Crystal horizontal grinding apparatus

Abstract

The application discloses a crystal horizontal grinding equipment, which is characterized by the following: a crystal direction detection station, a rounding positioning grinding station and a positioning grinding station are divided on the table top of the machine base, and a crystal direction detection device, a rounding grinding device and a positioning grinding device are arranged correspondingly at the stations, so that the crystal direction detection, rounding treatment and slotting treatment of the crystal are realized respectively, the rounding and slotting treatment of the crystal are integrated on the same setting, the processing efficiency of the crystal is improved, the transfer and repeated clamping of the crystal between different grinding equipment are avoided, the clamping positioning error is reduced, and the processing quality of the crystal is ensured.

Description

Technical Field

[0001] This application relates to the technical field of crystal processing, and more particularly to a horizontal crystal grinding device. Background Technology

[0002] In the field of crystal processing, sapphire, silicon rods, and other crystal materials are widely used in the manufacture of semiconductors, optoelectronics, and electronic devices. These crystal materials are typically manufactured in cylindrical shapes, but cylindrical shapes can have issues such as uneven diameter and geometric defects, leading to uneven stress distribution that affects product quality during subsequent processing steps such as cutting or slicing. Furthermore, certain subsequent processing steps require precise crystal orientation. Therefore, pre-treatment operations such as rounding and grooving are necessary before manufacturing the crystals.

[0003] Generally, most manufacturers use different grinding equipment to perform rounding and grooving operations on crystals separately. These grinding machines are scattered across different production units, workshops, or different areas of a workshop. Crystals need to be transported and moved between these machines, leading to complex processes, low processing efficiency, and an increased risk of crystal damage during transfer. Furthermore, the need for repeated clamping of crystals on different machines increases positioning errors, thus affecting processing quality. Therefore, integrating crystal rounding and grooving operations into a single machine to ensure both processing efficiency and quality is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0004] In view of the shortcomings of the above-mentioned related technologies, the purpose of this application is to provide a horizontal crystal grinding device to solve the technical problems in the related technologies.

[0005] To achieve the above and other related objectives, this application provides a horizontal crystal grinding apparatus, comprising: a base, including a base body and a table extending longitudinally from a proximal end to a distal end on the base body; the table surface is sequentially arranged from the proximal end to the distal end as a crystal orientation detection station, a rounding positioning grinding station, and a positioning grinding station; a carrier for horizontally loading and moving the crystal to be processed longitudinally is provided on the table surface; a rounding grinding device is disposed at the rounding positioning grinding station, including a first grinding component disposed on a first side of the table surface and a grinding assembly relative to the crystal to be processed. The first grinding assembly is disposed on the second side of the table, and the grinding wheel axis of the first grinding assembly and the second grinding assembly are parallel to the extension direction of the table; a crystal orientation detection device is disposed at the crystal orientation detection station for detecting and determining the crystal orientation of the rounded crystal; a positioning grinding device is disposed at the positioning grinding station, including a third grinding assembly for grinding the crystal according to the determined crystal orientation to form a positioning structure on the crystal, and the grinding wheel axis of the third grinding assembly is perpendicular to the extension direction of the table.

[0006] In summary, the horizontal crystal grinding equipment provided in this application divides the table of the machine base into a crystal orientation detection station, a rounding and positioning grinding station, and a positioning grinding station. Each station is equipped with a crystal orientation detection device, a rounding and positioning grinding device, and a positioning grinding device, respectively realizing crystal orientation detection, rounding, and grooving processing of the crystal. This integrates the rounding and grooving processes on the same setup, improving crystal processing efficiency. Simultaneously, it avoids the transfer and repeated clamping of the crystal between different grinding equipment, reduces clamping and positioning errors, and ensures the processing quality of the crystal. Attached Figure Description

[0007] The specific features involved in this application are shown in the appended claims. The features and advantages of the invention can be better understood by referring to the exemplary embodiments and accompanying drawings described in detail below. A brief description of the drawings is as follows:

[0008] Figure 1 and Figure 2 The images shown are schematic diagrams of the crystal horizontal grinding equipment in one embodiment of this application from different perspectives.

[0009] Figure 3 The diagram shown is a structural schematic of a vehicle in one embodiment of this application.

[0010] Figure 4 The diagram shown is a structural schematic of the first grinding assembly in one embodiment of this application.

[0011] Figure 5 The diagram shown is a schematic of a coarse grinding wheel performing a coarse grinding operation in one embodiment of this application.

[0012] Figure 6 The diagram shown is a schematic representation of the crystal orientation detection device in one embodiment of this application.

[0013] Figure 7 The diagram shown is a structural schematic of a positioning grinding device in one embodiment of this application.

[0014] Figure 8 The diagram shown is a cross-sectional view of a grooving grinding wheel used to create a V-groove in one embodiment of this application.

[0015] Figure 9 The diagram shown is a cross-sectional view of a grooving grinding wheel used to create a planar groove in one embodiment of this application.

[0016] Figure 10 The diagram shown is a structural schematic of a temporary storage device in one embodiment of this application.

[0017] Figure 11 The diagram shown is a schematic representation of a horizontal crystal grinding apparatus in another embodiment of this application.

[0018] Figure 12 The diagram shown is a structural schematic of the conveying device in one embodiment of this application.

[0019] Figure 13 The diagram shown is a structural schematic of the clamping mechanism in one embodiment of this application. Detailed Implementation

[0020] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand the advantages and technical effects of this application from the content disclosed in this specification. In the following description, some embodiments may be referenced to the accompanying drawings. It should be understood that other embodiments not shown in the drawings may also be used, and changes in specific structures, parts or mechanisms, components, and operations may be made without departing from the spirit and scope of this application. The following detailed description should not be considered limiting, and the scope of the embodiments of this application is limited only by the claims published in this application. The terminology used herein is for describing particular embodiments only and is not intended to limit this application.

[0021] It should be understood that although the terms first, second, or third, etc., may be used herein to describe various elements or parameters in some embodiments, these elements or parameters should not be limited by these terms. These terms are used only to distinguish one element or parameter from another, and not to define the order, priority, or importance of multiple elements. For example, a first grinding assembly may be referred to as a second grinding assembly, and similarly, a second grinding assembly may be referred to as a first grinding assembly, without departing from the scope of the various described embodiments.

[0022] Furthermore, as used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context indicates otherwise. It should be further understood that the terms “comprising,” “including,” and “including” indicate the presence of the stated features, steps, operations, elements, components, items, kinds, and / or groups, but do not exclude the presence, occurrence, or addition of one or more other features, steps, operations, elements, components, items, kinds, and / or groups. For example, a process, method, system, product, or device that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to these processes, methods, products, or devices. Additionally, the term “and / or,” which may be used hereinafter, describes the relationship between related objects, indicating that three relationships may exist; for example, A and / or B can represent: A alone, A and B simultaneously, and B alone. Furthermore, the character “ / ”, unless otherwise specified, generally indicates that the preceding and following related objects have an “and / or” relationship. Additionally, in the description of embodiments of this application, “multiple” refers to two or more. Furthermore, the terms “or” and “and / or” as used herein are interpreted as inclusive, or mean either one or any combination thereof. Exceptions to this definition only arise when a combination of elements, functions, steps, or operations is inherently mutually exclusive in some way.

[0023] It should also be understood that when an element, such as a layer, region, or substrate, is referred to as being "on" another element or extending "on" another element, the element may be directly on or directly extending onto the other element, or intermediate elements may be present. Conversely, when an element is referred to as being "directly on" another element or "directly extending onto" another element, no intermediate elements are present. It will also be understood that when an element is referred to as being "connected" or "attached" to another element, it may be directly connected or coupled to the other element, or intermediate elements may be present. Conversely, when an element is referred to as being "directly connected" or "directly coupled" to another element, no intermediate elements are present. Furthermore, the term "coupled" generally means physical, mechanical, magnetic, and / or electrical coupling or connection, and in the absence of specific contrasting language, the presence of intermediate elements between coupled or associated items is not excluded.

[0024] Relative terms such as “below,” “above,” “upper,” “lower,” “horizontal,” or “vertical” may be used herein to describe the relationship between one element, layer, or region and another element, layer, or region illustrated in the figures. It will be understood that these terms are intended to cover different device orientations other than those depicted in the figures. In this application, “vertical,” “horizontal,” and “parallel” are defined as including cases within ±10% of the standard definition. For example, vertical typically refers to an angle of 90° relative to a reference line, but in this application, vertical refers to cases including those within 80° to 100°. Unless otherwise expressly stated, comparative quantitative terms (such as “above” and “below”) are intended to cover the concept of equality. As an example, “above” can mean not only “greater than” in a mathematical sense but also “equal to.”

[0025] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application. When used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will also be understood that, when used herein, the terms “comprising,” “including,” “containing,” and / or “comprising” designate the presence of the stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or combinations thereof.

[0026] In view of the technical problems mentioned in the background art, this application discloses a horizontal crystal grinding equipment. By dividing the table of the machine base into a crystal orientation detection station, a rounding positioning grinding station, and a positioning grinding station, and setting a crystal orientation detection device, a rounding grinding device, and a positioning grinding device at each station, the crystal orientation detection, rounding processing, and grooving processing of the crystal are realized respectively. The rounding and grooving processing of the crystal are integrated on the same setting, which improves the crystal processing efficiency. At the same time, it avoids the transfer and repeated clamping of the crystal between different grinding equipment, reduces clamping and positioning errors, and ensures the processing quality of the crystal.

[0027] To clarify the definition of directions and the operational methods between different structures, the embodiments disclosed in this application define a three-dimensional space defined by the horizontal, vertical, and longitudinal directions, where the horizontal, vertical, and longitudinal directions are all straight lines and mutually perpendicular. For example, the width extension direction of the base bottom is defined as horizontal (as shown in the figure). Figure 1 The direction of the arrow X in the diagram is used to define the length extension direction of the base as longitudinal (as shown in the diagram). Figure 1 The direction of the arrow Y in the diagram is used to define the vertical direction, also known as the vertical direction or the up-down direction (as shown in the diagram). Figure 1 (The direction of arrow Z in the image).

[0028] To clearly illustrate the positional relationships between the various devices, components, structures, or mechanisms in the embodiments of this application, along the longitudinal direction of the machine base, the side of the crystal horizontal grinding equipment used for loading and unloading (or the side for crystal orientation detection) is defined as the proximal end, and the side of the crystal horizontal grinding equipment away from loading and unloading is defined as the distal end. It should be understood that when the crystal is moved from one side of the crystal horizontal grinding equipment to the opposite side for rounding or grooving, the proximal end and the distal end correspond to opposite sides of the crystal horizontal grinding equipment, which are opposite to each other or far apart.

[0029] In any embodiment provided in this application, the crystal includes, but is not limited to, various hard and brittle materials such as silicon rods, sapphire, or ceramics. The crystal is obtained through processes such as the Czochralski method or the pulling method, and is typically irregularly columnar or rod-shaped with different specifications. For example, sapphire typically has a length of 100-300 mm and a diameter of 4 inches (approximately 100 mm), 6 inches (approximately 150 mm), or even larger sizes of 12 inches (approximately 300 mm).

[0030] The rounding operation (or rounding process or rounding operation) described in the foregoing and subsequent embodiments of this application refers to the continuous grinding process of the outer circumferential surface of the crystal using a grinding wheel to gradually shape it into a standard cylindrical surface, providing a geometrically perfect standard blank for subsequent precision operations such as slicing. Depending on the amount of excess material removed and the accuracy requirements, the rounding operation can be divided into a rough grinding process to remove excess material from the crystal body and a fine grinding process to achieve a smooth crystal surface.

[0031] The grooving operation (or grooving treatment or grooving work) described in the foregoing and subsequent embodiments of this application refers to a grinding process that uses a grinding wheel of a specific shape to create one or more groove structures of a specific shape, such as V-shaped, U-shaped, or planar grooves, on the surface of a crystal that has undergone a rounding operation. In some examples, such as V-shaped grooves, the groove structure can provide a precise crystal orientation alignment reference for subsequent photolithography processes. In some examples, such as planar grooves, the groove structure can provide a bonding plane for the crystal in subsequent processes. In subsequent embodiments, the grooving operation will also be referred to as a positioning grinding operation.

[0032] Please see Figure 1 and Figure 2 The figures shown are schematic diagrams of the crystal horizontal grinding equipment in one embodiment of this application from different viewpoints. Figure 1 and Figure 2 As shown, the horizontal crystal grinding equipment includes a base 1, a rounding grinding device 2, a crystal orientation detection device 3, and a positioning grinding device 4.

[0033] In one embodiment, the base 1, as the main component of the horizontal crystal grinding equipment of this application, can be configured with a heavy material such as stainless steel or cast iron to provide robust overall stability. In some examples, the base 1 includes fixing or limiting structures for supporting different mechanisms or components in the horizontal crystal grinding equipment, such as a base, column, or frame. In some examples, the base 1 can be a single, integrated base. In some examples, the base 1 can include multiple independent bases.

[0034] In one embodiment, the base 1 includes a base body and a platform 10, the platform 10 being disposed on the base body and extending longitudinally from a proximal end toward a distal end. Figure 1 As shown, the table 10 is arranged on the upper surface of the base in the form of a track, for cooperating with the carrier 5 to move longitudinally along the table 10 to transfer the crystal to be processed between the crystal orientation detection station 11, the rounding positioning grinding station 12, and the positioning grinding station 13. Figure 2 As shown, the table 10 is provided with a crystal orientation detection station 11, a rounding positioning grinding station 12, and a positioning grinding station 13 arranged sequentially from the near end to the far end. It should be understood that each station is defined by the travel path and range of the processing device at the corresponding location. For example, the crystal orientation detection device 3 of the horizontal crystal grinding machine is located at the crystal orientation detection station 11, and the range of the crystal orientation detection station 11 is the range occupied by the crystal orientation detection device 3 during the crystal orientation detection operation. Similarly, the rounding grinding device 2 of the horizontal crystal grinding machine is located at the rounding positioning grinding station 12, and the range of the rounding positioning grinding station 12 is the range occupied by the rounding grinding device 2 during the rounding grinding operation. The positioning grinding device 4 of the horizontal crystal grinding machine is located at the positioning grinding station 13, and the range of the positioning grinding station 13 is the range occupied by the positioning grinding device 4 during the grooving grinding operation.

[0035] In one embodiment, such as Figure 1 and Figure 2 As shown, a carrier 5 is mounted on the platform 10, and the carrier 5 is used to horizontally load the crystal to be processed and move it longitudinally. Please refer to [link / reference]. Figure 3 The image shown is a schematic diagram of the structure of a vehicle in one embodiment of this application. Figure 3 As shown, the carrier 5 includes a base and a clamp. The base is disposed on the platform 10 and can move longitudinally along the platform 10. The clamp is disposed on the base and is used to clamp the two end faces of the crystal A for rotation.

[0036] In one embodiment, a longitudinal guide rail is provided on the table 10, and the carrier can move longitudinally along the longitudinal guide rail to clamp the crystal and transfer it between the crystal orientation detection station 11, the rounding positioning grinding station 12 and the positioning grinding station 13.

[0037] Specifically, in one embodiment, such as Figure 3 As shown, the carrier is configured to include a first carrier 51 located at the proximal end and a second carrier 52 located at the distal end. The first carrier 51 and the second carrier 52 are longitudinally movably disposed on the longitudinal guide rail. The first carrier 51 and the second carrier 52 may have the same configuration. Taking the first carrier 51 as an example, in some examples, the first carrier 51 further includes a slider 511 and a load-bearing drive assembly 512. The slider is disposed at the bottom of the first carrier 51 and adapted to the longitudinal guide rail. The load-bearing drive assembly is used to drive the first carrier 51 to move longitudinally along the longitudinal guide rail.

[0038] In some implementations, the load-bearing drive assembly 512 may include a load-bearing moving lead screw 5121 and a load-bearing drive motor 5122. The load-bearing moving lead screw 5121 is longitudinally oriented and connected to the first carrier 51, and the load-bearing drive motor 5122 (which may be, for example, a servo motor) is connected to the load-bearing moving lead screw 5121. Thus, the load-bearing drive motor 5122 drives the load-bearing moving lead screw 5121 to rotate, thereby enabling the first carrier 51 to move longitudinally along the longitudinal guide rail. The implementation of the load-bearing drive assembly 512 is not limited to this; other components that drive the first carrier 51 to move longitudinally along the longitudinal guide rail, thereby causing the clamp to move longitudinally, are also applicable. For example, the load-bearing drive assembly 512 may include a rack, a drive gear meshing with the rack, and a drive motor that drives the drive gear to rotate.

[0039] Furthermore, the load-bearing drive assembly 512 drives the first carrier 51 to move actively on the longitudinal guide rail, while the second carrier 52 moves passively on the longitudinal guide rail under the pushing or pulling action of the load-bearing moving screw 5121. Of course, in some other implementations, the load-bearing drive assembly 512 can be respectively configured on the first carrier 51 and the second carrier 52, so that both the first carrier 51 and the second carrier 52 can actively move relative to or away from each other to achieve opposite release or relative clamping opening and closing actions.

[0040] In one embodiment, such as Figure 3 As shown, the clamp can be configured to include a first clamp 53 and a second clamp 54. The first clamp 53 is disposed on the first carrier 51, and the second clamp 54 is disposed on the second carrier 52. A clamping space for clamping crystal A is formed between the first clamp 53 and the second clamp 54. Further, the first clamp 53 and the second clamp 54 can move towards or away from each other along the longitudinal guide rail along the bearing moving screw 5121 to adjust the size of the clamping space, thereby adapting to the clamping of crystals A of different sizes.

[0041] In one embodiment, the first clamp 53 and the second clamp 54 can be configured as rotary chucks, capable of clamping the two opposite end faces of crystal A located at its proximal and distal ends, respectively, with the clamping direction located along the crystal's axis. In this embodiment, a rotary drive source can be configured on the first clamp 53 or the second clamp 54, which can drive one of the clamps to rotate actively, thereby causing crystal A and the other clamp to rotate passively. In another embodiment, the first clamp 53 and the second clamp 54 can each be configured with a rotary drive source, so that the first clamp 53 and the second clamp 54 can rotate simultaneously around a certain direction, thereby causing crystal A to rotate around its axis. In one example, the rotary drive source can be configured as a rotary motor.

[0042] In one embodiment, during the round grinding operation, the carrier 5 drives the crystal A to rotate in the opposite direction to the round grinding device 2. Specifically, in embodiments where the round grinding device 2 is configured to include a first grinding assembly 21 and a second grinding assembly 22, the carrier 5 drives the crystal A to rotate in the opposite direction to either the first grinding assembly 21 or the second grinding assembly 22. In this embodiment, the crystal A and the grinding wheel rotate in opposite directions to achieve reverse grinding, thereby increasing the grinding effect of the first grinding assembly 21 or the second grinding assembly 22 per unit time, improving the material removal rate, and thus increasing the grinding efficiency.

[0043] In one embodiment, during a positioning grinding operation, the carrier 5 locks the crystal A to keep it stationary until the positioning grinding device 4 performs the positioning grinding operation. Specifically, in an embodiment where the positioning grinding device 4 is subsequently configured to include a third grinding assembly 41, the carrier 5 locks the crystal A to keep it stationary until the third grinding assembly 41 performs the positioning grinding operation.

[0044] In one implementation, a brake positioner may be configured on the fixture. The brake positioner stops the rotational movement of the first and second fixtures to lock the crystal A into a stationary state. Simultaneously, it prevents the first and second fixtures from rotating due to external forces when they stop moving, thereby further ensuring grinding accuracy. In another implementation, the brake positioner may be configured to include a brake actuator and a locking pin. The brake actuator controls the movement of the locking pin, locking the pin onto the carrier, thereby stopping the rotational movement of the first and second fixtures. The brake actuator may be, for example, a motor.

[0045] It should be noted that the first grinding component 21, the second grinding component 22, and the third grinding component 41 can be referred to in the description of the following embodiments, and will not be repeated here.

[0046] In one embodiment, such as Figure 1 and Figure 2 As shown, the rounding grinding apparatus 2 includes a first grinding component 21 and a second grinding component 22. The first grinding component 21 is disposed on a first side of the table 10, and the second grinding component 22 is disposed on a second side of the table 10 relative to the first grinding component 21. It should be noted that, to clearly illustrate the relative positions of the various components, structures, assemblies, mechanisms, members, or devices in the crystal horizontal grinding equipment, the first grinding component 21 and the second grinding component 22 on the table 10 are used as a reference for differentiation. The side (or end) of each component, structure, assembly, mechanism, member, or device that is relatively closer to the first grinding component 21 is referred to as the first side (or first end), and the side (or end) that is relatively closer to the second grinding component 22 is referred to as the second side (or second end). The first side and the second side will not be described again in subsequent embodiments.

[0047] Please see Figure 4 The image shown is a schematic diagram of the structure of the first grinding assembly in one embodiment of this application. Figure 4 As shown, the first grinding assembly 21 includes a first feed seat 211 and a rough grinding spindle 212. The first feed seat 211 is laterally movable, and the rough grinding spindle 212 is mounted on the first feed seat 211. Figure 1 In the example shown, the first feed seat 211 is laterally movable on the machine base 1, and the rough grinding spindle 212 is fixedly mounted on the first feed seat 211 in the longitudinal direction for rounding the crystal. In some examples, the first feed seat 211 serves as a carrier for the rough grinding spindle 212 on the machine base 1, and its specific form can be a beam, column, plate frame, bracket, etc.

[0048] In one embodiment, such as Figure 4 As shown, a first lateral moving device 213 is provided on the first feed seat 211, which is used to drive the first feed seat 211 relative to the machine base 1 along... Figure 4 The dashed arrow indicates lateral movement. Specifically, when the first lateral movement device 213 drives the first feed seat 211 to move towards the second side in the direction of the arrow, it can drive the rough grinding spindle 212 mounted on the first feed seat 211 to feed and grind the crystal on the table 10; when the first lateral movement device 213 drives the first feed seat 211 to move towards the first side in the direction of the arrow, it can drive the rough grinding spindle 212 away from the crystal.

[0049] In some examples, the first lateral movement device 213 may include a first lateral movement guide rail 2131, a first lateral movement lead screw, and a first lateral movement drive motor 2132 disposed on the table 10. The first lateral movement drive motor 2132 drives the first lateral movement lead screw to rotate, thereby causing the first feed seat 211 to move on the first lateral movement guide rail 2131. In other examples, the first lateral movement device, in addition to including the first lateral movement guide rail 2131, may also be configured to include a first lateral movement rack, a first lateral movement gear, and a first lateral movement gear drive motor. The first lateral movement rack may be arranged parallel to the first lateral movement guide rail 2131. The first lateral movement drive gear meshes with the first lateral movement rack. The first lateral movement gear drive motor is associated with the first lateral movement gear. The first lateral movement gear drive motor drives the connected first lateral movement gear to rotate. Through the meshing of the first lateral movement gear and the first lateral movement rack, the first feed seat 211 is moved on the first lateral movement guide rail 2131.

[0050] In one embodiment, the rough grinding spindle 212 includes a first drive shaft with a cylindrical structure. In some examples, the first drive shaft may be connected to a first rotary drive motor, which drives the first drive shaft to rotate at high speed, thereby causing the rough grinding spindle 212 to rotate at high speed, thereby rounding the circumferential surface of the crystal.

[0051] In one embodiment, such as Figure 4 As shown, a coarse grinding wheel 2121 is provided at the distal end of the coarse grinding spindle 212. Specifically, the coarse grinding wheel 2121 can rotate at high speed under the drive of the first rotary drive motor to complete the rounding process of the crystal. In one example, as... Figure 1 and Figure 2As shown, the axis of the coarse grinding wheel 2121 of the first grinding assembly 21 is parallel to the extending direction of the table 10. In other words, in this example, the first grinding assembly 21 grinds the circumferential surface of the crystal through the rim of the coarse grinding wheel 2121. In some examples, the coarse grinding wheel is formed by bonding abrasive grains with a binder, creating a surface with abrasive grains that rotates in contact with the circumferential surface of the crystal. The abrasive grains have a certain abrasive grain size and density. In some examples, the abrasive grains can be made of materials with a hardness greater than that of the crystal material, such as aluminum oxide, silicon carbide, or cubic boron diamond nitride, depending on the needs of grinding the crystal. In some examples, the coarse grinding wheel has vents for heat dissipation. In some examples, the coarse grinding wheel 2121 is also connected to a cooling device for cooling down. The cooling device may include, for example, a cooling water pipe, a guide groove, and a guide hole. The cooling water pipe is connected to a cooling water source. The cooling water drawn through the cooling water pipe is directed to the guide groove and guide hole on the coarse grinding wheel 2121 and is guided to the contact surface that reaches the wheel rim and the outer circumference of the crystal for cooling.

[0052] In one embodiment, the second grinding assembly 22 includes a second feed seat capable of lateral displacement and a fine grinding spindle disposed on the second feed seat. Specifically, when the second feed seat moves toward the first side, it can drive the fine grinding spindle disposed thereon to feed and grind the crystal that has completed rough grinding; when the second feed seat moves toward the second side, it can drive the fine grinding spindle away from the crystal. The second feed seat may have the same configuration as the first feed seat, and a second lateral moving device may be disposed thereon to realize lateral movement. The second lateral moving device may have the same configuration as the first lateral moving device 213.

[0053] In one embodiment, a fine grinding wheel is provided at the distal end of the fine grinding spindle for fine grinding of the crystal after coarse grinding. In one example, such as Figure 1 and Figure 2 As shown, the axis of the fine grinding wheel of the second grinding assembly 22 is parallel to the extending direction of the table 10. In other words, in this example, the second grinding assembly 22 grinds the circumferential surface of the crystal through the rim of the fine grinding wheel. Of course, in practical applications, the end face of either the coarse grinding wheel or the fine grinding wheel can also be used to grind the crystal.

[0054] It should be noted that, in the embodiments of this application, the first grinding component and the second grinding component may be distinguishably equipped with fine grinding wheels or coarse grinding wheels, while the other components can be configured the same.

[0055] During the rounding process, the fine grinding spindle of the second grinding assembly 22 first moves towards the second side under the drive of the second feed seat to a position that does not interfere with the first grinding assembly 21. Then, the rough grinding spindle 212 of the first grinding assembly 21 moves towards the second side under the drive of the first feed seat 211, so that the rim of the rough grinding wheel 2121 contacts the outer circumferential surface of the crystal and performs rough grinding. After rough grinding is completed, the rough grinding spindle 212 moves towards the first side under the drive of the first feed seat 211 to move away from the outer circumferential surface of the crystal. At this time, the fine grinding spindle of the second grinding assembly 22 moves towards the first side under the drive of the second feed seat, so that the rim of the fine grinding wheel contacts the outer circumferential surface of the crystal and performs fine grinding. After the rounding operation is completed, the fine grinding spindle moves towards the second side under the drive of the second feed seat to move away from the crystal.

[0056] In one embodiment, the end face of the coarse grinding wheel 2121 of the first grinding assembly 21 and the end face of the fine grinding wheel of the second grinding assembly 22 are located on the same vertical plane. In other words, the end faces of the coarse grinding wheel 2121 and the fine grinding wheel are on a straight line and are symmetrically distributed on the table relative to the carrier 5. In this embodiment, when the width of the crystal is smaller than the coarse grinding wheel 2121 and the fine grinding wheel, the crystal can stop moving after reaching the grinding position between the first grinding assembly 21 and the second grinding assembly 22 under the drive of the carrier 5. It only rotates under the drive of the rotary drive source and waits for the coarse grinding wheel 2121 or the fine grinding wheel to contact the outer circumferential surface to perform coarse grinding and fine grinding operations respectively. In this way, the movement process of the crystal after completing the coarse grinding operation to perform fine grinding is avoided, saving grinding time and improving grinding efficiency.

[0057] As previously mentioned, the crystal A and the grinding wheels of the rounding grinding device 2 rotate in opposite directions to achieve reverse grinding. Specifically, the rotation directions of the coarse grinding wheel 2121 of the first grinding assembly 21 and the fine grinding wheel of the second grinding assembly 22 are both opposite to the rotation direction of the crystal A. Please refer to [link to relevant documentation]. Figure 5 The image shown is a schematic diagram of a coarse grinding wheel performing a coarse grinding operation in one embodiment of this application. It should be noted that... Figure 5 The reverse grinding process is explained using the example of rough grinding the outer circumferential surface of crystal A with the aforementioned coarse grinding wheel 2121 during the rounding operation of crystal A. Figure 5 In the example shown, the rim of the coarse grinding wheel 2121 is tangent to the outer circumferential surface of the crystal A, and both the coarse grinding wheel 2121 and the crystal A rotate clockwise. On the grinding surface where they contact each other, the rotation directions of the coarse grinding wheel 2121 and the crystal A are opposite. Of course, in some other examples, both the coarse grinding wheel 2121 and the crystal A may rotate counterclockwise.

[0058] After the rough grinding operation is completed, crystal A can be rotated clockwise so that the fine grinding wheel of the second grinding assembly 22, driven by the second feed seat, moves to a position tangent to the outer circumferential surface of crystal A for fine grinding. Specifically, both the fine grinding wheel and crystal A can rotate clockwise, and on the grinding surfaces in contact with each other, the rotation directions of the fine grinding wheel and crystal A are opposite to achieve the reverse grinding. Of course, in some other examples, both the fine grinding wheel and crystal A can rotate counterclockwise. Thus, after both the rough grinding and fine grinding operations are completed, the rounding process is finished.

[0059] In one embodiment, such as Figure 2 As shown, the horizontal crystal grinding equipment also includes a grinding amount detection device 6, which is disposed on the second side of the table 10 and adjacent to the second grinding assembly 22. In this embodiment, the grinding amount detection device 6 is used to monitor the grinding amount of the crystal in real time to determine the feed rate of the first grinding assembly 21 and the second grinding assembly 22.

[0060] In some examples, the grinding amount detection device 6 may be configured to include a contact measuring probe, which may be configured as a mechanical displacement sensor. This probe monitors the dimensional changes of the crystal in real time before, during, and after grinding by contacting the crystal's surface. This allows for real-time adjustment of the distance the first or second feed seat moves relative to the crystal, thereby adjusting the grinding depth of the roughing or finishing grinding wheel to ensure the accuracy of the rolling grinding operation. In this example, the installation height of the contact measuring probe can be the same as the clamping height of the crystal on the carrier 5, so that the grinding amount detection device 6 only needs to extend horizontally during contact detection.

[0061] In some other examples, the grinding amount detection device 6 may be configured to include a non-contact measurement probe, which may be configured, for example, a laser displacement sensor or an ultrasonic sensor, to detect the reflected signal on the crystal surface by emitting a light beam or electromagnetic wave, thereby obtaining the crystal's size information without direct contact with the crystal.

[0062] In one embodiment, a cleaning device is provided between the rounding grinding device 2 and the crystal orientation detection device 3. This cleaning device is used to clean the grinding dust from the crystal surface. In this embodiment, by providing the cleaning device, grinding dust or debris generated by rounding grinding can be removed in time before the crystal enters the crystal orientation detection station 11, preventing obstruction or interference with the crystal orientation detection device 3's detection of the crystal orientation and improving the accuracy of the detection results. Simultaneously, cleaning the crystal surface before crystal orientation detection also reduces contamination of the crystal orientation detection device 3 by dust or debris, ensuring the device's service life.

[0063] In one implementation, the cleaning device includes a spraying structure and a drying structure. The spraying structure cleans the crystal surface, and the drying structure dries the cleaned crystal. In some examples, the spraying structure sprays liquid onto the crystal surface, which both cools the crystal and cleans it. In some examples, the drying structure may, for example, spray high-pressure gas onto the crystal surface to remove residual grinding debris and the liquid. In other implementations, the cleaning device further includes a rotating brush head for brushing the crystal surface to further remove grinding debris adhering to the crystal surface.

[0064] In one embodiment, the crystal orientation detection device 3 is disposed at the crystal orientation detection station 11 and is used to detect and determine the crystal orientation of the crystal after rounding. Specifically, after the crystal A completes the rounding process under the operation of the first grinding assembly 21 and the second grinding assembly 22, it can be moved from the far end to the near end of the table 10 to the crystal orientation detection station 11 under the drive of the carrier 5, and then the crystal orientation is detected by the crystal orientation detection device 3.

[0065] It should be understood that the performance of products obtained from the crystal is highly dependent on crystal orientation. For example, if a groove is cut in the wrong crystal orientation during subsequent grooving operations, it can easily cause edge chipping and cracking of the crystal, increasing the risk of subsequent grinding or cutting. Alternatively, if the groove structure on the crystal deviates from the crystal orientation, it will provide an incorrect reference for subsequent slicing operations, thereby affecting the performance of the product. For example, in the photovoltaic field, if the cut surface of the product deviates from the crystal orientation, it will lead to a decrease in electrical performance and a reduction in light absorption efficiency; in the semiconductor field, if the cut surface of the product deviates from the crystal orientation, it will affect the etching rate or carrier mobility, etc. Therefore, in this application, the crystal orientation detection process is set after the rounding operation and before the grooving operation to ensure that the groove structure is consistent with the target crystal orientation.

[0066] Furthermore, such as Figure 2 As shown, this application positions the crystal orientation detection station 11 near the end of the table 10, away from the rounding and positioning grinding station 12 and the positioning grinding station 13. This prevents the crystal orientation detection device 3 from being affected by grinding debris generated during the rounding and grooving operations when detecting the crystal, thus ensuring the accuracy of the crystal orientation detection. Furthermore, positioning the crystal orientation detection device 3 at the edge of the horizontal crystal grinding equipment avoids obstruction of the crystal orientation detection process by the grinding components and carriers, facilitating observation of the crystal orientation detection process by the equipment operator. It also facilitates maintenance and calibration of the crystal orientation detection device 3 based on the observation results.

[0067] Please see Figure 6 and combined Figure 1 and Figure 2 ,in, Figure 6 The diagram shown is a structural schematic of a crystal orientation detection device in one embodiment of this application. Figure 1 , Figure 2 and Figure 6 As shown, the crystal orientation detection device 3 includes a detection support 31 and a X-ray orientation instrument (not shown). The detection support 31 is located near the end of the mesa 10 and is vertically disposed on the second side of the mesa 10. Figure 6 In the embodiment shown, the detection bracket 31 includes a frame 311 and a detection space 312. The frame 311 can move laterally to the carrier 5, and the detection space 312 is formed on the frame 311 to accommodate crystals placed on the carrier 5.

[0068] In one embodiment, the frame 311 can be mounted on the platform 10 via a lateral moving mechanism, which can drive the detection bracket 31 along... Figure 6 The movement along the dotted line indicates that the detection space 312 on the frame 311 can be moved to a position directly facing the crystal to facilitate crystal orientation detection. In some examples, the lateral movement mechanism can be configured as a linear guide and lead screw drive, or a linear rack and pinion mechanism, as long as it enables lateral movement of the frame 311. In some examples, the frame 311 can be further configured with a buffer structure or vibration damping mechanism to reduce the impact of the rolling grinding device 2 and / or the positioning grinding device 4 on the crystal orientation detection accuracy during operation. In some examples, the frame 311 can be made of metal or high-strength alloy materials to ensure the rigidity and stability of the overall structure.

[0069] In one embodiment, the detection space 312 is configured as an opening structure formed on a first side of the frame 311. In the example described in this application, the height of the opening structure is the same as the height of the crystal carried on the carrier 5, so that after the crystal arrives at the crystal orientation detection station 11, the frame 311, driven by the lateral movement mechanism, can align the opening structure with the crystal to achieve crystal orientation detection without any vertical displacement of the frame 311 or the crystal, thereby improving the efficiency of crystal orientation detection and reducing the overall crystal processing time. In some examples, the opening structure can be configured as an annular, square, or open groove, the size of which matches the shape of the crystal, as long as it allows the crystal to pass through or stably enter the detection space.

[0070] In one embodiment, the X-ray orientation instrument is disposed in the frame 311 and is used to emit orientation-finding rays towards the crystal in the detection space 312 to determine the crystal orientation of the crystal. Specifically, the X-ray orientation instrument can be installed on the inner wall of the frame facing the detection space 312, and covers the crystal with rays of specific energy, and detects the crystal orientation of the crystal using the principle of optical diffraction.

[0071] In one embodiment, the X-ray orientation instrument includes an X-ray orientation instrument and a digital CCD detector. In this embodiment, the X-ray orientation instrument emits X-rays towards the crystal in the detection space 312. When the X-rays irradiate the crystal lattice structure of the crystal, Bragg diffraction occurs under a specific crystal direction. The diffracted X-rays exit at a certain angle to form diffraction fringes, which are then received by the digital CCD detector arranged in the corresponding position. Then, the digital CCD detector images the diffraction fringes and converts them into an electrical signal. The electrical signal can be analyzed by a data processing unit to determine the crystal orientation of the crystal. Subsequently, the crystal rotates around its axis under the drive of the first clamp 53 and the second clamp 54 to ensure the correct orientation during the grooving operation. Then, the crystal, after being positioned, moves longitudinally to the positioning grinding station 13 under the drive of the carrier 5, where the positioning grinding device 4 performs the grooving operation.

[0072] Please see Figure 7 The image shown is a schematic diagram of the positioning grinding device in one embodiment of this application. Figure 7 As shown, the positioning grinding device 4 includes a third grinding component 41, which is used to grind the crystal according to a determined crystal orientation to form a positioning structure on the crystal. The positioning structure is a groove structure formed by a grooving operation, such as a V-shape, U-shape, or plane. Specific details of the groove structure can be found in the descriptions of the foregoing embodiments and will not be repeated here.

[0073] In one embodiment, the third grinding assembly 41 is disposed on the second side of the table 10. Of course, in other embodiments, the third grinding assembly 41 may also be disposed on the first side of the table 10 and disposed side by side with the first grinding assembly 21.

[0074] In one embodiment, such as Figure 7 As shown, the third grinding assembly 41 includes a third feed seat 411 and a spindle seat 412. The third feed seat 411 is capable of lateral displacement, and the spindle seat 412 is disposed on the third feed seat 411. In some examples, the third feed seat 411 serves as a carrier for the spindle seat 412 to be disposed on the machine base 1, and its specific form can be a beam, column, plate frame, bracket, etc.

[0075] In one embodiment, such as Figure 7 As shown, a third transverse moving device 413 is provided on the third feed seat 411, which is used to drive the third feed seat 411 relative to the machine base 1 along... Figure 7The dashed arrow indicates lateral movement. Specifically, when the third lateral movement device 413 drives the third feed seat 411 to move towards the first side in the direction of the arrow, it can drive the spindle seat 412 mounted on the third feed seat 411 to feed and grind the crystal on the table 10; when the third lateral movement device 413 drives the third feed seat 411 to move towards the second side in the direction of the arrow, it can drive the spindle seat 412 away from the crystal.

[0076] In some examples, the third lateral movement device 413 may include a third lateral movement guide rail, a third lateral movement lead screw, and a third lateral movement drive motor disposed on the table 10. The third lateral movement drive motor drives the third lateral movement lead screw to rotate, thereby causing the third feed seat 411 to move on the third lateral movement guide rail. In other examples, the third lateral movement device, in addition to including the third lateral movement guide rail, may also be configured to include a third lateral movement rack, a third lateral movement gear, and a third lateral movement gear drive motor. The third lateral movement rack may be arranged parallel to the third lateral movement guide rail. The third lateral movement drive gear meshes with the third lateral movement rack. The third lateral movement gear drive motor is associated with the third lateral movement gear. The third lateral movement gear drive motor drives the connected third lateral movement gear to rotate. Through the meshing of the third lateral movement gear and the third lateral movement rack, the third feed seat 411 is moved on the third lateral movement guide rail.

[0077] In one embodiment, such as Figure 7 As shown, a slotted spindle 414 that can be raised and lowered is provided on the spindle seat 412. Figure 7 In the illustrated embodiment, the spindle seat 412 is provided with a lifting drive structure 415 for driving the slotted spindle 414 to perform lifting and lowering movements. In one example, the lifting drive structure 415 includes a lifting guide rail disposed vertically on the spindle seat 412, a lifting slider disposed on the slotted spindle 414 and connected to the lifting guide rail, and a lifting cylinder disposed on the spindle seat 412 for driving the lifting slider to slide on the lifting guide rail to perform lifting and lowering movements on the slotted spindle 414.

[0078] In practical applications, to ensure stable lifting and lowering of the slotting spindle 414 on the spindle seat 412, a dual-rail design can be adopted, i.e., two lifting rails can be arranged in parallel. Furthermore, the lifting cylinder can be further configured to include a lifting screw and a lifting motor, wherein the lifting screw is vertically connected to the slotting spindle 414, and the lifting motor is connected to the lifting screw. Thus, the lifting motor drives the lifting screw to rotate, thereby enabling the slotting spindle 414 to move vertically along the lifting rails. The implementation of the lifting drive unit is not limited to this; other components that can drive the slotting spindle 414 to move vertically along the guide rails are also applicable. For example, the lifting drive unit may include a lifting rack, a drive gear meshing with the lifting rack, and a drive motor that drives the drive gear to rotate.

[0079] In one embodiment, a limit block is also provided on the spindle seat 412 to limit the slotted spindle 414 from excessive displacement during lifting and lowering.

[0080] In one embodiment, the grooving spindle 414 includes a third drive shaft with a cylindrical structure. In some examples, the third drive shaft may be connected to a third rotary drive motor, which drives the third drive shaft to rotate at high speed, thereby causing the grooving spindle 414 to rotate at high speed, thus performing grooving processing on the crystal.

[0081] In one embodiment, such as Figure 7 As shown, a grooving grinding wheel 4141 is provided at the lower end of the grooving spindle 414. Specifically, the grooving grinding wheel 4141 can rotate at high speed under the drive of the third rotary drive motor to complete the grooving process on the crystal. In this embodiment, as... Figure 7 As shown, the axis of the grinding wheel of the third grinding assembly 41 is perpendicular to the extending direction of the table 10. In other words, the axis of the grooving grinding wheel 4141 is perpendicular to the extending direction of the table 10. In one example, as shown... Figure 7 As shown, the axis of the grooving grinding wheel 4141 is perpendicular to the table 10, and at this time, it can, for example, use the rim of the grooving grinding wheel 4141 to grind the side of the crystal.

[0082] In one example, the outer edge structure of the grooving grinding wheel 4141 is configured as U-shaped, meaning the cutting edge of the wheel has a rounded transition, used to grind an arc-shaped "∪" groove structure on the surface of the crystal. In another example, the outer edge structure of the grooving grinding wheel 4141 is configured as V-shaped or conical, meaning the cutting surfaces on both sides of the grinding wheel meet at an acute angle, used to grind a V-shaped groove on the crystal surface. In practical applications, the grinding angle between the grooving grinding wheel 4141 and the crystal can be adjusted according to the actual groove shape requirements.

[0083] For example, please refer to Figure 8 The image shown is a cross-sectional schematic diagram of a grooving grinding wheel used to create a V-groove in one embodiment of this application. Figure 8 As shown, the V-shaped cutting edge of the V-shaped grooving wheel 4141 perpendicularly contacts the surface of crystal A and grinds crystal A to create a symmetrical "∨" shaped groove structure on the crystal surface. Specifically, the carrier 5 locks crystal A to keep it stationary. At this time, the grooving wheel 4141 rotates at high speed along... Figure 8 The arrow indicates that the crystal is fed towards crystal A to first form the "∨" shaped groove structure at one end of crystal A. Then, crystal A moves towards the far end of the platform 10 under the drive of carrier 5, forming the "∨" shaped groove structure on the entire side of crystal A during the movement.

[0084] In some other examples, when the V-shaped cutting edge contacts the crystal surface at a certain angle, a "∠" shaped groove structure can be formed on the crystal surface.

[0085] In another embodiment, a faceted spindle that can move vertically is provided on the spindle seat 412. In one example, the faceted spindle can move vertically on the spindle seat 412 under the drive of the lifting drive structure 415. In this embodiment, the grooving grinding wheel 4141 can be provided at the end of the faceted spindle. In this case, the grooving grinding wheel 4141 can also be called a faceted grinding wheel, used to form planar groove structures on the crystal.

[0086] Specifically, please refer to Figure 9 The image shown is a cross-sectional schematic diagram of a planar groove created using a grooving grinding wheel in one embodiment of this application. Figure 9 As shown, the grooving grinding wheel 4141 can rotate at high speed under the drive of the third rotary drive motor to grind a plane on crystal A in accordance with the crystal orientation of crystal A. In one example, the grooving grinding wheel 4141 can be configured as a disc shape and grind the crystal through its rim. Specifically, the carrier 5 locks crystal A to keep it in a stationary state. At this time, the grooving grinding wheel 4141 rotates at high speed along... Figure 9 The horizontal arrow shown indicates that the feed is directed towards crystal A. After contacting one end of crystal A, the grooving grinding wheel 4141 moves along... Figure 9 The vertical arrow indicates that the crystal A moves up and down to first form a planar groove at one end. Then, the crystal A moves toward the far end of the platform 10 under the drive of the carrier 5. During the movement, the grooving grinding wheel 4141 continuously rotates and moves up and down to form the planar groove on the entire side of the crystal A.

[0087] It should be noted here that, Figure 7The example provided is a grooving spindle 414 configured on the third grinding assembly 41 for creating planar grooves, and should not be construed as a limitation of this application.

[0088] In one embodiment, the axis of the faceted grinding wheel is perpendicular to the extending direction of the table 10. In one example, the axis of the faceted grinding wheel is perpendicular to the table 10, in which case the faceted grinding wheel can, for example, use its rim to grind the side surface of the crystal. Of course, in another example, the axis of the faceted grinding wheel can also be parallel to the table 10. That is, this application does not limit the arrangement of the faceted grinding wheel, as long as it can be tangent to the curved surface of the crystal to form a grinding plane on the crystal.

[0089] In one embodiment, such as Figure 1 and Figure 2 As shown, the horizontal crystal grinding equipment also includes a temporary storage device 7, which is disposed on the base and located on the first side of the table 10. The temporary storage device 7 is used to load the crystal to be ground and to unload the crystal after grinding. Specifically, when loading the crystal to be ground using the temporary storage device 7, a person or a robot can transfer the crystal to the temporary storage device 7, and then transfer the crystal on the temporary storage device 7 to the carrier 5. The carrier 5 then transports the crystal to the rounding positioning grinding station 12 for rounding processing by the rounding grinding device 2. When unloading the crystal to be ground using the temporary storage device 7, the crystal that has already been slotted by the positioning grinding device 4 and is located on the carrier 5 can be transferred to the temporary storage device 7 and retrieved manually or by a robot.

[0090] It should be understood that during the aforementioned loading and unloading processes, the crystal needs to be transferred between the carrier 5 and the temporary storage device 7. Related technologies typically employ a conveying device capable of moving in both horizontal and vertical directions to achieve this transfer. In this case, the conveying device needs to move in at least two directions to transfer the crystal. However, this conveying method results in longer conveying times, reducing the overall crystal processing efficiency. Furthermore, it leads to the accumulation of conveying errors, increasing the likelihood of the crystal falling due to improper conveying, thus affecting processing quality.

[0091] More importantly, when loading and unloading crystals of different diameters, the vertical clamping position of the crystals needs to be adjusted because the centerlines of crystals of different diameters are at different heights. This further increases the loading error and loading time. Therefore, the temporary storage device 7 provided in this application has an adjustment mechanism for accommodating crystals of various sizes, so that the carrying height of the temporary storage device 7 on the crystals is on the same horizontal plane as the clamping height of the carrier 5 on the crystals. For example, using the clamping height of the carrier 5 on the crystals as a reference, when the diameter of the crystals to be loaded and unloaded is large (e.g., 12-inch crystals), the adjustment mechanism can lower the carrying height of the temporary storage device 7 on the crystals; when the diameter of the crystals to be loaded and unloaded is small (e.g., 6-inch crystals), the adjustment mechanism can raise the carrying height of the temporary storage device 7 on the crystals. In this embodiment, since the carrying height of the crystal by the temporary storage device 7 and the clamping height of the crystal by the carrier 5 are on the same horizontal plane, the transport device only needs to move in the horizontal direction to realize the transfer of the crystal between the temporary storage device 7 and the carrier 5, which shortens the time for loading and unloading the crystal, thereby improving the overall processing efficiency of the crystal, while reducing the transfer error and ensuring the processing quality of the crystal.

[0092] Please see Figure 10 The diagram shows a schematic representation of the temporary storage device in one embodiment of this application. Figure 10 As shown, the temporary storage device 7 includes a temporary storage platform 71, which is vertically and longitudinally movable on the base 1. It is used to temporarily store crystals of different specifications for longitudinal loading or unloading. Specifically, loading crystal A is achieved when the temporary storage platform 71 moves longitudinally from the near end to the far end, and unloading crystal A is achieved when the temporary storage platform 71 moves longitudinally from the far end to the near end.

[0093] In one embodiment, the temporary storage platform 71 extends longitudinally to support crystal A, whose centerline also extends longitudinally. In some examples, the temporary storage platform 71 may employ a high-strength metal plate or alloy frame structure to ensure its load-bearing capacity for crystal A. In some examples, the temporary storage platform 71 may be provided with positioning slots or multiple positioning blocks to ensure that crystal A can be stably placed on the temporary storage platform 71, preventing rolling or displacement during lifting or longitudinal movement. In some examples, the temporary storage platform 71 may also be covered with a flexible material such as polyurethane or rubber to provide cushioning, thereby reducing surface damage to crystal A.

[0094] In one embodiment, such as Figure 10As shown, the temporary storage platform 71 is raised and lowered relative to the base 1 via an adjustment mechanism 72. In one example, the adjustment mechanism 72 may be configured to include a platform lifting shaft connected to the temporary storage platform 71 and a platform lifting drive unit for driving the platform lifting shaft to move the temporary storage platform 71 up and down. Specifically, the platform lifting drive unit drives the platform lifting shaft to descend, thereby lowering the temporary storage platform 71 until its bearing height is on the same horizontal plane as the clamping height of the crystal held by the carrier 5; the platform lifting drive unit drives the platform lifting shaft to rise, thereby raising the temporary storage platform 71 until its bearing height is on the same horizontal plane as the clamping height of the crystal held by the carrier 5. Of course, the temporary storage platform 71 can also achieve the lifting and lowering movement in any other form, and the adjustment mechanism 72 can also be configured in other forms, as long as it can adjust the bearing height of the temporary storage device 7 so that the axis of the crystal carried on the temporary storage platform 71 is on the same horizontal plane as the axis of the crystal held by the carrier 5.

[0095] In some other embodiments, the adjustment mechanism 72 can also be disposed on the carrier 5. That is, the carrying height of the crystal by the temporary storage device 7 can be used as a reference. When the diameter of the crystal to be transferred is large, the adjustment mechanism can make the clamping height of the carrier 5 on the crystal decrease; when the diameter of the crystal to be transferred is small, the adjustment mechanism can make the clamping height of the carrier 5 on the crystal increase.

[0096] In one embodiment, the temporary storage device 7 includes a longitudinal moving device 73 for longitudinally moving the temporary storage platform 71 relative to the base 1. In one example, the longitudinal moving device 73 may include a longitudinal moving guide rail, a longitudinal moving lead screw, and a longitudinal moving drive motor disposed on the platform 10. The longitudinal moving drive motor drives the longitudinal moving lead screw to rotate, thereby moving the temporary storage platform 71 on the longitudinal moving guide rail. In other examples, the longitudinal moving device, in addition to including the longitudinal moving guide rail, may also be configured to include a longitudinal moving rack, a longitudinal moving gear, and a longitudinal moving gear drive motor. The longitudinal moving rack may be arranged parallel to the longitudinal moving guide rail. The longitudinal moving drive gear meshes with the longitudinal moving rack. The longitudinal moving gear drive motor is associated with the longitudinal moving gear. The longitudinal moving gear drive motor drives the connected longitudinal moving gear to rotate. Through the meshing of the longitudinal moving gear and the longitudinal moving rack, the temporary storage platform 71 is moved on the longitudinal moving guide rail.

[0097] In one embodiment, such as Figure 10As shown, the temporary storage device 7 also includes a clamp 73, which is disposed on the temporary storage platform 71 and includes a backrest 731 and a clamping arm (not shown). The clamping arm can move longitudinally relative to the backrest 731 to longitudinally clamp the end face of the crystal A. In this embodiment, the clamping arm is made movable, so that the clamp 73 can be used to clamp crystals of different lengths and diameters, improving the adaptability of the clamp.

[0098] In one embodiment, the backrest 731 is fixedly disposed longitudinally on one side of the temporary storage platform 71. In some embodiments, the contact surface between the backrest and the crystal A is further provided with an elastic element, such as a rubber pad. The elastic element can be attached to the end face of the crystal A, and while pressing the crystal A, it can buffer the crystal A and prevent damage to the crystal A.

[0099] In one embodiment, the clamping arm is longitudinally movably disposed near the other end of the temporary storage platform 71, for laterally opening to release the crystal A it carries and laterally pressing to fix the crystal A onto the temporary storage platform 71. In one example, the clamping arm includes a pressing part and a pressing drive unit. The pressing part is used to press against the other end face of the crystal A. The pressing part may also be provided with an elastic element, such as a rubber pad, for contact with the crystal A, thereby preventing mechanical damage to the crystal A. The pressing drive unit may include a lead screw and a drive motor, wherein the lead screw is associated with the pressing part, and the drive motor drives the lead screw to rotate forward and backward to drive the pressing part to move longitudinally, thereby achieving the pressing or releasing of the crystal A by the pressing part.

[0100] In some embodiments, the support can also be configured as a movable clamping arm. In this case, when both ends of the temporary storage platform 71 used to fix the crystal A are movable, the lead screw can be designed as a bidirectional lead screw, also known as a left-hand or right-hand threaded lead screw, with one end having a left-hand thread and the other end having a right-hand thread. Thus, by using the drive motor to drive the bidirectional lead screw to rotate in both directions, the support and the clamping arm can be driven to move in opposite directions longitudinally, thereby achieving longitudinal opening to release the crystal A and longitudinal clamping to fix the crystal A on the temporary storage platform 71.

[0101] Please see Figure 11 The image shown is a schematic diagram of the structure of a horizontal crystal grinding apparatus in another embodiment of this application, as follows: Figure 11 As shown, the horizontal crystal grinding equipment also includes a transport device 8, which is disposed on the base and spans both sides of the table 10. The transport device 8 is used to laterally transport the crystals to be processed from the temporary storage device 7 to the carrier 5 for grinding operations, or to place the ground crystals from the carrier 5 onto the temporary storage device 7 for unloading. As mentioned above, the transport device provided in this application only needs to generate horizontal movement to realize the transfer of crystals between the temporary storage device 7 and the carrier 5.

[0102] Please see Figure 12 The image shown is a schematic diagram of the transport device in one embodiment of this application. Figure 12 As shown, the transport device 8 includes a gantry frame 81, which spans across the carrier 5 and the temporary storage device 7 on opposite sides. In this embodiment, the transport device 8 also includes a clamping mechanism 82.

[0103] In one embodiment, the center of the clamping mechanism 82 of the transport device 8 is on the same horizontal plane as the clamping center of the carrier 5. In other words, when the transport device 8 clamps the crystal, the axis of the crystal is at the same height as the axis of the carrier 5 when clamping the crystal. This means that the transport device 8 only needs to move laterally to realize the transfer of the crystal between the temporary storage device 7 and the carrier 5, without any movement in the vertical direction.

[0104] To achieve lateral transport of parts, a transport translation mechanism 83 is provided on the gantry frame 81. In one example, the transport translation mechanism 83 includes a transport translation screw arranged laterally on the gantry frame 81 and a transport translation motor for driving the clamping mechanism 82 to move laterally on the transport translation screw.

[0105] Please see Figure 13 The image shown is a schematic diagram of the clamping mechanism in one embodiment of this application. Figure 13 As shown, the clamping mechanism 82 includes a first jaw 821, a second jaw 822, and a jaw driving unit 823. The first jaw 821 and the second jaw 822 are located on the first side and the second side of the clamping mechanism 82, respectively. The jaw driving unit 823 is used to drive the first jaw 821 and the second jaw 822 to open and close along the length direction of the crystal to clamp the crystal.

[0106] In one example, the gripper driving unit may include a gripper translation screw and a gripper translation drive motor. The gripper translation screw is connected to the first gripper 821 and the second gripper 822 along the crystal length direction, and the gripper translation drive motor is associated with the gripper translation screw. The gripper translation drive motor drives the gripper translation screw to rotate in both directions to achieve the opening and closing movement of the first gripper 821 and the second gripper 822 along the crystal length direction. For example, the gripper translation drive motor drives the gripper translation screw to rotate forward, driving the first gripper 821 and the second gripper 822 to move relative to each other along the gripper translation screw along the crystal length direction; the gripper translation drive motor drives the gripper translation screw to rotate in reverse, driving the first gripper 821 and the second gripper 822 to move in opposite directions along the gripper translation screw.

[0107] In another example, the gripper driving unit may include: a gripper translation rack, a gripper translation gear, and a gripper translation drive motor. The gripper translation rack is arranged along the crystal length direction on the first gripper 821 and the second gripper 822. The gripper translation gear meshes with the gripper translation rack. The gripper translation drive motor drives the gripper translation gear to rotate, causing the associated first gripper 821 and second gripper 822 to move along the gripper translation rack, thereby realizing the opening and closing movement of the first gripper 821 and the second gripper 822 along the crystal length direction. For example, the gripper translation drive motor drives the gripper translation gear to rotate clockwise, driving the first gripper 821 and the second gripper 822 to move relative to each other along the gripper translation rack along the crystal length direction; the gripper translation drive motor drives the gripper translation gear to rotate counterclockwise, driving the first gripper 821 and the second gripper 822 to move opposite to each other along the gripper translation rack along the crystal length direction.

[0108] In one embodiment, the clamping mechanism 82 is used to determine the center of the crystal. In one example, such as Figure 13 As shown, the first gripper 821 and the second gripper 822 are configured with a centrally symmetrical structure so that when the first gripper 821 and the second gripper 822 hold the crystal, the axis of the crystal automatically extends in the longitudinal direction. That is, the axis of the crystal held by the gripping mechanism 82, the axis of the crystal carried by the temporary storage device 7, and the axis of the crystal held by the carrier 5 are parallel to each other.

[0109] The following combination Figures 1 to 13 The process of rounding and grooving crystals using the horizontal crystal grinding equipment described in this application is explained in detail.

[0110] First, the clamping mechanism 82 of the transport device 8 laterally transfers the crystal located on the temporary storage table 71 to the carrier 5. The first clamp 53 and the second clamp 54 of the carrier 5 clamp the crystal's axis and move it to the rounding positioning grinding station 12 under the drive of the bearing drive assembly 512. The first grinding assembly 21 performs rough grinding on the crystal under the drive of the first lateral movement device 213. Subsequently, the second grinding assembly 22 performs fine grinding on the crystal under the drive of the second lateral movement device. After the rounding operation is completed, the carrier 5 moves the crystal to the crystal orientation detection station 11, where the crystal orientation detection device 3 detects and determines the crystal orientation. After the crystal orientation detection is completed, the carrier 5 moves the crystal to the positioning grinding station 13, where the third grinding assembly 41 performs grooving on the crystal under the drive of the third lateral movement device 413 and the lifting drive structure 415. Finally, the carrier 5 moves the crystal to the transport device 8, where the clamping mechanism 82 transfers the crystal on the carrier 5 to the temporary storage device 7 for unloading.

[0111] In summary, the horizontal crystal grinding equipment disclosed in this application divides the table of the machine base into a crystal orientation detection station, a rounding and positioning grinding station, and a positioning grinding station. Each station is equipped with a crystal orientation detection device, a rounding and positioning grinding device, and a positioning grinding device, respectively realizing crystal orientation detection, rounding and grooving processing of the crystal. This integrates the rounding and grooving processing of the crystal on the same setting, improves the crystal processing efficiency, avoids the transfer and repeated clamping of the crystal between different grinding equipment, reduces clamping and positioning errors, and ensures the processing quality of the crystal.

[0112] Furthermore, this application includes an adjustment mechanism in the temporary storage device used for loading and unloading crystals. This mechanism is compatible with crystals of various specifications and ensures that the carrying height of the temporary storage device on the crystal and the clamping height of the carrier on the crystal are on the same horizontal plane. This allows the transport device to transfer the crystal between the temporary storage device and the carrier simply by moving horizontally, thus shortening the time for loading and unloading crystals and improving the overall processing efficiency of the crystals. At the same time, it reduces the transfer error and ensures the processing quality of the crystals.

[0113] The above embodiments are merely illustrative of the inventive essence and beneficial effects of this application, and are not intended to limit this application. Any person skilled in the art can modify or alter the above embodiments without departing from the principles and scope of this application. Therefore, all equivalent modifications or alterations achieved by those skilled in the art without departing from the spirit and technical concept disclosed in this application should still be covered by the claims of this application.

Claims

1. A horizontal crystal grinding machine, characterized in that, include: The machine base includes a base body and a platform extending longitudinally from the proximal end to the distal end on the base body. The platform is provided with a crystal orientation detection station, a rounding positioning grinding station and a positioning grinding station arranged sequentially from the proximal end to the distal end. The platform is provided with a carrier for horizontally loading the crystal to be processed and moving it longitudinally. A rounding grinding device is provided at the rounding positioning grinding station, including a first grinding component provided on a first side of the table and a second grinding component provided on a second side of the table relative to the first grinding component, wherein the grinding wheel axis of the first grinding component and the second grinding component are parallel to the extension direction of the table. A crystal orientation detection device is installed at the crystal orientation detection station to detect and determine the crystal orientation of the rounded crystal; A positioning grinding device is disposed at the positioning grinding station, including a third grinding assembly for grinding the crystal according to a determined crystal orientation to form a positioning structure on the crystal, and the grinding wheel axis of the third grinding assembly is perpendicular to the extension direction of the table.

2. The horizontal crystal grinding equipment according to claim 1, characterized in that, It also includes a temporary storage device disposed on the base and located on the first side of the table for loading the crystal to be ground and unloading the crystal after grinding.

3. The horizontal crystal grinding equipment according to claim 2, characterized in that, The temporary storage device has an adjustment mechanism for accommodating crystals of various sizes, such that the height at which the temporary storage device supports the crystal and the height at which the carrier clamps the crystal are on the same horizontal plane.

4. The horizontal crystal grinding equipment according to claim 2 or 3, characterized in that, The temporary storage device includes: A temporary storage platform is mounted on the machine base, which can be raised and lowered and can move longitudinally, and is used to temporarily store crystals of different specifications for longitudinal loading or unloading. A clamp, disposed on the temporary storage platform, includes a support and a clamping arm that can move longitudinally relative to the support to longitudinally clamp the end face of the crystal.

5. The horizontal crystal grinding equipment according to claim 4, characterized in that, It also includes a conveying device disposed on the base and spanning both sides of the table, used to laterally transport the crystal to be processed on the temporary storage device to the carrier for grinding operation or to place the ground crystal from the carrier to the temporary storage device for unloading.

6. The horizontal crystal grinding equipment according to claim 5, characterized in that, The transport device includes a clamping mechanism for determining the center of the crystal.

7. The horizontal crystal grinding equipment according to claim 5, characterized in that, The center of the clamping mechanism of the transport device is on the same horizontal plane as the clamping center of the carrier.

8. The horizontal crystal grinding equipment according to claim 1, characterized in that, The crystal orientation detection device includes: The testing support, located near the end of the platform and vertically disposed on the second side of the platform, includes a frame that can move laterally to the carrier and a testing space formed on the frame for accommodating a crystal placed on the carrier. A ray orientation instrument, disposed in the frame, is used to emit orientation rays toward a crystal in the detection space to determine the crystal orientation of the crystal.

9. The horizontal crystal grinding equipment according to claim 1, characterized in that, The carrier includes a base disposed on the platform and capable of moving longitudinally along the platform, and a clamp disposed on the base for clamping and rotating the two end faces of the crystal.

10. The horizontal crystal grinding equipment according to claim 9, characterized in that, In the rolling grinding operation, the carrier drives the crystal to rotate in the opposite direction to the first grinding assembly or the second grinding assembly.

11. The horizontal crystal grinding equipment according to claim 10, characterized in that, In a positioning grinding operation, the carrier locks the crystal to keep it stationary until the third grinding assembly performs the positioning grinding operation.

12. The horizontal crystal grinding equipment according to claim 1, characterized in that, The first grinding assembly includes a first feed seat that can be moved laterally and a rough grinding spindle disposed on the first feed seat.

13. The horizontal crystal grinding equipment according to claim 1, characterized in that, The second grinding assembly includes a second feed seat that can be moved laterally and a fine grinding spindle disposed on the second feed seat.

14. The horizontal crystal grinding equipment according to claim 1, characterized in that, The third grinding assembly includes a third feed seat that can be laterally displaced and a spindle seat disposed on the third feed seat, wherein a slotted spindle that can be raised and lowered is disposed on the spindle seat.

15. The horizontal crystal grinding equipment according to claim 1, characterized in that, The third grinding assembly includes a third feed seat that can be laterally displaced and a spindle seat disposed on the third feed seat, wherein a faceted spindle that can be raised and lowered is disposed on the spindle seat.

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