Diode lead forming and bending apparatus

Abstract

The utility model relates to the technical field of lead, disclose a diode lead forming bending device, including bending diameter adjusting assembly, bending diameter adjusting assembly includes bending forming post, be provided with assembly hole on the bending forming post, be equipped with the sliding slot on the bending forming post, the inboard connection of bending forming post has the spring, one end of spring is connected with the connecting ball, the outside of bending forming post is provided with adjusting assembly ring, the inboard of adjusting assembly ring is provided with fixed block, through the collaborative work of bending diameter adjusting assembly and bending axle distance adjusting unit, can accurately adjust the distance between the bending diameter of lead and bending axle. This makes the device can adapt to different specifications and models of diode lead, satisfy the diversified production demand.

Description

Technical Field

[0001] This utility model relates to the field of lead wire technology, specifically a diode lead wire forming and bending device. Background Technology

[0002] In the electronics manufacturing industry, diode lead forming is a crucial step in the production process, especially in the mass production of semiconductor components such as diodes. Precise lead forming directly affects product performance and quality. Traditional lead forming methods rely heavily on manual operation or simple mechanical devices, resulting in low efficiency and insufficient precision. Manual operation is not only slow but also struggles to ensure consistent lead bending, easily leading to inconsistent product quality. Existing mechanical forming devices are often only suitable for specific lead specifications, lacking flexibility and failing to meet diverse and personalized production needs. Furthermore, adjusting lead bending parameters is cumbersome and time-consuming, making them unsuitable for the high-efficiency, rapid changeover requirements of modern production lines.

[0003] Therefore, developing an automated device that can efficiently and accurately adjust the lead bending diameter and axial distance is of great significance for improving diode production efficiency and quality. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a diode lead forming and bending device.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a diode lead forming and bending device, comprising a bending diameter adjustment component, the bending diameter adjustment component comprising a bending forming column, the bending forming column having an assembly hole and a sliding groove, a spring connected to the inner side of the bending forming column, a connecting ball connected to one end of the spring, an adjustment assembly ring provided on the outer side of the bending forming column, and a fixing block provided on the inner side of the adjustment assembly ring.

[0006] As a further description of the above technical solution:

[0007] The bending diameter adjustment assembly has a bending shaft distance adjustment unit on its lower side. The bending shaft distance adjustment unit includes a fixed shell, a drive motor connected to the inner side of the fixed shell, a rotating disk connected to the output end of the drive motor, a connecting disk on the upper side of the rotating disk, a sliding adjustment plate connected to the inner side of the connecting disk, a fixing hole on the sliding adjustment plate, a forming roller connected to one end of the sliding adjustment plate, and a fixing bolt connected to the lower middle position of the connecting disk.

[0008] As a further description of the above technical solution:

[0009] The fixing block is slidably connected to the inner side of the assembly hole and the slide groove. Two sets of fixing blocks are symmetrically arranged and are located inside the adjusting assembly ring. The assembly hole and the slide groove are interconnected.

[0010] As a further description of the above technical solution:

[0011] One end of the spring is fixedly connected to the inner side of the bent-formed column, and the other end of the spring is fixedly connected to the upper side of the connecting ball. The connecting ball is slidably connected to the inner side of the bent-formed column and slides within the groove.

[0012] As a further description of the above technical solution:

[0013] The drive motor is fixedly mounted on the inner side of the fixed housing, the rotating disk is rotatably connected to the fixed housing, and the rotating disk is fixedly connected to the lower side of the connecting disk.

[0014] As a further description of the above technical solution:

[0015] The sliding adjustment plate is slidably connected to the connecting plate, the fixing bolt is rotatably connected to the fixing hole, and the fixing bolt is threadedly connected to the lower middle position of the connecting plate.

[0016] As a further description of the above technical solution:

[0017] The forming roller is rotatably connected to a shaft on the sliding adjustment plate, and the bending forming column is fixedly located at the upper middle position of the connecting plate.

[0018] This utility model has the following beneficial effects:

[0019] 1. Through the coordinated operation of the bending diameter adjustment component and the bending shaft distance adjustment unit, the bending diameter of the lead and the distance between the bending shaft can be precisely adjusted. This allows the device to adapt to diode leads of different specifications and models, meeting diverse production needs. The ingenious design of the adjustment assembly ring, combined with the structure of springs and connecting balls, enables quick installation and fixation, greatly improving adjustment efficiency. In addition, the drive motor drives the rotating disk and connecting disk to rotate, enabling the forming roller to perform a semi-circular motion, thereby achieving precise bending and forming of the lead. This process not only improves the accuracy of lead forming but also significantly increases production efficiency and reduces the complexity of manual operation, making it particularly suitable for large-scale production and high-precision scenarios.

[0020] 2. The installation and fixing process of the adjustment assembly ring is simple, and can be completed by sliding and rotating, without complicated tools or cumbersome steps. The design of the sliding adjustment plate and forming roller makes it easy to adjust the lead wire bending parameters, and can quickly switch production tasks with different bending requirements. Attached Figure Description

[0021] Figure 1 A three-dimensional structural diagram of a diode lead forming and bending device proposed in this utility model. Figure 1 ;

[0022] Figure 2 A three-dimensional structural diagram of a diode lead forming and bending device proposed in this utility model. Figure 2 ;

[0023] Figure 3 This is a partial structural cross-sectional view of a diode lead forming and bending device proposed in this utility model;

[0024] Figure 4 This is a partial exploded view of the diode lead forming and bending device proposed in this utility model.

[0025] Legend:

[0026] 1. Bending diameter adjustment assembly; 11. Bending forming column; 12. Assembly hole; 13. Slide groove; 14. Spring; 15. Connecting ball; 16. Adjusting assembly ring; 17. Fixing block; 2. Bending shaft distance adjustment unit; 21. Fixing shell; 22. Drive motor; 23. Rotating disk; 24. Connecting disk; 25. Sliding adjustment plate; 26. Fixing hole; 27. Forming roller; 28. Fixing bolt. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The utility model will be further described in detail below with reference to the accompanying drawings.

[0029] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0030] Example 1:

[0031] like Figures 1 to 4 As shown, this embodiment provides a diode lead forming and bending device, including a bending diameter adjustment component 1. The bending diameter adjustment component 1 includes a bending forming column 11, an assembly hole 12 is provided on the bending forming column 11, a sliding groove 13 is provided on the bending forming column 11, a spring 14 is connected to the inner side of the bending forming column 11, a connecting ball 15 is connected to one end of the spring 14, an adjusting assembly ring 16 is provided on the outer side of the bending forming column 11, and a fixing block 17 is provided on the inner side of the adjusting assembly ring 16.

[0032] In this embodiment, the bending diameter adjustment component 1 and the bending shaft distance adjustment unit 2 constitute a diode lead forming bending device according to this application.

[0033] Specifically, a bending axis distance adjustment unit 2 is provided on the lower side of the bending diameter adjustment component 1. The bending axis distance adjustment unit 2 includes a fixed shell 21. A drive motor 22 is connected to the inner side of the fixed shell 21. A rotating disk 23 is connected to the output end of the drive motor 22. A connecting disk 24 is provided on the upper side of the rotating disk 23. A sliding adjustment plate 25 is connected to the inner side of the connecting disk 24. A fixing hole 26 is provided on the sliding adjustment plate 25. A forming roller 27 is connected to one end of the sliding adjustment plate 25. A fixing bolt 28 is connected to the middle position of the lower side of the connecting disk 24.

[0034] In this embodiment, the assembly hole 12 and the slide groove 13 are arranged vertically, both being elongated hole structures and interconnected. The fixing block 17 is arranged in two symmetrical sets, with a cuboid shape and metal material, and is slidably connected to the inner side of the assembly hole 12 and the slide groove 13.

[0035] Specifically, the fixing block 17 is slidably connected to the inner side of the assembly hole 12 and the slide groove 13. Two sets of fixing blocks 17 are symmetrically arranged and are located inside the adjusting assembly ring 16. The assembly hole 12 and the slide groove 13 are interconnected.

[0036] In a preferred embodiment, when the adjusting assembly ring 16 is fitted onto the outside of the bent forming column 11, the two sets of fixing blocks 17 slide downwards along the assembly hole 12 and the slide groove 13. When they slide to the bottom, the adjusting assembly ring 16 is rotated, causing the fixing blocks 17 to slide within the slide groove 13. When they slide to one side of the two sets of connecting balls 15, the adjusting assembly ring 16 is rotated again, and the fixing blocks 17 press against the two sets of connecting balls 15, causing the two sets of connecting balls 15 to move in opposite directions. This achieves the installation and fixation of the adjusting assembly ring 16 on the outside of the bent forming column 11, thereby adjusting the width of the diode lead bend.

[0037] Example 2:

[0038] Specifically, one end of the spring 14 is fixedly connected to the inner side of the bent-formed column 11, and the other end of the spring 14 is fixedly connected to the upper side of the connecting ball 15. The connecting ball 15 is slidably connected to the inner side of the bent-formed column 11 and slides within the groove 13.

[0039] In this embodiment, spring 14 is a helical spring made of spring steel, and one end is fixedly connected to the inner bottom of the bent column 11. Connecting ball 15 is spherical and made of steel.

[0040] Specifically, the drive motor 22 is fixedly mounted on the inner side of the fixed housing 21, the rotating disk 23 is rotatably connected to the fixed housing 21, and the rotating disk 23 is fixedly connected to the lower side of the connecting disk 24.

[0041] With this configuration, when the fixing block 17 presses the connecting ball 15, the spring 14 is compressed, and the connecting ball 15 slides in the slide groove 13. When the fixing block 17 moves to the other side of the connecting ball 15, the connecting ball 15 is fixed in the slide groove 13 under the restoring force of the spring 14, thereby realizing the positioning and fixing of the adjustment assembly ring 16 and providing stable support for adjusting the bending width of the diode lead.

[0042] Example 3:

[0043] Specifically, the sliding adjustment plate 25 is slidably connected to the connecting plate 24, the fixing bolt 28 is rotatably slidably connected to the fixing hole 26, and the fixing bolt 28 is threadedly connected to the lower middle position of the connecting plate 24.

[0044] The rotating disk 23 is a circular disk made of metal, fixedly connected to the output end of the drive motor 22, and rotatably connected to the fixed housing 21. The connecting disk 24 is a circular disk made of metal, and fixedly connected to the upper side of the rotating disk 23.

[0045] Specifically, the forming roller 27 is rotatably connected to the shaft provided on the sliding adjustment plate 25, and the bending forming column 11 is fixedly provided at the upper middle position of the connecting plate 24.

[0046] In this embodiment, the drive motor 22 is started, and its output end drives the rotating disk 23 to rotate inside the fixed housing 21, which in turn drives the connecting disk 24 to rotate, providing power support for the subsequent lead wire bending operation.

[0047] In use, firstly, the adjusting assembly ring 16 is fitted onto the outside of the bent forming column 11, while the two sets of fixing blocks 17 slide into the assembly holes 12 on the bent forming column 11. When it slides to the bottom, the adjusting assembly ring 16 is rotated, causing the fixing blocks 17 to slide within the slide groove 13. When they slide to one side of the two sets of connecting balls 15, the adjusting assembly ring 16 is continued to rotate, and the fixing blocks 17 press against the two sets of connecting balls 15, causing them to move in opposite directions. Once they move to the other side of the connecting balls 15, the adjusting assembly ring 16 can be installed onto the outside of the bent forming column 11 to adjust the width of the diode lead bend. The fixing screws are then removed. Bolt 28 is used to move the sliding adjustment plate 25 inside the connecting plate 24. The distance between the adjusting forming roller 27 and the adjusting assembly ring 16 is adjusted. The diode lead is passed between the adjusting assembly ring 16 and the adjusting roller 27. The sliding adjustment plate 25 is fixed to the connecting plate 24 by fixing bolt 28. The drive motor 22 is started to drive the rotating plate 23 to rotate. The rotating plate 23 drives the connecting plate 24 to rotate, which in turn drives the sliding adjustment plate 25 to rotate. The sliding adjustment plate 25 drives the forming roller 27 to make a semi-circular motion outside the adjusting assembly ring 16, which can bend the diode lead.

[0048] It should be noted that all electrical components mentioned in this article are connected to an external main controller and 220V AC mains power. The main controller can be a conventional known device that can be controlled by a computer or other means. The detailed description of known functions and known components is omitted in the specific embodiments disclosed herein. In order to ensure the compatibility of the device, the operating methods used are consistent with the parameters of commercially available instruments.

[0049] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A diode lead forming and bending device, characterized in that: The device includes a bending diameter adjustment assembly (1), which includes a bending forming column (11), an assembly hole (12) on the bending forming column (11), a sliding groove (13) on the bending forming column (11), a spring (14) connected to the inner side of the bending forming column (11), a connecting ball (15) connected to one end of the spring (14), an adjustment assembly ring (16) on the outer side of the bending forming column (11), and a fixing block (17) on the inner side of the adjustment assembly ring (16).

2. The diode lead forming and bending device according to claim 1, characterized in that: The bending diameter adjustment assembly (1) is provided with a bending shaft distance adjustment unit (2) on its lower side. The bending shaft distance adjustment unit (2) includes a fixed shell (21). The inner side of the fixed shell (21) is connected to a drive motor (22). The output end of the drive motor (22) is connected to a rotating disk (23). The upper side of the rotating disk (23) is provided with a connecting disk (24). The inner side of the connecting disk (24) is connected to a sliding adjustment plate (25). The sliding adjustment plate (25) is provided with a fixing hole (26). One end of the sliding adjustment plate (25) is connected to a forming roller (27). The middle position of the lower side of the connecting disk (24) is connected to a fixing bolt (28).

3. The diode lead forming and bending device according to claim 2, characterized in that: The fixing block (17) is slidably connected to the inner side of the assembly hole (12) and the slide groove (13). Two sets of fixing blocks (17) are symmetrically arranged and are located inside the adjusting assembly ring (16). The assembly hole (12) and the slide groove (13) are interconnected.

4. The diode lead forming and bending device according to claim 3, characterized in that: One end of the spring (14) is fixedly connected to the inner side of the bent column (11), and the other end of the spring (14) is fixedly connected to the upper side of the connecting ball (15). The connecting ball (15) is slidably connected to the inner side of the bent column (11) and slides in the groove (13).

5. The diode lead forming and bending device according to claim 4, characterized in that: The drive motor (22) is fixedly installed on the inner side of the fixed shell (21), the rotating disk (23) is rotatably connected to the fixed shell (21), and the rotating disk (23) is fixedly connected to the lower side of the connecting disk (24).

6. The diode lead forming and bending device according to claim 5, characterized in that: The sliding adjustment plate (25) is slidably connected to the connecting plate (24), and the fixing bolt (28) is rotatably slidably connected to the fixing hole (26). The fixing bolt (28) is threadedly connected to the lower middle position of the connecting plate (24).

7. A diode lead forming and bending device according to claim 6, characterized in that: The forming roller (27) is rotatably connected to the shaft provided on the sliding adjustment plate (25), and the bending forming column (11) is fixedly provided at the middle position on the upper side of the connecting plate (24).

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