High-temperature-resistant inorganic artificial stone plate with heat-conducting heat-dissipating structure

Abstract

The utility model discloses a kind of high-temperature-resistant inorganic artificial stone panel with heat conduction heat dissipation structure, relate to artificial stone technical field.The utility model discloses a main plate body and subplate body, first radiating groove accommodating groove for accommodating subplate body is opened in main plate body, subplate body is located in first radiating groove accommodating groove, main plate body and subplate body are bonded fixed, and main plate body and subplate body are spliced into artificial stone panel main body;To increase the heat dissipation performance of artificial stone panel main body, communication groove is opened in the bottom end of subplate body, and a group of heat dissipation components are provided in main plate body and subplate body, and heat dissipation component is used to quickly dissipate the heat on the surface of main plate body;Heat can be rapidly conducted to the communication groove in the heat dissipation channel and dissipate, greatly improve the heat dissipation efficiency of panel, effectively reduce panel surface temperature.

Description

Technical Field

[0001] This utility model belongs to the field of artificial stone technology, and in particular relates to a high-temperature resistant inorganic artificial stone slab with a heat-conducting and heat-dissipating structure. Background Technology

[0002] In the fields of architectural decoration and industrial applications, inorganic artificial stone slabs are widely used due to their aesthetic appeal and durability.

[0003] Artificial stone slabs may experience performance degradation, shortened lifespan, or even safety hazards due to heat accumulation in specific application scenarios, such as as tabletops for park stone tables, seat surfaces for stone chairs, or kitchen countertops. Existing artificial stone slabs lack effective heat dissipation structures, making it inconvenient to quickly dissipate surface heat.

[0004] To address the aforementioned issues, this utility model proposes a high-temperature resistant inorganic artificial stone slab with a heat-conducting and heat-dissipating structure. Utility Model Content

[0005] The purpose of this invention is to provide a high-temperature resistant inorganic artificial stone slab with a heat-conducting and heat-dissipating structure. Heat can be quickly conducted through the heat dissipation channel to the connecting groove and dissipated, which greatly improves the heat dissipation efficiency of the slab, effectively reduces the surface temperature of the slab, and solves the existing technical problems.

[0006] To solve the above-mentioned technical problems, this utility model is achieved through the following technical solution: A high-temperature resistant inorganic artificial stone slab with a thermally conductive and heat-dissipating structure, used to dissipate high temperatures on the surface of the artificial stone slab, comprising: The main board and the sub-board are provided. The main board has a first heat dissipation groove for accommodating the sub-board. The sub-board is located in the first heat dissipation groove. The main board and the sub-board are bonded and fixed together. The main board and the sub-board are assembled into the main body of the artificial stone slab. In order to increase the heat dissipation performance of the main body of the artificial stone slab, a connecting groove is provided at the bottom of the sub-slab. A set of heat dissipation components is provided in the main body and the sub-slab, which are used to quickly dissipate the heat from the surface of the main body. A baffle is provided in the connecting groove to protect the heat dissipation components. A set of connecting components is provided between the baffle and the sub-plate to fix the baffle in the connecting groove.

[0007] Optionally, the heat dissipation component includes a plurality of first heat dissipation slots formed in the motherboard body, a plurality of second heat dissipation slots formed in the sub-board body, the plurality of first heat dissipation slots being matched with the plurality of second heat dissipation slots respectively, and a plurality of third heat dissipation slots connected to the connecting slots being formed in the sub-board body, the plurality of third heat dissipation slots being connected to the plurality of second heat dissipation slots respectively. The heat from the motherboard surface can be quickly transferred through the first, second, and third heat dissipation slots between the motherboard and the sub-board, and then dissipated into the connecting slots after passing through multiple third heat dissipation slots.

[0008] Optionally, the connecting assembly includes four positioning posts disposed within the communicating groove. Each of the four positioning posts includes a limiting cylinder and a matching cylinder. The four limiting cylinders are bonded and fixed within the communicating groove. The four matching cylinders are respectively fixed to the bottom ends of the four limiting cylinders. Each of the four positioning posts has a threaded groove. The baffle has four matching grooves, which are respectively matched with the four matching cylinders. The baffle and the four matching cylinders have the same thickness. The baffle is limited by the four limiting cylinders. Bolts are threaded into each of the four threaded grooves. The baffle is fixed in position by inserting four matching cylinders into four matching slots, and then tightening the bolts in sequence to limit the position of the baffle, which can prevent it from falling off.

[0009] Optionally, four limiting grooves are provided in the body of the sub-plate, and the four limiting cylinders are respectively glued and fixed in the four limiting grooves; The four limiting slots can effectively ensure that the four matching cylinders are aligned with the four matching slots in the baffle.

[0010] Optionally, a U-shaped frame is fixed to the surface of the baffle, and a heat dissipation gap is formed between the U-shaped frame and the sub-plate body; The heat dissipation gap has a wide air intake and a narrow air intake, which can effectively block dust and further protect the third heat dissipation slot.

[0011] Optionally, boron nitride is added to both the main board body and the sub-board body.

[0012] In this invention, a high-temperature resistant inorganic artificial stone slab with a heat-conducting and heat-dissipating structure forms a highly efficient heat dissipation channel by setting a first heat dissipation groove, a second heat dissipation groove, and a third heat dissipation groove that are interconnected within the main body and the sub-body. When the surface of the main body absorbs heat, the heat can be quickly conducted through the heat dissipation channel to the interconnecting grooves and dissipated, greatly improving the heat dissipation efficiency of the slab, effectively reducing the surface temperature of the slab, avoiding problems such as deformation and aging of the slab due to high temperature, and extending the service life of the slab. In this invention, a high-temperature resistant inorganic artificial stone slab with a heat-conducting and heat-dissipating structure features a heat dissipation gap formed between the U-shaped frame fixed to the baffle surface and the sub-plate. Its unique design—wide air intake and narrow air inlet—effectively prevents dust from entering the connecting groove and the third heat dissipation groove. This not only avoids dust clogging the heat dissipation channels and affecting the heat dissipation effect, but also reduces dust erosion of the slab's internal structure, further improving the slab's service life and performance stability.

[0013] Of course, any product implementing this utility model does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0014] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a three-dimensional schematic diagram of the present invention.

[0016] Figure 2 This is a partial sectional view of the present invention.

[0017] Figure 3 This is a partial exploded view of the first heat dissipation groove in this utility model.

[0018] Figure 4 This is a partial exploded view of the second heat dissipation groove in this utility model.

[0019] In the diagram: 1. Main board body; 2. Sub-board body; 3. First heat dissipation slot receiving slot; 4. Connecting slot; 5. Baffle; 6. U-shaped frame; 7. First heat dissipation slot; 8. Second heat dissipation slot; 9. Third heat dissipation slot; 10. Positioning post; 101. Limiting cylinder; 102. Matching cylinder; 11. Threaded groove; 12. Bolt; 13. Heat dissipation gap; 14. Limiting groove; 15. Matching groove. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0021] In the description of this utility model, it should be understood that the terms "opening", "upper", "middle", "length", "inner", etc., which indicate orientation or positional relationship, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the components or elements referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0022] To keep the following description of the embodiments of this utility model clear and concise, detailed descriptions of known functions and known components are omitted.

[0023] Example 1 Please see Figures 1-4 As shown, this embodiment provides a high-temperature resistant inorganic artificial stone slab with a heat-conducting and heat-dissipating structure. The main body consists of a main body 1 and a secondary body 2. A first heat dissipation groove 3 is formed on the main body 1. The secondary body 2 is placed in the first heat dissipation groove 3 and fixedly connected to the main body 1 by adhesive bonding. The two are then assembled to form a complete artificial stone slab body. In the production process, the main body 1 and the secondary body 2 are first processed into their respective shapes. The main body 1 has a pre-reserved first heat dissipation groove 3 of appropriate size and depth. Then, the secondary body 2 is placed into the first heat dissipation groove 3, a special adhesive is applied, and appropriate pressure is applied to ensure tight adhesion and fixation. To improve the heat dissipation performance of the board, a heat dissipation assembly is installed inside the main board body 1 and the sub-board body 2. Specifically, multiple first heat dissipation slots 7 are evenly distributed inside the main board body 1, and multiple second heat dissipation slots 8 are correspondingly distributed inside the sub-board body 2, with each of the first heat dissipation slots 7 and the second heat dissipation slots 8 being matched one-to-one. At the same time, multiple third heat dissipation slots 9 are also provided inside the sub-board body 2. One end of each of these third heat dissipation slots 9 is connected to one of the second heat dissipation slots 8, and the other end is connected to a connecting slot 4 at the bottom of the sub-board body 2. When the surface of the motherboard 1 absorbs heat, the heat is first conducted through the material of the motherboard 1 to the area around each of the first heat sinks 7. Since the first heat sinks 7 and the second heat sinks 8 are matched and correspond, the heat can be quickly transferred between the first heat sinks 7 and the second heat sinks 8. Then, the heat is conducted through the third heat sink 9 connected to the second heat sink 8 to the connecting groove 4. Finally, the heat is exchanged with the surrounding air in the connecting groove 4, thereby achieving the purpose of quickly dissipating the heat from the surface of the motherboard 1. A baffle 5 is installed inside the connecting groove 4 to protect the heat dissipation components and prevent external debris from entering the connecting groove 4 and blocking the heat dissipation channel. The baffle 5 is fixed inside the connecting groove 4 by a connecting assembly. The connecting assembly specifically includes four positioning posts 10, each positioning post 10 consisting of a limiting cylinder 101 and a matching cylinder 102. Four limiting grooves 14 are opened in the sub-plate body 2, and the four limiting cylinders 101 are respectively glued and fixed in these four limiting grooves 14, so that the four matching cylinders 102 are respectively fixed to the bottom ends of the four limiting cylinders 101, and threaded grooves 11 are opened in each of the four positioning posts 10. At the same time, four matching grooves 15 are opened in the baffle 5, and these four matching grooves 15 are respectively matched with the four matching cylinders 102, and the thickness of the baffle 5 and the four matching cylinders 102 is the same. When installing the baffle 5, place the baffle 5 into the connecting groove 4, so that the four matching cylinders 102 are respectively inserted into the four matching grooves 15. At this time, the baffle 5 is limited by the four limiting cylinders 101. Then, screw the four bolts 12 into the four threaded grooves 11 in sequence. Through the threaded connection between the bolts 12 and the threaded grooves 11, the baffle 5 is further limited to prevent it from falling off.

[0024] Example 2 Improvements based on Example 1: Refer to Appendix Figure 1 -Appendix Figure 4 A high-temperature resistant inorganic artificial stone slab with a heat-conducting and heat-dissipating structure is provided. A U-shaped frame 6 is fixed on the surface of the baffle 5, forming a heat dissipation gap 13 between the U-shaped frame 6 and the sub-plate 2. The heat dissipation gap 13 is designed with a wide air inlet and a narrow air outlet. This unique design can effectively prevent dust from entering. The ratio of the width of the air inlet to the width of the air outlet is 1.5:1 to 3:1. When air enters the heat dissipation gap 13 from the wider air inlet, the air velocity increases due to the narrower air outlet, which can more effectively remove the heat dissipated in the connecting groove 4. At the same time, it further protects the third heat dissipation groove 9, preventing dust from entering and clogging the third heat dissipation groove 9, thus affecting the heat dissipation effect. The cross-sectional shapes of the first heat dissipation groove 7, the second heat dissipation groove 8, and the third heat dissipation groove 9 are rectangular, trapezoidal, or semi-circular.

[0025] To improve the thermal conductivity and high-temperature resistance of the board, boron nitride was added during the manufacturing process of both the main board 1 and the sub-board 2. The mass percentage of boron nitride was 5%-15%, and the particle size of boron nitride was 10-50μm. Boron nitride has good thermal conductivity and high-temperature resistance, which can effectively improve the overall thermal conductivity and heat dissipation capacity of the board, so that the board can maintain good performance and stability in high-temperature environments.

[0026] It should be noted that in the description of this specification, descriptions such as "first heat sink" and "second heat sink" are only used to distinguish the features and do not have any actual order or directional meaning. This application is not limited to this.

[0027] The accompanying drawings in this application are for illustrative purposes only. The dimensions and shapes of the components shown are not actual limitations but are merely schematic representations. In actual implementation, the components can be reasonably configured and adjusted according to specific needs and actual conditions.

[0028] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0029] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the utility model to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of this utility model, thereby enabling those skilled in the art to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A high-temperature resistant inorganic artificial stone slab with a thermally conductive and heat-dissipating structure, characterized in that, include: The motherboard body (1) and the sub-board body (2) are provided. The motherboard body (1) has a first heat sink receiving slot (3) and the sub-board body (2) is disposed in the first heat sink receiving slot (3) and is bonded and fixed to the motherboard body (1). The heat dissipation assembly includes multiple first heat dissipation slots (7) opened in the main board body (1), multiple second heat dissipation slots (8) opened in the sub-board body (2) and multiple third heat dissipation slots (9). The first heat dissipation slots (7) are connected to the second heat dissipation slots (8) respectively. One end of the third heat dissipation slot (9) is connected to the second heat dissipation slot (8) and the other end is connected to the connecting slot (4) opened at the bottom of the sub-board body (2). A baffle (5) is disposed in the connecting groove (4) and fixed by a connecting component; The heat on the surface of the motherboard body (1) is conducted to the connecting groove (4) for heat dissipation through the first heat dissipation groove (7), the second heat dissipation groove (8) and the third heat dissipation groove (9).

2. The high-temperature resistant inorganic artificial stone slab with a thermally conductive and heat-dissipating structure as described in claim 1, characterized in that, The connection component includes: Four positioning posts (10), each positioning post (10) includes a limiting cylinder (101) and a matching cylinder (102), the limiting cylinder (101) is fixed in the communicating groove (4), and the matching cylinder (102) is fixed at the bottom end of the limiting cylinder (101); Four threaded grooves (11) are respectively opened in the four positioning pins (10); Four matching slots (15) are opened inside the baffle (5) and correspond to and cooperate with four matching cylinders (102); Four bolts (12) are threaded into four threaded grooves (11), respectively; The baffle (5) is positioned by the matching cylinder (102) and the matching groove (15) and is fixed by bolts (12).

3. The high-temperature resistant inorganic artificial stone slab with a thermally conductive and heat-dissipating structure as described in claim 2, characterized in that, The sub-plate (2) has four limiting grooves (14) and four limiting cylinders (101) are fixed in the four limiting grooves (14).

4. A high-temperature resistant inorganic artificial stone slab with a thermally conductive and heat-dissipating structure as described in claim 3, characterized in that, A U-shaped frame (6) is fixed on the surface of the baffle (5), and a heat dissipation gap (13) is formed between the U-shaped frame (6) and the sub-plate (2). The width of the air inlet of the heat dissipation gap (13) is greater than the width of the air outlet.

5. A high-temperature resistant inorganic artificial stone slab with a thermally conductive and heat-dissipating structure as described in claim 4, characterized in that, The ratio of the width of the air inlet to the width of the air outlet of the heat dissipation gap (13) is 1.5:1 to 3:

1.

6. The high-temperature resistant inorganic artificial stone slab according to any one of claims 1-5, characterized in that, The cross-sectional shape of the first heat sink (7), the second heat sink (8) and the third heat sink (9) is rectangular, trapezoidal or semi-circular.

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