Semiconductor cleaning apparatus

Abstract

The application discloses a semiconductor cleaning device, which comprises a cleaning brush, a driving assembly, a wear detection assembly and a controller. The cleaning brush comprises a brush shaft and a plurality of brush groups arranged on the circumferential side of the brush shaft. The driving assembly is connected with the brush shaft and used for driving the brush shaft to rotate. The wear detection assembly is used for detecting the wear amount of the brush groups. The actuating assembly is connected with the driving assembly and used for driving the driving assembly to move along a preset direction. The preset direction is perpendicular to the central axis of the brush shaft. The controller is connected with the wear detection assembly and the actuating assembly and used for controlling the actuating assembly to drive the driving assembly to move a corresponding distance along the preset direction according to the wear amount. The semiconductor cleaning device can effectively prolong the service life of the cleaning brush and improve the cleaning effect.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and more specifically to a semiconductor cleaning apparatus. Background Technology

[0002] In chip manufacturing, even the smallest contamination can severely impact semiconductor devices, potentially causing them to fail. Therefore, cleaning processes are crucial for ensuring the cleanliness of wafer surfaces. Currently, wafer cleaning is primarily achieved using semiconductor cleaning equipment. This equipment utilizes a motor to rotate cleaning brushes, which clean the wafers using the bristles on the brushes.

[0003] Because the bristles of the cleaning brush will wear down during use, the worn bristles will have less contact with the wafer, or even no contact at all, which will affect the cleaning effect of the wafer.

[0004] Therefore, improvements are needed to at least partially address the aforementioned problems. Utility Model Content

[0005] The utility model description section introduces a series of simplified concepts, which will be further explained in detail in the detailed description section. This utility model description section is not intended to limit the key features and essential technical features of the claimed technical solution, nor is it intended to determine the scope of protection of the claimed technical solution.

[0006] To at least partially solve the above problems, this utility model provides a semiconductor cleaning apparatus, comprising:

[0007] A cleaning brush includes a brush shaft and multiple bristle groups disposed on the circumferential side of the brush shaft.

[0008] A drive assembly, connected to the brush shaft, is used to drive the brush shaft to rotate;

[0009] A wear detection component is used to detect the amount of wear on the bristle assembly;

[0010] An actuation component, connected to the drive component, is used to drive the drive component to move along a preset direction, the preset direction being perpendicular to the central axis of the brush shaft;

[0011] A controller, connected to the wear detection component and the actuation component, is used to control the actuation component to drive the drive component to move a corresponding distance along the preset direction according to the amount of wear.

[0012] For example, the actuation component includes:

[0013] Fixed frame;

[0014] A first motor is connected to the fixed frame;

[0015] A lead screw is connected to the output end of the first motor and extends along the preset direction;

[0016] A lead screw nut is fitted onto the lead screw and connected to the drive assembly.

[0017] For example, the driving component includes:

[0018] A connecting plate is attached to the lead screw nut;

[0019] A second motor is connected to the connecting plate, and the output end of the second motor is connected to the brush shaft.

[0020] For example, the fixed frame has a guide rod extending in a first direction;

[0021] The connecting plate is provided with a guide groove or guide hole corresponding to the guide rod;

[0022] The guide rod is engaged with the guide groove, or the guide rod passes through the guide hole.

[0023] For example, the driving component further includes:

[0024] A brush assembly / disassembly assembly is disposed between the drive assembly and the brush shaft, the brush shaft being detachably connected to the brush assembly / disassembly assembly.

[0025] For example, one end of the brush shaft has a plug, and the plug is provided with a slot;

[0026] The brush assembly / disassembly component includes:

[0027] A socket having a slot that matches the shape of the plug, and a socket hole communicating with the slot is provided on one side wall of the socket;

[0028] A lever is inserted into the socket and configured to switch between a first position and a second position. The plug is inserted into the slot, and when the lever is in the first position, the lever is inserted into the slot, restricting the plug from leaving the slot. When the lever is in the second position, the lever is separated from the slot, and the plug is not restricted from leaving or inserting into the slot.

[0029] A pull block is connected to the end of the lever furthest from the slot;

[0030] A spring is sleeved on the lever, with its first end connected to the pull block and its second end connected to the insert sleeve. The spring is used to keep the lever in the first position when no external force is applied.

[0031] For example, the brush removal and assembly assembly further includes:

[0032] A connecting rod, the first end of which is connected to the insert;

[0033] A limiting block is connected to the second end of the connecting rod and is located on the side of the pull block away from the insert.

[0034] When the lever is in the second position, the pull block abuts against the limiting block, and the lever is still partially located in the insertion hole.

[0035] For example, the wear detection component includes:

[0036] A connector, the first end of which is connected to the drive assembly or the actuation assembly;

[0037] Mounting plate, connected to the second end of the connector;

[0038] A distance sensor is disposed on the side of the mounting plate facing the brush shaft, and is used to measure the distance between the bristle assembly and the distance sensor.

[0039] For example, the distance sensor is a laser distance sensor or an infrared distance sensor.

[0040] For example, the mounting plate is an arc-shaped plate, which is arranged around the brush shaft;

[0041] There are multiple distance sensors, and the distance sensors are evenly arranged along the circumferential direction of the brush shaft on the side of the arc plate facing the brush shaft.

[0042] According to the semiconductor cleaning device of this utility model, the wear amount of the bristle assembly in the cleaning brush can be detected by the wear detection component, and the actuation component can be controlled to drive the drive component (that is, drive the cleaning brush) to move a corresponding distance according to the wear amount, so as to compensate for the wear amount of the bristle assembly, so that the contact force between the worn bristle assembly and the wafer remains basically unchanged, ensuring the cleaning effect of the wafer, and extending the service life of the cleaning brush. Attached Figure Description

[0043] The following drawings, which are incorporated herein by reference and are used to understand this application, illustrate embodiments of the invention and their descriptions, thereby explaining the apparatus and principles of the invention. In the drawings,

[0044] Figure 1This is a schematic diagram of a semiconductor cleaning apparatus according to an embodiment of this application;

[0045] Figure 2 for Figure 1 A schematic diagram of the semiconductor cleaning device from another angle;

[0046] Figure 3 for Figure 1 The diagram shows the structure of the brush assembly / disassembly component and the cleaning brush, with the brush assembly / disassembly component shown in an exploded view.

[0047] Explanation of reference numerals in the attached figures:

[0048] 100-Cleaning brush, 110-Brush shaft, 120-Bristle assembly, 130-Insertion block, 131-Slot;

[0049] 200-Drive assembly, 210-Connecting plate, 211-Guide hole, 220-Second motor;

[0050] 300-Wear detection assembly, 310-Connector, 311-L-shaped support rod, 312-Fixing plate, 313-Connecting piece, 320-Mounting plate, 330-Distance sensor;

[0051] 400-Actuation assembly, 410-Fixed frame, 411-Guide rod, 420-First motor, 430-Lead screw, 440-Lead screw nut;

[0052] 500-Controller;

[0053] 600-Brush assembly / disassembly kit, 610-Plug, 611-Slot, 612-Socket, 620-Clamping rod, 630-Pull block, 640-Spring, 650-Connecting rod, 660-Limiting block. Detailed Implementation

[0054] The following description provides numerous specific details to offer a more thorough understanding of this application. However, it will be apparent to those skilled in the art that this application can be practiced without one or more of these details. In other instances, certain technical features well-known in the art have not been described to avoid confusion with this application.

[0055] It should be understood that this application can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Rather, providing these embodiments will make the disclosure thorough and complete, and will fully convey the scope of this application to those skilled in the art. In the drawings, for clarity, the dimensions and relative dimensions of layers and regions may be exaggerated. The same reference numerals denote the same elements throughout.

[0056] It should be understood that although the terms first, second, third, etc., may be used to describe various elements, components, areas, layers, and / or parts, these elements, components, areas, layers, and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, area, layer, or part from another element, component, area, layer, or part. Therefore, without departing from the teachings of this application, the first element, component, area, layer, or part discussed below may be referred to as the second element, component, area, layer, or part.

[0057] Spatial relation terms such as "below," "under," "below," "under," "above," and "above" are used here for convenience to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms are intended to also include different orientations of devices in use and operation.

[0058] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of this application. When used herein, the singular forms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising” and / or “including,” when used in this specification, identify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. When used herein, the term “and / or” includes any and all combinations of the associated listed items.

[0059] Embodiments of the utility model are described herein with reference to cross-sectional views that serve as schematic diagrams of preferred embodiments (and intermediate structures) of this application. Thus, variations in the shown shape can be anticipated due to, for example, manufacturing techniques and / or tolerances. Therefore, embodiments of this application should not be limited to the specific shapes shown herein, but include shape deviations due to, for example, manufacturing processes. Consequently, the figures are substantially schematic, and their shapes are not intended to show the actual shape of the device and are not intended to limit the scope of this application.

[0060] See attached document Figures 1-3 An exemplary description of a semiconductor cleaning apparatus according to an embodiment of this application is provided. The semiconductor cleaning apparatus includes a cleaning brush 100, a drive assembly 200, a wear detection assembly 300, an actuation assembly, a controller 500, and a brush removal and mounting assembly 600.

[0061] The cleaning brush 100 includes a brush shaft 110 and multiple bristle assemblies 120 disposed on the circumferential side of the brush shaft 110. Each bristle assembly 120 is formed by multiple bristles closely arranged together, and the bristle assembly 120 is generally cylindrical and perpendicular to the central axis of the brush shaft 110.

[0062] A brush removal and assembly 600 is disposed between the drive assembly 200 and the brush shaft 110. The brush shaft 110 is detachably connected to the brush removal and assembly 600, thereby allowing for convenient removal and assembly of the cleaning brush 100 to facilitate the replacement of the cleaning brush 100.

[0063] The drive assembly 200 is connected to the brush shaft 110 via the brush assembly 600, and is used to drive the brush shaft 110 to rotate (rotate about the central axis of the brush shaft 110). In this embodiment, the drive assembly 200 drives the brush assembly 600 to rotate together with the brush shaft 110. When the brush shaft 110 rotates, the bristle assembly 120 on it can contact the wafer to be cleaned to achieve cleaning of the wafer. It should be noted that in some other embodiments, the semiconductor cleaning apparatus may not have the brush assembly 600, and the drive assembly 200 may be directly connected to the brush shaft 110, for example, by a threaded connection.

[0064] The wear detection component 300 is used to detect the amount of wear on the bristle assembly 120. The amount of wear on the bristle assembly 120 is the amount by which the distance from the end of the bristle assembly 120 away from the brush shaft 110 to the circumferential side of the brush shaft 110 decreases.

[0065] The actuation component is connected to the drive component 200 and is used to drive the drive component 200 to move in a preset direction (that is, to drive the drive component 200, the brush assembly / disassembly component 600 and the cleaning brush 100 as a whole to move in a preset direction), the preset direction being perpendicular to the central axis of the brush shaft 110.

[0066] The controller 500 is connected to the wear detection component 300 and the actuation component, and is used to control the actuation component to drive the drive component 200 to move a corresponding distance along a preset direction based on the amount of wear. For example, when the wear of the bristle assembly 120 is 1mm, the controller 500 controls the actuation component to drive the drive component 200 (that is, to drive the cleaning brush 100) to move 1mm along the preset direction, so as to ensure that the contact amount between the bristle assembly 120 and the wafer to be cleaned remains basically unchanged, that is, the contact force between the bristle assembly 120 and the wafer to be cleaned remains basically unchanged. Exemplarily, the controller 500 may include a microcontroller or a programmable logic controller 500.

[0067] According to the semiconductor cleaning apparatus of this application embodiment, the wear amount of the bristle group 120 in the cleaning brush 100 can be detected by the wear detection component 300, and the actuation component can be controlled to drive the drive component 200 (that is, drive the cleaning brush 100) to move a corresponding distance according to the wear amount, so as to compensate for the wear amount of the bristle group 120, so that the contact force between the worn bristle group 120 and the wafer remains basically unchanged, ensuring the cleaning effect of the wafer, and extending the service life of the cleaning brush 100.

[0068] See appendix Figure 1 In this embodiment, the actuation assembly includes a fixed frame, a first motor, a lead screw, and a lead screw nut.

[0069] The fixed frame is generally box-shaped, consisting of a top wall and side walls that surround the top wall circumferentially, with the top wall and side walls enclosing a receiving space.

[0070] The first motor is connected to the fixed frame. Exemplarily, the first motor is located within the receiving space and can be securely connected to the fixed frame using connectors such as screws. In this embodiment, the first motor is connected to a controller 500, which controls the rotation of the first motor.

[0071] A lead screw is connected to the output end of a first motor and extends in a predetermined direction. For example, the lead screw can be directly or indirectly connected to the output end of the first motor (i.e., the output shaft of the first motor) via a connector, and the first motor drives the lead screw to rotate about its central axis. For example, the end of the lead screw away from the first motor is also rotatably connected to a fixed frame via a bearing.

[0072] The lead screw nut is sleeved on the lead screw and connected to the drive assembly 200. When the lead screw rotates, the lead screw nut moves along the extension direction of the lead screw, that is, along the preset direction, thereby driving the drive assembly 200 to move in the preset direction.

[0073] See appendix Figure 1 In this embodiment, the drive assembly 200 includes a connecting plate 210 and a second motor 220.

[0074] The connecting plate 210 is connected to the lead screw nut. For example, the connecting plate 210 can be fixedly connected to the lead screw nut by snap-fit ​​or adhesive. Thus, when the lead screw nut moves in a preset direction, it drives the connecting plate 210 to move synchronously in the preset direction.

[0075] The second motor 220 is connected to the connecting plate 210, and its output end is connected to the brush shaft 110 via the brush assembly 600. For example, the second motor 220 can be fixedly connected to the connecting plate 210 by means such as screws, so that when the connecting plate 210 moves in a preset direction, it drives the second motor 220, the brush assembly 600, and the brush shaft 110 to move together in the preset direction. In this embodiment, the second motor 220 is connected to the controller 500, which controls the rotation of the second motor 220.

[0076] In some other embodiments, when the semiconductor cleaning apparatus does not have a brush removal assembly 600, the output end of the second motor 220 (i.e., the output shaft of the second motor 220) is directly connected to the brush shaft 110, for example, by means of a threaded connection.

[0077] For further details, please see the appendix. Figure 1 In this embodiment, the fixed frame has a guide rod extending along a first direction.

[0078] The connecting plate 210 is provided with a guide hole 211 corresponding to the guide rod, and the guide rod passes through the guide hole 211. Thus, the cooperation between the guide rod and the guide hole 211 guides the movement of the connecting plate 210, ensuring it can only move in a preset direction; that is, the second motor 220, the brush assembly / disassembly assembly 600, and the brush shaft 110 as a whole can only move in a preset direction. In some other embodiments, the guide hole 211 can replace the guide groove, which can be, for example, a U-shaped groove, and the guide rod engages with the guide groove.

[0079] See appendix Figure 1 Appendix Figure 3 In this embodiment, one end of the brush shaft 110 has an insert 130, which is generally rectangular and has a slot 131. The brush assembly 600 includes a sleeve 610, a lever 620, a pull block 630, and a spring 640.

[0080] The sleeve 610 is generally rectangular in shape and has a slot 611 that matches the shape of the plug 130. A socket 612 communicating with the slot 611 is provided on one side wall of the sleeve 610. The plug 130 can be inserted into the slot 611. When the plug 130 is fully inserted into the slot 611, the slot 131 on the plug 130 is aligned with the socket 612.

[0081] A latch 620 passes through a socket 612 and is configured to switch between a first position and a second position. The insert 130 is inserted into a slot 611. When the latch 620 is in the first position, it is engaged in a slot 131, preventing the insert 130 from leaving the slot 611. When the latch 620 is in the second position, it is disengaged from the slot 131, not restricting the insert 130 from leaving or entering the slot 611. For example, in the second position, the latch 620 is only partially located in the socket 612 and not in the slot 611, thus not restricting the insert 130 from leaving or entering the slot 611.

[0082] Pull block 630 is connected to the end of lever 620 away from slot 611. Its cross-sectional area in the extension direction of lever 620 is larger than that of lever 620. The user can squeeze pull block 630 to push and pull lever 620 to switch it between a first position and a second position.

[0083] Spring 640 is sleeved on lever 620. The first end of spring 640 is connected to pull block 630, and the second end of spring 640 is connected to insert sleeve 610. Spring 640 is used to keep lever 620 in the first position when no external force is applied.

[0084] Therefore, when the insert 130 is inserted into the slot 611, the spring 640 can use its own elasticity to keep the locking rod 620 in the first position. The locking rod 620 is inserted into the slot 131, preventing the insert 130 from leaving the slot 611, thus connecting the cleaning brush to the brush removal assembly 600. When it is necessary to replace the cleaning brush 100, the pull block 630 can be pulled outward to move it to the second position. At this time, the end of the locking rod 620 will be pulled out from the slot 131, and the locking rod 620 will separate from the slot 131. The insert 130 can be directly pulled out from the insert sleeve 610 to remove the cleaning brush 100. Then, the insert 130 on the new cleaning brush 100 is inserted into the insert sleeve 610. Then, the pull block 630 is released, causing the locking rod 620 to move to the first position under the action of the spring 640 and be inserted into the slot 131.

[0085] In this embodiment, the locking rod 620 has an inclined guide surface on the side facing the brush shaft 110. This guide surface can push the locking rod 620 out of the slot 611 when the insert block 130 is inserted into the insert sleeve 610, overcoming the elastic force of the spring 640, and moving from the first position to the second position. When the insertion hole 612 and the slot 131 coincide, the spring 640 will drive the locking rod 620 from the second position to the first position and lock it into the slot 131.

[0086] See appendix Figure 3 In this embodiment, the brush assembly 600 also includes a connecting rod 650 and a limiting block 660.

[0087] The first end of the connecting rod 650 is connected to the insert 610, and the limiting block 660 is connected to the second end of the connecting rod 650 and is located on the side of the pull block 630 away from the insert 610. When the locking rod 620 is in the second position, the pull block 630 abuts against the limiting block 660, and the locking rod 620 is still partially located in the socket 612. The connecting rod 650 and the limiting block 660 are designed to limit the pull block 630 and the locking rod 620, preventing the locking rod 620 from coming out of the socket 612. On the other hand, they allow the locking rod 620 to be easily moved to the second position (simply by pulling the pull block 630 until it abuts against the limiting block 660).

[0088] See appendix Figure 1 Appendix Figure 2 In this embodiment, the wear detection component 300 includes a connector 310, a mounting plate 320, and a distance sensor 330.

[0089] The first end of the connector 310 is connected to the braking assembly, and the mounting plate 320 is connected to the second end of the connector 310. In this embodiment, the connector 310 includes an L-shaped support rod 311, a fixing plate 312, and a connecting piece 313. There are two L-shaped support rods 311, each with its first end connected to a fixed frame and its second end connected to the fixing plate 312. The controller 500 is mounted and fixed on the fixing plate 312. There are two connecting pieces 313, each with its first end connected to the fixing plate 312 and its second end connected to the mounting plate 320. In other embodiments, the connector 310 may also be other types of connecting members, with its first end connected to the drive assembly 200 (e.g., connected to the connecting plate 210) and its second end connected to the mounting plate 320.

[0090] A distance sensor 330 is disposed on the side of the mounting plate 320 facing the brush shaft 110 and is used to measure the distance between the bristle assembly 120 and the distance sensor 330. Specifically, it measures the distance between the end of the bristle assembly 120 furthest from the brush shaft 110 and the distance sensor 330. This distance increases significantly as the bristle assembly 120 wears down. Therefore, the amount of wear on the bristle assembly 120 can be determined based on this distance. For example, the distance sensor 330 can be a laser distance sensor 330 or an infrared distance sensor 330.

[0091] In this embodiment, the mounting plate 320 is an arc-shaped plate, which surrounds the brush shaft 110. Multiple distance sensors 330 are evenly distributed along the circumferential direction of the brush shaft 110 on the side of the arc-shaped plate facing the brush shaft 110. By using multiple sensors, the wear of the bristle assembly 120 can be measured more accurately. In other embodiments, the mounting plate 320 may be flat, and only one distance sensor 330 may be provided.

[0092] In use, the semiconductor cleaning apparatus of this embodiment controls the rotation of the second motor 220 via the controller 500. The rotation of the second motor 220 drives the brush shaft 110 to rotate, which in turn drives the bristle assembly 120 to rotate and clean the wafer. During the rotation of the cleaning brush 100, the distance sensor 330 on the mounting plate 320 measures the distance between itself and the bristle assembly 120 and detects the wear of the bristle assembly 120. Based on this wear, the controller 500 controls the rotation of the first motor, which drives the lead screw to rotate. The rotation of the lead screw causes the lead screw nut, connecting plate 210, second motor 220, brush assembly / disassembly assembly 600, and cleaning brush 100 to move along a preset direction. The distance moved is the same as the wear of the bristle assembly 120. This allows for effective adjustment of the position of the cleaning brush 100 when the bristle assembly 120 wears down, compensating for the wear of the bristle assembly 120. This ensures that the contact force between the worn bristle assembly 120 and the wafer remains essentially unchanged, guaranteeing the cleaning effect of the bristle assembly 120 on the wafer.

[0093] Although exemplary embodiments have been described herein with reference to the accompanying drawings, it should be understood that the above exemplary embodiments are merely illustrative and are not intended to limit the scope of this application. Various changes and modifications can be made therein by those skilled in the art without departing from the scope and spirit of this application. All such changes and modifications are intended to be included within the scope of this application as claimed in the appended claims.

[0094] Numerous specific details are set forth in the specification provided herein. However, it will be understood that embodiments of this application may be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification.

[0095] Similarly, it should be understood that, in order to streamline this application and aid in understanding one or more of the various aspects of the invention, features of this application may sometimes be grouped together in a single embodiment, figure, or description thereof in the description of exemplary embodiments of this application. However, this approach should not be construed as reflecting an intention that the claimed application requires more features than are expressly recited in each claim. Rather, as reflected in the corresponding claims, the inventive point lies in solving the corresponding technical problem with fewer features than all of those in a single disclosed embodiment. Therefore, the claims following the detailed description are hereby expressly incorporated into that detailed description, wherein each claim itself is a separate embodiment of this application.

[0096] Those skilled in the art will understand that, apart from the mutual exclusion of features, all features disclosed in this specification (including the accompanying claims, abstract, and drawings) and all processes or elements of any method or apparatus so disclosed can be combined in any combination. Unless otherwise expressly stated, each feature disclosed in this specification (including the accompanying claims, abstract, and drawings) may be replaced by an alternative feature serving the same, equivalent, or similar purpose.

[0097] Furthermore, those skilled in the art will understand that although some embodiments described herein include certain features but not others included in other embodiments, combinations of features from different embodiments are intended to be within the scope of this application and form different embodiments. For example, in the claims, any one of the claimed embodiments can be used in any combination.

[0098] It should be noted that the above embodiments are illustrative of this application and not restrictive of this application, and that those skilled in the art can devise alternative embodiments without departing from the scope of the appended claims.

Claims

1. A semiconductor cleaning apparatus, characterized in that, include: A cleaning brush includes a brush shaft and multiple bristle groups disposed on the circumferential side of the brush shaft. A drive assembly, connected to the brush shaft, is used to drive the brush shaft to rotate; A wear detection component is used to detect the amount of wear on the bristle assembly; An actuation component, connected to the drive component, is used to drive the drive component to move along a preset direction, the preset direction being perpendicular to the central axis of the brush shaft; A controller, connected to the wear detection component and the actuation component, is used to control the actuation component to drive the drive component to move a corresponding distance along the preset direction according to the amount of wear.

2. The cleaning device according to claim 1, characterized in that, The actuation component includes: Fixed frame; A first motor is connected to the fixed frame; A lead screw is connected to the output end of the first motor and extends along the preset direction; A lead screw nut is fitted onto the lead screw and connected to the drive assembly.

3. The cleaning device according to claim 2, characterized in that, The driving component includes: A connecting plate is attached to the lead screw nut; A second motor is connected to the connecting plate, and the output end of the second motor is connected to the brush shaft.

4. The cleaning device according to claim 3, characterized in that, The fixed frame has a guide rod extending along a first direction; The connecting plate is provided with a guide groove or guide hole corresponding to the guide rod; The guide rod is engaged with the guide groove, or the guide rod passes through the guide hole.

5. The cleaning device according to claim 1, characterized in that, The driving component also includes: A brush assembly / disassembly assembly is disposed between the drive assembly and the brush shaft, the brush shaft being detachably connected to the brush assembly / disassembly assembly.

6. The cleaning apparatus according to claim 5, characterized in that, One end of the brush shaft has an insert block, and the insert block is provided with a slot. The brush assembly / disassembly component includes: A socket having a slot that matches the shape of the plug, and a socket hole communicating with the slot is provided on one side wall of the socket; A lever is inserted into the socket and configured to switch between a first position and a second position. The plug is inserted into the slot, and when the lever is in the first position, the lever is inserted into the slot, restricting the plug from leaving the slot. When the lever is in the second position, the lever is separated from the slot, and the plug is not restricted from leaving or inserting into the slot. A pull block is connected to the end of the lever furthest from the slot; A spring is sleeved on the lever, with its first end connected to the pull block and its second end connected to the insert sleeve. The spring is used to keep the lever in the first position when no external force is applied.

7. The cleaning apparatus according to claim 6, characterized in that, The brush assembly / disassembly component also includes: A connecting rod, the first end of which is connected to the insert; A limiting block is connected to the second end of the connecting rod and is located on the side of the pull block away from the insert. When the lever is in the second position, the pull block abuts against the limiting block, and the lever is still partially located in the insertion hole.

8. The cleaning apparatus according to claim 1, characterized in that, The wear detection component includes: A connector, the first end of which is connected to the drive assembly or the actuation assembly; Mounting plate, connected to the second end of the connector; A distance sensor is disposed on the side of the mounting plate facing the brush shaft, and is used to measure the distance between the bristle assembly and the distance sensor.

9. The cleaning apparatus according to claim 8, characterized in that, The distance sensor is a laser distance sensor or an infrared distance sensor.

10. The cleaning apparatus according to claim 8, characterized in that, The mounting plate is an arc-shaped plate, which is arranged around the brush shaft; There are multiple distance sensors, which are evenly arranged on the side of the arc-shaped plate facing the brush shaft along the circumferential direction of the brush shaft.

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