Wafer carrier device

Abstract

The utility model relates to wafer processing technical field and disclose a kind of wafer bearing device, including processing platform, the upper surface of processing platform is fixedly installed with fixed block, the upper end outer wall of fixed block is fixedly installed with polishing structure, the inside of processing platform is fixedly installed with second liquid storage cavity, the upper end of second liquid storage cavity is fixedly installed with reinforcing block. In the utility model, by setting the cooling liquid groove of vortex structure, gear and tooth block meshing connection in cooperation driving assembly drive bearing platform rotation, make cooling liquid under the action of centrifugal force along helical flow channel initiative cover wafer body entire back, dynamic flow pattern significantly enhances heat exchange efficiency, avoid local overheating caused wafer deformation or polishing rate fluctuation, simultaneously, under the action of centrifugal force, further accelerate cooling liquid renewal by the mechanism that cooling liquid is thrown out outward through through groove, ensure temperature control uniformity, provide stable thermal environment for high-precision polishing.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, and in particular to a wafer carrier device. Background Technology

[0002] During the chemical mechanical polishing (CMP) process, the friction between the high-speed rotating polishing pad and the wafer surface generates a large amount of heat, causing the wafer temperature to rise sharply.

[0003] By integrating a cooling system within the wafer carrier device to cool the wafer during processing, traditional cooling methods typically employ a multi-zone flow channel design. This makes it difficult to maintain uniform and continuous coolant flow across the channels, resulting in dead zones within some channels. Consequently, heat dissipation in certain areas of the backplane becomes ineffective, leading to wafer warping or material deformation due to localized thermal stress. Furthermore, existing wafer carriers often employ a fixed design, resulting in poor coolant flow and low heat exchange efficiency. Therefore, we propose a wafer carrier device. Utility Model Content

[0004] The present invention aims to solve the technical problems existing in the prior art and provide a wafer carrier device.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a wafer carrier device, comprising a processing table, a fixing block fixedly installed on the upper surface of the processing table, a polishing structure fixedly installed on the upper outer wall of the fixing block, a second liquid storage chamber fixedly installed inside the processing table, a reinforcing block fixedly installed on the upper end of the second liquid storage chamber, a first liquid storage chamber rotatably installed on the upper surface of the reinforcing block, a carrier platform fixedly installed on the upper end of the first liquid storage chamber, a baffle fixedly installed on the upper surface of the carrier platform, a coolant tank opened inside the baffle on the upper surface of the carrier platform, and a wafer body placed inside the baffle, an inlet hole penetrating one end of the coolant tank, and multiple through slots penetrating the other end, a material collection tank fixedly installed on the outer side of the carrier platform on the upper surface of the processing table, and a drive assembly for driving the carrier platform to rotate is also provided below the carrier platform.

[0006] Preferably, a collection box is fixedly installed inside the processing table below the collection trough. The collection box is hollow inside, and a connecting pipe is fixedly connected between the lower end of the collection trough and the collection box.

[0007] Preferably, the drive assembly includes a servo motor fixedly mounted on the upper surface of the collection box, a gear fixedly mounted on the output end of the servo motor, and a plurality of toothed blocks meshing with the gear fixedly mounted on the lower outer wall of the first liquid storage chamber.

[0008] Preferably, a pump body is installed inside the second liquid storage chamber, and a suction pipe is fixedly connected to the output end of the pump body. The suction pipe passes through the interior of the reinforcing block and extends to the upper end of the reinforcing block, and the upper end of the suction pipe is rotatably connected to the center position of the bottom surface of the first liquid storage chamber.

[0009] Preferably, the bottom surface of the material collection trough is fixedly equipped with multiple support legs, and the other end of the support legs is fixedly connected to the processing table.

[0010] Preferably, the coolant tank has a vortex structure, and the number of through slots at the end of the coolant tank is not less than three.

[0011] Preferably, the lower end of the material collection trough is recessed downwards, and the upper end of the material collection trough is at least ten centimeters higher than the upper surface of the wafer body. Beneficial effects

[0012] This invention provides a wafer carrier device. It has the following advantages: (1) The wafer carrier device, by setting a vortex structure coolant tank, and cooperating with the gear and tooth block in the drive component to drive the carrier platform to rotate, so that the coolant actively covers the entire back side of the wafer body along the spiral flow channel under the action of centrifugal force. The dynamic flow mode significantly enhances the heat exchange efficiency and avoids wafer deformation or polishing rate fluctuation caused by local overheating. At the same time, under the action of centrifugal force, the mechanism of throwing the coolant outward through the channel further accelerates the coolant renewal, ensures temperature control uniformity, and provides a stable thermal environment for high-precision polishing. Attached Figure Description

[0013] To more clearly illustrate the embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description are merely exemplary, and those skilled in the art can derive other embodiments based on the provided drawings without creative effort.

[0014] The structures, proportions, sizes, etc. illustrated in this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the implementation conditions of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and objectives that this utility model can produce, should still fall within the scope of the technical content disclosed in this utility model.

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic cross-sectional view of the overall structure of this utility model; Figure 3 This is a schematic cross-sectional view of the connecting pipe structure of this utility model; Figure 4 This is a top view of the coolant tank of this utility model; Figure 5 This is a schematic diagram showing the disassembled structure of the wafer body and the support platform of this utility model; Figure 6 This utility model Figure 2 Enlarged structural diagram at point A in the middle.

[0016] Legend: 1. Processing table; 2. Fixing block; 3. Polishing structure; 4. Collection tank; 5. Support platform; 6. Edge guard; 7. Wafer body; 8. First liquid storage chamber; 9. Tooth block; 10. Gear; 11. Servo motor; 12. Connecting pipe; 13. Collection box; 14. Pump body; 15. Suction pipe; 16. Second liquid storage chamber; 17. Coolant tank; 18. Through groove; 19. Reinforcing block; 20. Liquid inlet hole; 21. Support leg. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] like Figure 1-6 As shown, a wafer carrier device includes a processing table 1, a fixing block 2 fixedly installed on the upper surface of the processing table 1, a polishing structure 3 fixedly installed on the upper outer wall of the fixing block 2, a second liquid storage chamber 16 fixedly installed inside the processing table 1, a reinforcing block 19 fixedly installed on the upper end of the second liquid storage chamber 16, a first liquid storage chamber 8 rotatably installed on the upper surface of the reinforcing block 19, a carrier platform 5 fixedly installed on the upper end of the first liquid storage chamber 8, a baffle 6 fixedly installed on the upper surface of the carrier platform 5, a coolant tank 17 opened inside the baffle 6 on the upper surface of the carrier platform 5, and a wafer body 7 placed inside the baffle 6, an inlet hole 20 penetrating one end of the coolant tank 17, and multiple through slots 18 penetrating the other end, a material collection tank 4 fixedly installed on the outer side of the carrier platform 5 on the upper surface of the processing table 1, and a drive assembly for driving the carrier platform 5 to rotate is also provided below the carrier platform 5; The upper surface of the wafer body 7 is polished by the polishing structure 3. When the polishing pad in the polishing structure 3 polishes the upper surface of the wafer body 7, polishing slurry can also be continuously sprayed onto the polishing position. This is existing technology and will not be described in detail here. For details, please refer to Huahai Qingke Universal-H300. At the same time, the back side of the wafer body 7 can be cooled by the flow of coolant in the coolant tank 17, thereby controlling the temperature of the wafer body 7. With the rotation of the support stage 5, the coolant flowing in the coolant tank 17 can be thrown out through the channel 18 and collected in the inside of the collection tank 4.

[0019] like Figure 2 As shown, a collection box 13 is fixedly installed inside the processing table 1 below the collection tank 4. The inside of the collection box 13 is hollow. A connecting pipe 12 is fixedly connected between the lower end of the collection tank 4 and the collection box 13. The coolant collected inside the collection tank 4 can enter the inside of the collection box 13 through the connecting pipe 12. After the coolant is collected inside the collection box 13, it can be reused after being processed again by existing technology.

[0020] like Figure 2 As shown, the driving assembly includes a servo motor 11 fixedly mounted on the upper surface of the collection box 13, a gear 10 fixedly mounted on the output end of the servo motor 11, and a plurality of toothed blocks 9 fixedly mounted on the lower outer wall of the first liquid storage chamber 8, which mesh with the gear 10. The servo motor 11 drives the gear 10 to rotate clockwise, and the meshing action between the gear 10 and the plurality of toothed blocks 9 causes the first liquid storage chamber 8 to rotate counterclockwise, thereby causing the support platform 5 fixedly connected to the upper end of the first liquid storage chamber 8 to rotate counterclockwise.

[0021] like Figure 2 As shown, a pump body 14 is installed inside the second liquid storage chamber 16. A suction pipe 15 is fixedly connected to the output end of the pump body 14. The suction pipe 15 passes through the interior of the reinforcing block 19 and extends to the upper end of the reinforcing block 19. The upper end of the suction pipe 15 is rotatably connected to the center of the bottom surface of the first liquid storage chamber 8. The second liquid storage chamber 16 stores coolant. The pump body 14 provides power to draw the coolant into the suction pipe 15, so that the coolant is injected into the interior of the first liquid storage chamber 8.

[0022] like Figure 5 As shown, multiple support legs 21 are fixedly installed on the bottom surface of the material collection trough 4, and the other end of the support legs 21 is fixedly connected to the processing table 1; the material collection trough 4 is supported and fixed by the multiple support legs 21.

[0023] like Figure 5As shown, the coolant tank 17 has a vortex structure, and the number of through slots 18 located at the end of the coolant tank 17 is not less than three. The vortex structure of the coolant tank 17 allows the coolant to flow inside it, ensuring the cooling effect on the back side of the wafer body 7. When the support platform 5 rotates counterclockwise, the coolant can be thrown outward from the multiple through slots 18 under the action of centrifugal force.

[0024] like Figure 3 As shown, the lower end of the collecting tank 4 is recessed downwards, and the upper end of the collecting tank 4 is at least 10 centimeters higher than the upper surface of the wafer body 7. The height of the collecting tank 4 is higher than the upper surface of the wafer body 7, which can prevent the coolant from splashing out of the collecting tank 4 after impacting the inner wall of the collecting tank 4. The coolant thrown out from the inside of the coolant tank 17 can be collected at the lower end of the collecting tank 4.

[0025] The working principle of this utility model is as follows: During use, the wafer body 7 is placed on the upper surface of the support platform 5. The surface of the wafer body 7 is polished by the polishing structure 3. While polishing the upper surface of the wafer body 7, the polishing structure 3 continuously injects polishing slurry near the polishing pad. During the polishing process, the servo motor 11 drives the gear 10 to rotate. The gear 10 meshes with multiple toothed blocks 9 fixedly installed at the lower end of the first liquid storage chamber 8. This drives the first liquid storage chamber 8 to rotate, causing the support platform 5 to rotate. Therefore, the wafer body 7 rotates synchronously with the support platform 5 during the polishing process. During the polishing of the wafer body 7, the pump body 14 draws the coolant stored in the second liquid storage chamber 16 into the first liquid storage chamber 8 for storage. Once the amount of coolant stored in the first storage chamber 8 exceeds its volume, the coolant enters the coolant tank 17 through the inlet hole 20. When the coolant flows inside the coolant tank 17, it can cool the back side of the wafer body 7. During the counterclockwise rotation of the support platform 5, the flow of coolant inside the coolant tank 17 is accelerated by centrifugal force. At the same time, the coolant can be thrown outward from the multiple first storage chambers 8 opened at the end of the coolant tank 17. After being thrown out, the coolant is collected inside the collection tank 4, and then flows through the connecting pipe 12 to the collection box 13 for storage. Thus, the coolant can continue to flow inside the coolant tank 17, effectively controlling the temperature of the wafer body 7. The coolant collected inside the collection box 13 can be taken out, reprocessed, and reused.

[0026] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A wafer carrier device, comprising a processing stage (1), characterized in that: A fixing block (2) is fixedly installed on the upper surface of the processing table (1). A polishing structure (3) is fixedly installed on the upper outer wall of the fixing block (2). A second liquid storage chamber (16) is fixedly installed inside the processing table (1). A reinforcing block (19) is fixedly installed on the upper end of the second liquid storage chamber (16). A first liquid storage chamber (8) is rotatably installed on the upper surface of the reinforcing block (19). A support platform (5) is fixedly installed on the upper end of the first liquid storage chamber (8). A baffle (6) is fixedly installed on the upper surface of the support platform (5). A coolant tank (17) is opened inside the baffle (6) on the upper surface of the support platform (5). A wafer body (7) is placed inside the baffle (6). An inlet hole (20) is opened through one end of the coolant tank (17). Multiple through slots (18) are opened through the other end. A material collection tank (4) is fixedly installed on the upper surface of the processing table (1) outside the support platform (5). A drive assembly for driving the support platform (5) to rotate is also provided below the support platform (5).

2. The wafer carrier device according to claim 1, characterized in that: Inside the processing table (1), a collection box (13) is fixedly installed below the collection trough (4). The inside of the collection box (13) is hollow. A connecting pipe (12) is fixedly connected between the lower end of the collection trough (4) and the collection box (13).

3. A wafer carrier device according to claim 2, characterized in that: The drive assembly includes a servo motor (11) fixedly mounted on the upper surface of the collection box (13), a gear (10) fixedly mounted on the output end of the servo motor (11), and a plurality of tooth blocks (9) meshing with the gear (10) fixedly mounted on the lower outer wall of the first liquid storage chamber (8).

4. A wafer carrier device according to claim 3, characterized in that: The second liquid storage chamber (16) is equipped with a pump body (14), and the output end of the pump body (14) is fixedly connected to a suction pipe (15). The suction pipe (15) passes through the interior of the reinforcing block (19) and extends to the upper end of the reinforcing block (19). The upper end of the suction pipe (15) is rotatably connected to the center position of the bottom surface of the first liquid storage chamber (8).

5. A wafer carrier device according to claim 4, characterized in that: The bottom surface of the material collection trough (4) is fixedly installed with multiple support legs (21), and the other end of the support legs (21) is fixedly connected to the processing table (1).

6. A wafer carrier device according to claim 5, characterized in that: The coolant tank (17) has a vortex structure, and the number of through slots (18) located at the end of the coolant tank (17) is not less than three.

7. A wafer carrier device according to claim 6, characterized in that: The lower end of the material collection tank (4) is recessed downwards, and the upper end of the material collection tank (4) is at least 10 centimeters higher than the upper surface of the wafer body (7).

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