A soldering rapid cooling structure for a circuit board processing

Abstract

The utility model discloses a kind of soldering tin rapid cooling structures for circuit board processing, it is related to circuit board processing field, the utility model includes cooling box, two shunt pipes are installed in the inside of cooling box, and shunt pipe is installed with the gas pipe extending to the inside of cooling box, multiple air jets are installed on gas pipe, the two sides of cooling box are all set with material mouth, the two sides of the top of cooling box are all set with through mouth, and through mouth is connected with material mouth.The utility model is provided with baffle, threaded column, lifting plate, threaded sleeve, pull rod, scale, slip ring and annular groove, staff can be according to the thickness of circuit board to be cooled, by rotating threaded sleeve, lifting plate is driven along threaded column to lift, baffle height is adjusted to appropriate position (such as circuit board thickness 1.6mm, baffle height is adjusted to 1.8mm) in combination with scale, ensure that material mouth gap is minimum, reduce material mouth cold air leakage by adjustable baffle, to improve the cooling efficiency to circuit board.

Description

Technical Field

[0001] This utility model relates to the field of circuit board processing, specifically to a rapid cooling structure for solder in circuit board processing. Background Technology

[0002] Circuit boards are important electronic components that support electronic elements and serve as the carrier for electrical connections between electronic components. Rapid cooling equipment for soldering circuit boards is a key auxiliary device in modern electronic assembly soldering processes (such as wave soldering and selective wave soldering). It is an active temperature control system located at the outlet of the soldering unit. After soldering, the circuit board is conveyed by a conveyor belt to the cooling device for cooling. Therefore, the core function of this equipment is to force and rapidly cool the solder joints that have just been soldered and are still in a molten state, so that they can quickly solidify and take shape.

[0003] Existing rapid cooling structures for soldering in circuit board processing often have fixed-size feed inlets that cannot accommodate circuit boards of varying thicknesses, resulting in significant gaps between the feed inlet and the circuit board. While some devices may install flexible curtains at the feed inlet to provide some shielding, these curtains rely on passive adhesion of flexible materials (such as ordinary rubber or PVC), easily creating irregular gaps (especially when the circuit board edges are uneven). Furthermore, the elasticity of the curtains diminishes over time, further widening the gaps and leading to substantial air leakage. This results in unstable internal temperatures, slower cooling of the circuit board after soldering, and negatively impacts solder joint solidification quality (e.g., coarse grains, cold solder joints). Additionally, the flexible curtains have a very narrow range of adaptability to circuit board thickness. If the circuit board is too thin, the curtains cannot fit tightly, resulting in even larger gaps; if the circuit board is too thick, the curtains may be overstretched or even torn, potentially causing the circuit board to become stuck at the feed inlet due to excessive resistance, damaging components and ultimately reducing the cooling effect on the circuit board. Utility Model Content

[0004] Therefore, the purpose of this utility model is to provide a rapid cooling structure for solder in circuit board processing, so as to solve the technical problem that the cold air inside the device will leak in large quantities through the feed port, thus affecting the cooling efficiency of the circuit board.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a rapid cooling structure for solder in circuit board processing, comprising a cooling box, wherein two diversion pipes are installed inside the cooling box, and an air supply pipe extending into the cooling box is installed inside the diversion pipe, and multiple air nozzles are installed on the air supply pipe; material inlets are opened on both sides of the cooling box, and through openings are opened on both sides of the top of the cooling box, and the through openings are connected to the material inlets; a threaded column is fixed on the top of the cooling box, and a lifting plate and a threaded sleeve are respectively fitted on the outer wall of the threaded column; an annular groove is opened at the bottom of the lifting plate, and a slip ring is provided inside the annular groove; the bottom of the slip ring is fixedly connected to the top of the threaded sleeve; and pull rods extending into the through openings are fixed on both sides of the bottom of the lifting plate, and baffles are installed at the bottom ends of the pull rods.

[0006] By adopting the above technical solution, the distribution pipe receives cold air from the external cold source and distributes it to each air supply pipe. The air supply pipe guides the cold air into the cooling box, and the cold air is then sprayed out through the air nozzle, directly acting on the upper and lower surfaces of the circuit board to achieve forced rapid cooling.

[0007] Furthermore, a scale is installed on the top of the cooling box. The scale is made of stainless steel, and the back of the lifting plate is in contact with the surface of the scale.

[0008] By adopting the above technical solution, the scale is attached to the back of the lifting plate, which can intuitively display the lifting height of the lifting plate, thereby accurately controlling the adjustment range of the baffle, avoiding excessive or insufficient adjustment of the baffle height, and ensuring the sealing effect of the material port and the smooth passage of the circuit board (for example, for a circuit board with a thickness of 1.6mm, the baffle height can be accurately adjusted to 1.8-2.0mm by using the scale).

[0009] Furthermore, a mesh belt conveyor is installed inside the cooling box, with material inlets on both sides of the mesh belt conveyor, and the conveyor belt of the mesh belt conveyor is a stainless steel mesh belt.

[0010] By adopting the above technical solution, the mesh belt conveyor, as the conveying carrier of the circuit board, has good air permeability due to its mesh structure, allowing cold air to penetrate the mesh belt and act on the lower surface of the circuit board, thus avoiding uneven cooling on the back of the circuit board due to being blocked by the conveyor belt.

[0011] Furthermore, the outer surface and back of the baffle are both in contact with the inner wall of the feed inlet, and the baffle is made of polycarbonate sheet or PEEK sheet.

[0012] By adopting the above technical solution, the baffle can block most of the material inlet area, slowing down the rate at which cold air leaks from the material inlet.

[0013] Furthermore, an observation window is installed on the outer surface of the cooling box, and the observation window is made of quartz glass.

[0014] By adopting the above technical solution, the observation window can be used to observe the conveying status and cooling of the circuit board inside the cooling box, making it easier to detect abnormal problems such as jamming and uneven cooling in a timely manner.

[0015] Furthermore, a temperature sensor is installed on the upper part of the interior of the cooling box.

[0016] By adopting the above technical solution, the temperature sensor monitors the temperature of the cold air inside the box in real time, providing data support for subsequent temperature control adjustment (for example, when the temperature is higher than the set value, the power of the air cooler can be adjusted through the control panel to ensure stable cooling effect), avoiding inconsistent cooling quality of solder joints due to fluctuations in cold air temperature.

[0017] Furthermore, the outer wall of the baffle is provided with anti-slip strips, and the outer wall of the anti-slip strips is in contact with the inner wall of the inlet and the feed port, and the anti-slip strips are made of silicone rubber material.

[0018] By adopting the above technical solution, the silicone rubber anti-slip strip adheres to the outer wall of the baffle and the inner wall of the opening and material inlet, which can improve the stability of the baffle and prevent the baffle from shifting due to vibration when it is raised or lowered.

[0019] Furthermore, the back of the diverter is connected to an air inlet pipe, and an air volume regulating valve is installed on the air inlet pipe. The air inlet end of the air inlet pipe is connected to the air outlet end of an external compression industrial air cooler via a flange.

[0020] By adopting the above technical solution, the air intake pipe is connected to an external compression industrial air cooler through a flange to ensure a stable input of cold air; the air volume regulating valve can adjust the cold air input according to the cooling requirements of the circuit board (such as thicker boards requiring a larger air volume), avoiding excessive air volume causing the circuit board to shake, or insufficient air volume causing insufficient cooling efficiency.

[0021] Furthermore, guide rods are fixed on both sides of the top of the cooling box, and the guide rods pass through the lifting plate.

[0022] By adopting the above technical solution, the guide rod passes through the lifting plate, restricting the movement direction of the lifting plate and preventing it from rotating around the threaded column during the lifting process, thus ensuring that the baffle is always aligned with the material opening.

[0023] Furthermore, a control panel is installed on the upper surface of the cooling box, and the control panel is electrically connected to the mesh belt conveyor, temperature sensor, air volume regulating valve and external compression industrial air cooler.

[0024] By adopting the above technical solution, it is convenient to start or stop the mesh belt conveyor, temperature sensor, air volume regulating valve and external compression industrial air cooler through the control panel.

[0025] In summary, the present invention has the following main advantages: 1. This utility model is equipped with a baffle, a threaded column, a lifting plate, a threaded sleeve, a pull rod, a scale, a slip ring, and an annular groove. According to the thickness of the circuit board to be cooled, the operator can rotate the threaded sleeve to drive the lifting plate to rise and fall along the threaded column. Combined with the scale, the height of the baffle is adjusted to a suitable position (e.g., if the circuit board thickness is 1.6mm, the baffle height is adjusted to 1.8mm). This ensures that the gap between the material inlet and the material outlet is minimized, improves the shielding effect on the material outlet, and reduces the leakage of cold air from the material outlet by the adjustable baffle, thereby improving the cooling efficiency of the circuit board. 2. This utility model is equipped with a slip ring and an annular groove. When the threaded sleeve rotates, it can drive the slip ring to slide inside the annular groove, so that when the threaded sleeve rotates and rises and falls, it can drive the lifting plate to rise and fall simultaneously, so that the position of the lifting plate can be quickly adjusted. By setting a guide rod, the lifting plate can be guided to prevent the lifting plate from rotating, thereby improving the stability of the lifting plate when it rises and falls. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the present invention; Figure 2 This is a schematic diagram of the overall back structure of this utility model; Figure 3 This is a schematic diagram of the overall orthographic structure of this utility model; Figure 4 This is a schematic diagram of the overall side structure of this utility model; Figure 5 This is a schematic diagram of the baffle structure of this utility model; Figure 6 This is a bottom view of the lifting plate structure of this utility model; Figure 7 For the present utility model Figure 3 A magnified structural diagram of point A in the middle.

[0027] In the diagram: 1. Cooling box; 2. Feed inlet; 3. Mesh belt conveyor; 4. Temperature sensor; 5. Diverter pipe; 6. Air supply pipe; 7. Air nozzle; 8. Air inlet pipe; 9. Observation window; 10. Control panel; 11. Through port; 12. Baffle; 13. Tie rod; 14. Lifting plate; 15. Threaded column; 16. Annular groove; 17. Slip ring; 18. Threaded sleeve; 19. Scale; 20. Anti-slip strip; 21. Guide rod; 22. Air volume regulating valve. Detailed Implementation

[0028] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0029] The embodiments of this utility model will be described below based on its overall structure.

[0030] Example 1: A rapid cooling structure for solder in circuit board processing, such as Figures 1-7 As shown, the device includes a cooling box 1. Inside the cooling box 1, two distribution pipes 5 are installed, and air supply pipes 6 extending into the cooling box 1 are installed inside the distribution pipes 5. Multiple air nozzles 7 are installed on the air supply pipes 6, which are inclined. The distribution pipes 5 receive cold air from an external cold source and distribute it to each air supply pipe 6. The air supply pipes 6 guide the cold air into the cooling box 1, and the cold air is then sprayed out through the air nozzles 7, directly acting on the upper and lower surfaces of the circuit board to achieve forced rapid cooling. Both sides of the cooling box 1 have a material inlet 2, and both sides of the top of the cooling box 1 have a through-hole 11, which is connected to the material inlet 2. The top of the cooling box 1 is fixed with a threaded post 15, and the outer wall of the threaded post 15 is fitted with a lifting plate 14 and a threaded sleeve 18, respectively. The threaded sleeve 18 is threadedly connected to the threaded post 15, and the outer wall of the threaded sleeve 18 is provided with anti-slip texture to facilitate the rotation of the threaded sleeve 18. The lifting plate 14 is slidably connected to the threaded post 15.

[0031] See Figures 1-7 The bottom of the lifting plate 14 is provided with an annular groove 16, and a slip ring 17 is provided inside the annular groove 16. The bottom of the slip ring 17 is fixedly connected to the top of the threaded sleeve 18, and the slip ring 17 is slidably connected to the annular groove 16. Both sides of the bottom of the lifting plate 14 are fixed with pull rods 13 extending into the opening 11, and a baffle 12 is installed at the bottom end of the pull rod 13. The outer surface and back of the baffle 12 are in contact with the inner wall of the material opening 2. The baffle 12 is made of polycarbonate sheet or PEEK sheet. The baffle 12 can cover most of the area of ​​the material opening 2 and slow down the speed of cold air leakage from the material opening 2. The outer wall of the baffle 12 is provided with anti-slip strips 20, and the outer wall of the anti-slip strips 20 is in contact with the inner wall of the opening 11 and the material opening 2. The anti-slip strips 20 are made of silicone rubber material. The silicone rubber anti-slip strips 20 are in contact with the outer wall of the baffle 12 and the inner wall of the opening 11 and the material opening 2, which can improve the stability of the baffle 12 and prevent the baffle 12 from shifting due to vibration when it is raised and lowered.

[0032] See Figures 1-5 The cooling box 1 is equipped with a mesh belt conveyor 3. The mesh belt conveyor 3 has material inlets 2 on both sides. The conveyor belt of the mesh belt conveyor 3 is a stainless steel mesh belt. The mesh belt conveyor 3 serves as the conveying carrier for the circuit board. Its mesh structure has good air permeability, allowing cold air to penetrate the mesh belt and act on the lower surface of the circuit board. This avoids uneven cooling on the back of the circuit board due to the conveyor belt blocking the cooling. A temperature sensor 4 is installed at the top inside the cooling box 1. The temperature sensor 4 monitors the temperature of the cold air inside the box in real time, providing data support for subsequent temperature control adjustment (e.g., when the temperature is higher than the set value, the power of the cold air fan can be adjusted through the control panel 10 to ensure stable cooling effect). This avoids inconsistent cooling quality of the solder joints due to fluctuations in the cold air temperature.

[0033] See Figures 1-6 The back of the diversion pipe 5 is connected to the air inlet pipe 8, and the air inlet pipe 8 is equipped with an air volume regulating valve 22. The air inlet end of the air inlet pipe 8 is connected to the air outlet end of the external compression industrial air cooler through a flange. The connection between the air inlet pipe 8 and the external compression industrial air cooler through the flange ensures stable cold air input. The air volume regulating valve 22 can adjust the cold air input according to the cooling requirements of the circuit board (such as thicker boards requiring a larger air volume), avoiding excessive air volume causing the circuit board to shake, or insufficient air volume causing insufficient cooling efficiency. A control panel 10 is installed on the upper surface of the cooling box 1, and the control panel 10 is electrically connected to the mesh belt conveyor 3, the temperature sensor 4, the air volume regulating valve 22, and the external compression industrial air cooler, respectively, so as to facilitate the start or stop of the mesh belt conveyor 3, the temperature sensor 4, the air volume regulating valve 22, and the external compression industrial air cooler through the control panel 10.

[0034] Example 2: Based on the above embodiment 1, the following structure will be set up to facilitate observation of the lifting height of the lifting plate 14.

[0035] Specifically, a scale 19 is installed on the top of the cooling box 1. The scale 19 is a stainless steel scale. The back of the lifting plate 14 is in contact with the surface of the scale 19. The scale 19 and the back of the lifting plate 14 are in contact, which can intuitively display the lifting height of the lifting plate 14, thereby accurately controlling the adjustment range of the baffle 12, avoiding excessive or insufficient adjustment of the height of the baffle 12, and ensuring the sealing effect of the material port 2 and the smooth passage of the circuit board (for example, for a circuit board with a thickness of 1.6mm, the height of the baffle can be accurately adjusted to 1.8-2.0mm by using the scale).

[0036] Example 3: Based on the above embodiment 1, the following structure will be set up to facilitate observation of the internal condition of the cooling box 1.

[0037] Specifically, an observation window 9 is installed on the outer surface of the cooling box 1, and the observation window 9 is made of quartz glass. The observation window 9 can observe the conveying status and cooling status of the circuit board inside the cooling box 1, so as to promptly detect abnormal problems such as jamming and uneven cooling.

[0038] Example 4: Based on the above embodiment 1, in order to improve the stability of the lifting plate 14 when it moves, it is necessary to guide the lifting plate 14, so the following structure will be set.

[0039] Specifically, guide rods 21 are fixed on both sides of the top of the cooling box 1. The guide rods 21 pass through the lifting plate 14 and restrict the movement direction of the lifting plate 14 to prevent it from rotating around the threaded column 15 during the lifting process, so as to ensure that the baffle 12 is always aligned with the feed port 2.

[0040] The working principle of this utility model is as follows: First, before use, the operator can turn on the power supply. According to the thickness of the circuit board to be cooled, the operator can rotate the threaded sleeve 18 to drive the lifting plate 14 to rise and fall along the threaded post 15 and the guide rod 21. Combined with the scale 19, the height of the baffle 12 is adjusted to a suitable position (e.g., if the circuit board thickness is 1.6mm, the baffle height is adjusted to 1.8mm) to ensure that the gap between the material inlets is minimized and to slow down the rate at which cold air leaks from the material inlet 2. The speed of the mesh belt conveyor (e.g., 1-2m / min) and the target temperature inside the cooling box are set through the control panel. When the external compression industrial air cooler is started, cold air enters the distribution pipe 5 through the air inlet pipe 8. The air volume regulating valve 22 adjusts the cold air input according to the set parameters. The distribution pipe 5 distributes the cold air to the air delivery pipe 6 inside the cooling box 1. The cold air is then sprayed out through multiple air nozzles 7. The soldered circuit board is transported by the mesh belt conveyor 3 and enters the cooling box 1 from the material port 2 on one side of the cooling box 1. During the transport process, the cold air sprayed from the air nozzles 7 directly acts on the upper and lower surfaces of the circuit board, quickly removing heat. At the same time, the air permeability of the mesh belt ensures that the back of the circuit board is fully cooled. The temperature sensor 4 monitors the temperature inside the cooling box 1 in real time. If the temperature is higher than the set value, the control panel 10 automatically increases the power of the air cooler or opens the air volume regulating valve 22. Conversely, it decreases the power when the temperature is lower, ensuring temperature stability. After cooling, the circuit board is output from the other side of the feed port 2 via the mesh belt conveyor 3 and enters the next process. The operator can check the conveying and cooling status of the circuit board through the observation window 9. If problems such as jamming or uneven cooling are found, the emergency stop device on the control panel 10 can be used to troubleshoot and handle the problem.

[0041] Although embodiments of the present invention have been shown and described, these specific embodiments are merely explanations of the present invention and are not intended to limit the invention. The specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions, and variations to the embodiments as needed without departing from the principles and spirit of the present invention, provided that such modifications, substitutions, and variations are within the scope of the claims of the present invention and are protected by patent law.

Claims

1. A rapid cooling structure for solder in circuit board processing, comprising a cooling box (1), characterized in that: The cooling box (1) is equipped with two branch pipes (5), and an air supply pipe (6) extending into the cooling box (1) is installed inside the branch pipes (5). Multiple air nozzles (7) are installed on the air supply pipes (6). Material inlets (2) are opened on both sides of the cooling box (1). Through-holes (11) are opened on both sides of the top of the cooling box (1), and the through-holes (11) are connected to the material inlets (2). A threaded post (15) is fixed to the top of the cooling box (1). The outer wall of the threaded column (15) is fitted with a lifting plate (14) and a threaded sleeve (18). The bottom of the lifting plate (14) is provided with an annular groove (16), and a slip ring (17) is provided inside the annular groove (16). The bottom of the slip ring (17) is fixedly connected to the top of the threaded sleeve (18). Both sides of the bottom of the lifting plate (14) are fixed with pull rods (13) extending into the opening (11), and a baffle (12) is installed at the bottom end of the pull rod (13).

2. The rapid cooling structure for solder in circuit board processing according to claim 1, characterized in that: A scale (19) is also installed on the top of the cooling box (1). The scale (19) is a stainless steel scale, and the back of the lifting plate (14) is in contact with the surface of the scale (19).

3. The rapid cooling structure for solder in circuit board processing according to claim 1, characterized in that: The cooling box (1) is equipped with a mesh belt conveyor (3), and the mesh belt conveyor (3) has material inlets (2) on both sides. The conveyor belt of the mesh belt conveyor (3) is a stainless steel mesh belt.

4. The rapid cooling structure for solder in circuit board processing according to claim 1, characterized in that: The outer surface and back of the baffle (12) are both attached to the inner wall of the feed inlet (2), and the baffle (12) is made of polycarbonate sheet or PEEK sheet.

5. The rapid cooling structure for solder in circuit board processing according to claim 1, characterized in that: The outer surface of the cooling box (1) is equipped with an observation window (9), and the observation window (9) is made of quartz glass.

6. The rapid cooling structure for solder in circuit board processing according to claim 1, characterized in that: A temperature sensor (4) is installed on the upper part of the interior of the cooling box (1).

7. The rapid cooling structure for solder in circuit board processing according to claim 1, characterized in that: The outer wall of the baffle (12) is provided with anti-slip strips (20), and the outer wall of the anti-slip strips (20) is in contact with the inner wall of the opening (11) and the feed opening (2), and the anti-slip strips (20) are made of silicone rubber material.

8. The rapid cooling structure for solder in circuit board processing according to claim 1, characterized in that: The back of the diverter pipe (5) is connected to the air inlet pipe (8), and the air inlet pipe (8) is equipped with an air volume regulating valve (22). The air inlet end of the air inlet pipe (8) is connected to the air outlet end of an external compression industrial air cooler through a flange.

9. The rapid cooling structure for solder in circuit board processing according to claim 1, characterized in that: Guide rods (21) are fixed on both sides of the top of the cooling box (1), and the guide rods (21) pass through the lifting plate (14).

10. The rapid cooling structure for solder in circuit board processing according to claim 1, characterized in that: A control panel (10) is installed on the upper surface of the cooling box (1), and the control panel (10) is electrically connected to the mesh belt conveyor (3), temperature sensor (4), air volume regulating valve (22) and external compression industrial air cooler respectively.

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