An apparatus for car gauge LED desoldering

Abstract

The utility model relates to LED technical field mainly discloses a kind of equipment for car gauge LED disassembly, including table board, rack installed on table board, assembly frame installed on the one side of rack, vertical rod installed on the upper and lower ends of assembly frame, lifting assembly installed on the outside of vertical rod and heat dissipation platform installed on table board;Microscope is installed outside in the upper of the lifting assembly, heating gun is installed outside in the lower of lifting assembly;Extension frame is also installed on rack, and extension frame end is installed with clamp assembly being located in the upper of table board, and clamp assembly is located between microscope and heating gun.This utility model clamp assembly can be fixed to PCB, and microscope and heating gun can be all height adjustment, to change the distance between PCB, to reach best observation and heating effect, and heat dissipation platform is set to the LED disassembly down separately placed cooling, avoid the risk of loss and stick foreign matter.

Description

Technical Field

[0001] This utility model relates to the field of LED technology, and in particular to a device for desoldering automotive-grade LEDs. Background Technology

[0002] With the advent of intelligent and electric vehicle development, automotive-grade LEDs are increasingly used in automobiles, leading to the emergence of numerous new technologies, manufacturers, and models. Among these developments, LED failure analysis has garnered increasing attention. Generally, after identifying a single LED failure based on circuit principles, post-desoldering failure analysis of that individual LED is necessary. Unlike chips, diodes, resistors, and inductors, automotive-grade LEDs are typically encapsulated with plastic frames and silicone or epoxy resin phosphors. These materials generally have a temperature resistance not exceeding 125°C, while the desoldering temperature of LED pads generally needs to be greater than 217°C. This structural and material characteristic necessitates that LEDs on the PCB be desoldered from the back of the PCB using heat to avoid damaging the LED's structure.

[0003] Currently, there are two main methods for desoldering LEDs on the back. One method is to desolder the LEDs by heating the back of the PCB when there are no components on the back. The other method is to desolder the LEDs when there are components on the back of the PCB, which requires multiple people to work together. While fixing the PCB, a hot air gun is used to heat the back of the PCB. After the solder paste melts, the LEDs are picked up from the front with a clamp for further failure analysis. This method is relatively cumbersome, and the current heating plates do not have a fixed heat dissipation area for LED samples. The desoldered LED samples are prone to being lost. Utility Model Content

[0004] The technical problem this invention aims to solve is: to avoid the need for multiple people to work together when desoldering LEDs on a PCB, and the problem that desoldered LEDs are easily lost. This invention provides a device for desoldering automotive-grade LEDs that can fix the edge of the PCB, magnify the area to be desoldered, easily adjust the position of the PCB, heat the area to be desoldered, and easily place the desoldered LEDs separately.

[0005] The technical solution adopted by this utility model to solve its technical problem is as follows: a device for desoldering automotive-grade LEDs, including a platform, a frame mounted on the platform, an assembly rack mounted on one side of the frame, uprights mounted at the upper and lower ends of the assembly rack, a lifting assembly mounted on the outside of the uprights, and a heat sink mounted on the platform; a microscope is mounted on the outside of the upper lifting assembly, and a heating gun is mounted on the outside of the lower lifting assembly; an extension frame is also mounted on the frame, and a clamping assembly is mounted at the end of the extension frame above the platform, with the clamping assembly positioned between the microscope and the heating gun. The clamping assembly can fix the PCB, while the microscope and heating gun can both be height-adjusted to change the distance between them and the PCB, achieving optimal observation and heating effects. Furthermore, the heat sink allows for individual cooling of the desoldered LEDs, avoiding the risk of loss or foreign matter adhesion.

[0006] Furthermore, in order to more intuitively observe the desoldering area on the PCB and thus perform the desoldering operation, a side support is installed on one side of the stand, and a display screen is installed at the end of the side support. The display screen is connected to the microscope via a data cable.

[0007] Furthermore, in order to provide good lighting for the desoldering area on the PCB, an extension plate is installed on one side of the top of the stand, a fixed seat is installed on the extension plate, a flexible tube is installed on the fixed seat, and a lighting lamp is installed at the end of the flexible tube.

[0008] Furthermore, in order to properly place the desoldered LEDs on the heat sink, the heat sink is used to place the desoldered LEDs. The heat sink is a cuboid with a square bottom and a length of 3 to 5 cm. The top outer side of the heat sink is provided with a side plate, which is rectangular and has a height of 0.5 to 1 cm. It is made of heat-dissipating and anti-static material and has no top cover.

[0009] Furthermore, to better adapt the microscope to the heating gun and enable simultaneous observation of the PCB during desoldering, the microscope is equipped with multiple fixed magnifications. When adjusted to a fixed magnification, the microscope's exterior displays a number. The heating gun's tip is rectangular, designed according to the shape of the LED. The heating gun tip comes in various models, and its model number matches the microscope's number. The microscope's magnification is inversely proportional to the heating gun's size.

[0010] Furthermore, in order to effectively control the heating gun, a controller is also installed on the platform, which is connected to the heating gun via a data cable.

[0011] Furthermore, in order to enable stable assembly between the assembly frame and the platform, the platform is provided with insertion holes, and the end of the assembly frame is equipped with a plug rod, which is fixedly inserted into the insertion hole.

[0012] Furthermore, in order to enable the lifting assembly to be adjusted up and down outside the pole, the lifting assembly includes a lifting frame sleeved outside the pole, a locking button is installed on one side of the lifting frame, and an adjustment button is also installed on the side wall of the lifting frame.

[0013] Furthermore, in order to enable precise vertical adjustment between the lifting frame and the upright, a rack is provided on the outer wall of the upright along its length, and a gear that meshes with the rack is installed inside the lifting frame, and the gear is connected to the shaft end of the adjusting knob.

[0014] Furthermore, to enable the fixture assembly to stably clamp the PCB and adjust its horizontal position according to the area to be desoldered, the fixture assembly includes an outer frame. One bottom side of the outer frame is mounted on an extension frame. Slide grooves are formed on the top of opposite sides of the outer frame, and sliders are slidably installed in the slide grooves. A crossbar is fixedly installed between the tops of two opposite sliders. A fixture frame is also provided above the outer frame. A sliding sleeve is fixedly installed on the outer wall of the fixture frame and slidably sleeved outside the crossbar. A flexible rod is fixedly installed on the outer wall of the fixture frame, and a clamp is installed at the end of the flexible rod. The end of the clamp that contacts the sample is made of an anti-static material.

[0015] The beneficial effects of this utility model are that the microscope and heating gun can be individually adjusted in height, thereby changing the height between them and the fixture frame. Regardless of the PCB size, it can achieve good heating, desoldering, and magnified observation operations, ensuring smooth desoldering. Furthermore, the fixture frame can be adjusted horizontally relative to the outer frame, so that the desoldering area is directly facing the heating gun and microscope. The position of the PCB can be adjusted according to the desoldering area, which is simple and quick. A heat dissipation platform is also provided on the table to place the desoldered LED samples, reducing the risk of sample loss and foreign matter adhesion. Attached Figure Description

[0016] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0017] Figure 1 This is a schematic diagram of the optimal embodiment of a device for desoldering automotive-grade LEDs according to the present invention.

[0018] Figure 2 This is an assembly drawing of the lifting assembly and the upright in a device for desoldering automotive-grade LEDs according to this utility model.

[0019] Figure 3 This is a schematic diagram of the top structure of the platform in a device for desoldering automotive-grade LEDs according to this utility model.

[0020] Figure 4 This is a schematic diagram of the fixture assembly in a device for desoldering automotive-grade LEDs according to this utility model.

[0021] Figure 5 This is a schematic diagram of the outer frame structure of a device for desoldering automotive-grade LEDs according to this utility model.

[0022] Figure 6 This is a schematic diagram of the fixture frame in a device for desoldering automotive-grade LEDs according to this utility model.

[0023] In the diagram: 1. Platform; 2. Stand; 201. Socket;

[0024] 3. Assembly rack; 301. Insert rod;

[0025] 4. Upright pole; 401. Rack;

[0026] 5. Lifting assembly; 501. Lifting frame; 502. Locking button; 503. Adjusting button;

[0027] 6. Microscope; 7. Heating gun;

[0028] 8. Fixture assembly; 801. Outer frame; 802. Slide groove; 803. Slider; 804. Crossbar; 805. Fixture frame; 806. Sliding sleeve; 807. Flexible rod; 808. Clamp;

[0029] 9. Extension frame; 10. Side bracket; 11. Display screen; 12. Extension plate; 13. Fixture; 14. Flexible tube; 15. Lighting lamp; 16. Heat sink; 17. Controller. Detailed Implementation

[0030] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, illustrating only the basic structure of the present invention, and therefore only show the components relevant to the present invention.

[0031] like Figure 1The diagram shows the preferred embodiment of this utility model, an equipment for desoldering automotive-grade LEDs, including a platform 1. A frame 2 is fixedly installed on one side of the top of the platform 1, and the frame 2 is perpendicular to the platform 1. An assembly frame 3 is fixedly installed in the middle of the side of the frame 2 facing the upper area of ​​the platform 1. Vertically arranged uprights 4 are fixedly installed at both the upper and lower ends of the assembly frame 3. A lifting assembly 5 is installed on the outside of the uprights 4. A microscope 6 is fixedly installed on the outside of the upper lifting assembly 5, and a heating gun 7 is fixedly installed on the outside of the lower lifting assembly 5. An extension frame 9 is also fixedly installed on the outer side of the middle of the frame 2. The end of the extension frame 9 away from the frame 2 faces the upper part of the platform 1, and a clamp assembly 8 is installed at the end of the extension frame 9 away from the frame 2. The clamp assembly 8 is located between the microscope 6 and the heating gun 7.

[0032] The PCB to be desoldered is positioned using the clamp assembly 8. Then, the height of the microscope 6 is adjusted using the upper lifting assembly 5 so that the target LED is clearly within the maximum range of the microscope 6's line of sight. Then, the heating gun 7 is activated, and the distance between the nozzle of the heating gun 7 and the PCB can also be adjusted using the lower lifting assembly 5 to achieve the best heating effect. After the solder paste melts, the desoldered LED can be clamped off the PCB.

[0033] A side bracket 10 is fixedly installed on one side of the top of the stand 2. A display screen 11 is fixedly installed at the end of the side bracket 10 away from the stand 2. The display screen 11 is connected to the microscope 6 via a data cable. The data cable can transmit digital signals between the microscope 6 and the display screen 11, and display the appearance of the sample under the microscope 6 in real time, so that the operator can keep track of the sample status in real time and confirm whether it has been moved to the target LED position.

[0034] The microscope 6 has multiple fixed magnifications, and the number is displayed on the exterior when the fixed magnification is adjusted. The heating gun 7 blows hot air to heat the back of the sample. The tip of the heating gun 7 is generally rectangular according to the shape of the LED. There are various models of the tip. The model of the heating gun tip is consistent with the microscope number. The microscope magnification and the tip size are inversely proportional. If the microscope 6 has a high magnification and the sample is small, the required heating size is small, and the tip size is small, and vice versa.

[0035] An extension plate 12 is fixedly installed on the top of the stand 2, away from the side support 10. A mounting base 13 is fixedly installed on the side wall of the extension plate 12 facing the area above the stand 1. A flexible tube 14 is installed on the mounting base 13. A lighting lamp 15 is fixedly installed at the end of the flexible tube 14 away from the mounting base 13. The lighting lamp 15 is mainly used to provide ambient light for the target LED, which facilitates better operation and observation of the sample status and makes it easier for staff to operate.

[0036] A heat sink 16 is fixedly installed on one side of the top of the platform 1. The heat sink 16 is a cuboid with a square bottom and a length of 3 to 5 cm. A side plate is provided on the outer side of the top of the heat sink 16. The side plate is rectangular and has a height of 0.5 cm to 1 cm. It is made of heat dissipation and anti-static material and has no top cover. It is mainly used to place the target LED for heat dissipation and prevent the LED from being placed randomly in other areas, which may cause damage to the LED or foreign objects to stick to it.

[0037] A controller 17 is also fixedly installed on the top of the platform 1. The controller 17 is connected to the heating gun 7 via a data cable. The controller 17 can adjust the temperature and air speed of the heating gun 7 via the data cable to achieve different heating effects.

[0038] like Figure 2 and Figure 3 As shown, a socket 201 is provided in the middle of the stand 2. A plug rod 301 is fixedly installed at one end of the assembly frame 3 facing the stand 2, and the plug rod 301 is fixedly inserted into the socket 201. The assembly frame 3 is inserted into the socket 201 on the stand 2 via the plug rod 301, which facilitates disassembly and assembly.

[0039] The lifting assembly 5 includes a lifting frame 501, which is fitted onto the outside of the upright 4. A locking button 502 is installed on the side of the lifting frame 501 facing the platform 2. An adjusting button 503 is also installed on the side wall of the lifting frame 501. The locking button 502 can lock the position of the lifting frame 501, while the adjusting button 503 can adjust the height of the lifting frame 501. A rack 401 is provided on the outer wall of the upright 4 along its length. A gear that meshes with the rack 401 is installed inside the lifting frame 501, and the gear is connected to the shaft end of the adjusting button 503. By rotating the adjusting button 503, the gear can be used to roll along the length of the rack 401, thereby adjusting the height of the lifting frame 501. This connection structure is similar to the height adjustment mechanism of a microscope in the prior art and is therefore not described in detail here.

[0040] like Figures 4 to 6 As shown, the fixture assembly 8 includes an outer frame 801. The bottom of the outer frame 801 facing the platform 2 is fixedly mounted on the extension frame 9. The top of the opposite sides of the outer frame 801 are provided with parallel sliding grooves 802. Slider 803 is slidably installed in the sliding grooves 802. A crossbar 804 is fixedly installed between the tops of the two oppositely arranged sliders 803. A fixture frame 805 is also provided above the outer frame 801. A sliding sleeve 806 is fixedly installed on the outer wall of the fixture frame 805. The sliding sleeve 806 is slidably sleeved on the outside of the crossbar 804. A flexible rod 807 is fixedly installed on the outer wall of the fixture frame 805. A clamp 808 is fixedly installed at the end of the flexible rod 807 away from the fixture frame 805. The sample contact end of the clamp 808 is made of anti-static material.

[0041] By using clamps 808 to hold the external solderless area of ​​the PCB, the PCB can be fixed. The clamp frame 805 can be adjusted by moving the sliding sleeve 806 along the length of the horizontal bar 804. The horizontal bar 804 can be adjusted by moving the slider 803 along the length of the slide groove 802. Thus, the horizontal position of the clamp frame 805 can be adjusted in the XY direction, which can ensure the movement of the sample.

[0042] Working principle: Select a suitable edge point on the PCB that is far from the components. Use clamp 808 to clamp the PCB edge and adjust the PCB position so that the PCB is as parallel as possible to the microscope 6 and the heating gun 7. Adjust the position of the clamp frame 805 on the outer frame 801 so that the target LED is within the line of sight of the microscope 6. Adjust the magnification and height of the microscope 6 so that the target LED is clearly within the maximum range of the microscope 6's line of sight. This can be observed in real time through the display screen 11. Then, according to the microscope 6 magnification number, change the heating gun 7 nozzle model and adjust the height of the heating gun 7 so that the hot air can come into close contact with the back of the PCB without damaging the components on the back. Then, turn on the controller 17, adjust the temperature and air speed of the heating gun 7, and turn on the hot air gun. Observe the sample status through the display screen 11 and adjust the heating gun 7 effect in time. After the solder paste melts, clamp the target LED and place it on the heat sink 16. Turn off the heating gun 7 and wait for 3 to 5 minutes. The target LED is desoldered and ready for the next step of analysis.

[0043] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. An apparatus for desoldering automotive-grade LEDs, characterized in that: It includes a platform (1), a frame (2) mounted on the platform (1), an assembly frame (3) mounted on one side of the frame (2), uprights (4) mounted on the upper and lower ends of the assembly frame (3), a lifting assembly (5) mounted on the outside of the uprights (4), and a heat dissipation platform (16) mounted on the platform (1). A microscope (6) is mounted on the outside of the upper lifting assembly (5), and a heating gun (7) is mounted on the outside of the lower lifting assembly (5). An extension frame (9) is also installed on the frame (2). A clamp assembly (8) is installed at the end of the extension frame (9) above the platform (1), and the clamp assembly (8) is located between the microscope (6) and the heating gun (7).

2. The equipment for desoldering automotive-grade LEDs as described in claim 1, characterized in that: A side bracket (10) is installed on one side of the stand (2), and a display screen (11) is installed at the end of the side bracket (10). The display screen (11) is connected to the microscope (6) via a data cable.

3. The equipment for desoldering automotive-grade LEDs as described in claim 1, characterized in that: An extension plate (12) is installed on one side of the top of the platform (2). A fixed seat (13) is installed on the extension plate (12). A flexible tube (14) is installed on the fixed seat (13). A lighting lamp (15) is installed at the end of the flexible tube (14).

4. The equipment for desoldering automotive-grade LEDs as described in claim 1, characterized in that: The heat sink (16) is used to place the LEDs that have been desoldered. The heat sink (16) is a cuboid with a square bottom and a length of 3 to 5 cm. The top of the heat sink (16) is provided with a side plate, which is rectangular and has a height of 0.5 to 1 cm. It is made of heat dissipation and anti-static material and has no top cover.

5. The equipment for desoldering automotive-grade LEDs as described in claim 1, characterized in that: The microscope (6) is equipped with multiple fixed magnifications, and when adjusted to a fixed magnification, the microscope (6) has a number displayed on its appearance. The nozzle of the heating gun (7) is set to be rectangular according to the shape of the LED. The nozzle of the heating gun (7) has multiple models, and the model of the nozzle of the heating gun (7) is consistent with the number of the microscope (6). The magnification of the microscope (6) is inversely proportional to the size of the heating gun (7).

6. The equipment for desoldering automotive-grade LEDs as described in claim 1, characterized in that: A controller (17) is also installed on the platform (1), and the controller (17) is connected to the heating gun (7) via a data cable.

7. The equipment for desoldering automotive-grade LEDs as described in claim 1, characterized in that: The stand (2) has an insertion hole (201), and the end of the assembly frame (3) is equipped with a plug rod (301), which is fixedly inserted into the insertion hole (201).

8. The equipment for desoldering automotive-grade LEDs as described in claim 1, characterized in that: The lifting assembly (5) includes a lifting frame (501) sleeved on the outside of the upright (4). A locking button (502) is installed on the outside of one side of the lifting frame (501), and an adjusting button (503) is also installed on the side wall of the lifting frame (501).

9. The equipment for desoldering automotive-grade LEDs as described in claim 8, characterized in that: The outer wall of the upright (4) is provided with a rack (401) arranged along its length direction. The inside of the lifting frame (501) is equipped with a gear that meshes with the rack (401), and the gear is connected to the shaft end of the adjusting knob (503) for transmission.

10. The equipment for desoldering automotive-grade LEDs as described in claim 1, characterized in that: The clamp assembly (8) includes an outer frame (801), one bottom side of which is mounted on an extension frame (9). The top of opposite sides of the outer frame (801) are provided with sliding grooves (802), and sliders (803) are slidably installed in the sliding grooves (802). A crossbar (804) is fixedly installed between the tops of the two opposite sliders (803). A clamp frame (805) is also provided above the outer frame (801). A sliding sleeve (806) is fixedly installed on the outer wall of the clamp frame (805). The sliding sleeve (806) is slidably sleeved on the outside of the crossbar (804). A flexible rod (807) is fixedly installed on the outer wall of the clamp frame (805). A clamp (808) is installed at the end of the flexible rod (807).

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