Lifting device for wafer cleaning splash shield

Abstract

The utility model relates to wafer cleaning equipment technical field, concretely relates to a kind of lifting device of wafer cleaning splash shield, comprising: motor base;Stepping motor, motor shaft passes through motor base and points to upper side;The upper side of motor base is provided with mounting substrate, lifting rod passes through mounting substrate, is connected motor shaft by internal thread, under the drive of motor shaft, lifting is carried out by thread pushing;The top of lifting rod is connected to wafer cleaning splash shield.For the problem that the lifting mechanism design of wafer cleaning splash shield in prior art is more complex, drive mechanism is replaced for the combination of stepping motor and lifting rod, corresponding driving torque is provided by the rotation of stepping motor, and torque is converted into moving distance by the thread screw rod formed on lifting rod, so as to realize the pushing of wafer cleaning splash shield.Due to the adoption of electric principle, the volume of device can be reduced, and the arrangement of power supply line is more free relative to air delivery pipeline, which reduces design cost.

Description

Technical Field

[0001] This utility model relates to the technical field of wafer cleaning equipment, specifically to a lifting device for a wafer cleaning splash guard. Background Technology

[0002] Wafer cleaning equipment is a key piece of equipment in the semiconductor manufacturing process. It is primarily used to remove contaminants (such as particles, organic matter, metal ions, and native oxide layers) from the wafer surface, ensuring yield and performance in subsequent processes such as photolithography, etching, and deposition. Typically, the wafer cleaning process involves transferring the wafer to a platform using loading equipment and fixtures, followed by cleaning the wafer surface through processes such as spraying and drying. A wafer cleaning splash guard is a device mounted on the wafer cleaning equipment to protect the wafers during the cleaning process. Since various chemical agents, such as HF and isopropanol, are commonly used in wafer cleaning, a liftable wafer cleaning splash guard is usually installed outside the equipment. This guard rises during wafer loading and unloading to allow the robotic arm to handle the wafers, and lowers during cleaning to prevent chemical splashes from contaminating the external production area.

[0003] For example, patent document CN201610891936.7 discloses an anti-splash device for a wafer cleaning machine. The wafer cleaning machine includes a wafer carrier and a peripheral wall surrounding the wafer carrier. The wafer carrier includes a carrier suction cup. The anti-splash device covers the outer perimeter of the wafer carrier and includes a shielding unit and a driving mechanism. The shielding unit includes a top and is switchable between a retracted state and an extended state relative to the wafer carrier. In the retracted state, the top of the shielding unit is spaced apart from the top surface of the carrier suction cup by a first distance. In the extended state, the top of the shielding unit is spaced apart from the top surface of the carrier suction cup by a second distance, the second distance being greater than the first distance. The driving mechanism is connected to the shielding unit to drive the shielding unit to switch between the retracted and extended states. This limits the range of cleaning fluid splashing within the shielding unit, preventing the cleaning fluid from splashing onto other objects.

[0004] However, in actual implementation, the inventors discovered that the driving mechanism in this type of technical solution typically uses pneumatic principles. For example, a set of cylinders and piston rods are connected to an external compressed air device, which pneumatically drives the splash guard to rise and fall. However, lifting devices based on this principle usually require the installation of corresponding air delivery pipes on the cleaning device, and specific design of parameters such as the air pressure that the compressed air device can provide. This increases the design cost of the wafer cleaning device. Utility Model Content

[0005] In view of the above-mentioned problems in the prior art, a lifting device for a wafer cleaning splash guard is provided.

[0006] The specific technical solution is as follows:

[0007] A lifting device for a wafer cleaning splash guard includes:

[0008] Motor base;

[0009] A stepper motor, which is mounted vertically below the motor base;

[0010] The motor shaft of the stepper motor passes through the motor base and points upward;

[0011] A mounting base is provided above the motor base, and the mounting base is provided with guide holes in the vertical direction;

[0012] The lifting rod passes through the mounting base plate, and the bottom end of the lifting rod is connected to the motor shaft via an internal thread;

[0013] The motor shaft is provided with an external thread that matches the lifting rod, and the lifting rod is pushed up and down by the thread under the drive of the motor shaft;

[0014] The top of the lifting rod is connected to the wafer cleaning splash guard.

[0015] On the other hand, the motor base is in the shape of a long cube;

[0016] A pair of uprights are provided on the left and right sides of the motor base;

[0017] The top of the column is supported by the mounting base plate;

[0018] A bushing is installed at the center of the mounting base plate, and the guide hole is formed on the bushing.

[0019] The bushing extends downward toward the mounting base plate and is in the shape of an elongated cylinder.

[0020] On the other hand, it also includes flexible couplings and locking rods;

[0021] The bottom end of the flexible coupling is connected to the top of the lifting rod;

[0022] The top of the flexible coupling is connected to the bottom of the locking rod;

[0023] The flexible coupling has movable space at both its upper and lower ends along the horizontal plane.

[0024] The top of the locking rod is connected to the wafer cleaning splash guard via a locking structure.

[0025] On the other hand, a bellows is fitted onto the top edge of the lifting rod and the lower edge of the locking rod;

[0026] The bellows wraps the elastic coupling.

[0027] On the other hand, connecting bolts are provided on the upper surface of the mounting substrate;

[0028] The mounting substrate is connected to the bottom surface of the wafer cleaning device via the connecting bolts, and the wafer cleaning splash guard is provided above the wafer cleaning device.

[0029] On the other hand, buffer pads are provided on the upper surface of the motor base;

[0030] An opening is provided in the middle of the buffer pad;

[0031] The buffer pad surrounds the lifting rod.

[0032] On the other hand, two photoelectric sensor brackets are arranged in sequence along the height direction on the side surface of the column;

[0033] The photoelectric sensor bracket is in a U-shaped in the top view direction;

[0034] A photoelectric sensor is provided on the photoelectric sensor bracket;

[0035] The photoelectric sensor points to the lifting rod.

[0036] On the other hand, a sliding flange is provided at the bottom end of the lifting rod.

[0037] The above technical solution has the following advantages or beneficial effects:

[0038] Aiming at the problem that the lifting mechanism design of the wafer cleaning splash guard in the prior art is relatively complex, the driving mechanism is replaced with a combination of a stepping motor and a lifting rod. The corresponding driving torque is provided by the rotation of the stepping motor, and the torque is converted into a moving distance through the threaded screw formed on the lifting rod, so as to realize the pushing of the wafer cleaning splash guard. Due to the adoption of the electric principle, the volume of the device is reduced, and the layout of the power supply line is more flexible than that of the air conveying pipeline, reducing the design cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Referring to the accompanying drawings, the embodiments of the present invention will be described more fully. However, the accompanying drawings are only for illustration and explanation, and do not constitute a limitation on the scope of the present invention.

[0040] Figure 1 It is a schematic cross-sectional view of an embodiment of the present invention;

[0041] Figure 2 It is an isometric schematic view of an embodiment of the present invention;

[0042] Figure 3 This is a bottom view of the lifting platform according to an embodiment of the present utility model;

[0043] Figure 4 This is an enlarged schematic diagram of the coupling according to an embodiment of the present utility model.

[0044] Reference numerals: 1A, wafer cleaning splash guard; 2A, lifting device; 1, motor base; 2, stepper motor; 21, motor shaft; 3, mounting base; 4, lifting rod; 5, column; 6, bushing; 7, flexible coupling; 8, locking rod; 9, bellows; 10, buffer pad; 11, photoelectric sensor bracket; 12, photoelectric sensor; 12A, baffle; 13, sliding flange. Detailed Implementation

[0045] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0046] It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0047] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the present invention.

[0048] This utility model includes:

[0049] A lifting device for a wafer cleaning splash guard includes:

[0050] Motor base 1;

[0051] Stepper motor 2 is mounted vertically below motor base 1;

[0052] The motor shaft 21 of the stepper motor 2 passes through the motor base 1 and points upward;

[0053] A mounting base 3 is provided above the motor base 1, and the mounting base 3 has guide holes along the vertical direction;

[0054] The lifting rod 4 passes through the mounting base plate 3, and the bottom end of the lifting rod 4 is connected to the motor shaft through an internal thread;

[0055] The motor shaft is provided with an external thread that matches the lifting rod. The lifting rod 4 is driven by the motor shaft and is pushed up and down by the thread.

[0056] The top of the lifting rod 4 is connected to the wafer cleaning splash guard 1A.

[0057] Specifically, addressing the issue of the complex design of the lifting mechanism in existing wafer cleaning splash guards, this embodiment replaces the drive mechanism with a combination of a stepper motor 2 and a lifting rod 4. The rotation of the stepper motor 2 provides the corresponding driving torque, which is converted into a moving distance via a threaded screw formed on the lifting rod 4, thereby pushing the wafer cleaning splash guard. Due to the adoption of an electric principle, the size of the device is reduced, and the arrangement of the power supply lines is more flexible compared to air delivery ducts, lowering design costs.

[0058] Specifically, the driving scheme in this solution is an electric drive scheme that drives the lifting rod 4 through the stepper motor 2. The motor shaft of the stepper motor 2 is set in the vertical direction, and the outer surface of the motor shaft is machined with threads to form a lead screw.

[0059] The lifting rod 4 has a circular rod-shaped structure. At the bottom of the lifting rod 4, a cylindrical cavity is machined upwards. The inner wall of the cavity has an internal thread that matches the lead screw formed by the motor shaft of the stepper motor.

[0060] The top of the lifting rod 4 is connected and fixed to the lower surface of the wafer cleaning splash guard 1A via a connecting device. The engagement part between the internal thread at the bottom of the lifting rod 4 and the motor shaft is fully lubricated so that the motor shaft can rotate freely along the thread direction. When the stepper motor 2 rotates forward and backward according to the externally input control commands, the motor shaft, acting as a lead screw, rotates clockwise and counterclockwise, thereby causing the internal thread of the lifting rod 4 to be screwed in or out, thus changing the distance between the bottom of the lifting rod 4 and the motor, thereby achieving the height adjustment of the wafer cleaning splash guard 1A above.

[0061] Based on the above driving principle, a motor base 1 can be set up during implementation. The motor base 1 is connected to the wafer cleaning machine platform through a connector and is usually located below the processing plane of the wafer platform to meet the relevant cleanliness requirements. The lifting rod 4 is used to cross the processing plane and connect to the wafer cleaning splash guard 1A above. When the motor base 1 is fixed, the stepper motor 2 pushes the lifting rod 4 to move, thereby changing the distance between the bottom of the lifting rod 4 and the motor, so as to realize the height adjustment of the wafer cleaning splash guard 1A above.

[0062] Multiple lifting devices 2A will be installed below the machine as needed.

[0063] In one embodiment, the motor base 2 is rectangular.

[0064] A pair of uprights 5 are provided on the left and right sides of the motor base 2;

[0065] The top of the column 5 is supported by the mounting base plate 3;

[0066] A bushing 6 is mounted in the center of the mounting base plate 3, and a guide hole is formed on the bushing 6.

[0067] The bushing 6 extends downward toward the mounting base plate 3 and is in the shape of a long cylinder.

[0068] Specifically, to meet the cleanliness requirements of the wafer cleaning machine, a suspended structural design was selected in this embodiment. The overall lifting device is installed via a mounting substrate 3, which is attached to the lower surface of the wafer cleaning machine and is typically enclosed by the machine's outer casing.

[0069] The wafer cleaning machine platform has corresponding holes to allow the lifting rod 4 to pass through.

[0070] A pair of columns 5 extend downward from the mounting base 3, and the lower ends of the columns 5 are connected and fixed to the motor base 2. The extension of the columns 5 can meet the movement distance requirements of the lifting rod 4, and allow the motor base 2 to be suspended below the machine platform. The stepper motor 2 is then mounted and fixed on the motor base 2.

[0071] Meanwhile, considering that the lifting rod 4 may be unstable during long-distance movement after the length is extended, a bushing 6 is also installed in the central part of the mounting base plate 3 in this embodiment. A guide hole is formed on the bushing 6. The bushing 6 extends downward to the mounting base plate 3 and is in the shape of a thick-walled long cylinder. It is preferably a linear bearing. The lifting rod 4 is limited by the bushing 6 and slides up and down along the bushing 6.

[0072] Because the bushing 6 has a certain thickness and length, it can wrap around the lifting rod 4 during the sliding process, preventing the lifting rod 4 from shifting during its movement.

[0073] In one embodiment, the upper surface of the mounting base plate 3 is provided with connecting bolts;

[0074] Mounting substrate 3 is connected to the bottom surface of wafer cleaning apparatus via connecting bolts, and wafer cleaning splash guard 1A is positioned above wafer cleaning apparatus.

[0075] Specifically, to achieve a better fixing effect, the central part of the mounting substrate 3 is opened to install the bushing 6, while the two sides are provided with mounting holes corresponding to the columns 5, and connecting bolts are provided at the four corners for connecting to the bottom surface of the wafer cleaning device upward.

[0076] Meanwhile, in order to achieve a better vertical positioning effect for the lifting rod 4, connecting bolts are also provided above the bushing 6 to fix the bushing 6 to the lower surface of the machine platform, so that the bushing 6 fits more tightly to the machine platform for positioning.

[0077] In one embodiment, it also includes a flexible coupling 7 and a locking lever 8;

[0078] The bottom end of the flexible coupling 7 is connected to the top of the lifting rod 4;

[0079] The top of the flexible coupling 7 is connected to the bottom of the locking rod 8;

[0080] The upper and lower ends of the flexible coupling 7 have movable space along the horizontal plane.

[0081] The top of the locking lever 8 is connected to the wafer cleaning splash guard 1A via a locking structure.

[0082] Specifically, considering that deviations may occur during the assembly of the lifting device, resulting in the lower lifting rod 4 not being strictly aligned with the corresponding hole on the upper wafer cleaning splash guard 1A, in this embodiment, an elastic coupling 7 and a locking rod 8 are sequentially provided on the top of the lifting rod 4.

[0083] The flexible coupling 7 is a coupling structure in which both ends can be offset to a certain extent in a specific direction. After installation, it can compensate for the misalignment error between the lifting rod 4 and the corresponding hole on the upper wafer cleaning splash guard 1A. At the same time, it has a certain rigidity in the height direction, which can realize the vertical limit and facilitate the movement of the wafer cleaning splash guard 1A. The locking rod 8 is designed as a quick-release structure on one end, which can be quickly unlocked to facilitate the removal of the wafer cleaning splash guard 1A.

[0084] In one embodiment, a bellows 9 is fitted onto the top edge of the lifting rod 4 and the edge of the locking rod 8;

[0085] The bellows 9 encloses the flexible coupling 7.

[0086] Specifically, since the top of the lifting rod 4 will pass through the machine platform and come into contact with the cleaning area above, in order to avoid the chemical agents from coming into contact with moving parts such as couplings through the holes and causing corrosion and pollution, a bellows 9 is introduced in this embodiment.

[0087] The bellows 9 is a tubular structure made of polymer material. Its surface is bent to form multiple segmented structures, allowing it to change length with stretching without breaking. Both ends of the bellows 9 are respectively secured to the top edge of the lifting rod 4 and the edge of the locking rod 8, thus completely enclosing the height portion of the elastic coupling 7. Grooves are machined into the top edge of the lifting rod 4 and the edge of the locking rod 8. After the end face of the bellows 9 is inserted into these grooves, it is secured using clamps.

[0088] In one embodiment, a buffer pad 10 is provided on the upper surface of the motor base 1;

[0089] The cushioning pad 10 has an opening in the middle;

[0090] A buffer pad 10 is set around the lifting rod 4.

[0091] Specifically, in order to avoid the problem of the upper structure falling due to the failure of the stepper motor 2 during operation, in this embodiment, a buffer pad 10 is provided on the upper surface of the motor base 1. The buffer pad 10 is made of a flexible material, such as rubber, which can absorb the impact force when the lifting rod 4 falls.

[0092] In one embodiment, two photoelectric sensor brackets 11 are respectively provided on the side of the column 5 along the height direction;

[0093] The photoelectric sensor bracket 11 is shaped like a "Z" when viewed from above;

[0094] A photoelectric sensor 12 is mounted on the photoelectric sensor bracket 11;

[0095] Photoelectric sensor 12 points to lifting rod 4.

[0096] Specifically, to facilitate external control of the stepper motor 2, in this embodiment, a photoelectric sensor 12 pointing to the lifting rod 4 is fixed to the side of the column 5 via a photoelectric sensor bracket 11. The photoelectric sensor 12 can detect specific structures on the lifting rod 4 and generate a detection signal output. Similar solutions can be easily found in existing technologies for this detection step and the backend control program, such as photoelectric sensors detecting surface reflectivity, reflective markings affixed to corresponding positions on the lifting rod 4, and reflective indicator lights appearing when the rod moves to the position of the photoelectric sensor. By setting two photoelectric sensors 12 in the height direction, it is possible to detect whether the lifting rod 4 has moved to a specific position.

[0097] In addition, to avoid crosstalk between the photoelectric signals of adjacent photoelectric sensors 12, a baffle 12A can be provided between the two photoelectric sensors 12 for shielding.

[0098] In one embodiment, a sliding flange 13 is provided at the bottom end of the lifting rod 4.

[0099] Specifically, considering the small size of the bottom end of the lifting rod 4 and the resulting ineffective buffering effect, a sliding flange 13 is provided at the bottom end of the lifting rod 4 in this embodiment. The sliding flange 13 is fixed to the bottom surface of the lifting rod 4 and has a large hole at its center that will not interfere with the motor shaft. The sliding flange 13 has a large bottom area. The sliding flange moves with the lifting rod 4 and reduces the impact force per unit area during impact by increasing the bottom area.

[0100] The above are merely preferred embodiments of the present utility model and are not intended to limit the implementation methods and protection scope of the present utility model. Those skilled in the art should realize that any equivalent substitutions and obvious changes made based on the description and illustrations of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A lifting device for a wafer cleaning splash guard, characterized in that, Comprising: Motor base; Stepper motor, which is installed vertically below the motor base; The motor shaft of the stepper motor passes through the motor base and points upward; An installation substrate is provided above the motor base, and a guide hole is provided on the installation substrate in the vertical direction; A lifting rod passes through the installation substrate, and the bottom end of the lifting rod is connected to the motor shaft through internal threads; External threads matching the lifting rod are provided on the motor shaft, and the lifting rod is lifted and lowered by being pushed by the threads under the drive of the motor shaft; The top of the lifting rod is connected to the wafer cleaning splash guard.

2. The lifting device according to claim 1, characterized in that, The motor base is in the shape of a long cube; A pair of columns are respectively provided on the left and right sides of the motor base; The top of the column supports the installation substrate; A bushing is installed at the central part of the installation substrate, and the guide hole is formed on the bushing; The bushing extends downward from the installation substrate and is in the shape of a long cylinder.

3. The lifting device according to claim 1, characterized in that, An elastic coupling and a locking rod are further included; The bottom end of the elastic coupling is connected to the top of the lifting rod; The top of the elastic coupling is connected to the bottom of the locking rod; Activity spaces are provided in the horizontal plane direction at the upper and lower ends of the elastic coupling; The top of the locking rod is connected to the wafer cleaning splash guard through a locking structure.

4. The lifting device according to claim 3, characterized in that, A corrugated pipe is clamped at the edge of the top of the lifting rod and the lower edge of the locking rod; The corrugated pipe wraps the elastic coupling.

5. The lifting device according to claim 1, characterized in that, Connection bolts are provided on the upper surface of the installation substrate; The installation substrate is connected to the bottom surface of the wafer cleaning device through the connection bolts, and the wafer cleaning splash guard is arranged above the wafer cleaning device.

6. The lifting device according to claim 1, characterized in that, A buffer pad is provided on the upper surface of the motor base; An opening is provided in the middle of the buffer pad; The buffer pad surrounds the lifting rod.

7. The lifting device according to claim 2, characterized in that, Two optoelectronic sensor brackets are arranged in sequence along the height direction on the side surface of the column; The optoelectronic sensor bracket is in a shape like a capital letter "J" in the top view direction; An optoelectronic sensor is provided on the optoelectronic sensor bracket; The optoelectronic sensor points to the lifting rod.

8. The lifting device according to claim 1, characterized in that, A sliding flange is provided at the bottom end of the lifting rod.

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