Nitrogen pre-wetting device for semiconductor industry

CN224656464UActive Publication Date: 2026-08-21LIRUN (SHANGHAI) CLEAN TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202522076403.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-09-26
Publication Date
2026-08-21
Estimated Expiration
2035-09-26

AI Technical Summary

Technical Problem

[0003]发明人在实现本实用新型的过程中发现现有技术存在如下问题:产品气的湿度难以控制,水位的波动及水温等因素均会影响加湿稳定性;加湿效率低下,产品气的湿度普遍低下,无法满足后端工艺条件;孔板易堵塞,且经过孔板的气体介质压力损失较大

Benefits of technology

[0006]本实用新型的有益效果为:采用空气雾化喷嘴的方式,利用气体高速流动的动能将液体破碎成微小液滴,增强气液的传质效率,提高产品气的湿度,并且通过调节外管、滑槽、调节内管、蜗轮、蜗杆和马达的组合,可以实现喷嘴喷出角度的多角度调节。

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Abstract

The utility model relates to the technical field of grinding process of semiconductor industry especially is a kind of nitrogen pre-wetting device of semiconductor industry, including water inlet, the other end of water inlet about the axis of pipeline is equipped with air inlet, water inlet and air inlet are located at the both ends of same pipeline, the middle part of pipeline is equipped with atomizing pipeline, the bottom of atomizing pipeline is equipped with angle adjusting mechanism, the outer cover of angle adjusting mechanism is equipped with protective cover, the bottom of angle adjusting mechanism is equipped with conical nozzle.This device can adjust the angle of atomizing nozzle, thereby improve the spray range of nozzle, the shearing force of high-speed flowing gas makes liquid broken, while high-speed flowing liquid and gas form convection, accelerate the transmission rate of matter, make the adsorption efficiency and volatilization efficiency of droplet be higher, thereby increase the humidity of product, the nozzle of adjustable spray angle, prevent that wet nitrogen is directly hit on pipe wall.
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Description

Technical Field

[0001] This utility model relates to the field of grinding technology in the semiconductor industry, and specifically to a nitrogen prehumidification device for the semiconductor industry. Background Technology

[0002] In recent years, with the rise of the semiconductor industry, the demand for polishing slurry supply equipment has been increasing day by day. The nitrogen humidification device in traditional polishing slurry supply equipment adopts the form of bubbling, which uses gas to generate bubbles in the liquid through tiny holes, promoting the evaporation or dissolution of water into the gas.

[0003] In the process of realizing this utility model, the inventors discovered the following problems with the existing technology: the humidity of the product gas is difficult to control, and factors such as water level fluctuations and water temperature will affect the humidification stability; the humidification efficiency is low, the humidity of the product gas is generally low, and it cannot meet the downstream process conditions; the orifice plate is easy to clog, and the pressure loss of the gas medium passing through the orifice plate is large. Utility Model Content

[0004] The purpose of this invention is to provide a nitrogen prehumidification device for the semiconductor industry to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a nitrogen prehumidification device for the semiconductor industry, including a water inlet, an air inlet at the other end of the water inlet about the axis of the pipeline, the water inlet and the air inlet being located at both ends of the same pipeline, an atomizing pipe running through the middle of the pipeline, an angle adjustment mechanism at the bottom of the atomizing pipe, a protective cover covering the outside of the angle adjustment mechanism, and a conical nozzle at the bottom of the angle adjustment mechanism; The angle adjustment mechanism includes an adjusting outer tube, the inner wall of which is provided with an annular groove, and an adjusting inner tube is slidably connected to the inner wall of the annular groove. A sealing rubber is provided at the connection between the adjusting inner tube and the annular groove. A worm gear is fixedly connected to the outer wall of the adjusting inner tube outside the adjusting outer tube, and a worm is meshed with the outer wall of the worm gear. A motor is rotatably connected to one end of the worm.

[0006] The beneficial effects of this utility model are as follows: by using an air atomizing nozzle, the kinetic energy of high-speed gas flow is used to break the liquid into tiny droplets, thereby enhancing the gas-liquid mass transfer efficiency and increasing the humidity of the product gas. Furthermore, by adjusting the combination of the outer tube, slide, inner tube, worm gear, worm, and motor, the nozzle spray angle can be adjusted at multiple angles.

[0007] To achieve the protective effect of the angle adjustment mechanism: A further configuration is made whereby the worm gear, worm, and motor are all located inside the protective cover.

[0008] By adopting the above technical solution, the transmission structure of the angle adjustment structure can be protected.

[0009] To achieve an adjustable angle for the conical nozzle: A further configuration is provided: the bottom of the adjusting inner tube extends through the bottom of the protective cover to the outside and is connected to a conical nozzle via a flange.

[0010] By adopting the above technical solution, the angle of the conical nozzle can be adjusted.

[0011] To achieve a larger spraying range with the conical nozzle: The conical nozzle is further configured such that: the nozzle body includes a nozzle body, and the top of the nozzle body has a liquid inlet, and the sidewalls of the nozzle body have symmetrically distributed liquid outlets.

[0012] By adopting the above technical solutions, a larger spraying range can be achieved.

[0013] To achieve power transmission for nozzle adjustment: The configuration is further defined as follows: the worm gear, worm, and motor constitute a transmission structure, and the adjusting inner tube and worm gear constitute a transmission structure.

[0014] By adopting the above technical solution, the power transmission can achieve nozzle adjustment.

[0015] The parts of the device not covered herein are the same as or can be implemented using existing technologies. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the main body of this utility model; Figure 2 This is a partial cross-sectional view of the angle adjustment mechanism of this utility model; Figure 3 This is a front view schematic diagram of the conical nozzle of this utility model.

[0017] In the diagram: 1. Water inlet; 2. Air inlet; 3. Atomizing pipe; 4. Protective cover; 5. Angle adjustment mechanism; 501. Adjustment outer pipe; 502. Annular slide groove; 503. Adjustment inner pipe; 504. Worm gear; 505. Worm; 506. Motor; 6. Conical nozzle; 601. Nozzle body; 602. Liquid inlet; 603. Liquid outlet. Detailed Implementation

[0018] To enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be described in detail below with reference to the accompanying drawings. The description in this part is only exemplary and explanatory, and should not be used to limit the scope of protection of the present invention in any way.

[0019] Please see Figures 1 to 3A nitrogen prehumidification device for the semiconductor industry includes a water inlet 1, an air inlet 2 at the other end of the water inlet 1 about the axis of the pipeline, the water inlet 1 and the air inlet 2 being located at both ends of the same pipeline, an atomizing pipe 3 passing through the middle of the pipeline, an angle adjustment mechanism 5 at the bottom of the atomizing pipe 3, a protective cover 4 covering the outside of the angle adjustment mechanism 5, and a conical nozzle 6 at the bottom of the angle adjustment mechanism 5. The angle adjustment mechanism 5 includes an adjusting outer tube 501, an annular groove 502 on the inner wall of the adjusting outer tube 501, an adjusting inner tube 503 slidably connected to the inner wall of the annular groove 502, a sealing rubber at the connection between the adjusting inner tube 503 and the annular groove 502, a worm gear 504 fixedly connected to the outer wall of the adjusting inner tube 503 outside the adjusting outer tube 501, a worm 505 meshing with the outer wall of the worm gear 504, and a motor 506 rotatably connected to one end of the worm 505.

[0020] In this embodiment, as Figure 1 and Figure 2 As shown, the worm gear 504, worm 505 and motor 506 are all located inside the protective cover 4.

[0021] In this embodiment, as Figure 1 and Figure 3 As shown, the bottom of the adjusting inner tube 503 extends through the bottom of the protective cover 4 to the outside and is connected to a conical nozzle 6 via a flange.

[0022] In this embodiment, as Figure 3 As shown, the conical nozzle 6 includes a nozzle body 601, and the top of the nozzle body 601 is provided with a liquid inlet 602, and the sidewalls of the nozzle body 601 are symmetrically distributed with liquid outlets 603.

[0023] In this embodiment, as Figure 2 As shown, the worm gear 504, worm 505 and motor 506 constitute the transmission structure, and the adjusting inner tube 503 and worm gear 504 constitute the transmission structure.

[0024] The working process of this nitrogen prehumidification device for the semiconductor industry is as follows: First, the water inlet 1 of the pipeline is connected to the pure water input system, and the air inlet 2 is connected to the nitrogen input system. High-pressure gas and pure water form droplets in the atomizing pipeline 3. The motor 506 is started to drive the worm gear 505 to rotate, which will also drive the meshing worm wheel 504 to rotate, thereby driving the inner regulating tube 503 to rotate in the annular sliding groove 502 of the outer regulating tube 501, thereby driving the nozzle body 601 to rotate, so that the liquid outlets 603 symmetrically distributed on the conical sidewall of the nozzle body 601 can spray droplets.

[0025] The contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0026] It should be noted that, in this document, the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0027] This article uses specific examples to illustrate the principles and implementation methods of this utility model. The above examples are only for the purpose of helping to understand the method and core ideas of this utility model. The above description is only a preferred embodiment of this utility model. It should be noted that due to the limitations of textual expression, there are objectively infinite specific structures. For those skilled in the art, several improvements, modifications, or changes can be made without departing from the principles of this utility model, and the above technical features can also be combined in an appropriate manner. These improvements, modifications, changes, or combinations, or the direct application of the concept and technical solution of the utility model to other occasions without modification, should all be considered within the protection scope of this utility model.

Claims

1. A nitrogen prehumidification device for the semiconductor industry, comprising a water inlet (1), characterized in that: An air inlet (2) is provided at the other end of the water inlet (1) about the pipeline axis. The water inlet (1) and the air inlet (2) are located at both ends of the same pipeline. An atomizing pipe (3) is provided through the middle of the pipeline. An angle adjustment mechanism (5) is provided at the bottom of the atomizing pipe (3). A protective cover (4) is provided on the outside of the angle adjustment mechanism (5). A conical nozzle (6) is provided at the bottom of the angle adjustment mechanism (5). The angle adjustment mechanism (5) includes an adjusting outer tube (501), the inner wall of the adjusting outer tube (501) is provided with an annular groove (502), the inner wall of the annular groove (502) is slidably connected to an adjusting inner tube (503), the connection between the adjusting inner tube (503) and the annular groove (502) is provided with sealing rubber, the outer wall of the adjusting inner tube (503) located outside the adjusting outer tube (501) is fixedly connected to a worm gear (504), the outer wall of the worm gear (504) is meshed with a worm (505), and one end of the worm (505) is rotatably connected to a motor (506).

2. The nitrogen prehumidification device for the semiconductor industry as described in claim 1, characterized in that: The worm gear (504), worm (505) and motor (506) are all located inside the protective cover (4).

3. A nitrogen prehumidification device for the semiconductor industry as described in claim 1, characterized in that: The bottom of the regulating inner tube (503) extends through the bottom of the protective cover (4) to the outside and is connected to a conical nozzle (6) via a flange.

4. A nitrogen prehumidification device for the semiconductor industry as described in claim 1, characterized in that: The conical nozzle (6) includes a nozzle body (601), and the top of the nozzle body (601) is provided with a liquid inlet (602), and the sidewalls of the nozzle body (601) are symmetrically distributed with liquid outlets (603).

5. A nitrogen prehumidification device for the semiconductor industry as described in claim 1, characterized in that: The worm wheel (504), worm (505) and motor (506) constitute a transmission structure, and the adjusting inner tube (503) and worm wheel (504) constitute a transmission structure.