A semiconductor industry polishing waste liquid recovery and purification device

Abstract

The utility model relates to waste liquid recovery device technical field especially for a kind of semiconductor industry polishing waste liquid recovery purification device, including jar body, the top surface of jar body is fixedly installed with jar cover, the lateral wall of jar body is connected with sealing door, the inner wall of jar body is slidably connected with two-stage grating aperture plate, the inside of jar body is equipped with multiple limiting components, the lateral wall of jar body is equipped with ultrasonic liquid level sensor and magnetic flap liquid level meter.The device is placed in the mouth in the lateral wall of jar body, and two-stage grating aperture plate is slidably placed in the top surface of the placing ring inside jar body, and connecting rod rotates and slides in the sliding slot by sliding rod, and connecting rod extrudes spring at the same time, when the bottom surface of the bottom surface of connecting rod and the top surface of plate frame contact abutment, spring releases elastic force to generate a downward thrust, to push connecting rod and abutment and plate frame abutment, to limit and fix the two-stage grating aperture inner plate placed in jar body.

Description

Technical Field

[0001] This utility model relates to the technical field of waste liquid recovery devices, specifically to a device for recovering and purifying polishing waste liquid in the semiconductor industry. Background Technology

[0002] In recent years, with the rise of the semiconductor industry, the demand for polishing slurries has been increasing. In semiconductor CMP processes, each wafer generates a large amount of waste liquid containing nanoscale metal particles, abrasives, and chemical additives. The waste liquid contains high-value metals such as copper and tungsten, as well as abrasives such as silicon dioxide and cerium dioxide. Direct discharge will cause resource waste and heavy metal pollution. Existing treatment technologies usually use chemical precipitation, which has high treatment costs, high energy consumption, and can cause secondary pollution from chemical agents. The polishing waste liquid recycling process includes integrated collection, filtration, centrifugation, electrolysis and other processes to realize the recovery of metals and abrasives in the polishing waste liquid. In the integrated collection process of polishing liquid, the polishing waste liquid is initially screened and filtered by the collection device. The device has a grid plate inside to intercept large suspended solid impurities in the polishing waste liquid. However, when the collection device filters and collects the polishing fluid through the internal multi-layer grid plate, a large number of particulate impurities remain on the top surface of the grid plate. These particulate impurities clog the holes of the grid plate, which in turn affects the subsequent filtration and collection of the polishing fluid. The top surface of the grid plate needs to be cleaned frequently. However, the grid plate is usually fixedly connected, making it difficult to quickly disassemble the grid plate. The cleaning process is very inconvenient and its practicality is poor. Utility Model Content

[0003] The purpose of this invention is to provide a device for recycling and purifying polishing waste liquid in the semiconductor industry, so as to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, this utility model provides the following technical solution: a semiconductor industry polishing waste liquid recycling and purification device, including a tank, a tank cover fixedly installed on the top surface of the tank, and a sealing door connected to the side wall of the tank; The inner wall of the tank is slidably connected with two levels of grid plates, the inner side of the tank is provided with multiple limiting components, and the outer side of the tank is provided with an ultrasonic level sensor and a magnetic float level gauge. The side wall of the tank is provided with an inlet pipe and an outlet pipe respectively, and a waste liquid lifting pump is fixedly installed on the outlet pipe through a flange; The side wall of the tank is provided with a placement opening, and a placement ring is fixedly connected to the inner side wall of the tank; The two-stage grid plate includes a frame, and the frame has two layers of grid plates inside. The limiting component includes a fixing frame, the inside of which is provided with a sliding groove. The inner sidewall of the sliding groove is slidably connected to the outer sidewall of the connecting rod. A stop block is fixedly connected to the bottom surface of the connecting rod, a sliding rod is fixedly connected to the top surface of the connecting rod, and a spring is fixedly connected to the top surface of the connecting rod.

[0005] The beneficial effects of this utility model are as follows: The device has a placement opening on the side wall of the tank, and a sealing door is rotatably connected to the side wall of the tank. The two-stage grid plate is slidably placed into the top surface of the placement ring inside the tank through the placement opening. The sealing door on the side wall of the tank closes the placement opening by rotating. The two-stage grid plate placed inside the tank is limited and fixed by the limiting component on the side wall of the tank. While the connecting rod rotates and slides in the sliding groove through the slide rod, the connecting rod compresses the spring. When the bottom surface of the abutment block on the bottom surface of the connecting rod contacts and abuts the top surface of the plate frame, the spring releases its elastic force to generate a downward thrust, thereby pushing the connecting rod and the abutment block to abut against the plate frame, thereby limiting and fixing the inner plate of the two-stage grid plate placed inside the tank.

[0006] To achieve the effect of easy installation and removal of the two-stage grid plate inside the tank: The sealing door is further configured such that it is rotatably connected to the tank body and located inside the placement opening, and the side wall of the sealing door is provided with a rubber sealing strip.

[0007] By adopting the above technical solution, after the two-stage grid plate is slid into the tank through the placement port, the sealing door closes the placement port by rotating, which facilitates the easy disassembly and assembly of the two-stage grid plate tube inside the tank. The connection between the sealing door and the placement port is sealed by a rubber sealing strip.

[0008] To facilitate easy assembly and disassembly of the two-stage grid perforated plates: The configuration is further defined as follows: the two-stage grid perforated plate is located on the top surface of the placement ring, and the plate frame is slidably connected to the inner side wall of the placement opening.

[0009] By adopting the above technical solution, the two-stage grid plate is slidably inserted into the top surface of the placement ring inside the tank through the placement port, thereby achieving the effect of easy disassembly and assembly of the two-stage grid plate.

[0010] To achieve the effect of limiting and fixing the two-stage grid perforated plates inside the tank: The abutment is further configured such that the bottom surface of the abutment block abuts against the top surface of the plate frame, and the connecting rod is slidably connected inside the fixed frame via a slide rod.

[0011] By adopting the above technical solution, the two-stage grid plate that is slidably placed inside the tank is fixed by the limiting component. The spring releases the elastic force to generate a downward thrust, thereby pushing the connecting rod and the abutment block to abut against the plate frame, thus fixing the inner plate of the two-stage grid inside the tank.

[0012] The parts of the device not covered herein are the same as or can be implemented using existing technologies. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the structure of the tank body of this utility model; Figure 3 This is a schematic diagram of the structure of the two-stage grid perforated plate of this utility model; Figure 4 This is an exploded structural diagram of the limiting component of this utility model.

[0014] In the diagram: 1. Tank body; 11. Inlet pipe; 12. Outlet pipe; 13. Placement port; 14. Placement ring; 2. Tank cover; 3. Sealing door; 4. Two-stage perforated grating plate; 41. Plate frame; 42. Grating plate; 5. Limiting assembly; 51. Fixing frame; 52. Slide groove; 53. Connecting rod; 54. Abutment block; 55. Slide rod; 56. Spring; 6. Ultrasonic liquid level sensor; 7. Magnetic float liquid level gauge; 8. Waste liquid lifting pump. Detailed Implementation

[0015] To enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be described in detail below with reference to the accompanying drawings. The description in this part is only exemplary and explanatory, and should not be used to limit the scope of protection of the present invention in any way.

[0016] Please see Figures 1 to 4 A device for recycling and purifying polishing waste liquid in the semiconductor industry includes a tank 1, a tank cover 2 fixedly installed on the top surface of the tank 1, and a sealing door 3 connected to the side wall of the tank 1. The inner wall of the tank 1 is slidably connected with two-stage grid perforated plates 4, the inner side of the tank 1 is provided with multiple limiting components 5, and the outer side of the tank 1 is provided with an ultrasonic level sensor 6 and a magnetic float level gauge 7. The side wall of the tank body 1 is provided with an inlet pipe 11 and an outlet pipe 12 respectively. The outlet pipe 12 is fixedly installed with a waste liquid lifting pump 8 through a flange. The side wall of the tank 1 is provided with a placement opening 13, and the inner side wall of the tank 1 is fixedly connected with a placement ring 14. The two-stage grid plate 4 includes a frame 41, and the frame 41 has two layers of grid plates 42 inside; The limiting component 5 includes a fixing frame 51, with a sliding groove 52 inside the fixing frame 51. The inner side wall of the sliding groove 52 is slidably connected to the outer side wall of the connecting rod 53. A stop block 54 is fixedly connected to the bottom surface of the connecting rod 53, a sliding rod 55 is fixedly connected to the top surface of the connecting rod 53, and a spring 56 is fixedly connected to the top surface of the connecting rod 53.

[0017] In this embodiment, as Figure 1 and Figure 2 As shown, the sealing door 3 is rotatably connected to the tank body 1 and is located inside the placement opening 13, and the side wall of the sealing door 3 is provided with a rubber sealing strip.

[0018] In this embodiment, as Figure 1 , Figure 2 and Figure 3 As shown, the two-stage grid perforated plate 4 is located on the top surface of the placement ring 14, and the plate frame 41 is slidably connected to the inner side wall of the placement opening 13.

[0019] In this embodiment, as Figure 3 and Figure 4 As shown, the bottom surface of the abutment block 54 abuts against the top surface of the plate frame 41, and the connecting rod 53 is slidably connected inside the fixed frame 51 through the slide rod 55.

[0020] The computer software involved in the hardware carriers such as the ultrasonic level sensor, magnetic level gauge, and waste liquid lift pump in the technical solution is software technology known to those skilled in the art. It is merely applied to the aforementioned hardware carriers. In other words, the computer software portion of the technical solution is an essential technical feature for solving the aforementioned technical problem, constituting a necessary technical feature for the technical problem solved by this application, but it is not a differentiating technical feature or a point of technical improvement. The applicant has not made any technical improvements to the computer software portion involved in the aforementioned related hardware carriers, nor is it a key technical point of the invention.

[0021] Therefore, the "ultrasonic liquid level sensor", "magnetic float liquid level gauge", "waste liquid lifting pump" and other components involved in this application are physical functional modules that combine existing computer software programs or protocols with the hardware carrier of this application. The computer software programs involved in these physical functional modules are technologies known to those skilled in the art and are not improvements of this application. The improvement of this application should be the interaction between the various physical functional modules, that is, the improvement of the structure of the waste liquid recycling centralized device of this application, so as to solve the corresponding technical problems to be solved by this application.

[0022] The working process of this semiconductor industry polishing waste liquid recycling and purification device is as follows: When the two-stage grid plate 4 inside the tank 1 needs to be removed for cleaning and replacement, the sealing door 3 on the side wall of the tank 1 is opened by rotating, and then the connecting rod 53 of the limiting component 5 and the bottom block 54 are lifted up, so that the bottom surface of the block 54 is separated from the top surface of the plate frame 41. The connecting rod 53 is rotated to release the limiting fixation of the block 54 on the plate frame 41. At this time, the two-stage grid plate 4 can be slid out through the placement port 13 on the side wall of the tank 1, and the two-stage grid plate 4 can be removed from the inside of the tank 1, so as to facilitate the cleaning and replacement of the two-stage grid plate 4. When the two-stage grid plate 4 is placed into the tank 1, it slides into the top surface of the placement ring 14 inside the tank 1 through the placement port 13. The sealing door 3 on the side wall of the tank 1 closes the placement port 13 by rotating. While the connecting rod 53 rotates and slides in the slide groove 52 through the slide rod 55, the connecting rod 53 compresses the spring 56. When the bottom surface of the abutment block 54 on the bottom surface of the connecting rod 53 contacts the top surface of the plate frame 41, the spring 56 releases its elastic force to generate a downward thrust, thereby pushing the connecting rod 53 and the abutment block 54 to abut against the plate frame 41, thus limiting and fixing the two-stage grid plate 4 placed inside the tank 1.

[0023] The ultrasonic level sensor 6 adopts the known model YST940CY10, the magnetic level gauge 7 adopts the known model UHZ-51, and the waste liquid lifting pump 8 adopts the known model QW non-clogging lifting pump. All of these are known existing technologies, but are not limited to the above models. They are mature technologies in this field and have been fully disclosed. Therefore, they will not be repeated in the specification.

[0024] The contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0025] It should be noted that, in this document, the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0026] This article uses specific examples to illustrate the principles and implementation methods of this utility model. The above examples are only for the purpose of helping to understand the method and core ideas of this utility model. The above description is only a preferred embodiment of this utility model. It should be noted that due to the limitations of textual expression, there are objectively infinite specific structures. For those skilled in the art, several improvements, modifications, or changes can be made without departing from the principles of this utility model, and the above technical features can also be combined in an appropriate manner. These improvements, modifications, changes, or combinations, or the direct application of the concept and technical solution of the utility model to other occasions without modification, should all be considered within the protection scope of this utility model.

Claims

1. A device for recycling and purifying polishing waste liquid in the semiconductor industry, comprising a tank (1), characterized in that: A can lid (2) is fixedly installed on the top surface of the tank (1), and a sealing door (3) is connected to the side wall of the tank (1). The inner wall of the tank (1) is slidably connected with two-stage grid perforated plates (4), and the inner side of the tank (1) is provided with multiple limiting components (5). The outer side of the tank (1) is provided with an ultrasonic level sensor (6) and a magnetic float level gauge (7). The side wall of the tank (1) is provided with an inlet pipe (11) and an outlet pipe (12), and the outlet pipe (12) is fixedly installed with a waste liquid lifting pump (8) through a flange. The side wall of the tank (1) is provided with a placement opening (13), and the inner side wall of the tank (1) is fixedly connected with a placement ring (14). The two-stage grid plate (4) includes a frame (41), and the frame (41) has two layers of grid plates (42) inside. The limiting component (5) includes a fixing frame (51), the fixing frame (51) has a sliding groove (52) inside, the inner side wall of the sliding groove (52) is slidably connected to the outer side wall of the connecting rod (53), the bottom surface of the connecting rod (53) is fixedly connected to a stop block (54), the top surface of the connecting rod (53) is fixedly connected to a sliding rod (55), and the top surface of the connecting rod (53) is fixedly connected to a spring (56).

2. The semiconductor industry polishing waste liquid recycling and purification device as described in claim 1, characterized in that: The sealing door (3) is rotatably connected to the tank body (1) and is located inside the placement opening (13), and the side wall of the sealing door (3) is provided with a rubber sealing strip.

3. The semiconductor industry polishing waste liquid recycling and purification device as described in claim 1, characterized in that: The two-stage grid perforated plate (4) is located on the top surface of the placement ring (14), and the plate frame (41) is slidably connected to the inner wall of the placement opening (13).

4. The semiconductor industry polishing waste liquid recycling and purification device as described in claim 1, characterized in that: The bottom surface of the abutment block (54) abuts against the top surface of the plate frame (41), and the connecting rod (53) is slidably connected inside the fixed frame (51) through the slide rod (55).

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