A silicon wafer conveying line and a silicon wafer sorting apparatus

Abstract

The application provides a wafer conveying line and a wafer sorting device. The wafer conveying line comprises a first conveying part, a first transfer part and a second conveying part. The first conveying part is arranged at the unloading end of the sorting machine, the first end of the first conveying part is close to the wafer stack re-inspection machine, and the first conveying part is configured to convey in the first direction. The second conveying part is arranged at the side of the sorting machine and is configured to convey in the second direction. The first end of the second conveying part is close to the second end of the first conveying part, and the second end of the second conveying part is provided with a trimming station close to the loading end of the sorting machine. The first transfer part is arranged between the second end of the first conveying part and the first end of the second conveying part. By using the wafer conveying line provided by the application, the trimming station can coincide with the loading station of the sorting machine. The operator can stay at the loading end of the sorting machine to implement wafer trimming and wafer loading of the sorting machine, and does not need to walk back and forth between the loading end and the unloading end of the sorting machine, thereby improving work efficiency.

Description

Technical Field

[0001] This application relates to the field of photovoltaic equipment, specifically a silicon wafer conveying line and silicon wafer sorting equipment. Background Technology

[0002] After being inspected by a sorting machine, silicon wafers are divided into several categories based on the inspection results. Wafers belonging to the same category are stacked together.

[0003] Each stack of silicon wafers is conveyed to the wafer re-inspection machine (near the unloading end of the sorting machine) for appearance quality and alignment checks. Wafers that do not meet the appearance quality or alignment requirements are identified as defective. The current procedure is to convey stacks of defective silicon wafers to a trimming station for manual trimming, which is located near the wafer re-inspection machine.

[0004] However, operators not only need to trim the silicon wafers at the trimming station, but also need to load the wafers to be sorted onto the sorter at the loading station, or handle abnormalities during the automatic loading process of the sorter, such as wafer fragments. Therefore, operators need to move back and forth between the trimming station near the unloading end of the sorter and the loading station near the loading end of the sorter to perform trimming and loading operations alternately.

[0005] If operators stay at the finishing station for too long, it will delay the feeding of the sorting machine, causing the sorting machine to run idle. If operators stay at the feeding station of the sorting machine for too long, the defective products waiting to be finished at the finishing station will not be processed in a timely manner, causing the stacking re-inspection machine to stop. Utility Model Content

[0006] To address the aforementioned technical problems, this application provides a silicon wafer conveyor, the detailed technical solution of which is as follows:

[0007] A silicon wafer conveying line includes a first conveying section, a first transfer section, and a second conveying section, wherein:

[0008] The first conveying section is located at the unloading end of the sorting machine, and the first end of the first conveying section is close to the stacking and re-inspection machine. The first conveying section is configured to convey along the first direction.

[0009] The second conveying section is located on the side of the sorting machine and is configured to convey along the second direction. The first end of the second conveying section is close to the second end of the first conveying section. The second end of the second conveying section is provided with a trimming station close to the feeding end of the sorting machine. The second direction is perpendicular to the first direction.

[0010] The first transfer unit is located between the second end of the first conveying unit and the first end of the second conveying unit:

[0011] The first conveying unit is configured to receive a first type of silicon wafers flowing out of the stacking inspection machine via a first material box placed thereon, and convey them to a first transfer unit; and to receive a second material box containing a second type of silicon wafers flowing out of the stacking inspection machine, and convey it to the first transfer unit, wherein the first type of silicon wafers are silicon wafers with unqualified appearance quality, and the second type of silicon wafers are silicon wafers with unqualified alignment.

[0012] The first conveying unit is also configured to receive a first cassette containing trimmed silicon wafers returned by the first transfer unit and convey it to a first end of the first conveying unit; and to receive an empty second cassette returned by the first transfer unit and convey it to a first end of the first conveying unit.

[0013] The second conveying unit is configured to receive empty first material boxes or second material boxes containing first type silicon wafers and second type silicon wafers conveyed by the first transfer unit, and convey them to the finishing station; after the first type silicon wafers and second type silicon wafers are taken out from the first material box and the second material box, they are finished at the finishing station.

[0014] The second conveying section is also configured to receive the trimmed silicon wafers flowing out of the trimming station via the first material box thereon and convey them to the first transfer section; and to convey the empty second material box to the first transfer section;

[0015] The first transfer unit is configured to receive empty first boxes or first boxes containing first type silicon wafers and second boxes containing second type silicon wafers from the first conveying unit and transfer them to the second conveying unit; and to receive first boxes containing trimmed silicon wafers and second boxes that have been emptied from the second conveying unit and transfer them to the first conveying unit.

[0016] The silicon wafer conveyor line provided in this application has a first conveying section located at the unloading end of the sorting machine, and a second end of the second conveying section located close to the loading end of the sorting machine. This configuration allows the trimming station to overlap with the loading station of the sorting machine. Operators can trim and load silicon wafers from the loading end of the sorting machine without having to move back and forth between the loading and unloading ends, thus improving work efficiency.

[0017] In some embodiments, the first conveying unit includes a first conveying line and a second conveying line arranged side by side, wherein: the first conveying line is configured to receive a first type of silicon wafer flowing out from the stacking inspection machine via a first cassette and convey it to a first transfer unit; and to receive a first cassette containing trimmed silicon wafers returned from the first transfer unit and convey it to a first end of the first conveying line; the second conveying line is configured to receive a second cassette containing a second type of silicon wafer flowing out from the stacking inspection machine and convey it to the first transfer unit; and to receive an empty second cassette returned from the first transfer unit and convey it to a first end of the second conveying line.

[0018] The first conveying section is configured as a first conveyor line and a second conveyor line arranged side by side. The first conveyor line and the second conveyor line respectively carry out reciprocating conveying of the first material box and the second material box, which facilitates the simultaneous loading and unloading of the first material box and the second material box at the first end of the first conveyor line and the second conveyor line, thereby improving work efficiency.

[0019] In some embodiments, both the first conveyor line and the second conveyor line include an upper conveyor line and a lower conveyor line arranged in layers and with opposite conveying directions; the upper conveyor line of the first conveyor line is configured to receive a first type of silicon wafer flowing out of the stacking inspection machine via a first material box and convey it to a first transfer unit; the lower conveyor line of the first conveyor line is configured to receive a first material box containing trimmed silicon wafers returned by the first transfer unit and convey it to a first end of the first conveyor line; the upper conveyor line of the second conveyor line is configured to receive a second material box containing a second type of silicon wafer flowing out of the stacking inspection machine and convey it to the first transfer unit; the lower conveyor line of the second conveyor line is configured to receive an empty second material box returned by the first transfer unit and convey it to a first end of the second conveyor line.

[0020] By configuring the first conveyor line as an upper and lower conveyor line with opposite conveying directions, bidirectional independent conveying physically isolates the first material box for the outbound and return journeys, thereby achieving conflict-free and efficient flow of the first material box. Similarly, by configuring the second conveyor line as an upper and lower conveyor line with opposite conveying directions, bidirectional independent conveying physically isolates the second material box for the outbound and return journeys, thereby achieving conflict-free and efficient flow of the second material box.

[0021] In some embodiments, the silicon wafer conveying line further includes a first lifting conveying section disposed at a first end of the first conveying line, wherein: the first lifting conveying section is configured to connect to an upper conveying line or a lower conveying line of the first conveying line by lifting; when the first lifting conveying section connects to the lower conveying line of the first conveying line, it receives a first material box containing trimmed silicon wafers transported back from the lower conveying line of the first conveying line; when the first lifting conveying section connects to the upper conveying line of the first conveying line, it receives a first type of silicon wafer flowing out from the stacking inspection machine through the first material box, and transports the first material box containing the first type of silicon wafers to the upper conveying line of the first conveying line.

[0022] By setting a first lifting conveyor at the first end of the first conveyor line, the first material box can be switched between the upper and lower conveyor lines of the first conveyor line.

[0023] In some embodiments, the second conveying unit includes a third conveying line and a fourth conveying line arranged side by side, wherein: the third conveying line is configured to receive an empty or first material box containing first type silicon wafers conveyed by the first transfer unit and convey it to a trimming station; and receive trimmed silicon wafers flowing out of the trimming station via the first material box and convey the first material box containing the trimmed silicon wafers to the first transfer unit; the fourth conveying line is configured to receive a second material box containing second type silicon wafers conveyed by the first transfer unit and convey it to a trimming station; and convey the empty second material box to the first transfer unit.

[0024] The second conveying section is configured as a third and fourth conveying line arranged side by side. The third and fourth conveying lines respectively convey the first and second material boxes, which facilitates the simultaneous loading and unloading of the first and second material boxes at the second end of the third and fourth conveying lines, thereby improving work efficiency.

[0025] In some embodiments, both the third and fourth conveyor lines include an upper conveyor line and a lower conveyor line arranged in opposite layers and with opposite conveying directions; the upper conveyor line of the third conveyor line is configured to receive empty or first material boxes containing first type silicon wafers from the first transfer station and convey them to the trimming station; the lower conveyor line of the third conveyor line is configured to receive trimmed silicon wafers flowing out of the trimming station via the first material box and convey the first material box containing the trimmed silicon wafers to the first transfer station; the upper conveyor line of the fourth conveyor line is configured to receive a second material box containing second type silicon wafers from the first transfer station and convey it to the trimming station; the lower conveyor line of the fourth conveyor line is configured to convey the empty second material box to the first transfer station.

[0026] By configuring the third conveyor line as an upper and lower conveyor line with opposite conveying directions, bidirectional independent conveying physically isolates the first material box for both the outbound and return journeys, thus achieving conflict-free and efficient flow of the first material box. Similarly, configuring the fourth conveyor line as an upper and lower conveyor line with opposite conveying directions, bidirectional independent conveying physically isolates the second material box for both the outbound and return journeys, thus achieving conflict-free and efficient flow of the second material box.

[0027] In some embodiments, the second conveying unit includes a buffer conveying unit, a second transfer unit, a transfer conveying unit, a third transfer unit, and a receiving conveying unit arranged sequentially along a second direction, wherein:

[0028] The buffer conveying unit includes a first buffer conveying line and a second buffer conveying line arranged side by side;

[0029] The receiving and conveying section includes a first receiving conveyor line and a second receiving conveyor line arranged side by side;

[0030] The first buffer conveyor line is configured to receive an empty or first material box containing a first type of silicon wafer from the first transfer unit and convey it to the second transfer unit; and to receive a first material box containing a trimmed silicon wafer returned from the second transfer unit and convey it to the first transfer unit.

[0031] The second buffer conveyor line is configured to receive a second cassette containing a second type of silicon wafer from the first transfer unit and convey it to the second transfer unit; and to receive an empty second cassette returned by the second transfer unit and convey it to the first transfer unit.

[0032] The transfer and conveying unit is configured to receive empty or first material boxes containing first-type silicon wafers and second material boxes containing second-type silicon wafers from the second transfer unit and convey them to the third transfer unit; and is configured to receive first material boxes containing trimmed silicon wafers and empty second material boxes returned from the third transfer unit and convey them to the second transfer unit.

[0033] The first receiving conveyor line is configured to receive empty or first material boxes containing first type silicon wafers from the third transfer station and convey them to the trimming station; and to receive trimmed silicon wafers flowing out of the trimming station via the first material box and convey the first material box containing the trimmed silicon wafers to the third transfer station.

[0034] The second receiving conveyor line is configured to receive the second material box containing the second type of silicon wafers conveyed by the third transfer station and convey it to the trimming station; and to convey the empty second material box to the third transfer station;

[0035] The second transfer unit is configured to receive empty or first material boxes containing first type silicon wafers conveyed by the first buffer conveyor line, and second material boxes containing second type silicon wafers conveyed by the second buffer conveyor line, and convey them to the transfer conveyor unit; and to receive first material boxes containing trimmed silicon wafers and empty second material boxes conveyed back by the transfer conveyor unit, and convey them to the first buffer conveyor line and the second buffer conveyor line respectively.

[0036] The third transfer unit is configured to receive empty first material boxes or second material boxes containing first-type silicon wafers from the transfer and conveying unit, and to convey them to the first receiving conveyor line and the second receiving conveyor line respectively; and to receive first material boxes containing trimmed silicon wafers from the first receiving conveyor line and empty second material boxes from the second receiving conveyor line, and to convey them to the transfer and conveying unit.

[0037] By setting the second conveying section to consist of three sections: a buffer conveying section, a transfer conveying section, and a receiving conveying section, and by making the buffer conveying section, the transfer conveying section, and the receiving conveying section independent of each other, and by making the conveying speed independently adjustable, buffering of the first type of material box and the second type of material box during the conveying process can be realized, thereby alleviating the difference in working rhythm between the second end of the second conveying section and the first end of the first conveying section.

[0038] The buffer conveying unit is configured to include a first buffer conveyor line and a second buffer conveyor line, which respectively convey the first material box and the second material box, thereby ensuring the buffering capacity of the first and second material boxes. The receiving conveying unit is configured to include a first receiving conveyor line and a second receiving conveyor line, which respectively convey the first material box and the second material box, thereby facilitating the synchronous picking and placing of the first and second material boxes at the second ends of the first and second receiving conveyor lines, improving work efficiency.

[0039] In some embodiments, both the first buffer conveyor line and the second buffer conveyor line include an upper conveyor line and a lower conveyor line arranged in layers and with opposite conveying directions, wherein:

[0040] The upper conveyor of the first buffer conveyor is configured to receive empty or first material boxes containing first type silicon wafers from the first transfer unit and convey them to the second transfer unit; the lower conveyor of the first buffer conveyor is configured to receive first material boxes containing trimmed silicon wafers returned from the second transfer unit and convey them to the first transfer unit.

[0041] The upper conveyor of the second buffer conveyor is configured to receive the second material box containing the second type of silicon wafers conveyed by the first transfer unit and convey it to the second transfer unit; the lower conveyor of the second buffer conveyor is configured to receive the empty second material box returned by the second transfer unit and convey it to the first transfer unit.

[0042] The transfer and conveying section includes an upper conveyor line and a lower conveyor line arranged in opposite directions, wherein:

[0043] The upper conveyor line of the transfer and conveying unit is configured to receive empty or first material boxes containing first-type silicon wafers and second material boxes containing second-type silicon wafers from the second transfer unit, and convey them to the third transfer unit.

[0044] The lower conveyor line of the transfer and conveying unit is configured to receive the first material box containing the trimmed silicon wafers and the empty second material box returned by the third transfer unit, and then convey them to the second transfer unit.

[0045] Both the first and second receiving conveyor lines include an upper conveyor line and a lower conveyor line arranged in opposite layers and with opposite conveying directions, wherein:

[0046] The upper conveyor of the first receiving conveyor line is configured to receive the first material box, which is empty or contains the first type of silicon wafers, from the third transfer unit and convey it to the trimming station.

[0047] The lower conveyor of the first receiving conveyor line is configured to receive the trimmed silicon wafers flowing out of the trimming station via the first material box, and transport the first material box containing the trimmed silicon wafers to the third transfer section.

[0048] The upper conveyor of the second receiving conveyor is configured to receive the second material box containing the second type of silicon wafers from the third transfer station and convey it to the trimming station; the lower conveyor of the second receiving conveyor is configured to convey the empty second material box to the third transfer station.

[0049] The first buffer conveyor line, the second buffer conveyor line, the transfer conveyor section, the first receiving conveyor line, and the second receiving conveyor line are all configured to include upper and lower conveyor lines with opposite conveying directions, thereby achieving physical isolation between the first and second material boxes for outbound and return journeys, and thus enabling conflict-free and efficient flow of the first and second material boxes.

[0050] In some embodiments, the silicon wafer conveying line further includes a second lifting conveying section disposed at a second end of the first receiving conveying line, and a third lifting conveying section disposed at a second end of the second receiving conveying line, wherein:

[0051] The second lifting conveyor is configured to connect to the upper or lower conveyor line of the first receiving conveyor line by lifting; when the second lifting conveyor connects to the upper conveyor line of the first receiving conveyor line, it receives the empty or first material box containing the first type of silicon wafers output from the upper conveyor line; when the second lifting conveyor connects to the lower conveyor line of the first receiving conveyor line, it conveys the first material box containing the trimmed silicon wafers to the lower conveyor line of the first receiving conveyor line.

[0052] The third lifting conveyor is configured to connect to the upper or lower conveyor line of the second receiving conveyor line by lifting; when the third lifting conveyor connects to the upper conveyor line of the second receiving conveyor line, it receives the second material box containing the second type of silicon wafers output from the upper conveyor line; when the third lifting conveyor connects to the lower conveyor line of the second receiving conveyor line, it transports the emptied second material box back to the lower conveyor line of the second receiving conveyor line.

[0053] By setting a second lifting conveyor at the second end of the first receiving conveyor line, the first material box can be switched between the upper and lower conveyor lines of the first receiving conveyor line. Similarly, by setting a third lifting conveyor at the second end of the second receiving conveyor line, the second material box can be switched between the upper and lower conveyor lines of the second receiving conveyor line.

[0054] This application also provides a silicon wafer sorting device, which includes a sorting machine, a stacking inspection machine, and the silicon wafer conveying line described in any one of the above claims, wherein:

[0055] The sorting machine is used to sort and classify silicon wafers, and silicon wafers belonging to the same category are stacked into piles;

[0056] The stacked wafer re-inspection machine is set at the unloading end of the sorting machine. It is used to re-inspect the stacked silicon wafers output by the sorting machine and classify them into qualified silicon wafers, first-class silicon wafers with unqualified appearance quality, and second-class silicon wafers with unqualified alignment based on the re-inspection results.

[0057] The silicon wafer conveyor line is used to receive the first type and second type of silicon wafers output from the stacking and inspection machine, and convey them to the trimming station located at the loading end of the sorting machine, where the first type and second type of silicon wafers are trimmed.

[0058] The silicon wafer conveyor line is also used to transport the trimmed silicon wafers back to the wafer stacking and inspection machine.

[0059] The silicon wafer sorting equipment provided in this application has its two ends of the silicon wafer conveyor line located close to the loading and unloading ends of the sorting machine, respectively. This configuration allows the trimming station to overlap with the loading station of the sorting machine. Thus, operators can trim and load silicon wafers from the sorting machine while remaining at the loading end, eliminating the need to move back and forth between the loading and unloading ends, thereby improving work efficiency. Attached Figure Description

[0060] Figure 1 This is a schematic diagram of the silicon wafer delivery line in an embodiment of this application from one view.

[0061] Figure 2 This is a schematic diagram of the silicon wafer delivery line in an embodiment of this application from another perspective.

[0062] Figure 3 This is a schematic diagram of the silicon wafer delivery line in an embodiment of this application from another perspective;

[0063] Figure 4 This is a schematic diagram of the structure of the first conveyor line and the first lifting conveyor unit in the embodiments of this application;

[0064] Figure 5 This is a schematic diagram of the structure of some components of the first conveying unit, the first transfer unit, and the second conveying unit in the embodiments of this application;

[0065] Figure 6 This is a schematic diagram of the structure of the receiving conveyor, the first lifting conveyor, and the second lifting conveyor in the embodiments of this application;

[0066] Figure 7 This is a schematic diagram of the structure of the first material box;

[0067] Figure 8 This is a schematic diagram of the second material box.

[0068] Figures 1 to 8 Includes:

[0069] First Conveying Section 1:

[0070] First conveyor line 11: upper conveyor line 111, lower conveyor line 112;

[0071] Second conveyor line 12

[0072] First Transfer Station 2

[0073] First transit branch 21;

[0074] Second transit branch 22;

[0075] Second Conveyor Section 3:

[0076] Buffer transport unit 31: First buffer transport line 311, second buffer transport line 312;

[0077] Second transfer station 32;

[0078] Transit and Transportation Department 33;

[0079] Third transit point 34;

[0080] Material receiving and conveying section 35: First material receiving and conveying line 351, second material receiving and conveying line 352;

[0081] First lifting and conveying unit 4:

[0082] Lifting drive component 41, base 42, belt conveyor component 43;

[0083] Second lifting and conveying unit 5;

[0084] Third lifting and conveying unit 6;

[0085] 100 sorting machine, 200 stacking and re-inspection machine, 300 support column, 400 first material box, and 500 second material box. Detailed Implementation

[0086] To make the above-mentioned objects, features, and advantages of this application more apparent and understandable, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0087] As described in the background section, in existing sorting equipment, operators not only need to trim silicon wafers at the trimming station, but also need to load the wafers to be sorted onto the sorter at the loading station, or handle abnormalities during the automatic loading process of the sorter, such as wafer fragments. Therefore, operators need to move back and forth between the trimming station near the unloading end of the sorter and the loading station near the loading end to alternate between trimming and loading operations. If operators stay at the trimming station for too long, it will delay loading the sorter, causing it to idle. If operators stay at the loading station for too long, defective wafers awaiting trimming at the trimming station cannot be processed in a timely manner, causing the wafer stacking inspection machine to stop.

[0088] Therefore, this application provides a silicon wafer transport line. For example... Figures 1 to 3 As shown, the silicon wafer conveying line of this application includes a first conveying section 1, a first transfer section 2, and a second conveying section 3, wherein:

[0089] The first conveying section 1 is located at the unloading end of the sorting machine 100. The first end of the first conveying section 1 is close to the stacking re-inspection machine 200. The first conveying section 1 is configured to convey along a first direction (such as the X direction).

[0090] The second conveying section 3 is located on the side of the sorting machine 100 and is configured to convey along a second direction (such as the Y direction). The first end of the second conveying section 3 is close to the second end of the first conveying section 1. The second end of the second conveying section 3 is provided with a trimming station A close to the feeding end of the sorting machine 100. The second direction is perpendicular to the first direction.

[0091] The first transfer unit 2 is located between the second end of the first conveying unit 1 and the first end of the second conveying unit 3.

[0092] The first conveying unit 1 is configured to receive a first type of silicon wafer from the stacking inspection machine 200 via a first material box placed thereon, and convey it to the first transfer unit 2; and to receive a second material box containing a second type of silicon wafer from the stacking inspection machine 200, and convey it to the first transfer unit 2, wherein the first type of silicon wafer is a silicon wafer with unqualified appearance quality, and the second type of silicon wafer is a silicon wafer with unqualified alignment.

[0093] The first conveying unit 1 is also configured to receive a first cassette containing trimmed silicon wafers returned by the first transfer unit 2 and convey it to a first end of the first conveying unit 1, and to receive an empty second cassette returned by the first transfer unit 2 and convey it to a first end of the first conveying unit 1.

[0094] The second conveying unit 3 is configured to receive empty first cassettes or second cassettes containing first-type silicon wafers and second-type silicon wafers from the first transfer unit 2, and convey them to the finishing station A. After the first-type and second-type silicon wafers are removed from the first and second cassettes, they are finished at the finishing station A.

[0095] The second conveying unit 3 is also configured to receive the trimmed silicon wafers flowing out of the trimming station A via the first material box thereon and convey them to the first transfer unit 2, as well as to convey the empty second material box to the first transfer unit 2.

[0096] The first transfer unit 2 is configured to receive empty first cassettes or second cassettes containing first-type silicon wafers or second-type silicon wafers from the first conveying unit 1, and transfer them to the second conveying unit 3. It also receives first cassettes containing trimmed silicon wafers and empty second cassettes from the second conveying unit 3, and transfers them to the first conveying unit 1.

[0097] To enable those skilled in the art to more clearly understand the technical solution of the silicon wafer conveyor line of this application, the conveying process of the silicon wafer conveyor line will be described exemplarily below.

[0098] In the initial state, a certain number of first material boxes are placed on the first conveying section 1.

[0099] The silicon wafer conveyor line's outbound transport process for the first and second wafer bins (i.e., from the stacking and inspection machine 200 to the finishing station A) is as follows:

[0100] The first conveyor unit 1 receives first-type silicon wafers (wafers with substandard appearance quality) from the stacking inspection machine 200 via its first material box. Of course, since there are a large number of first material boxes (redundant setting), not every first material box can receive first-type silicon wafers. At the same time, the first conveyor unit 1 also receives a second material box containing second-type silicon wafers (wafers with substandard alignment) from the stacking inspection machine 200.

[0101] The first conveying unit 1 conveys the first material box containing the first type of silicon wafers, the empty first material box (without receiving the first type of silicon wafers), and the second material box containing the second type of silicon wafers to the first transfer unit 2.

[0102] The first transfer unit 2 receives the first material box containing first type silicon wafers, the empty first material box (without receiving first type silicon wafers), and the second material box containing second type silicon wafers from the first conveying unit 1, and transfers them to the second conveying unit 3.

[0103] The second conveying unit 3 conveys the first material box containing the first type of silicon wafers, the empty first material box (without receiving the first type of silicon wafers), and the second material box containing the second type of silicon wafers to the finishing station A.

[0104] After the operator at the trimming station A removes the first and second type silicon wafers from the first and second material boxes, they trim the first and second type silicon wafers to obtain trimmed silicon wafers. The trimmed silicon wafers are no longer classified.

[0105] The return journey (i.e., from trimming station A to the wafer stacking inspection machine 200) of the silicon wafer conveyor line to the first and second wafer boxes is as follows:

[0106] The trimmed silicon wafers are uniformly and stacked and placed back into the first material box at the second end of the second conveyor section 3. Furthermore, since the trimmed silicon wafers are not placed back into the second material box, the second material box is empty during the return journey.

[0107] The second conveying unit 3 conveys the first material box containing the trimmed silicon wafers and the empty second material box to the first transfer unit 2.

[0108] The first transfer unit 2 receives the first material box containing the trimmed silicon wafers and the empty second material box from the second conveying unit 3 and transfers them to the first conveying unit 1.

[0109] The first conveying unit 1 transports the received first material box containing the trimmed silicon wafers and the empty second material box to the stacking re-inspection machine 200. The trimmed silicon wafers are removed from the first material box and then sent back into the stacking re-inspection machine 200 and flow into the subsequent packaging and unloading mechanism, while the second material box is transferred to the stacking re-inspection machine 200 for reuse.

[0110] As can be seen, in the silicon wafer conveying line provided in this application, the first conveying section 1 is located at the unloading end of the sorting machine 100, and the second end of the second conveying section 3 is close to the loading end of the sorting machine 100. With this arrangement, the trimming station A can coincide with the loading station of the sorting machine 100. Thus, the operator can trim and load silicon wafers from the sorting machine 100 while remaining at the loading end, eliminating the need to move back and forth between the loading and unloading ends of the sorting machine 100, thereby improving work efficiency.

[0111] like Figures 1 to 5 As shown, optionally, the first conveying unit 1 includes a first conveying line 11 and a second conveying line 12 arranged side by side, wherein:

[0112] The first conveyor line 11 is configured to receive the first type of silicon wafers flowing out of the stacking inspection machine 200 via the first material box and convey them to the first transfer unit 2, and to receive the first material box containing the trimmed silicon wafers returned by the first transfer unit 2 and convey it to the first end of the first conveyor line 11.

[0113] The second conveyor line 12 is configured to receive the second cassette containing the second type of silicon wafers flowing out of the wafer stacking inspection machine 200 and convey it to the first transfer unit 2, and to receive the empty second cassette returned by the first transfer unit 2 and convey it to the first end of the second conveyor line 12.

[0114] The first conveying section 1 is configured with a first conveying line 11 and a second conveying line 12 arranged side by side. The first conveying line 11 and the second conveying line 12 respectively carry out reciprocating conveying of the first material box and the second material box, which facilitates the simultaneous loading and unloading of the first material box and the second material box at the first end of the first conveying line 11 and the second conveying line 12, thereby improving work efficiency.

[0115] Optionally, both the first conveyor line 11 and the second conveyor line 12 include an upper conveyor line and a lower conveyor line arranged in layers and with opposite conveying directions.

[0116] The upper conveyor line 111 of the first conveyor line 11 is configured to receive the first type of silicon wafers flowing out of the stacking and inspection machine 200 via the first material box and convey them to the first transfer unit 2. The lower conveyor line 112 of the first conveyor line 11 is configured to receive the first material box containing the trimmed silicon wafers returned by the first transfer unit 2 and convey it to the first end of the first conveyor line 11.

[0117] As can be seen, by setting the first conveyor line 11 as an upper conveyor line 111 and a lower conveyor line 112 with opposite conveying directions, bidirectional independent conveying achieves physical isolation of the first material box for the outbound and return journeys, thereby realizing the collision-free and efficient flow of the first material box.

[0118] The upper conveyor of the second conveyor line 12 is configured to receive the second cassette containing the second type of silicon wafers flowing out of the wafer stacking inspection machine 200 and convey it to the first transfer unit 2. The lower conveyor of the second conveyor line 12 is configured to receive the emptied second cassette returned by the first transfer unit 2 and convey it to the first end of the second conveyor line 12.

[0119] Similarly, by setting the second conveyor line 12 as an upper conveyor line and a lower conveyor line with opposite conveying directions, bidirectional independent conveying achieves physical isolation between the outgoing and returning second material boxes, thereby achieving conflict-free and efficient flow of the second material boxes.

[0120] like Figure 4 As shown, optionally, the silicon wafer conveying line in this embodiment of the application further includes a first lifting conveying section 4 disposed at the first end of the first conveying line 11, wherein: the first lifting conveying section 4 is configured to connect to the upper conveying line 111 or the lower conveying line 112 of the first conveying line 11 by lifting.

[0121] When the first lifting conveyor unit 4 connects with the lower conveyor line 112 of the first conveyor line 11, it receives the first material box containing the trimmed silicon wafers transported back from the lower conveyor line of the first conveyor line 11. The trimmed silicon wafers are then transferred from the first lifting conveyor unit 4 to the wafer stacking inspection machine 200.

[0122] When the first lifting conveyor 4 connects with the upper conveyor line 111 of the first conveyor line 11, it receives the first type of silicon wafers flowing out of the stacking inspection machine 200 through the empty first material box on it, and conveys the first material box containing the first type of silicon wafers to the upper conveyor line 111 of the first conveyor line 11.

[0123] It can be seen that by setting the first lifting conveyor 4 at the first end of the first conveyor line 11, the first material box can be switched between the upper and lower conveyor lines of the first conveyor line 11.

[0124] The first end of the second conveyor line 12 does not require a lifting conveyor section. After the empty second material box is conveyed to the first end by the lower conveyor line of the second conveyor line 12, the second material box is directly transferred to the stacking inspection machine 200 by the handling mechanism (such as a robot). The second material box containing the second type of silicon wafers flowing out of the stacking inspection machine 200 is directly placed onto the upper conveyor line of the second conveyor line 12 by the handling mechanism.

[0125] The upper and lower conveyor lines of the first conveyor line 11 and the second conveyor line 12 can both adopt existing conveyor lines with various structures capable of conveying material boxes. For example, a conveyor line consisting of a drive roller, a driven roller, a first drive unit, and two belts, with the two belts spaced apart and parallel to each other on the drive roller and the driven roller, the first drive unit driving the drive roller to rotate, thereby driving the two belts to move synchronously, and the two belts cooperating to carry the first material box or the second material box.

[0126] like Figure 4 As shown, optionally, the first lifting and conveying unit 4 includes a base 42, a lifting drive 41, and a belt conveyor 43. The lifting drive 41 drives the base 42 to move vertically up and down. The belt conveyor 43 is mounted on the base 42, and its belt carries either a first or a second material box. The belt conveyor 43 drives the first or second material box to slide horizontally by sliding its own belt. The belt of the belt conveyor 43 can reciprocate bidirectionally along a first direction.

[0127] In one embodiment, the second conveying unit 3 includes a third conveying line and a fourth conveying line (not shown) arranged side by side, wherein:

[0128] The third conveyor line is configured to receive empty or first material boxes containing first type silicon wafers from the first transfer unit 2 and convey them to the trimming station A, and to receive trimmed silicon wafers flowing out of the trimming station A via the first material box, and to convey the first material box containing the trimmed silicon wafers to the first transfer unit 2.

[0129] The fourth conveyor line is configured to receive the second material box containing the second type of silicon wafers conveyed by the first transfer unit 2 and convey it to the trimming station A, and to convey the empty second material box to the first transfer unit 2.

[0130] Similarly, the second conveying section 3 is configured as a third conveying line and a fourth conveying line arranged side by side. The third conveying line and the fourth conveying line respectively convey the first material box and the second material box, which facilitates the simultaneous loading and unloading of the first material box and the second material box at the second end of the third conveying line and the fourth conveying line, thereby improving work efficiency.

[0131] Optionally, both the third and fourth conveyor lines include an upper conveyor line and a lower conveyor line arranged in opposite directions. Wherein:

[0132] The upper conveyor of the third conveyor line is configured to receive empty or first material boxes containing first-type silicon wafers from the first transfer unit 2 and convey them to the trimming station A. The lower conveyor of the third conveyor line is configured to receive trimmed silicon wafers flowing out of the trimming station via the first material box and convey the first material box containing the trimmed silicon wafers to the first transfer unit 2.

[0133] The third conveyor line is set up as an upper conveyor line and a lower conveyor line with opposite conveying directions. The bidirectional independent conveying realizes the physical isolation of the first material box for the outbound and return trips, thereby achieving conflict-free and efficient flow of the first material box.

[0134] The upper conveyor of the fourth conveyor line is configured to receive the second material box containing the second type of silicon wafers from the first transfer unit 2 and convey it to the trimming station A. The lower conveyor line of the fourth conveyor line is configured to convey the emptied second material box to the first transfer unit 2.

[0135] Similarly, by setting the fourth conveyor line as an upper and lower conveyor line with opposite conveying directions, bidirectional independent conveying achieves physical isolation between the outgoing and returning second material boxes, thereby enabling conflict-free and efficient flow of the second material boxes.

[0136] The upper and lower conveyor lines of the third and fourth conveyor lines can all adopt existing conveyor lines with various structures capable of conveying material boxes. For example, a conveyor line consisting of a drive roller, a driven roller, a first drive unit, and two belts, with the two belts spaced apart and parallel to the drive roller and the driven roller, the first drive unit driving the drive roller to rotate, thereby driving the two belts to move synchronously, and the two belts cooperating to carry the first material box or the second material box.

[0137] like Figures 1 to 6 As shown, in another embodiment, the second conveying unit 3 includes a buffer conveying unit 31, a second transfer unit 32, a transfer conveying unit 33, a third transfer unit 34, and a receiving conveying unit 35 arranged sequentially along the second direction, wherein:

[0138] The buffer conveying unit 31 includes a first buffer conveying line 311 and a second buffer conveying line 312 arranged side by side.

[0139] The receiving and conveying unit 35 includes a first receiving and conveying line 351 and a second receiving and conveying line 352 arranged side by side.

[0140] The first buffer conveyor line 311 is configured to receive empty or first material boxes containing first type silicon wafers conveyed by the first transfer unit 2 and convey them to the second transfer unit 32, and to receive first material boxes containing trimmed silicon wafers returned by the second transfer unit 32 and convey them to the first transfer unit 2.

[0141] The second buffer conveyor line 312 is configured to receive a second cassette containing a second type of silicon wafer conveyed by the first transfer unit 2 and convey it to the second transfer unit 32; and to receive an empty second cassette returned by the second transfer unit 32 and convey it to the first transfer unit 2.

[0142] The transfer and conveying unit 33 is configured to receive empty or first material boxes containing first type silicon wafers and second material boxes containing second type silicon wafers conveyed by the second transfer unit 32, and convey them to the third transfer unit 34; and is configured to receive first material boxes containing trimmed silicon wafers and empty second material boxes returned by the third transfer unit 34, and convey them to the second transfer unit 32.

[0143] The first receiving conveyor line 351 is configured to receive empty or first material boxes containing first type silicon wafers conveyed by the third transfer unit 34 and convey them to the trimming station A; and to receive trimmed silicon wafers flowing out of the trimming station A via the first material box and convey the first material box containing the trimmed silicon wafers to the third transfer unit 34.

[0144] The second receiving conveyor line 352 is configured to receive the second material box containing the second type of silicon wafers conveyed by the third transfer unit 34 and convey it to the trimming station A, and to convey the empty second material box to the third transfer unit 34.

[0145] The second transfer unit 32 is configured to receive empty or first material boxes containing first type silicon wafers conveyed by the first buffer conveyor line 311 and second material boxes containing second type silicon wafers conveyed by the second buffer conveyor line 312, and convey them to the transfer conveyor unit 33; and to receive first material boxes containing trimmed silicon wafers and empty second material boxes conveyed back by the transfer conveyor unit 33, and convey them to the first buffer conveyor line 311 and the second buffer conveyor line 312 respectively.

[0146] The third transfer unit 34 is configured to receive empty first material boxes or second material boxes containing first type silicon wafers and second material boxes containing second type silicon wafers from the transfer and conveying unit 33, and respectively convey them to the first receiving conveyor line 351 and the second receiving conveyor line 352; and to receive the first material box containing trimmed silicon wafers conveyed back from the first receiving conveyor line 351 and the empty second material box conveyed back from the second receiving conveyor line 352, and convey them to the transfer and conveying unit 33.

[0147] By configuring the second conveying section 3 into three sections: a buffer conveying section 31, a transfer conveying section 33, and a receiving conveying section 35, and by making the buffer conveying section 31, the transfer conveying section 33, and the receiving conveying section 35 independent of each other, the conveying speed of each section can be independently adjusted. Therefore, buffering of the first type of material box and the second type of material box during the conveying process can be realized, thereby alleviating the difference in working rhythm between the second end of the second conveying section 3 and the first end of the first conveying section 1.

[0148] The buffer conveying unit 31 is configured to include a first buffer conveying line 311 and a second buffer conveying line 312. The first buffer conveying line 311 and the second buffer conveying line 312 respectively convey and buffer the first material box and the second material box, thereby ensuring the buffering capacity of the first material box and the second material box.

[0149] The receiving and conveying unit 35 is configured to include a first receiving and conveying line 351 and a second receiving and conveying line 352. The first receiving and conveying line 351 and the second receiving and conveying line 352 respectively convey the first material box and the second material box, thereby facilitating the synchronous picking and putting of the first material box and the second material box at the second end of the first receiving and conveying line 351 and the second receiving and conveying line 352, thus improving work efficiency.

[0150] like Figure 1 and Figure 2 As shown, the transfer conveyor section 33 can be configured as a single-line conveyor structure.

[0151] During the outbound transport process, the empty first material box or the first material box containing the first type of silicon wafer and the second material box containing the second type of silicon wafer transported by the first buffer conveyor line 311 and the second buffer conveyor line 312 are converged by the second transfer unit 32 to the transfer conveyor unit 33.

[0152] Subsequently, the third transfer unit 34 diverts the empty first material box or the first material box containing the first type of silicon wafer and the second material box containing the second type of silicon wafer on the transfer conveyor unit 33 to the first receiving conveyor line 351 and the second receiving conveyor line 352.

[0153] The convergence and divergence processes of the return transport are the reverse of those of the outbound transport, and will not be elaborated here.

[0154] The transfer conveyor 33 is configured as a single-line conveyor structure, which enables the second conveyor 3 to avoid other facilities (such as the plant's support columns 300) located on its conveying path.

[0155] Of course, such as Figure 5 , Figure 7 and Figure 8 As shown, the first material box 400 and the second material box 500 have significantly different structures; for example, the first material box 400 is horizontal while the second material box 500 is tilted. Therefore, with the cooperation of the visual inspection mechanism, the third transfer unit 34 can accurately divert the empty first material box or the first material box containing the first type of silicon wafer, and the second material box containing the second type of silicon wafer, from the transfer conveyor unit 33 to the first receiving conveyor line 351 and the second receiving conveyor line 352.

[0156] Similarly, with the cooperation of the visual inspection mechanism, the second transfer unit 32 can accurately divert the first material box containing the trimmed silicon wafers and the empty second material box on the transfer and conveying unit 33 to the first buffer conveying line 311 and the second buffer conveying line 312.

[0157] like Figure 3 and Figure 5 As shown, optionally, both the first buffer conveyor line 311 and the second buffer conveyor line 312 include an upper conveyor line and a lower conveyor line arranged in opposite directions, wherein:

[0158] The upper conveyor line of the first buffer conveyor line 311 is configured to receive empty or first material boxes containing first type silicon wafers from the first transfer unit 2 and convey them to the second transfer unit 32. The lower conveyor line of the first buffer conveyor line 311 is configured to receive first material boxes containing trimmed silicon wafers returned by the second transfer unit 32 and convey them to the first transfer unit 2.

[0159] The upper conveyor line of the second buffer conveyor line 312 is configured to receive the second cassette containing the second type of silicon wafers conveyed by the first transfer unit 2 and convey it to the second transfer unit 32. The lower conveyor line of the second buffer conveyor line 312 is configured to receive the emptied second cassette returned by the second transfer unit 32 and convey it to the first transfer unit 2.

[0160] The first buffer conveyor line 31 is configured to include an upper conveyor line and a lower conveyor line with opposite conveying directions, achieving physical isolation between the outgoing and returning first material boxes, thereby enabling conflict-free and efficient flow of the material boxes. Similarly, the second buffer conveyor line 312 is configured to include an upper conveyor line and a lower conveyor line with opposite conveying directions, achieving physical isolation between the outgoing and returning second material boxes, thereby enabling conflict-free and efficient flow of the material boxes.

[0161] Optionally, the transfer conveyor 33 includes an upper conveyor line and a lower conveyor line arranged in opposite directions. The upper conveyor line of the transfer conveyor 33 is configured to receive empty first cassettes or cassettes containing first-type silicon wafers and second cassettes containing second-type silicon wafers from the second transfer conveyor 32, and convey them to the third transfer conveyor 34. The lower conveyor line of the transfer conveyor 33 is configured to receive first cassettes containing trimmed silicon wafers and empty second cassettes returned from the third transfer conveyor 34, and convey them to the second transfer conveyor 32.

[0162] Similarly, by setting the transfer and conveying unit 33 to include an upper conveying line and a lower conveying line with opposite conveying directions, the physical isolation of the first and second material boxes for the outbound and return journeys is achieved, thereby realizing the collision-free and efficient flow of the material boxes.

[0163] Optionally, both the first receiving conveyor line 351 and the second receiving conveyor line 352 include an upper conveyor line and a lower conveyor line arranged in opposite directions, wherein:

[0164] The upper conveyor of the first receiving conveyor line 351 is configured to receive empty or first material boxes containing first-type silicon wafers from the third transfer station 34 and convey them to the trimming station A; the lower conveyor of the first receiving conveyor line 351 is configured to receive trimmed silicon wafers flowing out of the trimming station via the first material box and convey the first material box containing the trimmed silicon wafers to the third transfer station 34. The upper conveyor of the second receiving conveyor line 352 is configured to receive second material boxes containing second-type silicon wafers from the third transfer station 34 and convey them to the trimming station A; the lower conveyor of the second receiving conveyor line 352 is configured to convey the empty second material boxes to the third transfer station 34.

[0165] The first receiving conveyor line 351 is configured to include an upper conveyor line and a lower conveyor line with opposite conveying directions, achieving physical isolation between the outgoing and returning first material boxes, thereby enabling collision-free and efficient flow of the material boxes. Similarly, the second receiving conveyor line 352 is configured to include an upper conveyor line and a lower conveyor line with opposite conveying directions, achieving physical isolation between the outgoing and returning second material boxes, thereby enabling collision-free and efficient flow of the material boxes.

[0166] like Figures 1 to 3 and Figure 6As shown, optionally, the silicon wafer conveying line in this embodiment further includes a second lifting conveying section 5 disposed at the second end of the first receiving conveying line 351, and a third lifting conveying section 6 disposed at the second end of the second receiving conveying line 352, wherein:

[0167] The second lifting conveyor unit 5 is configured to connect to the upper or lower conveyor line of the first receiving conveyor line 351 via lifting. When the second lifting conveyor unit 5 connects to the upper conveyor line of the first receiving conveyor line 351, it receives empty or first material boxes containing first-type silicon wafers output from the upper conveyor line. The operator removes the first-type silicon wafers from the first material box on the second lifting conveyor unit 5 and performs trimming. After trimming, the trimmed silicon wafers are placed back into the first material box on the second lifting conveyor unit 5.

[0168] When the second lifting conveyor 5 connects with the lower conveyor line of the first receiving conveyor line 351, it conveys the first material box containing the trimmed silicon wafers to the lower conveyor line of the first receiving conveyor line 351.

[0169] The third lifting conveyor unit 6 is configured to connect to the upper or lower conveyor line of the second receiving conveyor line 352 via lifting. When the third lifting conveyor unit 6 connects to the upper conveyor line of the second receiving conveyor line 352, it receives the second material box containing the second type of silicon wafers output from the upper conveyor line. The operator removes the second type of silicon wafers from the second material box on the third lifting conveyor unit 6 and performs trimming. After trimming, the trimmed silicon wafers are placed back into the first material box on the second lifting conveyor unit 5.

[0170] When the third lifting conveyor 6 connects with the lower conveyor line of the second receiving conveyor line 352, the emptied second material box is conveyed back to the lower conveyor line of the second receiving conveyor line 352.

[0171] As can be seen, by setting a second lifting conveyor 5 at the second end of the first receiving conveyor line 351, the switching of the first material box between the upper and lower conveyor lines of the first receiving conveyor line 351 is realized. Similarly, by setting a third lifting conveyor 6 at the second end of the second receiving conveyor line 352, the switching of the second material box between the upper and lower conveyor lines of the second receiving conveyor line 352 is realized.

[0172] Optionally, the second lifting conveyor 5 and the third lifting conveyor 6 have the same structure as the first lifting conveyor 4 in the previous embodiment, and will not be described again here. Of course, the belts of the belt conveyors of the second lifting conveyor 5 and the third lifting conveyor 6 reciprocate bidirectionally along the second direction.

[0173] like Figure 5 As shown, optionally, the first transit unit 2 includes a first transit branch 21 and a second transit branch 22, wherein:

[0174] The first transfer section 21 is located at the second end of the first conveyor line 11 and the second conveyor line 12. The second transfer section 22 is located between the first transfer section 21 and the first end of the first buffer conveyor line 311 and the second buffer conveyor line 312, and is configured to be able to switch and translate along a first direction to achieve docking with the first transfer section 21, the first buffer conveyor line 311 or the second buffer conveyor line 312.

[0175] The first transfer section 21 is used to receive empty first material boxes or first material boxes containing first-type silicon wafers and second material boxes containing second-type silicon wafers conveyed by the first conveyor line 11 and the second conveyor line 12, and convey them to the second transfer section 22 connected to it. The first transfer section 21 is also used to receive first material boxes containing trimmed silicon wafers and empty second material boxes conveyed by the second transfer section 22, and to convey the first material boxes containing trimmed silicon wafers to the second end of the first conveyor line 11, and convey the empty second material boxes to the second end of the second conveyor line 12. Optionally, the first transfer section 21 is also provided with a lifting conveyor capable of conveying along a first direction. The lifting conveyor can lift the first material box or second material box that has been conveyed to the first transfer section 21 out of the first transfer section 21, and then convey it along the first direction to the second end of the first conveyor line 11 or the second conveyor line 12.

[0176] When the second transfer section 22 connects with the first transfer section 21, it receives empty first material boxes or first material boxes containing first-type silicon wafers or second material boxes containing second-type silicon wafers from the first transfer section 21, or it transfers first material boxes containing trimmed silicon wafers or empty second material boxes to the first transfer section 21. When the second transfer section 22 connects with the first buffer conveyor line 311, it transfers empty first material boxes or first material boxes containing first-type silicon wafers to the first buffer conveyor line 311, or it receives first material boxes containing trimmed silicon wafers from the first buffer conveyor line 311. When the second transfer section 22 connects with the second buffer conveyor line 312, it transfers second material boxes containing second-type silicon wafers to the second buffer conveyor line 312, or it receives empty second material boxes from the second buffer conveyor line 312.

[0177] When the first conveyor line 11, the second conveyor line 12, the first buffer conveyor line 311, and the second buffer conveyor line 312 include two layers of conveyor lines, the first transfer section 21 and the second transfer section 22 can also be set to two layers accordingly.

[0178] Optionally, the second transfer section 32 and the third transfer section 34 can adopt the same structure as the second transfer section 22. Specifically, the second transfer section 32 can be shifted along the first direction to connect with the first buffer conveyor line 311, the second buffer conveyor line 312, or the transfer conveyor section 33, thereby transferring the first and second material boxes. The third transfer section 34 can be shifted along the first direction to connect with the transfer conveyor section 33, the first receiving conveyor line 351, or the second receiving conveyor line 352, thereby transferring the first and second material boxes. Similarly, the second transfer section 32 and the third transfer section 34 can also be configured as two layers.

[0179] This application also provides a silicon wafer sorting device. (Continue to reference...) Figure 1 and Figure 2 As shown, the silicon wafer sorting equipment of this application includes a sorting machine 100, a stacking inspection machine 200, and a silicon wafer conveying line provided in any of the above embodiments, wherein:

[0180] The sorting machine 100 is used to sort and classify silicon wafers, and silicon wafers belonging to the same category are stacked together.

[0181] The wafer re-inspection machine 200 is set at the unloading end of the sorting machine 100. It is used to re-inspect the stacked silicon wafers output by the sorting machine 100 and classify the silicon wafers into qualified silicon wafers, first-class silicon wafers with unqualified appearance quality, and second-class silicon wafers with unqualified alignment according to the re-inspection results.

[0182] The silicon wafer conveyor line is used to receive the first type and second type of silicon wafers output from the stacking inspection machine 200 and convey them to the trimming station A located at the loading end of the sorting machine 100, where the first type and second type of silicon wafers are trimmed.

[0183] The silicon wafer conveyor line is also used to transport the trimmed silicon wafers back to the stacking and inspection machine 200.

[0184] The silicon wafer sorting equipment provided in this application has two ends of the silicon wafer conveyor line that are close to the loading end and unloading end of the sorter 100, respectively. With this configuration, the trimming station can overlap with the loading station of the sorter 100.

[0185] The silicon wafer conveyor line inputs the first and second type silicon wafers, which have failed inspection and are stacked in piles, received from the stacking inspection machine 200, to the trimming station A. Operators can trim and load silicon wafers into the sorting machine 100 from the loading end, eliminating the need to move back and forth between the loading and unloading ends of the sorting machine 100, thus improving work efficiency.

[0186] This application provides a sufficiently detailed and specific description. Those skilled in the art should understand that the descriptions in the embodiments are merely exemplary, and all changes made without departing from the true spirit and scope of this application should fall within its protection scope. The scope of protection claimed in this application is defined by the claims, not by the above descriptions in the embodiments. Without contradiction, some optional components in one embodiment can also be used in another embodiment, and some preferred structures of the same component in one embodiment are also applicable to another embodiment. Furthermore, there may be slight differences in the wording of the names of certain components in different embodiments; these slight differences will not affect the understanding of the technical solution of the present invention by those skilled in the art.

Claims

1. A silicon wafer conveying line, characterized in that, The silicon wafer conveying line includes a first conveying section, a first transfer section, and a second conveying section, wherein: The first conveying section is located at the unloading end of the sorting machine, and the first end of the first conveying section is close to the stacking re-inspection machine. The first conveying section is configured to convey along a first direction. The second conveying section is disposed on the side of the sorting machine and is configured to convey along the second direction. The first end of the second conveying section is close to the second end of the first conveying section. The second end of the second conveying section is provided with a trimming station close to the loading end of the sorting machine. The second direction is perpendicular to the first direction. The first transfer unit is disposed between the second end of the first conveying unit and the first end of the second conveying unit: The first conveying unit is configured to receive a first type of silicon wafer from the stacking inspection machine via a first cassette placed thereon, and convey it to the first transfer unit; and to receive a second cassette containing a second type of silicon wafer from the stacking inspection machine, and convey it to the first transfer unit, wherein the first type of silicon wafer is a silicon wafer with unqualified appearance quality, and the second type of silicon wafer is a silicon wafer with unqualified alignment. The first conveying unit is also configured to receive a first cassette containing trimmed silicon wafers returned by the first transfer unit and convey it to a first end of the first conveying unit; and to receive an empty second cassette returned by the first transfer unit and convey it to a first end of the first conveying unit. The second conveying unit is configured to receive an empty first cassette containing a first type of silicon wafer and a second cassette containing a second type of silicon wafer from the first transfer unit, and convey them to the trimming station; after the first type of silicon wafer and the second type of silicon wafer are removed from the first cassette and the second cassette, they are trimmed at the trimming station; The second conveying section is also configured to receive the trimmed silicon wafers flowing out of the trimming station via a first hopper thereon and convey them to the first transfer section; and to convey the empty second hopper to the first transfer section; The first transfer unit is configured to receive empty or first material boxes containing first type silicon wafers and second material boxes containing second type silicon wafers from the first conveying unit and transfer them to the second conveying unit; and to receive first material boxes containing trimmed silicon wafers and second material boxes that have been emptied from the second conveying unit and transfer them to the first conveying unit.

2. The silicon wafer conveying line as described in claim 1, characterized in that, The first conveying unit includes a first conveyor line and a second conveyor line arranged side by side, wherein: The first conveyor line is configured to receive a first type of silicon wafer flowing out of the stacking inspection machine via a first hopper and convey it to the first transfer unit; and to receive a first hopper containing trimmed silicon wafers returned from the first transfer unit and convey it to the first end of the first conveyor line. The second conveyor line is configured to receive a second cassette containing a second type of silicon wafer from the wafer stacking inspection machine and convey it to the first transfer unit; and to receive an empty second cassette returned from the first transfer unit and convey it to the first end of the second conveyor line.

3. The silicon wafer conveying line as described in claim 2, characterized in that, Both the first conveyor line and the second conveyor line include an upper conveyor line and a lower conveyor line arranged in two layers with opposite conveying directions; The upper conveyor of the first conveyor line is configured to receive the first type of silicon wafers flowing out of the stacking inspection machine via the first material box and convey them to the first transfer unit; the lower conveyor of the first conveyor line is configured to receive the first material box containing the trimmed silicon wafers returned by the first transfer unit and convey it to the first end of the first conveyor line. The upper conveyor of the second conveyor line is configured to receive the second material box containing the second type of silicon wafers flowing out from the wafer stacking inspection machine and convey it to the first transfer unit; the lower conveyor line of the second conveyor line is configured to receive the empty second material box returned by the first transfer unit and convey it to the first end of the second conveyor line.

4. The silicon wafer conveying line as described in claim 3, characterized in that, The silicon wafer conveying line further includes a first lifting conveying section disposed at a first end of the first conveying line, wherein: The first lifting conveyor is configured to connect to the upper or lower conveyor line of the first conveyor line by lifting; when the first lifting conveyor connects to the lower conveyor line of the first conveyor line, it receives the first material box containing the trimmed silicon wafers transported back from the lower conveyor line of the first conveyor line; when the first lifting conveyor connects to the upper conveyor line of the first conveyor line, it receives the first type of silicon wafers flowing out from the stacking inspection machine through the first material box, and transports the first material box containing the first type of silicon wafers to the upper conveyor line of the first conveyor line.

5. The silicon wafer conveying line as described in claim 1, characterized in that, The second conveying section includes a third conveyor line and a fourth conveyor line arranged side by side, wherein: The third conveyor line is configured to receive an empty or first material box containing a first type of silicon wafer from the first transfer station and convey it to the trimming station; and to receive trimmed silicon wafers flowing out of the trimming station via the first material box and convey the first material box containing the trimmed silicon wafers to the first transfer station. The fourth conveyor line is configured to receive a second material box containing a second type of silicon wafer from the first transfer station and convey it to the trimming station; and to convey the empty second material box to the first transfer station.

6. The silicon wafer conveying line as described in claim 5, characterized in that, The third conveyor line and the fourth conveyor line both include an upper conveyor line and a lower conveyor line arranged in two layers with opposite conveying directions; The upper conveyor of the third conveyor line is configured to receive empty or first material boxes containing first type silicon wafers from the first transfer station and convey them to the trimming station; the lower conveyor of the third conveyor line is configured to receive trimmed silicon wafers flowing out of the trimming station via the first material box and convey the first material box containing the trimmed silicon wafers to the first transfer station. The upper conveyor of the fourth conveyor line is configured to receive the second material box containing the second type of silicon wafers conveyed by the first transfer unit and convey it to the trimming station; the lower conveyor of the fourth conveyor line is configured to convey the empty second material box to the first transfer unit.

7. The silicon wafer conveying line as described in claim 1, characterized in that, The second conveying section includes a buffer conveying section, a second transfer section, a transfer conveying section, a third transfer section, and a receiving conveying section arranged sequentially along the second direction, wherein: The buffer conveying unit includes a first buffer conveying line and a second buffer conveying line arranged side by side; The receiving and conveying section includes a first receiving and conveying line and a second receiving and conveying line arranged side by side; The first buffer conveyor line is configured to receive an empty or first material box containing a first type of silicon wafer conveyed by the first transfer unit and convey it to the second transfer unit; and to receive a first material box containing a trimmed silicon wafer returned by the second transfer unit and convey it to the first transfer unit. The second buffer conveyor line is configured to receive a second cassette containing a second type of silicon wafer conveyed by the first transfer unit and convey it to the second transfer unit; and to receive an empty second cassette returned by the second transfer unit and convey it to the first transfer unit. The transfer and conveying unit is configured to receive empty or first material boxes containing first type silicon wafers and second material boxes containing second type silicon wafers from the second transfer unit and convey them to the third transfer unit; and is configured to receive first material boxes containing trimmed silicon wafers and empty second material boxes returned by the third transfer unit and convey them to the second transfer unit. The first receiving conveyor line is configured to receive an empty or first material box containing first type silicon wafers conveyed by the third transfer unit and convey it to the trimming station; and to receive trimmed silicon wafers flowing out of the trimming station via the first material box and convey the first material box containing the trimmed silicon wafers to the third transfer unit. The second receiving conveyor line is configured to receive the second material box containing the second type of silicon wafers conveyed by the third transfer station and convey it to the trimming station; and to convey the empty second material box to the third transfer station; The second transfer unit is configured to receive empty or first material boxes containing first type silicon wafers conveyed by the first buffer conveyor line, and second material boxes containing second type silicon wafers conveyed by the second buffer conveyor line, and convey them to the transfer conveyor unit; and to receive first material boxes containing trimmed silicon wafers and empty second material boxes conveyed back by the transfer conveyor unit, and convey them to the first buffer conveyor line and the second buffer conveyor line respectively. The third transfer unit is configured to receive empty or first material boxes containing first-type silicon wafers and second material boxes containing second-type silicon wafers from the transfer and conveying unit, and respectively convey them to the first receiving conveyor line and the second receiving conveyor line; and to receive first material boxes containing trimmed silicon wafers from the first receiving conveyor line and empty second material boxes from the second receiving conveyor line, and convey them to the transfer and conveying unit.

8. The silicon wafer conveying line as described in claim 7, characterized in that: Both the first buffer conveyor line and the second buffer conveyor line include an upper conveyor line and a lower conveyor line arranged in opposite directions, wherein: The upper conveyor of the first buffer conveyor is configured to receive an empty or first material box containing a first type of silicon wafer from the first transfer unit and convey it to the second transfer unit; the lower conveyor of the first buffer conveyor is configured to receive a first material box containing a trimmed silicon wafer returned from the second transfer unit and convey it to the first transfer unit. The upper conveyor of the second buffer conveyor is configured to receive the second cassette containing the second type of silicon wafers conveyed by the first transfer unit and convey it to the second transfer unit; the lower conveyor of the second buffer conveyor is configured to receive the emptied second cassette returned by the second transfer unit and convey it to the first transfer unit. The transfer and conveying unit includes an upper conveyor line and a lower conveyor line arranged in two layers with opposite conveying directions, wherein: The upper conveyor line of the transfer and conveying unit is configured to receive empty or first material boxes containing first-type silicon wafers and second material boxes containing second-type silicon wafers from the second transfer unit, and convey them to the third transfer unit. The lower conveyor line of the transfer and conveying unit is configured to receive the first material box containing the trimmed silicon wafers and the empty second material box returned by the third transfer unit, and convey them to the second transfer unit. Both the first and second receiving conveyor lines include an upper conveyor line and a lower conveyor line arranged in opposite directions, wherein: The upper conveyor of the first receiving conveyor line is configured to receive the empty or first material box containing the first type of silicon wafers conveyed by the third transfer unit and convey it to the trimming station. The lower conveyor of the first receiving conveyor line is configured to receive the trimmed silicon wafers flowing out of the trimming station via the first material box, and to convey the first material box containing the trimmed silicon wafers to the third transfer unit; The upper conveyor of the second receiving conveyor is configured to receive the second material box containing the second type of silicon wafers conveyed by the third transfer unit and convey it to the trimming station; the lower conveyor of the second receiving conveyor is configured to convey the empty second material box to the third transfer unit.

9. The silicon wafer conveying line as described in claim 8, characterized in that: The silicon wafer conveying line further includes a second lifting conveying section disposed at the second end of the first receiving conveying line, and a third lifting conveying section disposed at the second end of the second receiving conveying line, wherein: The second lifting conveyor is configured to connect to the upper or lower conveyor line of the first receiving conveyor line by lifting; when the second lifting conveyor connects to the upper conveyor line of the first receiving conveyor line, it receives an empty or first material box containing first type silicon wafers output from the upper conveyor line; when the second lifting conveyor connects to the lower conveyor line of the first receiving conveyor line, it conveys the first material box containing trimmed silicon wafers to the lower conveyor line of the first receiving conveyor line. The third lifting conveyor is configured to connect to the upper or lower conveyor line of the second receiving conveyor line by lifting; when the third lifting conveyor connects to the upper conveyor line of the second receiving conveyor line, it receives the second material box containing the second type of silicon wafers output from the upper conveyor line; when the third lifting conveyor connects to the lower conveyor line of the second receiving conveyor line, it transports the emptied second material box back to the lower conveyor line of the second receiving conveyor line.

10. A silicon wafer sorting device, characterized in that, The silicon wafer sorting equipment includes a sorting machine, a stacking inspection machine, and a silicon wafer conveying line as described in any one of claims 1 to 9, wherein: The sorting machine is used to sort and classify silicon wafers, and silicon wafers belonging to the same category are stacked into piles; The stacked wafer re-inspection machine is installed at the unloading end of the sorting machine and is used to re-inspect the stacked silicon wafers output by the sorting machine, and classify the silicon wafers into qualified silicon wafers, first-class silicon wafers with unqualified appearance quality, and second-class silicon wafers with unqualified alignment according to the re-inspection results. The silicon wafer conveyor line is used to receive the first type and the second type of silicon wafers output by the stacking and inspection machine, and convey them to the trimming station located at the loading end of the sorting machine, where the first type and the second type of silicon wafers are trimmed. The silicon wafer conveyor line is also used to transport the trimmed silicon wafers back to the wafer stacking inspection machine.

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