A planet wheel with chip removal guide groove

Abstract

The utility model provides a kind of with the debris discharge guide groove of wandering star wheel, belong to wandering star wheel technical field. Including wandering star wheel main part, a plurality of placing holes for placing workpiece are set up in wandering star wheel main part, the upper surface of wandering star wheel main part is set up with multiple first guide grooves for discharging debris on the side of each placing hole away from the axis of wandering star wheel main part, the lower surface of wandering star wheel main part is set up with multiple second guide grooves corresponding to first guide groove at each placing hole, the outer lateral wall of wandering star wheel main part is set up with the discharge port being communicated with second guide groove, the first guide groove is equipped with the debris discharge hole between second guide groove, a plurality of first liquid leakage holes are set up in the upper surface of wandering star wheel main part. With the effect of improving workpiece processing quality.

Description

Technical Field

[0001] This utility model relates to the field of planetary wheel technology, and in particular to a planetary wheel with a chip removal guide groove. Background Technology

[0002] In the field of precision machining, especially in the double-sided grinding or polishing of hard and brittle materials such as semiconductor wafers, optical glass, ceramic substrates, and sapphire substrates, planetary wheels (also known as planetary gears or carrier disks) are widely used to carry workpieces and realize the planetary motion of workpieces between the upper and lower grinding disks to achieve high-precision planar machining results.

[0003] Traditional planetary wheels are typically disc-shaped with multiple through holes (placement holes) for placing workpieces. During machining, the planetary wheel is placed between upper and lower grinding discs, and the workpiece, aided by a grinding / polishing slurry, frictionally removes material from the grinding pads. However, in actual machining, a large amount of fine debris (such as shed abrasive particles and workpiece material fragments) is generated. If these debris cannot be discharged promptly, they easily accumulate around the workpiece or in the gap between the workpiece and the planetary wheel, causing scratches on the workpiece. Therefore, to facilitate debris removal and improve workpiece machining quality, a planetary wheel with chip removal guide grooves is needed. Utility Model Content

[0004] In view of the above problems, this utility model provides a planetary wheel with a chip removal guide groove.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows: A planetary gear with chip removal guide grooves is provided, including a planetary gear body. The planetary gear body has multiple placement holes for placing workpieces. On the upper surface of the planetary gear body, on the side away from the axis of the planetary gear body, multiple first guide grooves for discharging chips are formed. On the lower surface of the planetary gear body, multiple second guide grooves corresponding to the first guide grooves are formed at each placement hole. A discharge port communicating with the second guide grooves is formed on the outer wall of the planetary gear body. A chip removal hole is provided between the first guide grooves and the second guide grooves. Multiple first leakage holes are formed through the planetary gear body.

[0006] Furthermore, the upper surface of the planetary wheel body has a first annular groove for collecting debris at each placement hole, and each first annular groove is connected to the feed end of the corresponding first guide groove; the lower surface of the planetary wheel body has a second annular groove at each placement hole, and each second annular groove is connected to the feed end of the corresponding second guide groove.

[0007] Furthermore, the edge of the inner bottom wall of the first annular groove near the placement hole is higher than the edge of the other side so that the inner bottom wall of the first annular groove forms a first inclined surface.

[0008] Furthermore, the feed end of the first guide channel is higher than the discharge end so that the inner bottom wall of the first guide channel forms a second inclined surface, and the chip removal hole is opened at the discharge end of the first guide channel.

[0009] Furthermore, each first leakage hole is respectively disposed between two adjacent placement holes, a first connecting groove is disposed between the first leakage hole and the first guide grooves on both sides, and a second connecting groove is disposed between the first leakage hole and the second guide grooves on both sides.

[0010] Furthermore, the upper and lower surfaces of the planetary wheel body have arc-shaped chamfers at the edges of the placement holes.

[0011] Furthermore, a second leakage hole is provided through the axis of the planetary wheel body.

[0012] Furthermore, the surface of the planetary wheel body is coated with a wear-resistant layer.

[0013] Furthermore, the wear-resistant layer is a DLC coating.

[0014] The beneficial effects of this utility model are as follows: During the grinding process, the planetary wheel body rotates on its own axis and revolves around the sun. The grinding fluid can flush the debris from the upper surface of the workpiece into the first guide groove. Subsequently, the debris passes through the chip discharge hole and falls into the second guide groove below. Under the centrifugal force of the planetary wheel body, the debris can be discharged from the second guide groove to the discharge port. During grinding, some debris and waste liquid can also be discharged through multiple first drain holes. The planetary wheel with chip discharge guide groove of this application can quickly discharge the debris generated by the grinding of the workpiece through the first guide groove, the second guide groove and the first drain hole, avoiding the accumulation of debris around the workpiece and improving the processing quality of the workpiece. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of a planetary wheel with a chip removal guide groove according to an embodiment of this application.

[0016] Figure 2 for Figure 1 A magnified view of part A in the diagram.

[0017] Figure 3 This is a schematic diagram of the upper surface structure of a planetary wheel with a chip removal guide groove according to an embodiment of this application.

[0018] Figure 4 This is a schematic diagram of another perspective of a planetary wheel with a chip removal guide groove, according to an embodiment of this application.

[0019] Figure 5 This is a schematic diagram of the lower surface structure of a planetary wheel with a chip removal guide groove according to an embodiment of this application.

[0020] Among them, 1. Planetary wheel body; 11. Placement hole; 12. First guide groove; 121. First annular groove; 1211. First inclined surface; 1212. Second inclined surface; 13. Second guide groove; 131. Discharge port; 132. Second annular groove; 14. Chip removal hole; 15. First leakage hole; 16. First connecting groove; 17. Second connecting groove; 18. Arc chamfer; 19. Second leakage hole. Detailed Implementation

[0021] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods.

[0022] This application discloses a planetary wheel with a chip removal guide groove, referring to... Figures 1-5 The system includes a planetary gear body 1, which has multiple placement holes 11 for placing workpieces. On the upper surface of the planetary gear body 1, on the side of each placement hole 11 away from the axis of the planetary gear body 1, there are multiple first guide channels 12 for discharging debris. On the lower surface of the planetary gear body 1, at each placement hole 11, there are multiple second guide channels 13 corresponding to the first guide channels 12. An outlet 131 communicating with the second guide channels 13 is provided on the outer wall of the planetary gear body 1. A chip removal hole 14 is provided between the first guide channels 12 and the second guide channels 13. Multiple first leakage holes 15 are provided through the planetary gear body 1.

[0023] In this embodiment, when the planetary wheel body 1 is placed inside the grinding machine, its lower surface contacts the lower grinding disc, and its upper surface faces the upper grinding disc. During the grinding process, the planetary wheel body 1 rotates and revolves, and the grinding fluid can flush the debris from the workpiece's upper surface into the first guide groove 12. Subsequently, the debris passes through the chip discharge hole 14 and falls into the lower second guide groove 13. Under the centrifugal force of the planetary wheel body 1, the debris can be discharged from the second guide groove 13 to the discharge port 131. During grinding, some debris and waste fluid can also be discharged through multiple first drain holes 15. The planetary wheel with chip discharge guide groove of this application can quickly discharge the debris generated during workpiece grinding through the first guide groove 12, the second guide groove 13, and the first drain hole 15, avoiding the accumulation of debris around the workpiece and improving the workpiece processing quality.

[0024] Furthermore, the upper surface of the planetary wheel body 1 is provided with a first annular groove 121 for collecting debris at each placement hole 11, and each first annular groove 121 is connected to the feed end of the corresponding first guide groove 12. The lower surface of the planetary wheel body 1 is provided with a second annular groove 132 at each placement hole 11, and each second annular groove 132 is connected to the feed end of the corresponding second guide groove 13.

[0025] In this embodiment, some of the debris generated during grinding of the upper surface of the workpiece can be collected in the first annular groove 121 and flow along the first guide groove 12 under the centrifugal force of the planetary wheel body 1. Then, under gravity, it passes through the chip discharge hole 14 and flows to the lower second guide groove 13. Since the outlet 131 of the second guide groove 13 is located on the side wall of the planetary wheel body 1, the debris generated during grinding of the lower surface of the workpiece can be directly collected in the second annular groove 132 and thrown outwards along the second guide groove 13 under centrifugal force. This further improves the chip removal effect of the planetary wheel body 1.

[0026] Furthermore, the inner bottom wall of the first annular groove 121 is such that the edge on one side near the placement hole 11 is higher than the edge on the other side, so that the inner bottom wall of the first annular groove 121 forms a first inclined surface 1211.

[0027] In this embodiment of the application, the debris generated by grinding the upper surface of the workpiece can flow down the side wall of the workpiece into the first annular groove 121 under the action of gravity, and then flow into the first guide groove 12 along the first inclined surface 1211, which further improves the removal effect of debris.

[0028] In order to facilitate the discharge of debris from the first guide channel 12 to the second guide channel 13, the feed end of the first guide channel 12 is higher than the discharge end so that the inner bottom wall of the first guide channel 12 forms a second inclined surface 1212, and the chip discharge hole 14 is opened at the discharge end of the first guide channel 12.

[0029] Furthermore, each first leakage hole 15 is respectively disposed between two adjacent placement holes 11, a first connecting groove 16 is disposed between the first leakage hole 15 and the first guide grooves 12 on both sides, and a second connecting groove 17 is disposed between the first leakage hole 15 and the second guide grooves 13 on both sides.

[0030] In this embodiment, some debris in the first guide channel 12 can enter the first drain hole 15 along the first connecting channel 16, and then enter the second guide channel 13 along the second connecting channel 17 from the second drain hole 19, and finally be discharged from the discharge port 131, which can further improve the chip removal effect of the planetary wheel body 1.

[0031] Furthermore, the upper and lower surfaces of the planetary wheel body 1 are provided with arc-shaped chamfers 18 at the edges of the placement holes 11.

[0032] In this embodiment, the design of the arc chamfer 18 can prevent the edge of the workpiece from colliding or rubbing against the sharp corner of the hole wall of the placement hole 11, thereby avoiding chipping, scratches or micro-cracks on the workpiece and improving the workpiece processing quality.

[0033] To further improve the chip removal effect of the planetary wheel body 1, a second drain hole 19 is provided through the axis of the planetary wheel body 1.

[0034] To improve the service life of the planetary wheel body 1, the surface of the planetary wheel body 1 is coated with a wear-resistant layer.

[0035] In the embodiments of this application, the wear-resistant layer is a DLC coating.

[0036] The implementation principle of a planetary wheel with chip removal guide groove in this application embodiment is as follows: During the grinding process, the planetary wheel body 1 rotates on its own axis and revolves around the sun. The grinding fluid can flush the chips ground from the upper surface of the workpiece into the first guide groove 12. Subsequently, the chips pass through the chip removal hole 14 and fall into the second guide groove 13 below. Under the centrifugal force of the planetary wheel body 1, the chips can be discharged from the second guide groove 13 to the discharge port 131. During grinding, some chips and waste liquid can also be discharged through multiple first leakage holes 15, which avoids the accumulation of chips around the workpiece and has the effect of improving the processing quality of the workpiece.

[0037] Those skilled in the art will understand that although preferred embodiments of the present invention have been described, those skilled in the art, once they understand the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the present invention. Clearly, those skilled in the art can make various alterations and modifications to the present invention without departing from its spirit and scope. Thus, if these modifications and modifications of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention also intends to include these modifications and modifications.

Claims

1. A planetary gear with chip removal guide grooves, characterized in that: The system includes a planetary gear body (1), which has multiple placement holes (11) for placing workpieces. On the upper surface of the planetary gear body (1), there are multiple first guide channels (12) for discharging debris on the side of each placement hole (11) away from the axis of the planetary gear body (1). On the lower surface of the planetary gear body (1), there are multiple second guide channels (13) corresponding to the first guide channels (12) at each placement hole (11). On the outer wall of the planetary gear body (1), there is a discharge port (131) communicating with the second guide channels (13). There is a chip discharge hole (14) between the first guide channels (12) and the second guide channels (13). Multiple first leakage holes (15) are opened through the planetary gear body (1).

2. A planetary gear with a chip removal guide groove according to claim 1, characterized in that: The upper surface of the planetary wheel body (1) is provided with a first annular groove (121) for collecting debris at each placement hole (11), and each first annular groove (121) is connected to the feed end of the corresponding first guide groove (12); the lower surface of the planetary wheel body (1) is provided with a second annular groove (132) at each placement hole (11), and each second annular groove (132) is connected to the feed end of the corresponding second guide groove (13).

3. A planetary gear with a chip removal guide groove according to claim 2, characterized in that: The inner bottom wall of the first annular groove (121) has one edge near the placement hole (11) higher than the other edge so that the inner bottom wall of the first annular groove (121) forms a first inclined surface (1211).

4. A planetary gear with a chip removal guide groove according to claim 2, characterized in that: The feed end of the first guide channel (12) is higher than the discharge end so that the inner bottom wall of the first guide channel (12) forms a second inclined surface (1212), and the chip discharge hole (14) is opened at the discharge end of the first guide channel (12).

5. A planetary gear with a chip removal guide groove according to claim 1, characterized in that: Each of the first leakage holes (15) is respectively disposed between two adjacent placement holes (11), and a first connecting groove (16) is provided between the first leakage hole (15) and the first guide grooves (12) on both sides, and a second connecting groove (17) is provided between the first leakage hole (15) and the second guide grooves (13) on both sides.

6. A planetary gear with a chip removal guide groove according to claim 1, characterized in that: The upper and lower surfaces of the planetary wheel body (1) have arc-shaped chamfers (18) at the edges of the placement holes (11).

7. A planetary gear with a chip removal guide groove according to claim 1, characterized in that: The planetary wheel body (1) has a second leakage hole (19) through the axis.

8. A planetary gear with a chip removal guide groove according to claim 1, characterized in that: The surface of the planetary wheel body (1) is coated with a wear-resistant layer.

9. A planetary gear with a chip removal guide groove according to claim 8, characterized in that: The wear-resistant layer is a DLC coating.

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