3 the width of the power pin.

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