Double-tank assembly for silicon wafer cleaning and cleaning apparatus

Abstract

The application provides a double-tank assembly and a cleaning device for silicon wafer cleaning, the double-tank assembly comprising a water tank and a slow pull tank, wherein the water tank is used for water cleaning of the silicon wafer, and the slow pull tank is used for slow pull cleaning of the silicon wafer; the slow pull tank comprises an overflow plate, the overflow plate is provided with an overflow port, and the overflow port directly or indirectly communicates the slow pull tank and the water tank; in this way, when the slow pull tank is always supplied with water to realize cleaning of the silicon wafer and the water level exceeds the overflow port, the overflow water can directly or indirectly enter the water tank through the overflow port to supplement the water in the water tank, so that the water saving function is realized, the use of an additional water pump and a sub-tank is avoided, and the cost burden caused by the purchase, installation and maintenance of these components is directly eliminated.

Description

Technical Field

[0001] This application relates to the field of silicon wafer processing equipment technology, and in particular to a dual-tank assembly and cleaning equipment for silicon wafer cleaning. Background Technology

[0002] In the field of photovoltaic trough cleaning equipment, the current cleaning process involves acid washing of silicon wafers, followed by cleaning in a water tank, and then further cleaning in a slow-lift tank. To save water, the common practice is to divert the overflow water from the slow-lift tank into a secondary tank, and then use a circulation pump to pump it back to the previous tank for reuse. However, this water-saving method has significant drawbacks, primarily the need to add water pumps. This not only incurs additional equipment costs but also complicates the construction and operation of the entire system. Furthermore, the purchase, installation, and maintenance of the additional secondary tank and circulation pump further increase the overall cost, resulting in a substantial investment of resources and capital.

[0003] It should be noted that the above content is not necessarily prior art, nor is it intended to limit the scope of patent protection of this application. Utility Model Content

[0004] This application provides a dual-tank module and cleaning equipment for silicon wafer cleaning, in order to solve the problem of excessively high cost of existing photovoltaic trough cleaning equipment. The existing cleaning equipment requires the addition of water pumps and auxiliary tanks, which not only brings additional equipment costs, but also makes the construction and operation of the entire system more complicated. At the same time, the purchase, installation, and maintenance of the additional auxiliary tanks and water pumps further increase the overall cost, resulting in a large investment of resources and funds.

[0005] As one aspect of this application, this application provides a dual-tank assembly for silicon wafer cleaning, comprising:

[0006] Water tank, used to circulate water for cleaning silicon wafers;

[0007] Slow-pull groove, used for slow-pull cleaning of silicon wafers;

[0008] The slow lifting trough includes an overflow plate with an overflow port that is directly or indirectly connected to the slow lifting trough and the water tank.

[0009] Optionally, it also includes a liquid guide tube, one end of which is connected to the overflow port and the other end of which is connected to the water tank.

[0010] Optionally, the slow lifting channel further includes a guide plate, which is inclined toward the overflow port.

[0011] Optionally, the water tank also includes an overflow plate, wherein the height of the overflow plate of the slow-lifting tank in the vertical direction is greater than the height of the overflow plate of the water tank in the vertical direction.

[0012] Optionally, it also includes a base, in which the water tank and the slow-lifting channel are integrated.

[0013] Optionally, the base includes a liquid outlet channel, one end of which is connected to the water tank and / or the slow lifting channel, and the other end is connected to the external atmosphere.

[0014] Optionally, the liquid outlet channel includes a first liquid outlet and a second liquid outlet, one of which is connected to the water tank and the other is connected to the slow lifting tank.

[0015] Optionally, the first liquid outlet is provided with a solenoid valve for opening or closing the first liquid outlet; and / or

[0016] The second liquid outlet is equipped with a solenoid valve for opening or closing the second liquid outlet.

[0017] Optionally, the system also includes a three-way valve, which has three ports, with the liquid guide tube connected to one of the ports and the other two ports connected to the water tank and the outside atmosphere, respectively.

[0018] As another aspect of the embodiments of this application, this application provides a cleaning device, including a transfer component, a drying component, and a dual-tank assembly as described above. The transfer component is used to input / output silicon wafers into / out of the dual-tank assembly, and the drying component is used to dry the silicon wafers cleaned by the dual-tank assembly.

[0019] The embodiments of this application employing the above-described technical solution may have the following advantages:

[0020] This application provides a dual-tank assembly and cleaning equipment for silicon wafer cleaning. The dual-tank assembly includes a water tank and a slow-lifting tank. The water tank is used to circulate water for cleaning the silicon wafers, and the slow-lifting tank is used to slowly lift the silicon wafers for cleaning. The slow-lifting tank includes an overflow plate with an overflow port that directly or indirectly connects to the slow-lifting tank and the water tank. With this configuration, when the slow-lifting tank continuously circulates water to clean the silicon wafers and the water level exceeds the overflow port, the overflowing water can be directly or indirectly channeled into the water tank through the overflow port to replenish the water tank, thereby achieving water conservation. This avoids the use of additional water pumps and auxiliary tanks, directly eliminating the cost burden of purchasing, installing, and maintaining these components. The system architecture is simplified, reducing operational complexity, minimizing downtime risks due to equipment failure, and improving overall operational efficiency and stability. Simultaneously, the simplified system reduces space occupation, improves space utilization, reserves more space for other equipment or production processes, and enhances the flexibility of production layout. Furthermore, the reduction in components lowers maintenance workload and costs, further enhancing production efficiency. Attached Figure Description

[0021] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments disclosed in this application and should not be construed as limiting the scope of this application.

[0022] Figure 1 This is a front cross-sectional view of the double-slot assembly provided in an embodiment of this application;

[0023] Figure 2 This is a left-side structural schematic diagram of the double-slot assembly provided in an embodiment of this application;

[0024] Figure 3 This is a schematic diagram of the water circuit of the cleaning equipment provided in the embodiments of this application.

[0025] Explanation of reference numerals in the attached figures:

[0026] 1-Base; 11-First outer wall; 12-Bottom wall; 13-Outlet channel; 131-First outlet; 132-Second outlet; 14-Second outer wall; 2-Water tank; 21-First overflow plate; 22-Second overflow plate; 3-Slow lifting tank; 31-Third overflow plate; 32-First guide plate; 321-Front overflow plate; 322-Rear overflow plate; 33-Overflow port; 34-Second guide plate; 41-First solenoid valve; 42-Second solenoid valve. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other. The application will now be described in detail with reference to the accompanying drawings and embodiments.

[0028] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such terms can be used interchangeably where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0029] In this application, the term "numerical interval" (i.e., numerical range) refers to a range of values. Unless otherwise specified, the distribution of selectable values ​​within this numerical interval is considered continuous, and includes the two endpoints (i.e., the minimum and maximum values) of the interval, as well as every value between these endpoints. Unless otherwise specified, when a numerical interval refers only to integers within that interval, it includes the two endpoints of the range and every integer between them, effectively listing every integer. When multiple numerical ranges are provided to describe features or characteristics, these ranges can be merged. In other words, unless otherwise specified, the numerical ranges disclosed in this application should be understood to include any and all subranges included therein. The "numerical value" in this numerical interval can be any quantitative value, such as a number, percentage, or proportion. The term "numerical interval" can broadly include percentage intervals, proportion intervals, ratio intervals, and other quantitative intervals.

[0030] Exemplary embodiments according to this application will now be described in more detail with reference to the accompanying drawings. It should be understood that these exemplary embodiments may be implemented in many different forms and should not be construed as being limited to the embodiments set forth herein.

[0031] This application discloses a cleaning device, including a transfer component, a drying component, and a twin-tank assembly. The twin-tank assembly is used for / output cleaning of silicon wafers. The drying component is used to dry the cleaned silicon wafers. During operation, the transfer component inputs the silicon wafers into the twin-tank assembly for cleaning. After cleaning, the silicon wafers are output from the twin-tank assembly via the transfer component and then enter the drying component for drying. After drying, the silicon wafers are transferred out of the device by the transfer component, completing the entire process.

[0032] The following is a further detailed description of the double-slot assembly.

[0033] Please see Figure 1 The dual-tank assembly of this application embodiment is used for cleaning silicon wafers. The dual-tank assembly includes a water tank 2 and a slow-lifting tank 3. The water tank 2 is used to introduce water for cleaning the silicon wafers, and the slow-lifting tank 3 is used for slowly lifting the silicon wafers for cleaning. The slow-lifting tank 3 includes a third overflow plate 31 with an overflow port 33. The overflow port 33 directly or indirectly connects the slow-lifting tank 3 and the water tank 2. With this configuration, when the slow-lifting tank 3 continuously introduces water to clean the silicon wafers and the water level exceeds the overflow port 33, the overflowing water can be directly or indirectly introduced into the water tank 2 through the overflow port 33 to replenish the water tank 2, thereby achieving water conservation. This avoids the use of additional water pumps and auxiliary tanks, directly eliminating the cost burden of purchasing, installing, and maintaining these components. The system architecture is simplified, reducing operational complexity, decreasing the risk of downtime due to equipment failure, and improving overall operational efficiency and stability. Meanwhile, the simplified system reduces space occupation, improves space utilization, and reserves more space for other equipment or production processes, enhancing the flexibility of production layout. Furthermore, the reduced number of components lowers maintenance workload and costs, further improving production efficiency.

[0034] Specifically, such as Figure 1 As shown, the twin-tank assembly of this application embodiment includes a base 1, a water tank 2, and a slow-lifting tank 3 integrated within the base 1. The base 1 includes a first outer wall 11 and a bottom wall 12. The water tank 2 and the slow-lifting tank 3 share a common bottom wall 12. A liquid outlet channel 13 is provided on the bottom wall 12 for discharging water from the twin-tank assembly. The liquid outlet channel 13 includes a first outlet 131 and a second outlet 132. One of the first outlet 131 and the second outlet 132 is connected to the water tank 2, and the other is connected to the slow-lifting tank 3. In this embodiment, one end of the first outlet 131 is connected to the water tank 2, and the other end is connected to the external atmosphere; one end of the second outlet 132 is connected to the slow-lifting tank 3, and the other end is connected to the external atmosphere. Preferably, a solenoid valve is provided on the first outlet 131 and / or the second outlet 132. Figure 3 As shown in this embodiment, each of the two is equipped with a solenoid valve, which is used to open or close their respective liquid outlets.

[0035] Furthermore, the water tank 2 in this embodiment also includes an overflow plate, such as... Figure 1 and Figure 2As shown, the third overflow plate 31 of the slow lifting groove 3 is higher in the vertical direction than the overflow plate of the water tank 2. With this configuration, when the slow lifting groove 3 continuously receives water to clean the silicon wafer and the water level exceeds the overflow port 33 in this embodiment, the overflowing water can be directly fed into the water tank 2 through the overflow port 33 under the action of gravity to replenish the water tank 2, thereby achieving a water-saving function.

[0036] In some optional embodiments, the dual-tank assembly also includes a liquid guide pipe, one end of which is connected to the overflow port 33 and the other end is connected to the water tank 2. In this way, when the slow lifting tank 3 continuously feeds water to clean the silicon wafer and the water level exceeds the overflow port 33, the overflowing water can be fed into the liquid guide pipe through the overflow port 33 and then into the water tank 2 to replenish the water tank 2, thereby achieving a water-saving function. In another embodiment, the dual-tank assembly also includes a three-way valve with three ports. A liquid guide pipe connects to one of the ports, and the other two ports of the three-way valve connect to the water tank 2 and the external atmosphere, respectively. With this configuration, the liquid guide pipe can control the flow direction of the water overflowing from the slow-lifting tank 3 based on whether the water tank 2 is water-saving. If the water tank 2 needs to save water, the two ports of the three-way valve connecting the liquid guide pipe and the water tank 2 are open, and the port connecting to the external atmosphere is closed. If the water tank 2 does not need to save water, the two ports of the three-way valve connecting the liquid guide pipe and the external atmosphere are open, and the port connecting to the water tank 2 is closed, and the water overflowing from the slow-lifting tank 3 is directly discharged from the triple-tank assembly.

[0037] because Figure 1 This is a front cross-sectional view of the double-slot assembly provided in an embodiment of this application. Figure 2 This is a left-side structural schematic diagram of the double-slot assembly provided in the embodiments of this application, defining... Figure 2 In this embodiment, the horizontal left side is defined as rear, and the horizontal right side is defined as front. The rear sidewall of base 1 is defined as the first outer wall 11, and the front sidewall as the second outer wall 14. In this embodiment, the water tank 2 and the slow-lifting tank 3 share the first outer wall 11. The front overflow plate of the water tank 2 is the first overflow plate 21, and the rear overflow plate of the water tank 2 is the second overflow plate 22. The terms "first" and "second" are only used for distinction and do not indicate structural differences. When the water level in the water tank 2 is higher than the first overflow plate 21 and the second overflow plate 22, the excess water can flow along the first overflow plate 21 and the second overflow plate 22 into the bottom wall 12 of base 1. To accelerate the drainage of water from base 1, the bottom wall 12 can be configured to slope from front to back. Figure 2 As shown, the liquid outlet channel 13 is located on the rear side of the bottom wall 12; furthermore, as Figure 1 As shown, the overflow plate of the slow lifting groove 3 is defined as the third overflow plate 31. The third overflow plate 31 is annular. Figure 2The right side of the third overflow plate 31 is the front overflow plate 321, and the left side is the rear overflow plate 322. The overflow port 33 is located on the rear overflow plate 322. When the slow lifting groove 3 continuously receives water to clean the silicon wafer and the water level exceeds the overflow port 33 in this embodiment, the overflowing water can be directly or indirectly introduced into the water tank 2 through the overflow port 33 on the rear overflow plate 322 to replenish the water tank 2, thereby achieving a water-saving function. Furthermore, to accelerate the water replenishment effect, the slow lifting groove 3 also includes a guide plate. The guide plate is inclined and tilted towards the overflow port 33. In this embodiment, there are two guide plates, defined as the first guide plate 32 and the second guide plate 34, as follows: Figure 1 and Figure 2 As shown, both the first guide plate 32 and the second guide plate 34 are inclined from front to back and from top to bottom, so as to use the gravity of the water itself to accelerate the flow toward the overflow port 33.

[0038] like Figure 3 As shown, the slow-lifting tank 3 cleans the silicon wafers by continuously feeding water. When the liquid level exceeds the overflow port 33 on the rear overflow plate 322, water flows from the third overflow plate 31 to the first guide plate 32 and the second guide plate 34. Due to the certain tilt angle between the first guide plate 32 and the second guide plate 34 (higher at the front and lower at the back), all the overflowing water flows into the overflow port 33 and enters the overflow pipe. This pipe has two branches, each equipped with a solenoid valve. The two solenoid valves are defined as the first solenoid valve 41 and the second solenoid valve 42. If water tank 2 needs to use the overflow water from the slow-lifting tank 3 for water conservation, the valve of the first solenoid valve 41 is opened and the valve of the second solenoid valve 42 is closed. The water overflowing from the slow-lifting tank 3 enters the water tank 2 to replenish water and achieve the water conservation function. If water tank 2 does not need to use the overflow water from the slow-lifting tank 3 for water conservation, the valve of the first solenoid valve 41 is closed and the valve of the second solenoid valve 42 is opened. The water overflowing from the slow-lifting tank 3 is directly discharged through the second liquid outlet 132.

[0039] In summary, the present invention provides a dual-tank assembly and cleaning equipment for silicon wafer cleaning. The dual-tank assembly includes a water tank 2 and a slow-lifting tank 3. The water tank 2 is used to introduce water for cleaning the silicon wafers, and the slow-lifting tank 3 is used for slow-lifting cleaning of the silicon wafers. The slow-lifting tank 3 includes a third overflow plate 31 with an overflow port 33, which directly or indirectly connects to the slow-lifting tank 3 and the water tank 2. With this configuration, when the slow-lifting tank 3 continuously introduces water to clean the silicon wafers and the water level exceeds the overflow port 33, the overflowing water can be directly or indirectly introduced into the water tank 2 through the overflow port 33 to replenish the water tank 2, thereby achieving water conservation. This avoids the use of additional water pumps and auxiliary tanks, directly eliminating the cost burden of purchasing, installing, and maintaining these components. The system architecture is simplified, reducing operational complexity, minimizing downtime risks due to equipment failure, and improving overall operational efficiency and stability. Meanwhile, the simplified system reduces space occupation, improves space utilization, and reserves more space for other equipment or production processes, enhancing the flexibility of production layout. Furthermore, the reduced number of components lowers maintenance workload and costs, further improving production efficiency.

[0040] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0041] For ease of description, directional terms such as "front, back, up, down, left, right," "horizontal, vertical, horizontal," and "top, bottom" generally indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. These terms are used solely for the purpose of facilitating the description of this application and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the referred mechanism or element must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the scope of protection of this application. The directional terms "inner" and "outer" refer to the inner or outer contours relative to the components themselves. For example, if a device in the drawings is inverted, a device described as "above" or "on top of" other devices or structures will subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein are interpreted accordingly.

[0042] Unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0043] Unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0044] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this application. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0045] It should also be noted that the terms "one embodiment," "another embodiment," and "embodiment" used in this specification refer to specific features, structures, or characteristics described in connection with that embodiment, which are included in at least one embodiment described in the general description of this application. The appearance of the same expression in multiple places in the specification does not necessarily refer to the same embodiment. Furthermore, when a specific feature, structure, or characteristic is described in connection with any embodiment, the intention is to suggest that implementing such a feature, structure, or characteristic in conjunction with other embodiments also falls within the scope of this application.

[0046] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0047] It should also be noted that the above are merely preferred embodiments of this application and do not limit the scope of patent protection of this application. Any equivalent structural or procedural changes made using the content of this application’s specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of this application.

Claims

1. A dual-tank assembly for silicon wafer cleaning, characterized in that, include: Water tank (2) is used to circulate water to clean silicon wafers; Slow pull groove (3) is used for slow pull cleaning of silicon wafers; The slow lifting trough (3) includes a third overflow plate (31), and the third overflow plate (31) is provided with an overflow port (33). The overflow port (33) is directly or indirectly connected to the slow lifting trough (3) and the water tank (2).

2. The double-slot assembly according to claim 1, characterized in that, It also includes a liquid guide tube, one end of which is connected to the overflow port (33), and the other end is connected to the water tank (2).

3. The double-slot assembly according to claim 1, characterized in that, The slow lifting groove (3) also includes a guide plate, which is inclined and tilted toward the overflow port (33).

4. The double-slot assembly according to claim 1, characterized in that, The water tank (2) also includes an overflow plate, and the third overflow plate (31) of the slow lifting tank (3) is higher in the vertical direction than the overflow plate of the water tank (2).

5. The double-slot assembly according to claim 1, characterized in that, It also includes a base (1), in which the water tank (2) and the slow lifting channel (3) are integrated and configured.

6. The double-slot assembly according to claim 5, characterized in that, The base (1) includes a liquid outlet channel (13), one end of which is connected to the water tank (2) and / or the slow lifting tank (3), and the other end is connected to the external atmosphere.

7. The double-slot assembly according to claim 6, characterized in that, The liquid outlet channel (13) includes a first liquid outlet (131) and a second liquid outlet (132), one of which is connected to the water tank (2) and the other is connected to the slow lifting tank (3).

8. The double-slot assembly according to claim 7, characterized in that, The first liquid outlet (131) is equipped with a solenoid valve for opening or closing the first liquid outlet (131); and / or The second liquid outlet (132) is equipped with a solenoid valve for opening or closing the second liquid outlet (132).

9. The double-slot assembly according to claim 2, characterized in that, It also includes a three-way valve, which has three ports. The liquid guide tube is connected to one of the ports, and the other two ports of the three-way valve are connected to the water tank (2) and the outside atmosphere, respectively.

10. A cleaning device, characterized in that, It includes a transfer component, a drying component, and a twin-slot assembly as described in any one of claims 1-9, wherein the transfer component is used to input / output silicon wafers into / out of the twin-slot assembly, and the drying component is used to dry silicon wafers cleaned by the twin-slot assembly.

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