Soldering aid for chip mass production

Abstract

The utility model belongs to chip welding technical field, concretely relates to the welding auxiliary tool for chip mass production. Including workstation, be equipped with frame on the workstation, be equipped with upper welding head on the frame and slide, be equipped with the chip tray that matches with upper welding head on the workstation, be equipped with cleaning subassembly on the chip tray, be equipped with first drive assembly and second drive assembly respectively on the frame and workstation, first drive assembly is used for driving upper welding head to move up and down, second drive assembly is used for driving chip tray to move left and right, still include controller, controller is connected with first drive assembly and second drive assembly electricity respectively. The scheme removes the filler metal residue on the surface of welding head through the setting cleaning mechanism, avoids the influence of the residue to the follow -up welding process, improves chip welding quality.

Description

Technical Field

[0001] This utility model belongs to the field of chip welding technology, specifically relating to welding auxiliary tools used in mass production of chips. Background Technology

[0002] With the rapid development of information technology, chips have become increasingly central to modern electronic devices. From the initial vacuum tubes to transistors, and then to large-scale integrated circuits, the integration level of chips has increased exponentially. Currently, although Moore's Law is gradually approaching its physical limits, chip manufacturers continue to pursue smaller chip sizes, higher integration levels, and more powerful functions. This requires chip packaging and soldering processes to keep pace with the times. In recent years, significant progress has been made in technologies across several related fields, providing solid technical support for the development of chip soldering equipment.

[0003] When existing welding equipment is in operation, it needs to weld multiple solder joints on the chip surface. Prolonged welding will cause the temperature of the welding head to rise continuously. At high temperatures, the interaction between the solder and the base metal will intensify. If welding continues at this time, the base metal may be excessively eroded. This will not only damage the structure of the base metal, but may also introduce impurities, affecting the quality of the weld joint. Furthermore, during the welding process, the solder may stick to the end of the welding head. The sticky solder may also introduce impurities or air, forming welding defects such as pores and slag inclusions, which will affect the quality of subsequent welding. Utility Model Content

[0004] This invention provides a welding auxiliary tool for mass production of chips, which can solve the problem of impurities adhering to the end of the welding head.

[0005] To achieve the above objectives, this solution provides a welding auxiliary tool for mass production of chips, including a worktable, a frame on the worktable, an upper welding head slidably mounted on the frame, a chip tray on the worktable that matches the upper welding head, and a cleaning component on the chip tray; The frame and the worktable are respectively equipped with a first drive assembly and a second drive assembly. The first drive assembly is used to drive the upper welding head to move up and down, and the second drive assembly is used to drive the chip tray to move left and right. It also includes a controller, which is electrically connected to the first drive component and the second drive component, respectively.

[0006] The principle of this solution is as follows: The chip to be soldered is placed on the chip tray, and then the controller moves the chip tray from the inlet to the soldering position. The controller then moves the upper soldering head downward so that the cleaning component cleans the upper soldering head. After cleaning, the upper soldering head solders the chip. During the soldering process, the chip tray moves accordingly towards the outlet so that the upper soldering head can solder the solder joints on the chip one by one. When the chip is soldered, the chip tray moves along the outlet with the chip.

[0007] The beneficial effects of this solution are: by setting up a cleaning mechanism to remove solder residue from the surface of the soldering head, this solution avoids the impact of residue on the subsequent soldering process and improves the quality of chip soldering.

[0008] Furthermore, a lower welding head electrically connected to the controller is slidably provided on the worktable.

[0009] Beneficial effect: The upper and lower welding heads can weld the chip simultaneously, resulting in higher efficiency.

[0010] Furthermore, the cleaning assembly includes an upper cleaning assembly and a lower cleaning assembly.

[0011] Beneficial effects: The upper cleaning component and the lower cleaning component clean the upper welding head and the lower welding head respectively.

[0012] Furthermore, the upper cleaning component is located at the upper end of the chip tray near the outlet, and the lower cleaning component is located at the lower end of the chip tray near the inlet.

[0013] Beneficial effects: Before chip soldering, the controller controls the second drive component to drive the chip tray to reciprocate and clean the upper soldering head, removing any impurities left from the previous soldering. After cleaning, the upper and lower soldering heads simultaneously solder the chip. After soldering, the controller controls the second drive component to drive the chip tray to reciprocate and clean the lower soldering head.

[0014] Furthermore, the chip tray is provided with a clamping assembly, which is electrically connected to the controller.

[0015] Beneficial effects: The clamping component holds and fixes the chip, making it easier for the chip to be soldered; after the chip is soldered, the clamping component is released, making it easier for the chip to proceed to the next process.

[0016] Furthermore, the cleaning component is a brush.

[0017] Beneficial effect: Cleaning is performed using a brush-material cleaning component, which will not cause wear to the upper and lower welded joints.

[0018] Furthermore, the brush includes a first brush and a second brush, with a gap between the first brush and the second brush for inserting an upper welding head or a lower welding head.

[0019] Beneficial effect: Inserting the upper and lower welding heads into the gap makes it easier for the first and second brushes to clean the upper and lower welding heads.

[0020] Furthermore, the workbench is equipped with a recycling tank, which is located below the upper welding head.

[0021] Beneficial effect: Facilitates the collection of impurities. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of an embodiment of the present utility model; Figure 2 This is a front view of the structure of an embodiment of the present utility model; Figure 3 This is a schematic diagram of the chip tray structure according to an embodiment of the present invention. Detailed Implementation

[0023] The following detailed description illustrates the specific implementation method: The markings in the accompanying drawings include: 1. Worktable; 2. Frame; 3. Upper welding head; 4. Chip tray; 5. Lower welding head; 6. First drive assembly; 7. Second drive assembly; 8. First brush; 9. Second brush; 11. Clamping assembly.

[0024] As attached Figure 1-3 As shown, A welding auxiliary tool for mass production of chips includes a worktable 1, a frame 2 on the worktable 1, an upper welding head 3 slidably mounted on the frame 2, and a lower welding head 5 slidably mounted on the worktable 1. Both the upper and lower welding heads 5 can move up and down.

[0025] The frame 2 and the worktable 1 are respectively equipped with a first drive assembly 6 and a second drive assembly 7. The first drive assembly 6 is used to drive the upper welding head 3 to move up and down, and the second drive assembly 7 is used to drive the chip tray 4 to move left and right. Both the first drive assembly 6 and the second drive assembly 7 are hydraulic cylinders, and the piston rods of the two hydraulic cylinders are fixedly connected to the upper welding head 3 and the lower welding head 5 respectively.

[0026] It also includes a controller, which is electrically connected to the first drive component 6 and the second drive component 7, respectively.

[0027] The workbench 1 is equipped with a chip tray 4 that matches the upper welding head 3. The chip tray 4 is equipped with a clamping assembly 11, which is electrically connected to the controller.

[0028] The clamping component 11 clamps and fixes the chip, making it easier for the chip to be soldered; after the chip is soldered, the clamping component 11 is released, making it easier for the chip to proceed to the next process.

[0029] The chip tray 4 is equipped with a cleaning assembly; the cleaning assembly includes an upper cleaning assembly and a lower cleaning assembly. The upper cleaning assembly and the lower cleaning assembly clean the upper welding head 3 and the lower welding head 5, respectively.

[0030] The upper cleaning component is located at the upper end of the chip tray 4 near the outlet, and the lower cleaning component is located at the lower end of the chip tray 4 near the inlet. Before chip soldering, the controller controls the second drive component 7 to drive the chip tray 4 to reciprocate and clean the upper soldering head 3, removing any impurities left from the previous soldering. After cleaning, the upper and lower soldering heads 5 simultaneously solder the chip. After soldering, the controller controls the second drive component 7 to drive the chip tray 4 to reciprocate and clean the lower soldering head 5.

[0031] The cleaning component is a brush. Cleaning is performed using a brush-material cleaning component, which will not cause wear to the upper and lower welded heads 5.

[0032] The brush includes a first brush 8 and a second brush 9, with a gap between the first brush 8 and the second brush 9 for inserting the upper welding head 3 or the lower welding head 5. Inserting the upper or lower welding head 5 into the gap facilitates the first brush 8 and the second brush 9 to clean the upper or lower welding head 5.

[0033] The workbench 1 is equipped with a recycling tank, which is located below the upper welding head 3. This facilitates the collection of impurities.

[0034] Specific operations: The chip to be soldered enters through the feed inlet and is placed on the chip tray 4. Then, the controller controls the second drive component 7 to move the chip tray 4 from the feed inlet to the soldering position. The controller then controls the upper soldering head 3 to move down and the lower soldering head 5 to move up. The cleaning component then cleans the upper soldering head 3. After cleaning, the upper and lower soldering heads 5 solder the chip. During the soldering process, the chip tray 4 moves accordingly towards the discharge port to facilitate the upper and lower soldering heads 5 to solder the solder joints on the chip in sequence. After the chip is soldered, the lower cleaning component cleans the lower soldering head 5, and the cleaned-up impurities fall into the recycling tank. After the soldering is completed, the chip tray 4 moves along the discharge port with the chip.

[0035] The above are merely embodiments of this utility model. This utility model is not limited to the field covered by this embodiment. Commonly known structures and characteristics in the solution are not described in detail here. Those skilled in the art are aware of all common technical knowledge in the field prior to the application date or priority date, are able to access all existing technologies in that field, and have the ability to apply conventional experimental methods prior to that date. Those skilled in the art can, under the guidance of this application, improve and implement this solution in combination with their own capabilities. Some typical known structures or methods should not be obstacles for those skilled in the art to implement this application. It should be noted that those skilled in the art can make several modifications and improvements without departing from the structure of this utility model. These should also be considered within the scope of protection of this utility model, and will not affect the effectiveness of the implementation of this utility model or the practicality of the patent. The scope of protection claimed in this application should be determined by the content of its claims. The specific embodiments described in the specification can be used to interpret the content of the claims.

Claims

1. A welding auxiliary tool for mass production of chips, comprising a worktable (1), a frame (2) provided on the worktable (1), an upper welding head (3) slidably provided on the frame (2), and a chip tray (4) matching the upper welding head (3) provided on the worktable (1), characterized in that, The chip tray (4) is equipped with a cleaning component; the frame (2) and the worktable (1) are respectively equipped with a first drive component (6) and a second drive component (7), the first drive component (6) is used to drive the upper welding head (3) to move up and down, and the second drive component (7) is used to drive the chip tray (4) to move left and right. It also includes a controller, which is electrically connected to the first drive component (6) and the second drive component (7), respectively.

2. The welding auxiliary tool for mass production of chips according to claim 1, characterized in that: The workbench (1) is slidably provided with a lower welding head (5) that is electrically connected to the controller.

3. The welding auxiliary tool for mass production of chips according to claim 1, characterized in that: The cleaning assembly includes an upper cleaning assembly and a lower cleaning assembly.

4. The welding auxiliary tool for mass production of chips according to claim 3, characterized in that: The upper cleaning component is located at the upper end of the chip tray (4) near the outlet, and the lower cleaning component is located at the lower end of the chip tray (4) near the inlet.

5. The welding auxiliary tool for mass production of chips according to claim 1, characterized in that: The chip tray (4) is provided with a clamping assembly (11), which is electrically connected to the controller.

6. The welding auxiliary tool for mass production of chips according to claim 1, characterized in that: The cleaning component is a brush.

7. The welding auxiliary tool for mass production of chips according to claim 6, characterized in that: The brush includes a first brush (8) and a second brush (9), with a gap between the first brush (8) and the second brush (9) for inserting an upper welding head (3) or a lower welding head (5).

8. The welding auxiliary tool for mass production of chips according to claim 1, characterized in that: The workbench (1) is provided with a recycling tank, which is located below the upper welding head (3).

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