Ultrasound probe and ultrasound system

Abstract

The utility model provides a kind of ultrasonic probe and ultrasonic system.Ultrasonic probe includes ultrasonic vibration element, ultrasonic signal transceiver circuit, shielding layer, suppress interference part and be used for with the contact of electrically conductive part of examinee, ultrasonic signal transceiver circuit is connected to ultrasonic vibration element, shielding layer surrounds at least part of ultrasonic signal transceiver circuit, suppress interference part is connected between shielding layer and electrically conductive part, shielding layer, suppress interference part and electrically conductive part are spaced apart from ultrasonic signal transceiver circuit.The ultrasonic probe of the utility model, for the interference signal that enters by the proximal end or distal end of ultrasonic probe, can be discharged outside through the discharge path that does not influence each other with ultrasonic signal transceiver circuit, and the anti-interference ability to interference signal is strong, and the stability when using is improved.

Description

Technical Field

[0001] This utility model relates to the field of medical device technology, specifically to an ultrasound probe and an ultrasound system. Background Technology

[0002] With advancements in medical technology, ultrasound equipment is increasingly used in clinical diagnosis and treatment. Currently, ultrasound scans involve examining the subject using an ultrasound probe. However, during use, especially in departments with complex electromagnetic environments, external electromagnetic interference signals can easily be introduced into the probe. This internal interference can disrupt the ultrasound signal transmission and reception circuitry, thus interfering with the received ultrasound signal. Consequently, the resulting ultrasound image appears distorted, severely impacting the doctor's experience and diagnostic capabilities. Therefore, there is an urgent need for an ultrasound probe with stronger anti-interference capabilities. Utility Model Content

[0003] To at least partially address the problems existing in the prior art, according to one aspect of the present invention, an ultrasonic probe is provided. The ultrasonic probe includes an ultrasonic element, an ultrasonic signal transceiver circuit, a shielding layer, an interference suppression component, and a conductive portion for contacting a subject. The ultrasonic signal transceiver circuit is connected to the ultrasonic element, the shielding layer surrounds at least a portion of the ultrasonic signal transceiver circuit, and the interference suppression component is connected between the shielding layer and the conductive portion. The shielding layer, the interference suppression component, and the conductive portion are all spaced apart from the ultrasonic signal transceiver circuit.

[0004] In the ultrasonic probe provided by this invention, the shielding layer is connected to the conductive part through an interference suppression component, and the conductive part is in direct contact with the subject. A discharge path for interference signals can be formed from the shielding layer to the subject. Interference signals entering the ultrasonic probe from the proximal end can be transmitted to the shielding layer, then through the interference suppression component to the conductive part, and finally discharged to ground from the conductive part to the subject. The overall transmission path of the interference signal will not affect the ultrasonic signal transceiver circuit, thus avoiding interference from the proximal end of the ultrasonic probe to the ultrasonic signal transmission and reception. Interference signals entering the ultrasonic probe from the distal end can be transmitted through the conductive part to the interference suppression component, then further to the shielding layer, and discharged to ground, again avoiding interference from the distal end of the ultrasonic probe to the ultrasonic signal transmission and reception. Therefore, the ultrasonic probe of this invention can discharge interference signals entering from either the proximal or distal end of the ultrasonic probe through a discharge path that does not affect the ultrasonic signal transceiver circuit, exhibiting strong anti-interference capability and improving stability during use.

[0005] For example, an ultrasonic probe includes a head end, on which at least a portion of a conductive portion is disposed.

[0006] For example, the ultrasound probe includes a grip portion, the distal end of which is connected to the proximal end of the head end, a shielding layer extending into the grip portion from the proximal end of the grip portion, and an interference suppression element disposed within the grip portion.

[0007] For example, at least a portion of the conductive part is disposed on the distal end of the head end.

[0008] For example, the head end includes a portion made of a conductive material.

[0009] For example, the interference suppression element includes a capacitor; and / or, the interference suppression element includes a high-voltage resistor.

[0010] For example, the capacitor includes a Y1 capacitor.

[0011] For example, the capacitance of the capacitor is no greater than 1000pF.

[0012] According to another aspect of the present invention, an ultrasound system is provided. The ultrasound system includes an ultrasound main unit and any of the ultrasound probes described above, the ultrasound probes being connected to the ultrasound main unit.

[0013] For example, the ultrasound host includes a neutral / live wire to ground capacitor and a primary bridging capacitor of the switching power supply. The interference suppression component is a capacitor, and the sum of the capacitances of the primary bridging capacitor and the neutral / live wire to ground capacitor is equal to the capacitance of the capacitor.

[0014] This utility model description introduces a series of simplified concepts, which will be further explained in detail in the detailed description section. This utility model description is not intended to limit the key features and essential technical features of the claimed technical solution, nor is it intended to determine the scope of protection of the claimed technical solution.

[0015] The advantages and features of this utility model will be described in detail below with reference to the accompanying drawings. Attached Figure Description

[0016] The following drawings, which are incorporated herein by reference as part of this invention, are provided for understanding the invention. The drawings illustrate embodiments of the invention and their descriptions, serving to explain the principles of the invention. In the drawings,

[0017] Figure 1 This is a schematic diagram of an ultrasound system according to an exemplary embodiment of the present invention;

[0018] Figure 2 This is a schematic diagram of an ultrasonic system according to an exemplary embodiment of the present invention, showing the interference signal discharge path; and

[0019] Figure 3 This is a schematic diagram of a partial structure of an ultrasonic system according to an exemplary embodiment of the present invention.

[0020] The above figures include the following reference numerals:

[0021] 1. Ultrasonic system; 100. Ultrasonic probe; 110. Ultrasonic vibrator; 120. Ultrasonic signal transceiver circuit; 130. Shielding layer; 140. Interference suppression component; 150. Conductive part; 160. Insulating layer; 200. Ultrasonic main unit; 210. Internal circuit of ultrasonic main unit; 220. Neutral and live wire to ground capacitance; 230. Primary bridging capacitor; 300. Interference signal discharge path; 400. Main power supply; 2. Subject under test. Detailed Implementation

[0022] In the following description, numerous details are provided to enable a thorough understanding of the present invention. However, those skilled in the art will appreciate that the following description merely illustrates preferred embodiments of the present invention, which may be practiced without one or more of these details. Furthermore, to avoid confusion with the present invention, some technical features well-known in the art have not been described in detail.

[0023] According to one aspect of the present invention, an ultrasonic probe is provided. The ultrasonic probe can be applied to any suitable ultrasonic system. Therefore, according to another aspect of the present invention, an ultrasonic system is provided. See also... Figure 1 The ultrasound system 1 may include an ultrasound host 200 and any of the ultrasound probes 100 described below, which may be connected to the ultrasound host 200. The ultrasound host 200 may be connected to a mains power supply 400.

[0024] See Figure 1The ultrasonic probe 100 may include an ultrasonic element 110, an ultrasonic signal transceiver circuit 120, a shielding layer 130, an interference suppression component 140, and a conductive portion 150 for contacting the subject 2. The ultrasonic signal transceiver circuit 120 may be connected to the ultrasonic element 110. When the ultrasonic probe 100 is connected to the ultrasonic host 200, the ultrasonic signal transceiver circuit 120 may be connected between the ultrasonic element 110 and the internal circuitry 210 of the ultrasonic host. The shielding layer 130 may surround at least a portion of the ultrasonic signal transceiver circuit 120. The ultrasonic probe 100 may include a cable, at least a portion of the shielding layer 130 and at least a portion of the ultrasonic signal transceiver circuit 120 may be located inside the cable, and the cable may have an insulation layer 160, the portion of the shielding layer 130 located inside the cable and the portion of the ultrasonic signal transceiver circuit 120 located inside the cable may be surrounded by the insulation layer 160. The shielding layer 130 may be grounded, and interference signals on the shielding layer 130 may be discharged through the grounding of the shielding layer 130. The interference suppression element 140 can be connected between the shielding layer 130 and the conductive part 150. The conductive part 150 can be a portion of the ultrasonic probe 100 made of conductive material. For example, the conductive part 150 can be disposed on the tip of the ultrasonic probe 100, in which case the tip of the ultrasonic probe 100 can correspondingly have a portion made of conductive material. When the ultrasonic probe 100 probes the subject 2, at least a portion of the ultrasonic probe 100 will contact the subject 2, and the portion of the ultrasonic probe 100 in contact with the subject 2 may include the conductive part 150.

[0025] When existing ultrasonic probes are in use, since both the ultrasonic transducer and the test object 2 can be considered as conductors, a parasitic capacitance will be formed between the ultrasonic transducer and the test object 2 when the ultrasonic probe contacts the test object 2. The shielding layer cannot surround the entire ultrasonic signal transceiver circuit. Since a shielding layer cannot be set around the part of the ultrasonic signal transceiver circuit connected to the ultrasonic transducer, interference signals can enter the ultrasonic host through coupling between the power supply and the test object 2 or through spatial coupling. These interference signals will pass through the ultrasonic signal transceiver circuit, thereby creating noise effects on the ultrasonic signal transceiver circuit, causing interference to appear on the ultrasonic image formed after the ultrasonic signal transceiver circuit acquires the ultrasonic signal.

[0026] The ultrasonic probe 100 provided in this application, see [reference needed]. Figure 2The shielding layer 130, the interference suppression element 140, and the conductive part 150 can all be spaced apart from the ultrasonic signal transceiver circuit 120. By providing the conductive part 150 on the ultrasonic probe 100, and connecting the shielding layer 130 to the conductive part 150 through the interference suppression element 140, an interference signal discharge path 300 can be formed. The interference signal discharge path 300 is spaced apart from the ultrasonic signal transceiver circuit 120, thus preventing interference signals from interfering with the ultrasonic signal transceiver circuit 120. This provides the ultrasonic probe 100 with stronger anti-interference capabilities. When external electromagnetic interference enters the ultrasonic host 200 through the mains power supply, grounding line, or any other means, these interference signals enter the shielding layer 130, are transmitted through the interference suppression element 140 to the conductive part 150, and further transmitted to the subject 2 before being grounded and discharged. During this process, the interference signal discharge path 300 is spaced apart from the ultrasonic signal transceiver circuit 120, and the interference signals do not affect the ultrasonic signal transceiver circuit 120. When external electromagnetic interference enters the ultrasonic probe 100 through the test subject 2 or other means, it can first be transmitted to the conductive part 150, and then from the conductive part 150 through the interference suppression component 140 to the shielding layer 130. Afterwards, it can be discharged to ground through the shielding layer 130. During this process, the interference signal discharge path 300 is separated from the ultrasonic signal transceiver circuit 120, and the interference signal will not affect the ultrasonic signal transceiver circuit 120. Therefore, interference signals entering the ultrasonic host 200 from the mains power supply 400 or other means and then transmitted to the ultrasonic probe 100, as well as interference signals entering the ultrasonic probe 100 from the test subject 2 or other means, can all be discharged through the interference signal discharge path 300, which is independent of the ultrasonic signal transceiver circuit 120.

[0027] In the ultrasonic probe 100 provided by this utility model, the shielding layer 130 is connected to the conductive part 150 through the interference suppression component 140, and the conductive part 150 is in direct contact with the subject 2. A path for dissipating interference signals can be formed from the shielding layer 130 to the subject 2. Interference signals entering the ultrasonic probe 100 from its proximal end (i.e., the end of the ultrasonic probe 100 closest to the ultrasonic host 200, or the end of the ultrasonic probe 100 used for connection to the ultrasonic host 200) can be transmitted to the shielding layer 130, then through the interference suppression component 140 to the conductive part 150, and finally from the conductive part 150 to the subject 2 for grounding. The overall transmission path of the interference signal will not affect the ultrasonic signal transceiver circuit 120, thus preventing interference signals from entering the ultrasonic probe 100 from its proximal end. Interference signals of 0 interfere with the transmission and reception of ultrasonic signals. Interference signals entering the ultrasonic probe 100 from its distal end (i.e., the end of the ultrasonic probe 100 furthest from the ultrasonic host 200, or the end of the ultrasonic probe 100 closest to the ultrasonic element 110 and first in contact with the subject 2) can be transmitted through the conductive part 150 to the interference suppression component 140 and then further to the shielding layer 130 before being grounded and discharged. This prevents interference signals entering the ultrasonic probe 100 from its distal end from interfering with the transmission and reception of ultrasonic signals. Therefore, the ultrasonic probe 100 of this invention can discharge interference signals entering from either its proximal or distal end through the interference signal discharge path 300, which is independent of the ultrasonic signal transceiver circuit 120. This provides strong anti-interference capability and improves stability during use.

[0028] In one embodiment of this invention, the ultrasonic probe 100 may include a head end, and at least a portion of the conductive part 150 may be disposed on the head end. Understandably, the head end is the structure on the ultrasonic probe 100 that first contacts the subject 2, and an ultrasonic element 110 may also be disposed within the head end. The fact that at least a portion of the conductive part 150 is disposed on the head end ensures that the conductive part 150 can contact the subject 2, thereby ensuring that such an ultrasonic probe 100 can form an interference signal discharge path 300 during use. Furthermore, the conductive part 150 can be made of a conductive material, thus possessing a certain degree of rigidity. The head end, with at least a portion of rigidity, reduces wear when in contact with the subject 2, making it more convenient. In some embodiments, the conductive part 150 can be made of a metallic conductive material, which is easy to process and manufacture, ensuring that the ultrasonic probe 100 can form an interference signal discharge path 300 during use. When the ultrasound probe 100 is used for in vivo ultrasound, the tip can be inserted into the subject 2. The tip experiences significant wear when inside the subject 2. However, because the conductive part 150 is made of a conductive metal, the lifespan of the tip is extended. When the ultrasound probe 100 is used for in vitro ultrasound, wear is reduced when the tip contacts the subject 2, thus improving durability.

[0029] Exemplarily, the ultrasound probe 100 may include a grip portion, the distal end of which (i.e., the end of the grip portion away from the ultrasound host 200) may be connected to the proximal end of the head end (i.e., the end of the head end close to the ultrasound host 200). The grip portion may be a structure on the ultrasound probe 100 connected to the head end. Specifically, the ultrasound probe 100 may be divided into multiple segments, and the grip portion and the head end may be two connected segments of the ultrasound probe 100. The shielding layer 130 may extend into the grip portion from the proximal end, and the interference suppression member 140 may be disposed within the grip portion. It should be noted that the grip portion has sufficient space to accommodate the interference suppression component 140. Since the interference suppression component 140 is connected between the shielding layer 130 and the conductive part 150, and the shielding layer 130 needs to surround the ultrasonic signal transceiver circuit 120 as much as possible to reduce signal interference, the shielding layer 130 can be at least partially disposed within the grip portion. Furthermore, to prevent the shielding layer 130 from interfering with the signal transmission of the ultrasonic element 110, the portion of the shielding layer 130 located within the grip portion can extend from the proximal end of the grip portion. For the ultrasonic probe 100 including a cable, the cable can be connected between the proximal end of the grip portion and the ultrasonic host 200. The cable can be a section of the ultrasonic probe 100 connected to the grip portion, and the shielding layer 130 disposed within the cable can extend from the proximal end of the grip portion into the grip portion. Sufficient space within the grip portion is available for accommodating the interference suppression component 140, resulting in a more rational overall structure.

[0030] Exemplarily, at least a portion of the conductive part 150 may be disposed on the distal end of the head tip (i.e., the end of the head tip away from the ultrasound host 200). The ultrasound element 110 may typically be disposed within the head tip, and the head tip usually needs to be in contact with the subject 2 to obtain better imaging results. The fact that at least a portion of the conductive part 150 is disposed on the head tip ensures that the conductive part 150 can contact the subject 2, thereby ensuring that such an ultrasound probe 100 can form an interference signal discharge path 300 during use. When the ultrasound probe 100 is used for in vivo ultrasound, the ultrasound probe 100 may include an insertion part, the distal end of which may be provided with the head tip. Since at least a portion of the conductive part 150 may be disposed on the distal end of the head tip, the distal end of the head tip is inserted into the subject 2 first. When it is inserted into the subject 2, not only is it ensured that such an ultrasound probe 100 can form an interference signal discharge path 300 during use, but also, through the rigidity of the conductive part 150, wear is reduced, extending the service life of the head tip. When the ultrasound probe 100 is used in external ultrasound, the distal end of the probe tip first contacts the subject 2. When the probe tip contacts the subject 2, wear is reduced, durability is improved, and the ultrasound probe 100 is ensured to form an interference signal discharge path 300 during use. Exemplarily, the probe tip may include a portion made of conductive material, and a conductive portion 150 may be formed on the conductive portion of the probe tip. Exemplarily, the probe tip may include a conductive head shell made of conductive material, and at least a portion of the conductive portion 150 may be formed on the conductive head shell.

[0031] For example, the head end may include a portion made of conductive material. At least a portion of the conductive part 150 may be formed on the portion made of conductive material in the head end. This simplifies the formation of the interference signal discharge path 300 and makes the overall structure simpler and easier to implement. For example, the head end may include a conductive shell made of conductive material, and at least a portion of the conductive part 150 may be formed on the conductive shell.

[0032] For example, the interference suppression component 140 may include a capacitor. The capacitor has a good effect on dissipating interference signals. The shielding layer 130 is connected to the conductive part 150 through the capacitor, and the conductive part 150 is in direct contact with the test object 2. A discharge path for interference signals can be formed from the shielding layer 130 to the test object 2.

[0033] For example, the interference suppression component 140 may include a high-voltage resistor. In some embodiments, the resistance of the high-voltage resistor may be 100KΩ, and the withstand voltage of the high-voltage resistor may be 4KV. The high-voltage resistor can ensure the discharge of interference signals, withstand higher voltages, reduce the risk of component damage due to high voltage, and has a lower cost. The shielding layer 130 is connected to the conductive part 150 through the high-voltage resistor, and the conductive part 150 is in direct contact with the test object 2. A discharge path for interference signals can be formed from the shielding layer 130 to the test object 2.

[0034] For example, the interference suppression component 140 may include a capacitor and a high-voltage resistor, which may be connected in parallel. The capacitor has a better effect on discharging interference signals. The shielding layer 130 is connected to the conductive part 150 through the capacitor, and the conductive part 150 is in direct contact with the test object 2. A first discharge path for the interference signal can be formed from the shielding layer 130 to the test object 2. The high-voltage resistor can ensure the discharge of interference signals, withstand higher voltages, reduce the risk of component damage due to high voltage, and has a lower cost. The shielding layer 130 is connected to the conductive part 150 through the high-voltage resistor, and the conductive part 150 is in direct contact with the test object 2. A second discharge path for the interference signal can be formed from the shielding layer 130 to the test object 2. Thus, the interference suppression component 140 has a better effect on discharging interference signals.

[0035] For example, the capacitor may include a Y capacitor. Since at least a portion of the ultrasonic probe 100 needs to contact the subject 2, especially the conductive part 150, which is connected to the interference suppression element 140, the interference suppression element 140 in the form of a Y capacitor can meet electrical safety requirements, making the ultrasonic probe 100 safer to use.

[0036] For example, the capacitor may include a Y1 capacitor. A Y1 capacitor can withstand higher voltages. The Y1 capacitor form of the interference suppression element 140 has a higher voltage withstand capability, thus making the ultrasonic probe 100 safer to use.

[0037] For example, the capacitance of the capacitor may not exceed 1000pF. Since at least a portion of the ultrasonic probe 100 needs to contact the subject 2, especially the conductive part 150, and the conductive part 150 is connected to the interference suppression element 140, if the capacitance of the interference suppression element 140 is not greater than 1000pF, the current in the event of leakage will not be excessive, ensuring that there is no safety risk to the subject 2. Such an ultrasonic probe 100 is safer to use.

[0038] It should be noted that, in addition to the ultrasound probe 100 described above being applicable to in vivo and extracorporeal ultrasound scenarios, the ultrasound probe 100 of this application can also be applied to any suitable scenario.

[0039] In the ultrasonic system 1 provided by this utility model, see Figure 1 , Figure 2 and Figure 3 The ultrasonic main unit 200 may include a neutral / live wire to ground capacitor 220 and a primary bridging capacitor 230 of the switching power supply. The interference suppression component 140 may be a capacitor, and the sum of the capacitances of the primary bridging capacitor 230 and the neutral / live wire to ground capacitor 220 may be equal to the capacitance of the capacitor. The ultrasonic system 1 typically requires dielectric testing, in which a certain voltage U needs to be withstood from the mains power supply 400 to the conductive part 150. In existing ultrasonic systems, considering that the tip of the ultrasonic probe is usually in contact with the object under test during dielectric testing, it is assumed that the tip of the ultrasonic probe has parasitic capacitance. Because of the parasitic capacitance at the tip of the ultrasonic probe, and because the capacitance of the parasitic capacitance is very small, the sum of the capacitances of the neutral / live wire to ground capacitor 220 and the primary bridging capacitor 230 is much larger than the capacitance of the parasitic capacitance. This causes most of the voltage U to be applied to the parasitic capacitance, easily leading to its breakdown. Therefore, in existing ultrasonic systems, the insulation design of the ultrasonic probe tip is very complex. In the ultrasonic probe 100 provided in this application, due to the inclusion of an interference suppression component 140, the sum of the capacitances of the primary bridging capacitor 230 and the neutral / live wire to ground capacitor 220 is equal to the capacitance of the interference suppression component 140. During dielectric testing, the interference suppression component 140 receives half of the voltage U, while the primary bridging capacitor 230 and the neutral / live wire to ground capacitor 220 share the other half of the voltage U. This significantly reduces the design difficulty of the internal structure of the ultrasonic probe 100 head, making the construction of the ultrasonic system 1 simpler and easier to implement.

[0040] In the description of this utility model, it should be understood that the directional terms such as "front", "rear", "up", "down", "left", "right", "horizontal", "vertical", "horizontal", "top", and "bottom" indicate the orientation or positional relationship, which are usually based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this utility model. The directional terms "inner" and "outer" refer to the inner and outer contours of each component itself.

[0041] For ease of description, relative terms such as "above," "over," "on the upper surface of," and "above" are used here to describe the regional positional relationship of one or more components or features shown in the figures to other components or features. It should be understood that relative terms include not only the orientation of the component as depicted in the figure but also different orientations during use or operation. For example, if the components in the figures are inverted as a whole, "above" or "above other components or features" will include cases where the component is "below" or "under" other components or features. Thus, the exemplary term "above" can include both "above" and "below." Furthermore, these components or features may also be positioned at other different angles (e.g., rotated 90 degrees or other angles), and this document intends to include all such cases.

[0042] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to the present invention. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, parts, components, and / or combinations thereof.

[0043] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this utility model described herein can be implemented in sequences other than those illustrated or described herein.

[0044] This utility model has been described through the above embodiments. However, it should be understood that the above embodiments are for illustrative purposes only and are not intended to limit the utility model to the described embodiments. Furthermore, those skilled in the art will understand that this utility model is not limited to the above embodiments, and many more variations and modifications can be made based on the teachings of this utility model, all of which fall within the scope of protection claimed by this utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. An ultrasonic probe, characterized in that, The device includes an ultrasonic transceiver element, an ultrasonic signal transceiver circuit, a shielding layer, an interference suppression component, and a conductive part for contacting the test subject. The ultrasonic signal transceiver circuit is connected to the ultrasonic transceiver element. The shielding layer surrounds at least a portion of the ultrasonic signal transceiver circuit. The interference suppression component is connected between the shielding layer and the conductive part. The shielding layer, the interference suppression component, and the conductive part are all spaced apart from the ultrasonic signal transceiver circuit.

2. The ultrasonic probe according to claim 1, characterized in that, The ultrasonic probe includes a head end, and at least a portion of the conductive part is disposed on the head end.

3. The ultrasonic probe according to claim 2, characterized in that, The ultrasound probe includes a grip portion, the distal end of which is connected to the proximal end of the head end, the shielding layer extending into the grip portion from the proximal end of the grip portion, and the interference suppression element disposed within the grip portion.

4. The ultrasonic probe according to claim 2, characterized in that, At least a portion of the conductive portion is disposed on the distal end of the head end.

5. The ultrasonic probe according to claim 2, characterized in that, The head end includes a portion made of conductive material.

6. The ultrasonic probe according to claim 1, characterized in that, The interference suppression component includes a capacitor; and / or, the interference suppression component includes a high-voltage resistor.

7. The ultrasonic probe according to claim 6, characterized in that, The capacitor includes a Y1 capacitor.

8. The ultrasonic probe according to claim 7, characterized in that, The capacitance of the capacitor is not greater than 1000pF.

9. An ultrasonic system, characterized in that, It includes an ultrasound host and an ultrasound probe as described in any one of claims 1-8, wherein the ultrasound probe is connected to the ultrasound host.

10. The ultrasonic system according to claim 9, characterized in that, The ultrasound host includes a neutral / live wire to ground capacitor and a primary bridging capacitor for the switching power supply. The interference suppression component is a capacitor. The sum of the capacitances of the primary bridging capacitor and the neutral / live wire to ground capacitor is equal to the capacitance of the capacitor.

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