A flux cleaning device

Abstract

This application relates to the technical field of flux cleaning apparatus, and more particularly to a flux cleaning apparatus, comprising a cleaning tank, a mounting base disposed within the cleaning tank, a liquid storage chamber on the lower side of the mounting base, a drain hole communicating with the liquid storage chamber, the mounting base for mounting a plurality of substrates, a spray head disposed within the cleaning tank, the spray head having a connecting pipe connected to the top wall of the cleaning tank, and a limiting structure disposed on the mounting base for fixing the substrates, the limiting structure including an abutment rod slidably connected to the mounting base in a vertical direction, the abutment rod being used to abut the edge of the substrates, thereby limiting the substrates. This application has the following advantages: this spray cleaning method allows the cleaning agent to enter the liquid storage chamber through the drain hole, minimizing the possibility of the solder joints being immersed in the cleaning agent, thus protecting the solder joints.

Description

Technical Field

[0001] This application relates to the technical field of flux cleaning apparatus, and in particular to a flux cleaning apparatus. Background Technology

[0002] In chip packaging, copper-pillar tin-based alloy solder pads are commonly used soldering materials due to their low cost and simple process. The overall soldering structure generally consists of a substrate and structural units, with the structural units connected to the substrate via solder joints. However, an oxide layer often forms on the surface of the tin-based alloy, which can adversely affect the soldering effect. Therefore, before reflow soldering, the tin-based alloy solder pads need to be wetted with flux to remove the oxides on their surface. The problem is that residues remain after the flux reacts with the oxides on the tin-based alloy surface, requiring additional process steps to remove these organic solvents.

[0003] During the cleaning process, in order to improve the cleaning efficiency of the flux cleaner, the substrate 120 is usually soaked in a large amount of cleaner. However, prolonged soaking can cause the solder joints to erode and pit, damaging the integrity of the solder joints and reducing their mechanical strength. Utility Model Content

[0004] In order to shorten the contact time between the flux cleaner and the solder joint while achieving high cleaning efficiency and thus protecting the solder joint, this application provides a flux cleaning device.

[0005] This application provides a flux cleaning device, which adopts the following technical solution: A flux cleaning device includes a cleaning tank, a mounting base is provided inside the cleaning tank, a liquid storage chamber is provided on the lower side of the mounting base, the mounting base has a leakage hole communicating with the liquid storage chamber, the mounting base is used to set a plurality of substrates, a spray head is provided inside the cleaning tank and inclined toward the soldering part inside the substrate, each spray head corresponds to a substrate individually, the spray head has a connecting pipe connected to the top wall of the cleaning tank, and the mounting base is provided with a limiting structure for fixing the substrates.

[0006] By adopting the above technical solution, before cleaning, the substrate is fixed on the mounting base by the abutment rod in the limiting structure, and flux cleaning agent is filled into the connecting pipe. The agent is then sprayed at an angle onto the soldering part of the substrate through a separate corresponding spray head, thereby cleaning away as much flux as possible from the solder joint. This spraying method allows the sprayed cleaning agent to enter the liquid storage chamber through the leakage hole, minimizing the possibility of the solder joint being soaked in the cleaning agent and protecting the solder joint.

[0007] Preferably, the limiting structure includes an abutment rod that slides vertically to the mounting base, the abutment rod being used to abut the edge of the substrate, thereby limiting the substrate.

[0008] Preferably, the mounting base has a receiving groove for embedding the substrate, the receiving groove being circular, and the abutment rod being disposed on the edge of the receiving groove.

[0009] By adopting the above technical solution, after the substrate is embedded in the receiving groove, the substrate is stopped and limited by the movement of the abutment rod.

[0010] Preferably, the abutment rod has a circumferential rotational stroke and a vertical sliding stroke. When the abutment rod moves toward the substrate and abuts the edge of the substrate, it is the starting point of the stroke. At this time, the abutment rod is arranged radially along the receiving groove. When the abutment rod moves away from the substrate to the end point of the stroke, the abutment rod is in a state perpendicular to the starting point of the stroke.

[0011] By adopting the above technical solution, the abutment rod moves in the vertical direction, that is, it will rotate in the circumferential direction during the process from the start of the stroke to the end of the stroke, thereby avoiding the edge of the substrate in the vertical direction and removing the substrate.

[0012] Preferably, the lower side of the abutment rod has a vertically arranged connecting portion, and the mounting base has a mating groove for the connecting portion to be inserted.

[0013] By adopting the above technical solution, the movement of the connecting part within the mating groove can cooperate with the abutment rod to achieve rotation and movement in the vertical direction.

[0014] Preferably, the inner wall of the mating groove has a guide slide, the guide slide is spiral, the connecting part has a guide post embedded in the guide slide, and the mounting base is provided with a drive mechanism for driving the connecting part to move back and forth along the axial direction.

[0015] By adopting the above technical solution, when the connecting part slides in the mating groove, the movement of the guide post in the guide groove will cause circumferential rotation.

[0016] Preferably, a piston portion is rotatably connected to the lower side of the connecting portion, and the driving mechanism is connected to the piston portion.

[0017] By adopting the above technical solution, when the piston moves, the corresponding connecting part will rotate circumferentially with the cooperation of the guide column.

[0018] Preferably, the mounting base is fixedly connected to the inner wall of the cleaning tank. The driving mechanism includes a telescopic member disposed in the cleaning tank, a driving rod connected to the telescopic member and passing through the mating groove, and a spring disposed in the mating groove. One end of the spring is connected to the piston part, and the other end is connected to the inner wall of the mating groove. The end of the driving rod is used to abut against and cause the piston part to slide upward. The spring is used to drive the abutting rod to always have a downward movement tendency.

[0019] By adopting the above technical solution, the telescopic component is mainly used to lift the piston part, and when the telescopic rod descends, the spring can keep the abutment rod in good position against the edge of the base plate.

[0020] Preferably, a rotating block is rotatably connected to the upper wall of the cleaning tank corresponding to the connecting pipe, and the rotating block is used to drive the spray head to move circumferentially along the substrate.

[0021] By adopting the above technical solution, during the cleaning process, as the rotating block rotates, the spray position of the spray head will change, thereby allowing different areas to be rinsed and improving the cleaning effect.

[0022] Preferably, the upper side of the cleaning tank is also connected to a vacuum tube.

[0023] By adopting the above technical solution, vacuuming creates a low-pressure environment in the cleaning chamber, which significantly disrupts the surface tension of the cleaning fluid. This process eliminates the "cavitation phenomenon," forcing bubbles to escape from the micro-gap between the wafers and avoiding cleaning blind spots.

[0024] In summary, this application includes at least one of the following beneficial technical effects: The cleaning agent is sprayed at an angle onto the solder joint of the substrate through a separate corresponding spray head, thereby cleaning away as much flux as possible from the solder joint. This spray cleaning method allows the cleaning agent to enter the liquid storage chamber through the leakage hole, minimizing the possibility of the solder joint being soaked in the cleaning agent and thus protecting the solder joint. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the structure of Embodiment 1 of this application; Figure 2 This is a schematic diagram of the internal structure of Embodiment 1 of this application; Figure 3 This is a partial exploded view of Embodiment 1 of this application, wherein the piston portion is still located within the mating groove; Figure 4 This is a schematic diagram of the structure of the abutment rod and the connecting part in Embodiment 1 of this application; Figure 5 This is a partial cross-sectional view of Embodiment 1 of this application; Figure 6This is another partial cross-sectional view of Embodiment 1 of this application, used to show the guide slide; Figure 7 This is a partial structural schematic diagram of Embodiment 2 of this application.

[0026] Explanation of reference numerals in the attached drawings: 100, cleaning tank; 110, mounting base; 111, liquid storage chamber; 112, leakage hole; 120, base plate; 121, structural unit; 122, spray head; 123, connecting pipe; 124, receiving groove; 130, abutment rod; 131, connecting part; 132, mating groove; 133, guide slide; 134, guide column; 135, piston part; 141, telescopic component; 142, drive rod; 143, spring; 144, vacuum tube; 145, drive plate; 150, rotating block. Detailed Implementation

[0027] The present application will be further described in detail below with reference to the accompanying drawings.

[0028] Example 1: Example 1 of this application discloses a flux cleaning device, referring to... Figure 1 , Figure 2 The system includes a cleaning tank 100, within which a mounting base 110 is provided. The mounting base 110 is cylindrical in shape, and its sidewall is connected to the inner wall of the cleaning tank 100. The mounting base 110 can be fixedly connected to the inner wall of the cleaning tank 100, or it can be detachably connected. For example, the inner wall of the cleaning tank 100 may have a protruding ring for placing the mounting base 110, or other detachable connection methods. A liquid storage chamber 111 is located between the lower side of the mounting base 110 and the bottom of the cleaning tank 100. The mounting base 110 has a drain hole 112 communicating with the liquid storage chamber 111. The cleaning agent after cleaning will flow down into the liquid storage chamber 111 through the drain hole 112. Generally, the liquid storage chamber 111 will be externally connected to a cleaning agent recycling device, which will not be elaborated in this embodiment.

[0029] Mounting base 110 is used to mount substrate 120 and structural unit 121 connected to the upper side of substrate 120. Structural unit 121 is welded to substrate 120. The specific configuration of structural unit 121 will not be elaborated here. A cleaning tank 100 is provided with spray heads 122 inclined towards the welded portion of substrate 120. Each spray head 122 corresponds individually to substrate 120. Spray head 122 has a connecting pipe 123 connected to the top wall of cleaning tank 100. Cleaning agent is introduced into the connecting pipe 123 for spraying onto the corresponding welded portion.

[0030] Reference Figure 3The mounting base 110 has a circular receiving groove 124 for embedding a substrate 120. The mounting base 110 is provided with a limiting structure for fixing the substrate 120. The limiting structure includes an abutment rod 130 that slides vertically connected to the mounting base 110. The abutment rod 130 is disposed at the edge of the receiving groove 124 and abuts against the edge of the substrate 120, thereby limiting the substrate 120. In this embodiment, each substrate 120 has only one corresponding abutment rod 130; in other embodiments, multiple abutment rods may be provided circumferentially.

[0031] Reference Figure 4 , Figure 5 , Figure 6 Specifically, a connecting portion 131 is located on the lower side of the abutment rod 130. The connecting portion 131 is vertically arranged, while the abutment rod 130 is horizontally arranged. The mounting base 110 has a mating groove 132 for the connecting portion 131 to be inserted. The inner wall of the mating groove 132 has a guide slide 133, which is spiral in shape. In this embodiment, the circumferential offset angle of the guide slide 133 is 90 degrees. The connecting portion 131 has a guide post 134 that is embedded in the guide slide 133. The mounting base 110 is provided with a drive mechanism for driving the connecting portion 131 to move back and forth along the axial direction. When the connecting portion 131 moves along the axial direction, the guide post 134 will rotate circumferentially along the guide slide 133.

[0032] In this embodiment, the abutment rod 130 has a circumferential rotational stroke and a vertical sliding stroke. When the abutment rod 130 moves toward the substrate 120 and abuts against the edge of the substrate 120, it is the starting point of the stroke. At this time, the abutment rod 130 is radially arranged along the receiving groove 124, and the guide post 134 is located at the lower end of the guide slide 133. When the abutment rod 130 moves away from the substrate 120 to the end of the stroke, the abutment rod 130 is in a state perpendicular to the starting point of the stroke. At this time, the guide post 134 is located at the upper end of the guide slide 133.

[0033] A piston portion 135 is rotatably connected to the lower side of the connecting portion 131. The piston portion 135 rotates circumferentially and is axially fixed to the connecting portion 131. A drive mechanism is connected to the piston portion 135. In this embodiment, the drive mechanism includes a telescopic member 141 disposed within the cleaning tank 100, a drive rod 142 connected to the telescopic member 141 and passing through a mating groove 132, and a spring 143 disposed within the mating groove 132. The drive rod 142 will abut against the lower side of the piston portion 135. The telescopic member 141 is a linear actuator such as a lead screw device, cylinder, or hydraulic cylinder to achieve vertical movement. In this embodiment, there are multiple drive rods 142, and multiple drive rods 142 are connected to the upper side of the same drive plate 145, while the output end of the telescopic member 141 is fixedly connected to the lower side of the drive plate 145. When the telescopic member 141 is in operation, since the mounting base 110 is fixed to the inner wall of the cleaning tank 100, the drive plate 145 will move upward. At this time, the drive rod 142 causes the piston part 135 to move upward, the piston part 135 and the connecting part 131 to rotate relative to each other, and the connecting part 131 will shift circumferentially. One end of the spring 143 is fixedly connected to the piston, and the other end is fixedly connected to the inner wall of the mating groove 132. The drive rod 142 passes through the spring 143, and the spring 143 is used to drive the abutment rod 130 to always have a downward movement tendency. Therefore, when the drive rod 142 pushes upward, the spring 143 will be stretched. When the telescopic member 141 retracts, the spring 143 will pull the piston part 135 back to its original position, thereby limiting it to the edge of the base plate 120 again.

[0034] To create a low-pressure environment in the cleaning chamber and significantly disrupt the surface tension of the cleaning fluid, this process eliminates cavitation, forcing air bubbles to escape from the micro-gap between the wafers and avoiding cleaning blind spots. A vacuum tube 144 is also provided on one side of the cleaning tank 100. This tube is not intended to create a vacuum inside the cleaning tank 100, but only to create a low pressure inside.

[0035] The implementation principle of Embodiment 1 of this application is as follows: First, the telescopic member 141 causes the drive plate 145 to rise, thereby causing the drive rod 142 to lift the piston part 135 located in the mating groove 132. At this time, the abutment rod 130 rotates, and the substrate 120 can be inserted in the vertical direction. Then, the telescopic member 141 retracts, and the spring 143 can drive the abutment rod 130 to rotate and press back to the edge of the substrate 120, thereby limiting the substrate 120. Then, the cleaning agent in the connecting pipe 123 will be sprayed onto the welding part for cleaning.

[0036] The cleaning agent, once cleaned, will flow along the drain hole 112 into the reservoir 111, preventing the cleaning agent from soaking the substrate 120 and structural unit 121 for an extended period. This process also protects the soldered parts during cleaning.

[0037] It is worth noting that, in order to protect the edges of the substrate 120, the retraction of the telescopic member 141 is also relatively slow, causing the spring 143 to retract slowly. Furthermore, the upper wall of the cleaning tank 100 can be configured as an openable structure to facilitate the removal of the internal substrate 120.

[0038] In this embodiment, to remove the mounting base 110 entirely from the cleaning tank 100, the output ends of the drive plate 145 and the drive component 141 can be detachably connected, such as by a key or other detachable shaft connection. After opening the upper side of the cleaning tank 100, the mounting base 110 and drive plate 145 can be removed as a whole for transport or cleaning. Alternatively, the mounting base 110 and drive plate 145 can be placed inside the cleaning tank 100, and then the telescopic component 141 can be reinstalled separately, with its output end reconnected to the drive plate 145. The specific connection method is not detailed here; technicians can achieve this using conventional techniques to remove the mounting base 110.

[0039] Example 2: The difference from Example 1 is that, referring to... Figure 7 The upper wall of the cleaning tank 100 is rotatably connected to the connecting pipe 123 via rotating blocks 150. Each rotating block 150 is equipped with a separate driving component, such as a drive motor, so that the rotating block 150 can independently drive the connecting pipe 123 to spray the welded joint along the circumference. It is worth noting that since an abutment rod 130 is provided on one side of the substrate 120, in this embodiment, only one abutment rod 130 is initially provided, and the circumferential rotation path of the rotating block 150 is not a complete circumferential rotation, but rather avoids the circumferential angle of the abutment rod 130, for example, 300°.

[0040] The embodiments described in this specific implementation are preferred embodiments of this application and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A flux cleaning device, comprising a cleaning tank (100), characterized in that: The cleaning tank (100) is provided with a mounting base (110), the mounting base (110) has a liquid storage chamber (111) on its lower side, the mounting base (110) has a leakage hole (112) communicating with the liquid storage chamber (111), the mounting base (110) is used to set a plurality of substrates (120), the cleaning tank (100) is provided with a spray head (122) inclined toward the welding part inside the substrate (120), each spray head (122) is individually corresponding to the substrate (120), the spray head (122) has a connecting pipe (123) connected to the top wall of the cleaning tank (100), and the mounting base (110) is provided with a limiting structure for fixing the substrate (120).

2. The flux cleaning device according to claim 1, characterized in that: The limiting structure includes an abutment rod (130) that slides vertically to the mounting base (110). The abutment rod (130) is used to abut the edge of the substrate (120), thereby abutting the substrate (120).

3. The flux cleaning device according to claim 2, characterized in that: The mounting base (110) has a receiving groove (124) for embedding a substrate (120), the receiving groove (124) is circular, and the abutment rod (130) is disposed on the edge of the receiving groove (124).

4. The flux cleaning device according to claim 3, characterized in that: The abutment rod (130) has a circumferential rotational stroke and a vertical sliding stroke. When the abutment rod (130) moves toward the substrate (120) and abuts against the edge of the substrate (120), it is the starting point of the stroke. At this time, the abutment rod (130) is arranged radially along the receiving groove (124). When the abutment rod (130) moves away from the substrate (120) to the end of the stroke, the abutment rod (130) is in a state perpendicular to the starting point of the stroke.

5. The flux cleaning device according to claim 4, characterized in that: The abutment rod (130) has a vertically arranged connecting part (131) on its lower side, and the mounting base (110) has a mating groove (132) for the connecting part (131) to be inserted.

6. The flux cleaning device according to claim 5, characterized in that: The inner wall of the mating groove (132) has a guide slide (133), which is spiral in shape. The connecting part (131) has a guide post (134) embedded in the guide slide (133). The mounting base (110) is provided with a drive mechanism for driving the connecting part (131) to move back and forth along the axial direction.

7. The flux cleaning device according to claim 6, characterized in that: The piston part (135) is rotatably connected to the lower side of the connecting part (131), and the driving mechanism is connected to the piston part (135).

8. The flux cleaning device according to claim 7, characterized in that: The mounting base (110) is fixedly connected to the inner wall of the cleaning tank (100). The driving mechanism includes a telescopic member (141) disposed in the cleaning tank (100), a driving rod (142) connected to the telescopic member (141) and passing through the mating groove (132), and a spring (143) disposed in the mating groove (132). One end of the spring (143) is connected to the piston part (135), and the other end is connected to the inner wall of the mating groove (132). The end of the driving rod (142) is used to abut against and cause the piston part (135) to slide upward. The spring (143) is used to drive the abutting rod (130) to always have a downward movement tendency.

9. The flux cleaning device according to claim 1, characterized in that: The upper wall of the cleaning tank (100) is rotatably connected to the connecting pipe (123) with a rotating block (150), which is used to drive the spray head (122) to move circumferentially along the substrate (120).

10. A flux cleaning device according to claim 1, 8, or 9, characterized in that: The upper side of the cleaning tank (100) is also connected to a vacuum tube (144).

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