Mechanical hand mechanism and transport device

Abstract

The application provides a mechanical hand mechanism and a conveying device. The mechanical hand mechanism comprises a slide rail assembly, a first mechanical arm and a second mechanical arm. The first mechanical arm comprises a first connecting seat, a first connecting block, a first connecting plate and a first adsorption bearing part which are sequentially and flexibly connected. The first connecting plate extends at least partially in the opposite direction of the second direction. The second mechanical arm comprises a second connecting seat, a second connecting block, a second connecting plate and a second adsorption bearing part which are sequentially and flexibly connected. The second connecting seat is connected with the second slide rail. The second connecting plate extends at least partially in the second direction. The first adsorption bearing part is higher than the second adsorption bearing part. In the second direction, the length of the first connecting plate is greater than the length of the second connecting plate. The mechanical hand mechanism is provided with double mechanical hands, so that the efficiency of wafer conveying work can be improved. The length of the first connecting plate is greater than the length of the second connecting plate, so that the wafer conveyed by the second mechanical arm can be prevented from interfering with the first mechanical arm, and the working stability of the mechanical hand mechanism can be improved.

Description

Technical Field

[0001] This application relates to the field of wafer inspection technology, specifically to a robotic arm mechanism and a transport device. Background Technology

[0002] In the field of wafer inspection technology, a probe station is an important piece of equipment used for electrical performance testing of wafers. It consists of a precision mechanical structure, high-performance probe tips, and electrical performance testing instruments. Furthermore, a transport device is typically used in the probe station for loading and unloading wafers, that is, for taking out or placing wafers.

[0003] Transport devices typically include robotic arms for picking up and moving wafers; however, in related technologies, the wafer picking and placing efficiency of robotic arms is relatively low. Utility Model Content

[0004] The purpose of this application is to provide a robotic arm mechanism and a transport device to solve the technical problem of low wafer pick-and-place efficiency in related technologies.

[0005] In a first aspect, this application provides a robotic arm mechanism for transporting a sample to be tested, the robotic arm mechanism comprising: A slide rail assembly extends along a first direction, the slide rail assembly including a first slide rail and a second slide rail spaced apart along a second direction, the second direction being perpendicular to the first direction; A first robotic arm, slidably connected to a first slide rail, includes a first connecting seat, a first connecting block, a first connecting plate, and a first adsorption-bearing portion sequentially bent and connected. The first connecting seat is connected to the first slide rail and extends along a second direction. The first connecting block extends along a third direction. The first connecting plate extends at least partially in the opposite direction to the second direction. The first adsorption-bearing portion extends along the first direction. The third direction is perpendicular to both the first and second directions. A second robotic arm is slidably connected to a second slide rail. The second robotic arm includes a second connecting seat, a second connecting block, a second connecting plate, and a second adsorption bearing portion that are bent and connected in sequence. The second connecting seat is connected to the second slide rail and extends in the opposite direction to the second direction. The second connecting block extends in a third direction. The second connecting plate extends at least partially in the second direction. The second adsorption bearing portion extends in the first direction. In the third direction, the first adsorption bearing portion is higher than the second adsorption bearing portion. In the second direction, the length of the first connecting plate is greater than the length of the second connecting plate.

[0006] In the robotic arm mechanism provided in this application, a slide rail assembly extends along a first direction. The slide rail assembly includes a first slide rail and a second slide rail spaced apart along a second direction. A first robotic arm is slidably connected to the first slide rail. The first robotic arm includes a first connecting seat, a first connecting block, a first connecting plate, and a first adsorption support portion that are bent and connected in sequence. The first connecting seat is connected to the first slide rail and extends along the second direction. The first connecting block extends along a third direction. The first connecting plate extends at least partially along the opposite direction of the second direction. The first adsorption support portion extends along the first direction. A second robotic arm is slidably connected to the second slide rail. The second robotic arm includes a second connecting seat, a second connecting block, a second connecting plate, and a second adsorption support portion that are bent and connected in sequence. The second connecting seat is connected to the second slide rail and extends along the opposite direction of the second direction. The second connecting block extends along a third direction. The second connecting plate extends at least partially along the second direction. The second adsorption support portion extends along the first direction. In the third direction, the first adsorption support portion is higher than the second adsorption support portion. In the second direction, the length of the first connecting plate is greater than the length of the second connecting plate. Either the first or second robotic arm can move into the wafer storage device to retrieve a wafer, and the other robotic arm can also move into the wafer storage device to place a wafer. This dual-arm configuration enables more efficient wafer transport. Furthermore, the length of the first connecting plate is greater than the length of the second connecting plate. The first connecting plate, the first connecting block, and the first connecting seat are bent to form a reserved space for accommodating the wafer. This prevents interference between the wafer transported by the second robotic arm and the first robotic arm when both are transporting wafers, thereby improving the working efficiency and stability of both robotic arms.

[0007] The first connecting block includes a first channel disposed along the third direction; the first connecting plate includes a connected first main body and a first extension; the first main body extends in the opposite direction to the second direction; the first extension extends in the first direction; the first extension includes a second channel disposed along the first direction; one end of the first main body away from the first extension is connected to the first connecting block; one end of the first extension away from the first main body is connected to the first adsorption support; the first adsorption support includes a connected first vacuum channel and a plurality of first vacuum adsorption holes; the first vacuum channel is connected to the second channel. The robotic arm mechanism further includes a first negative pressure component, which includes a first negative pressure pipe, a first adapter nozzle, a second adapter nozzle, a first connecting pipe, and a third adapter nozzle connected in series. The first adapter nozzle and the second adapter nozzle are respectively located at opposite ends of the first connecting block along the third direction and are respectively connected to the first channel. The third adapter nozzle is located at the end of the first main body away from the first connecting block. The first connecting pipe extends along the second direction and is respectively connected to the second adapter nozzle and the third adapter nozzle. The third adapter nozzle is connected to the second channel.

[0008] The first extension includes a first through hole disposed along the third direction, the first through hole communicating with the second channel; the first adsorption bearing includes a second through hole disposed along the third direction, the second through hole communicating with the first vacuum flow; the second through holes are disposed corresponding to the first through hole and communicating with each other, so that the second channel communicates with the first vacuum flow channel. The first robotic arm further includes a first pad and a first fixing plate. The first extension, the first adsorption bearing part, the first pad and the first fixing plate are arranged in sequence. The first fixing plate and the first extension are fixed by screws to limit the first adsorption bearing part and the first pad.

[0009] The first robotic arm includes multiple protrusions, which are arranged around the first vacuum adsorption hole and are used to support the sample to be tested.

[0010] The first robotic arm further includes a first leveling assembly, which is located at one end of the first main body near the first connecting block. The first leveling assembly includes a plurality of first leveling components and a plurality of second leveling components. The first leveling components pass through the first main body and are threadedly connected to the first connecting block, and the second leveling components pass through the first main body and abut against the first connecting block. The number of the first leveling components corresponds to the number of the second leveling components. There are three first leveling components, and the installation positions of the three first leveling components form a triangle vertex distribution. There are also three second leveling components, and the installation positions of the three second leveling components form a triangle vertex distribution. The second leveling components and the first leveling components are arranged adjacent to each other.

[0011] The second connecting block includes a third channel arranged along the second direction; the second connecting plate includes a connected second main body and a second extension; the second main body extends along the second direction; the second extension extends along the first direction; the second extension includes a fourth channel arranged along the first direction; one end of the second main body away from the second extension is connected to the second connecting block; one end of the second extension away from the second main body is connected to the second adsorption support; the second adsorption support includes a connected second vacuum channel and a plurality of second vacuum adsorption holes; the second vacuum channel is connected to the fourth channel. The robotic arm mechanism further includes a second negative pressure component, which includes a second negative pressure pipe, a fourth adapter nozzle, a fifth adapter nozzle, a second connecting pipe, and a sixth adapter nozzle connected in series. The fourth adapter nozzle and the fifth adapter nozzle are respectively located at opposite ends of the second connecting block along the second direction and are respectively connected to the third channel. The sixth adapter nozzle is located at the end of the second main body away from the second connecting block. The second connecting pipe extends along the second direction and connects the fifth adapter nozzle and the sixth adapter nozzle respectively. The sixth adapter nozzle is connected to the fourth channel.

[0012] The second extension includes a third through hole disposed along the third direction, the third through hole communicating with the fourth channel; the second adsorption support includes a fourth through hole disposed along the third direction, the fourth through hole communicating with the second vacuum flow; the third through hole is disposed corresponding to the fourth through hole and communicates with each other, so that the fourth channel communicates with the second vacuum flow channel. The second robotic arm also includes a second pad and a second fixing plate. The second extension, the second adsorption bearing part, the second pad and the second fixing plate are arranged in sequence. The second fixing plate and the second extension are fixed by screws to limit the second adsorption bearing part and the second pad.

[0013] The second robotic arm includes multiple suction cups, each suction cup corresponding to a multiple second vacuum suction hole.

[0014] The second robotic arm further includes a second leveling assembly, which is located at one end of the second main body near the second connecting block. The second leveling assembly includes a plurality of third leveling components and a plurality of fourth leveling components. The third leveling components pass through the second main body and are threadedly connected to the second connecting block. The fourth leveling components pass through the second main body and abut against the second connecting block. The number of the third leveling components corresponds to the number of the fourth leveling components. There are three third leveling components, and the installation positions of the three third leveling components form a triangle vertices distribution. There are also three fourth leveling components, and the installation positions of the three fourth leveling components form a triangle vertices distribution. The third and fourth leveling components are arranged adjacent to each other.

[0015] Secondly, this application provides a transportation device, which includes a rotating mechanism, a lifting mechanism, and the robotic arm mechanism. The rotating mechanism is connected to the robotic arm mechanism and is used to drive the robotic arm mechanism to rotate. The lifting mechanism carries the rotating mechanism and is used to drive the rotating mechanism and the robotic arm mechanism to move in a third direction and the opposite direction of the third direction. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Figure 1 This is a schematic diagram of the structure of a transportation device provided in an embodiment of this application; Figure 2 This is a schematic diagram of the structure of a robotic arm mechanism provided in an embodiment of this application; Figure 3 This is an exploded structural diagram of a robotic arm mechanism provided in an embodiment of this application; Figure 4 This is a schematic diagram of the structure of a first robotic arm provided in an embodiment of this application; Figure 5 This is an exploded structural diagram of a first robotic arm provided in an embodiment of this application; Figure 6 This is a schematic diagram of the structure of a second robotic arm provided in an embodiment of this application; Figure 7 This is an exploded structural diagram of a second robotic arm provided in an embodiment of this application; Figure 8 yes Figure 5 Enlarged structural diagram of region A in the middle; Figure 9 This is a schematic diagram of the structure of a first connecting plate, a first connecting block, and a first leveling component provided in an embodiment of this application; Figure 10 This is a schematic diagram of the structure of a second connecting plate, a second connecting block, and a second leveling component provided in an embodiment of this application.

[0017] Label Explanation: The system comprises: a robotic arm mechanism 100, a slide rail assembly 10, a first slide rail 11, a second slide rail 12, a first robotic arm 20, a first connecting seat 21, a first connecting block 22, a first connecting plate 23, a first main body 231, a first extension 232, a first through hole 233, a first adsorption bearing part 24, a first vacuum adsorption hole 241, a second through hole 242, a first gasket 25, a first fixing plate 26, a protrusion 27, a first leveling component 281, a second leveling component 282, a second robotic arm 30, a second connecting seat 31, a second connecting block 32, and a second connecting plate. Plate 33, second main body 331, second extension 332, third through hole 333, second adsorption bearing part 34, second vacuum adsorption hole 342, second gasket 35, second fixing plate 36, suction cup 37, third leveling component 381, fourth leveling component 382, ​​first negative pressure pipe 41, first adapter air nozzle 42, second adapter air nozzle 43, third adapter air nozzle 44, second negative pressure pipe 51, fourth adapter air nozzle 52, fifth adapter air nozzle 53, sixth adapter air nozzle 54, rotating mechanism 200, lifting mechanism 300, and transport device 1000. Detailed Implementation

[0018] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0019] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0020] In this specification, for convenience, terms such as "middle," "upper," "lower," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer" are used to indicate orientation or positional relationships in conjunction with the accompanying drawings. This is solely for the purpose of facilitating the description and simplification, and does not imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this disclosure. The positional relationships of the constituent elements may be appropriately varied depending on the orientation of the constituent elements being described. Therefore, the use of terms not limited to those described in the specification may be appropriately replaced as needed.

[0021] In this specification, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they may refer to a fixed connection, a detachable connection, or an integral connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection via an intermediate component, or a connection within two components. Those skilled in the art will understand the meaning of these terms in this disclosure as appropriate.

[0022] In the field of wafer inspection technology, a probe station is an important piece of equipment used for electrical performance testing of wafers. It consists of a precision mechanical structure, high-performance probe tips, and electrical performance testing instruments. Furthermore, a transport device is typically used in the probe station for loading and unloading wafers, that is, for taking out or placing wafers.

[0023] Transport devices typically include robotic arms for picking up and moving wafers; however, in related technologies, the wafer picking and placing efficiency of robotic arms is relatively low.

[0024] Please refer to Figures 1 to 3 , Figure 1 This is a schematic diagram of the structure of a transportation device provided in an embodiment of this application. Figure 2 This is a schematic diagram of the structure of a robotic arm mechanism provided in an embodiment of this application. Figure 3 This is an exploded structural diagram of a robotic arm mechanism provided in an embodiment of this application.

[0025] This application provides a robotic arm mechanism 100 to solve the technical problem of low wafer pick-and-place efficiency in related technologies.

[0026] The robotic arm mechanism 100 provided in this application is used to transport samples to be tested. It should be noted that the robotic arm mechanism 100 is applied in a transport device 1000. In one embodiment, when the transport device 1000 is applied in the field of wafer inspection technology, the sample to be tested is a wafer. In other embodiments, the transport device 1000 can also be applied in other fields, and the sample to be tested transported by the robotic arm mechanism 100 can be other components. This application uses a wafer as an example for illustration and should not be construed as a limitation of this application.

[0027] The robotic arm mechanism 100 includes a slide rail assembly 10, a first robotic arm 20, and a second robotic arm 30. The first robotic arm 20 and the second robotic arm 30 are mounted on the slide rail assembly 10. Both the first robotic arm 20 and the second robotic arm 30 can be used to carry the wafer, and both can slide along the slide rail assembly 10 to move the wafer.

[0028] The robotic arm mechanism 100 includes a first robotic arm 20 and a second robotic arm 30. Optionally, when the robotic arm mechanism 100 retrieves a wafer from the wafer storage device, either the first robotic arm 20 or the second robotic arm 30 can move into the wafer storage device to retrieve the wafer. At the same time, the other robotic arm can also move into the wafer storage device and place the wafer.

[0029] Optionally, when the robotic arm mechanism 100 places the wafer to be tested onto the chuck of the probe station, either the first robotic arm 20 or the second robotic arm 30 can move to the position of the chuck to remove the tested wafer. Simultaneously, the other robotic arm can also move to the position of the chuck and place the wafer to be tested. In this embodiment, the robotic arm mechanism 100, with its dual robotic arms, can achieve more efficient wafer transport.

[0030] The slide rail assembly 10 extends along a first direction D1, and the slide rail assembly 10 includes a first slide rail 11 and a second slide rail 12 spaced apart along a second direction D2, wherein the second direction D2 is perpendicular to the first direction D1.

[0031] Please refer to the above as well. Figure 4 and Figure 5 , Figure 4 This is a schematic diagram of the structure of a first robotic arm provided in an embodiment of this application. Figure 5 This is an exploded structural diagram of a first robotic arm according to an embodiment of this application. The first robotic arm 20 is slidably connected to the first slide rail 11. The first robotic arm 20 includes a first connecting seat 21, a first connecting block 22, a first connecting plate 23, and a first adsorption bearing part 24 that are bent and connected in sequence. The first connecting seat 21 is connected to the first slide rail 11 and extends along the second direction D2. The first connecting block 22 extends along the third direction D3. The first connecting plate 23 extends at least partially in the opposite direction of the second direction D2. It can be understood that the first connecting plate 23 and the first connecting seat 21 are located on the same side of the first connecting block 22, wherein the third direction D3 is perpendicular to both the first direction D1 and the second direction D2.

[0032] The first adsorption support portion 24 extends along the first direction D1 and is used to support the wafer. The first connecting seat 21 is used to connect to the slider on the first slide rail 11 and slides to connect to the first slide rail 11 through the slider, thereby driving the first connecting block 22, the first connecting plate 23 and the first adsorption support portion 24 to move along the first direction D1.

[0033] In this embodiment, the first adsorption bearing portion 24 of the first robotic arm 20 is slidably connected to the first slide rail 11 via the first connecting plate 23, the first connecting block 22, and the first connecting seat 21, which is connected by bending. This helps to improve the stability of the first robotic arm 20 on the first slide rail 11 and improves the structural stability of the first robotic arm 20 in picking up, placing, and transporting the wafer.

[0034] Please refer to the above as well. Figure 6 and Figure 7 , Figure 6 This is a schematic diagram of the structure of a second robotic arm provided in an embodiment of this application. Figure 7 This is an exploded structural diagram of a second robotic arm according to an embodiment of this application. The second robotic arm 30 is slidably connected to the second slide rail 12. The second robotic arm 30 includes a second connecting seat 31, a second connecting block 32, a second connecting plate 33, and a second adsorption bearing part 34 that are bent and connected in sequence. The second connecting seat 31 is connected to the second slide rail 12 and extends in the opposite direction to the second direction D2. The second connecting block 32 extends in the third direction D3. The second connecting plate 33 extends at least partially in the second direction D2. It can be understood that the second connecting plate 33 and the second connecting seat 31 are located on the same side of the second connecting block 32.

[0035] The second adsorption support portion 34 extends along the first direction D1, and the second adsorption support portion 34 is used to support the wafer. The second connecting seat 31 is used to connect to the slider on the second slide rail 12, and slides to connect to the second slide rail 12 through the slider, and drives the second connecting block 32, the second connecting plate 33 and the second adsorption support portion 34 to move along the first direction D1.

[0036] In this embodiment, the second adsorption bearing portion 34 of the second robotic arm 30 is slidably connected to the second slide rail 12 via the second connecting plate 33, the second connecting block 32, and the second connecting seat 31, which is connected by bending. This helps to improve the stability of the second robotic arm 30 on the second slide rail 12 and improve the structural stability of the second robotic arm 30 in picking up, placing, and transporting the wafer.

[0037] It should be noted that in this embodiment, the first robotic arm 20 is the upper robotic arm and the second robotic arm 30 is the lower robotic arm. In other words, the second robotic arm 30 and the first robotic arm 20 are arranged along the third direction D3. Therefore, on the third direction D3, the size of the first connecting block 22 is larger than the size of the second connecting block 32, so that the height of the first adsorption support 24 is higher than that of the second adsorption support 34.

[0038] Furthermore, in the second direction D2, the length of the first connecting plate 23 is greater than the length of the second connecting plate 33, so that when the second connecting plate 33 carries the wafer, even if the wafer is large, the first robotic arm 20 will not interfere with the wafer. In other words, the first connecting plate 23, the first connecting block 22, and the first connecting seat 21 are bent to form a reserved space, which can be used to accommodate the wafer, so as to avoid interference between the wafer transported by the second robotic arm 30 and the first robotic arm 20 when both the first robotic arm 20 and the second robotic arm 30 are transporting the wafer, thereby improving the working efficiency and stability of the first robotic arm 20 and the second robotic arm 30.

[0039] In the robotic arm mechanism 100 provided in this application, the slide rail assembly 10 extends along a first direction D1. The slide rail assembly 10 includes a first slide rail 11 and a second slide rail 12 spaced apart along a second direction D2. A first robotic arm 20 is slidably connected to the first slide rail 11. The first robotic arm 20 includes a first connecting seat 21, a first connecting block 22, a first connecting plate 23, and a first adsorption bearing portion 24, which are sequentially bent and connected. The first connecting seat 21 is connected to the first slide rail 11 and extends along the second direction D2. The first connecting block 22 extends along a third direction D3. The first connecting plate 23 extends at least partially along the opposite direction of the second direction D2. The first adsorption bearing portion 24 extends along the first direction D1. The second robotic arm 30 is slidably connected to the second slide rail 12. The second robotic arm 30 includes a second connecting seat 31, a second connecting block 32, a second connecting plate 33, and a second adsorption bearing portion 34, which are bent and connected in sequence. The second connecting seat 31 is connected to the second slide rail 12 and extends in the opposite direction to the second direction D2. The second connecting block 32 extends in the third direction D3. The second connecting plate 33 extends at least partially in the second direction D2. The second adsorption bearing portion 34 extends in the first direction D1. In the third direction D3, the first adsorption bearing portion 24 is higher than the second adsorption bearing portion 34. In the second direction D2, the length of the first connecting plate 23 is greater than the length of the second connecting plate 33. Either the first robotic arm 20 or the second robotic arm 30 can move into the wafer storage device to retrieve a wafer. The other robotic arm 30 can also move into the wafer storage device to place a wafer. The robotic arm mechanism 100, with its dual robotic arms, can achieve more efficient wafer transport. Furthermore, the length of the first connecting plate 23 is greater than the length of the second connecting plate 33. The first connecting plate 23, the first connecting block 22, and the first connecting seat 21 are bent to form a reserved space for accommodating the wafer. This can prevent interference between the wafer transported by the second robotic arm 30 and the first robotic arm 20 when both the first robotic arm 20 and the second robotic arm 30 are transporting the wafer, thereby improving the working efficiency and stability of the first robotic arm 20 and the second robotic arm 30.

[0040] In this embodiment, the first robotic arm 20 adsorbs and fixes the wafer by forming a vacuum or negative pressure on the surface of the robotic arm, and the second robotic arm 30 adsorbs and fixes the wafer by forming a vacuum or negative pressure on the surface of the robotic arm.

[0041] Specifically, in this embodiment, the first connecting block 22 includes a first channel disposed along the third direction D3, the first connecting plate 23 includes a connected first main body 231 and a first extension 232, the first main body 231 extends in the opposite direction to the second direction D2, the first extension 232 extends in the first direction D1, the first extension 232 includes a second channel disposed along the first direction D1, one end of the first main body 231 away from the first extension 232 is connected to the first connecting block 22, and one end of the first extension 232 away from the first main body 231 is connected to the first adsorption support 24, the first adsorption support 24 includes a connected first vacuum channel and a plurality of first vacuum adsorption holes 241, the first vacuum channel is connected to the second channel.

[0042] The robotic arm mechanism 100 further includes a first negative pressure component, which includes a first negative pressure pipe 41, a first adapter nozzle 42, a second adapter nozzle 43, a first connecting pipe (not shown), and a third adapter nozzle 44 connected together. The first adapter nozzle 42 and the second adapter nozzle 43 are respectively located at opposite ends of the first connecting block 22 along the third direction D3 and are respectively connected to the first channel. The third adapter nozzle 44 is located at the end of the first main body 231 away from the first connecting block 22. The first connecting pipe extends along the second direction D2 and connects the second adapter nozzle 43 and the third adapter nozzle 44 respectively. The third adapter nozzle 44 is connected to the second channel.

[0043] The first connecting block 22 has the first channel inside, which is used for airflow, and the first extension 232 has the second channel inside, which is also used for airflow.

[0044] Please refer to Figures 1 to 4 Furthermore, in this embodiment, the first extension 232 includes a first through hole 233 disposed along the third direction D3, the first through hole 233 communicating with the second channel, and the first adsorption support portion 24 includes a second through hole 242 disposed along the third direction D3, the second through hole 242 communicating with the first vacuum flow, the second through hole 242 being disposed corresponding to the first through hole 233 and communicating with each other, so that the second channel communicating with the first vacuum flow channel.

[0045] The vacuuming channels of the first robotic arm 20 are, in sequence, the first negative pressure pipe 41, the first adapter nozzle 42, the first channel of the first connecting block 22, the second adapter nozzle 43, the first connecting pipe, the third adapter nozzle 44, the second channel of the first extension 232, the first vacuum flow channel, and a plurality of first vacuum adsorption holes 241. The vacuuming path of the first robotic arm 20 can be set along the shape of the first robotic arm 20, so that the vacuuming path of the first robotic arm 20 can also form a reserved space. The reserved space can be used to accommodate the wafer and avoid interference between the wafer transported by the second robotic arm 30 and the vacuuming device of the first robotic arm 20, so as to improve the working efficiency and stability of the first robotic arm 20 and the second robotic arm 30.

[0046] Furthermore, in this embodiment, a first annular groove is provided on the outer periphery of the first through hole 233. The first annular groove can be used to place an annular seal to seal the gap between the first connecting plate 23 and the first adsorption support part 24, so that the second channel of the first connecting plate 23 and the first vacuum flow channel of the first adsorption support part 24 are in close communication.

[0047] Furthermore, in this embodiment, there are multiple first negative pressure tubes 41, and these multiple first negative pressure tubes 41 can be connected to each other, so that the first robotic arm 20 can easily drive the multiple first negative pressure tubes 41 to move synchronously while moving. It should be noted that in this embodiment, one of the first negative pressure tubes 41 is located at the foremost position in the first direction D1. This first negative pressure tube 41 is a schematic diagram illustrating the position of the first negative pressure tube 41 after the first robotic arm 20 moves to the foremost position along the first direction D1, and should not be construed as a limitation of this application.

[0048] Optionally, in this embodiment, the number of the first vacuum adsorption holes 241 is three, and the three first vacuum adsorption holes 241 are arranged in a triangle at the three vertices, so that the three first vacuum adsorption holes 241 can adsorb the entire surface of the wafer, thereby improving the firmness and stability of the first robotic arm 20 in adsorbing the wafer. Optionally, in other embodiments, the number of the first vacuum adsorption holes 241 may also be two, four, five, or more than five, and this application does not impose any limitation on this.

[0049] In this embodiment, the first robotic arm 20 further includes a first pad 25 and a first fixing plate 26. The first extension 232, the first adsorption bearing portion 24, the first pad 25, and the first fixing plate 26 are arranged sequentially. The first fixing plate 26 and the first extension 232 are fixed by screws to limit the first adsorption bearing portion 24 and the first pad 25, thereby fixing the first adsorption bearing portion 24 and avoiding directly fixing the first adsorption bearing portion 24 and the first connecting plate 23 to avoid damaging the first adsorption bearing portion 24. The first pad 25 can also be used to reduce and buffer the pressure on the first adsorption bearing portion 24 to prevent damage to the first adsorption bearing portion 24.

[0050] Furthermore, the first gasket 25 covers the first through hole 233 of the first extension 232. The first gasket 25 can be used to seal the first through hole 233 to prevent problems such as pressure leakage in the vacuum channel of the first robotic arm 20.

[0051] It should be noted that the object supporting the wafer needs to have high manufacturing precision, which refers to the precision of geometric tolerances, such as flatness and parallelism. If the flatness of the object supporting the wafer is insufficient, vacuum leakage may occur during wafer adsorption, leading to unstable adsorption. If the parallelism of the object supporting the wafer is insufficient, the wafer may tilt and fall.

[0052] Please refer to Figures 2 to 5 ,and Figure 8 , Figure 8 yes Figure 5 A magnified structural diagram of region A. In this embodiment, the first robotic arm 20 includes a plurality of protrusions 27, which surround the first vacuum adsorption hole 241 and are used to support the sample to be tested.

[0053] The first robotic arm 20 supports the wafer through multiple protrusions 27, avoiding direct contact between the wafer and the first adsorption support 24. This reduces the contact area between the first robotic arm 20 and the wafer. In this case, it is only necessary to ensure the manufacturing precision of the protrusions 27, rather than the manufacturing precision of the entire upper surface of the first adsorption support 24, thereby reducing the cost of machining precision of the first robotic arm 20.

[0054] The protrusions 27 are provided corresponding to the first vacuum adsorption holes 241, and the number of protrusions 27 corresponds to the number of first vacuum adsorption holes 241. Optionally, in this embodiment, there are three protrusions 27, and the three first vacuum adsorption holes 241 are arranged at the three vertices of a triangle, so that the three protrusions 27 can support the entire surface of the wafer, thereby improving the robustness and stability of the first robotic arm 20 in supporting the wafer. Optionally, in other embodiments, the number of protrusions 27 may be two, four, five, or more than five; this application does not impose any limitation on this.

[0055] Please refer to Figures 2 to 5 ,and Figure 9 , Figure 9 This is a schematic diagram of the structure of a first connecting plate, a first connecting block, and a first leveling component provided in an embodiment of this application.

[0056] In this embodiment, the first robotic arm 20 further includes a first leveling component. The first leveling component is disposed at one end of the first main body 231 near the first connecting block 22. The first leveling component includes a plurality of first leveling members 281 and a plurality of second leveling members 282. The first leveling members 281 pass through the first main body 231 and are threadedly connected to the first connecting block 22. The second leveling members 282 pass through the first main body 231 and abut against the first connecting block 22.

[0057] The first leveling component 281 passes through the through hole on the first main body 231 and is threadedly connected to the first connecting block 22. In this embodiment, the first leveling component 281 is a locking screw. The screw head of the first leveling component 281 abuts against the first main body 231, and the screw rod of the first leveling component 281 is threadedly connected to the first connecting block 22. The first leveling component 281 can rotate relative to the first main body 231 to drive the first main body 231 to move downward along the height direction (the opposite direction of the third direction D3).

[0058] The second leveling member 282 passes through the threaded hole on the first main body 231 and abuts against the first connecting block 22. In this embodiment, the second leveling member 282 has a set screw structure. The screw head of the second leveling member 282 is spaced apart from the first main body 231, and the outer periphery of the screw rod of the second leveling member 282 is threadedly connected to the first main body 231. The screw rod of the second leveling member 282 abuts against the first connecting block 22. The second leveling member 282 can rotate relative to the first connecting block 22 to drive the first main body 231 to move upward along the height direction (the third direction D3). The direction of movement of the first main body 231 driven by the second leveling member 282 is opposite to the direction of movement of the first main body 231 driven by the first leveling member 281, so as to realize the adjustment of the movement of the first main body 231 in both the vertical and horizontal directions along the height direction.

[0059] Furthermore, in this embodiment, the number of the first leveling component 281 corresponds to the number of the second leveling component 282. There are three first leveling components 281, and the installation positions of the three first leveling components 281 form a triangle vertex distribution. There are also three second leveling components 282, and the installation positions of the three second leveling components 282 form a triangle vertex distribution. The second leveling components 282 and the first leveling components 281 are arranged adjacent to each other.

[0060] The mounting positions of the three first leveling components 281 form a triangle with vertices, and the mounting positions of the three second leveling components 282 also form a triangle with vertices. It should be noted that the three points define a plane. The three first leveling components 281 and the three second leveling components 282 cooperate to adjust the level of the first main body 231, thereby adjusting the level of the first robotic arm 20, so as to avoid the first robotic arm 20 tilting and thus being unable to effectively transport the wafer.

[0061] Please refer to Figures 2 to 7 In this embodiment, the second connecting block 32 includes a third channel disposed along the second direction D2, and the second connecting plate 33 includes a connected second main body 331 and a second extension 332. The second main body 331 extends along the second direction D2, and the second extension 332 extends along the first direction D1. The second extension 332 includes a fourth channel disposed along the first direction D1. One end of the second main body 331 away from the second extension 332 is connected to the second connecting block 32, and one end of the second extension 332 away from the second main body 331 is connected to the second adsorption support 34. The second adsorption support 34 includes a connected second vacuum channel and a plurality of second vacuum adsorption holes 342. The second vacuum channel communicates with the fourth channel.

[0062] The robotic arm mechanism 100 further includes a second negative pressure assembly, which includes a second negative pressure pipe 51, a fourth adapter nozzle 52, a fifth adapter nozzle 53, a second connecting pipe, and a sixth adapter nozzle 54 connected together. The fourth adapter nozzle 52 and the fifth adapter nozzle 53 are respectively located at opposite ends of the second connecting block 32 along the second direction D2 and are respectively connected to the third channel. The sixth adapter nozzle 54 is located at the end of the second main body 331 away from the second connecting block 32. The second connecting pipe extends along the second direction D2 and connects the fifth adapter nozzle 53 and the sixth adapter nozzle 54 respectively. The sixth adapter nozzle 54 is connected to the fourth channel.

[0063] The second connecting block 32 has a third channel inside, which is used for airflow, and the second extension 332 has a fourth channel inside, which is also used for airflow.

[0064] Furthermore, in this embodiment, the second extension 332 includes a third through hole 333 disposed along the third direction D3, the third through hole 333 communicating with the fourth channel, the second adsorption support portion 34 includes a fourth through hole disposed along the third direction D3, the fourth through hole communicating with the second vacuum flow, the third through hole 333 being disposed corresponding to the fourth through hole and communicating with each other, so that the fourth channel communicating with the second vacuum flow channel.

[0065] The vacuuming channels of the second robotic arm 30 are, in sequence, the second negative pressure pipe 51, the fourth adapter nozzle 52, the third channel of the second connecting block 32, the fifth adapter nozzle 53, the second connecting pipe, the sixth adapter nozzle 54, the fourth channel of the second extension 332, the second vacuum flow channel, and a plurality of second vacuum adsorption holes 342. The vacuuming path of the second robotic arm 30 can be set along the shape of the second robotic arm 30 to avoid interference between the vacuuming device of the second robotic arm 30 and the second slide rail 12 or other structural components.

[0066] Furthermore, in this embodiment, a second annular groove is provided on the outer periphery of the third through hole 333. The second annular groove can be used to place an annular seal to seal the gap between the second connecting plate 33 and the second adsorption support part 34, so that the fourth channel of the second connecting plate 33 and the second vacuum flow channel of the second adsorption support part 34 are in close communication.

[0067] In this embodiment, the second robotic arm 30 includes a plurality of suction cups 37, and the plurality of suction cups 37 are arranged corresponding to the plurality of second vacuum adsorption holes 342.

[0068] Specifically, in this embodiment, the second adsorption support portion 34 includes a first sub-fork arm and a second sub-fork arm. The first and second sub-fork arms are spaced apart and both extend along the first direction D1. Both the first and second sub-fork arms are provided with a plurality of second vacuum adsorption holes 342 and a plurality of suction cups 37, enabling the second robotic arm to adsorb and support wafers with significant warpage. Optionally, in this embodiment, the number of suction cups 37 and second vacuum adsorption holes 342 is eight, and both the first and second sub-fork arms are provided with four suction cups 37 and four second vacuum adsorption holes 342. In other embodiments, the number of suction cups 37 and second vacuum adsorption holes 342 can also be four, six, ten, or more than ten; this application does not limit this. In this embodiment, the second robotic arm 30 and the first robotic arm 20 can adsorb different types of wafers, thereby improving the application range and practicality of the robotic arm mechanism 100.

[0069] It should be noted that in other embodiments, the second adsorption support portion 34 of the second robotic arm 30 may also have the same structure as the first adsorption support portion 24 of the first robotic arm 20, that is, the second robotic arm 30 and the first robotic arm 20 adsorb the same type of wafer, and this application does not limit this.

[0070] In this embodiment, the second robotic arm 30 further includes a second pad 35 and a second fixing plate 36. The second extension 332, the second adsorption bearing portion 34, the second pad 35, and the second fixing plate 36 are arranged sequentially. The second fixing plate 36 and the second extension 332 are fixed by screws to limit the second adsorption bearing portion 34 and the second pad 35, thereby fixing the second adsorption bearing portion 34 and avoiding direct fixing of the second adsorption bearing portion 34 and the second connecting plate 33 to prevent damage to the second adsorption bearing portion 34. The second pad 35 can also be used to reduce and buffer the pressure on the second adsorption bearing portion 34 to prevent damage to the second adsorption bearing portion 34.

[0071] Furthermore, the second gasket 35 covers the third through hole 333 of the second extension 332. The second gasket 35 can be used to seal the third through hole 333 to prevent problems such as pressure leakage in the vacuum channel of the second robotic arm 30.

[0072] Please refer to Figures 2 to 7 ,and Figure 10 , Figure 10 This is a schematic diagram of the structure of a second connecting plate, a second connecting block, and a second leveling component provided in an embodiment of this application.

[0073] In this embodiment, the second robotic arm 30 further includes a second leveling assembly. The second leveling assembly is disposed at one end of the second main body 331 near the second connecting block 32. The second leveling assembly includes a plurality of third leveling members 381 and a plurality of fourth leveling members 382. The third leveling members 381 pass through the second main body 331 and are threadedly connected to the second connecting block 32. The fourth leveling members 382 pass through the second main body 331 and abut against the second connecting block 32.

[0074] The third leveling component 381 passes through the through hole on the second main body 331 and is threadedly connected to the second connecting block 32. In this embodiment, the third leveling component 381 is a locking screw. The screw head of the third leveling component 381 abuts against the second main body 331, and the screw rod of the third leveling component 381 is threadedly connected to the second connecting block 32. The third leveling component 381 can rotate relative to the second main body 331 to drive the second main body 331 to move downward along the height direction (the opposite direction of the third direction D3).

[0075] The fourth leveling component 382 passes through a threaded hole on the second main body 331 and abuts against the second connecting block 32. In this embodiment, the fourth leveling component 382 has a set screw structure. The screw head of the fourth leveling component 382 is spaced apart from the second main body 331. The outer periphery of the screw rod of the fourth leveling component 382 is threadedly connected to the second main body 331, and the screw rod of the fourth leveling component 382 abuts against the second connecting block 32. The fourth leveling component 382 can rotate relative to the second connecting block 32 to drive the second main body 331 to move upward along the height direction (the third direction D3). The direction of movement of the second main body 331 driven by the fourth leveling component 382 is opposite to the direction of movement of the second main body 331 driven by the third leveling component 381, so as to realize the adjustment of the movement of the second main body 331 in both the vertical and horizontal directions along the height direction.

[0076] Furthermore, in this embodiment, the number of the third leveling component 381 corresponds to the number of the fourth leveling component 382. There are three third leveling components 381, and the installation positions of the three third leveling components 381 form a triangle vertex distribution. There are three fourth leveling components 382, ​​and the installation positions of the three fourth leveling components 382 form a triangle vertex distribution. The third leveling components 381 and the fourth leveling components 382 are arranged adjacent to each other.

[0077] The mounting positions of the three third leveling components 381 form a triangle with vertices, and the mounting positions of the three fourth leveling components 382 also form a triangle with vertices. It should be noted that the three points define a plane. The three third leveling components 381 and the three fourth leveling components 382 cooperate to adjust the level of the second main body 331, thereby adjusting the level of the second robotic arm 30, so as to avoid the second robotic arm 30 tilting and thus being unable to effectively transport the wafer.

[0078] Please refer to Figures 1 to 10 This application also provides a transportation device 1000, which includes a rotating mechanism 200, a lifting mechanism 300, and the robotic arm mechanism 100. The rotating mechanism 200 is connected to the robotic arm mechanism 100 and is used to drive the robotic arm mechanism 100 to rotate. The lifting mechanism 300 carries the rotating mechanism 200 and is used to drive the rotating mechanism 200 and the robotic arm mechanism 100 to move along a third direction D3 and the opposite direction of the third direction D3.

[0079] In the transport device 1000 provided in this application, the slide rail assembly 10 extends along a first direction D1. The slide rail assembly 10 includes a first slide rail 11 and a second slide rail 12 spaced apart along a second direction D2. A first robotic arm 20 is slidably connected to the first slide rail 11. The first robotic arm 20 includes a first connecting seat 21, a first connecting block 22, a first connecting plate 23, and a first adsorption bearing portion 24 that are bent and connected in sequence. The first connecting seat 21 is connected to the first slide rail 11 and extends along the second direction D2. The first connecting block 22 extends along a third direction D3. The first connecting plate 23 extends at least partially along the opposite direction of the second direction D2. The first adsorption bearing portion 24 extends along the first direction D1. The second robotic arm 30 is slidably connected to the second slide rail 12. The second robotic arm 30 includes a second connecting seat 31, a second connecting block 32, a second connecting plate 33, and a second adsorption bearing part 34, which are bent and connected in sequence. The second connecting seat 31 is connected to the second slide rail 12 and extends in the opposite direction of the second direction D2. The second connecting block 32 extends in the third direction D3. The second connecting plate 33 extends at least partially in the second direction D2. The second adsorption bearing part 34 extends in the first direction D1. In the third direction D3, the first adsorption bearing part 24 is higher than the second adsorption bearing part 34. In the second direction D2, the length of the first connecting plate 23 is greater than the length of the second connecting plate 33. Either the first robotic arm 20 or the second robotic arm 30 can move into the wafer storage device to retrieve a wafer. The other robotic arm 30 can also move into the wafer storage device to place a wafer. The robotic arm mechanism 100, with its dual robotic arms, can achieve more efficient wafer transport. Furthermore, the length of the first connecting plate 23 is greater than the length of the second connecting plate 33. The first connecting plate 23, the first connecting block 22, and the first connecting seat 21 are bent to form a reserved space for accommodating the wafer. This can prevent interference between the wafer transported by the second robotic arm 30 and the first robotic arm 20 when both the first robotic arm 20 and the second robotic arm 30 are transporting the wafer, thereby improving the working efficiency and stability of the first robotic arm 20 and the second robotic arm 30.

[0080] In this application, the terms "embodiment" and "implementation" mean that a specific feature, structure, or characteristic described in connection with an embodiment can be included in at least one embodiment of this application. The appearance of these phrases in various locations throughout the specification does not necessarily refer to the same embodiment, nor are they independent or alternative embodiments mutually exclusive with other embodiments. Those skilled in the art will understand, explicitly and implicitly, that the embodiments described in this application can be combined with other embodiments. Furthermore, it should be understood that the features, structures, or characteristics described in the various embodiments of this application can be arbitrarily combined to form another embodiment that does not depart from the spirit and scope of the technical solution of this application, provided there is no contradiction between them.

[0081] The above description represents some embodiments of this application. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of this application, and these improvements and modifications are also considered to be within the scope of protection of this application.

Claims

1. A robotic arm mechanism for transporting samples to be tested, characterized in that, The robotic arm mechanism includes: A slide rail assembly extends along a first direction, the slide rail assembly including a first slide rail and a second slide rail spaced apart along a second direction, the second direction being perpendicular to the first direction; A first robotic arm, slidably connected to a first slide rail, includes a first connecting seat, a first connecting block, a first connecting plate, and a first adsorption-bearing portion sequentially bent and connected. The first connecting seat is connected to the first slide rail and extends along a second direction. The first connecting block extends along a third direction. The first connecting plate extends at least partially in the opposite direction to the second direction. The first adsorption-bearing portion extends along the first direction. The third direction is perpendicular to both the first and second directions. A second robotic arm is slidably connected to a second slide rail. The second robotic arm includes a second connecting seat, a second connecting block, a second connecting plate, and a second adsorption bearing portion that are bent and connected in sequence. The second connecting seat is connected to the second slide rail and extends in the opposite direction to the second direction. The second connecting block extends in a third direction. The second connecting plate extends at least partially in the second direction. The second adsorption bearing portion extends in the first direction. In the third direction, the first adsorption bearing portion is higher than the second adsorption bearing portion. In the second direction, the length of the first connecting plate is greater than the length of the second connecting plate.

2. The robotic arm mechanism according to claim 1, characterized in that, The first connecting block includes a first channel disposed along the third direction. The first connecting plate includes a connected first main body and a first extension. The first main body extends in the opposite direction to the second direction. The first extension extends in the first direction. The first extension includes a second channel disposed along the first direction. The end of the first main body away from the first extension is connected to the first connecting block. The end of the first extension away from the first main body is connected to the first adsorption support. The first adsorption support includes a first vacuum channel and a plurality of first vacuum adsorption holes that are connected to each other. The first vacuum channel is connected to the second channel. The robotic arm mechanism further includes a first negative pressure component, which includes a first negative pressure pipe, a first adapter nozzle, a second adapter nozzle, a first connecting pipe, and a third adapter nozzle connected in series. The first adapter nozzle and the second adapter nozzle are respectively located at opposite ends of the first connecting block along the third direction and are respectively connected to the first channel. The third adapter nozzle is located at the end of the first main body away from the first connecting block. The first connecting pipe extends along the second direction and is respectively connected to the second adapter nozzle and the third adapter nozzle. The third adapter nozzle is connected to the second channel.

3. The robotic arm mechanism according to claim 2, characterized in that, The first extension includes a first through hole disposed along the third direction, the first through hole communicating with the second channel; the first adsorption bearing portion includes a second through hole disposed along the third direction, the second through hole communicating with the first vacuum flow; the second through holes are disposed corresponding to the first through hole and communicating with each other, so that the second channel communicates with the first vacuum flow channel. The first robotic arm further includes a first pad and a first fixing plate. The first extension, the first adsorption bearing part, the first pad and the first fixing plate are arranged in sequence. The first fixing plate and the first extension are fixed by screws to limit the first adsorption bearing part and the first pad.

4. The robotic arm mechanism according to claim 2, characterized in that, The first robotic arm includes multiple protrusions, which are arranged around the first vacuum adsorption hole and are used to support the sample to be tested.

5. The robotic arm mechanism according to claim 2, characterized in that, The first robotic arm further includes a first leveling assembly, which is located at one end of the first main body near the first connecting block. The first leveling assembly includes a plurality of first leveling components and a plurality of second leveling components. The first leveling components pass through the first main body and are threadedly connected to the first connecting block, and the second leveling components pass through the first main body and abut against the first connecting block. The number of the first leveling components corresponds to the number of the second leveling components. There are three first leveling components, and the installation positions of the three first leveling components form a triangle vertex distribution. There are also three second leveling components, and the installation positions of the three second leveling components form a triangle vertex distribution. The second leveling components and the first leveling components are arranged adjacent to each other.

6. The robotic arm mechanism according to claim 1, characterized in that, The second connecting block includes a third channel disposed along the second direction. The second connecting plate includes a connected second main body and a second extension. The second main body extends along the second direction, and the second extension extends along the first direction. The second extension includes a fourth channel disposed along the first direction. One end of the second main body away from the second extension is connected to the second connecting block. One end of the second extension away from the second main body is connected to the second adsorption support. The second adsorption support includes a connected second vacuum channel and a plurality of second vacuum adsorption holes. The second vacuum channel communicates with the fourth channel. The robotic arm mechanism further includes a second negative pressure component, which includes a second negative pressure pipe, a fourth adapter nozzle, a fifth adapter nozzle, a second connecting pipe, and a sixth adapter nozzle connected in series. The fourth adapter nozzle and the fifth adapter nozzle are respectively located at opposite ends of the second connecting block along the second direction and are respectively connected to the third channel. The sixth adapter nozzle is located at the end of the second main body away from the second connecting block. The second connecting pipe extends along the second direction and connects the fifth adapter nozzle and the sixth adapter nozzle respectively. The sixth adapter nozzle is connected to the fourth channel.

7. The robotic arm mechanism according to claim 6, characterized in that, The second extension includes a third through hole disposed along the third direction, the third through hole communicating with the fourth channel; the second adsorption support includes a fourth through hole disposed along the third direction, the fourth through hole communicating with the second vacuum flow; the third through hole is disposed corresponding to the fourth through hole and communicates with each other, so that the fourth channel communicates with the second vacuum flow channel. The second robotic arm also includes a second pad and a second fixing plate. The second extension, the second adsorption bearing part, the second pad and the second fixing plate are arranged in sequence. The second fixing plate and the second extension are fixed by screws to limit the second adsorption bearing part and the second pad.

8. The robotic arm mechanism according to claim 6, characterized in that, The second robotic arm includes multiple suction cups, which are arranged corresponding to the multiple second vacuum suction holes.

9. The robotic arm mechanism according to claim 6, characterized in that, The second robotic arm also includes a second leveling assembly, which is located at one end of the second main body near the second connecting block. The second leveling assembly includes a plurality of third leveling components and a plurality of fourth leveling components. The third leveling components pass through the second main body and are threadedly connected to the second connecting block. The fourth leveling components pass through the second main body and abut against the second connecting block. The number of the third leveling components corresponds to the number of the fourth leveling components. There are three third leveling components, and the installation positions of the three third leveling components form a triangle vertices distribution. There are also three fourth leveling components, and the installation positions of the three fourth leveling components form a triangle vertices distribution. The third and fourth leveling components are arranged adjacent to each other.

10. A transport device, characterized in that, The transport device includes a rotating mechanism, a lifting mechanism, and a robotic arm mechanism as described in any one of claims 1-9. The rotating mechanism is connected to the robotic arm mechanism and is used to drive the robotic arm mechanism to rotate. The lifting mechanism carries the rotating mechanism and is used to drive the rotating mechanism and the robotic arm mechanism to move in a third direction and the opposite direction of the third direction.

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